WO2005008170A3 - Edge normal process - Google Patents

Edge normal process Download PDF

Info

Publication number
WO2005008170A3
WO2005008170A3 PCT/US2004/022401 US2004022401W WO2005008170A3 WO 2005008170 A3 WO2005008170 A3 WO 2005008170A3 US 2004022401 W US2004022401 W US 2004022401W WO 2005008170 A3 WO2005008170 A3 WO 2005008170A3
Authority
WO
WIPO (PCT)
Prior art keywords
edge
wafer
circumference
defects
normal process
Prior art date
Application number
PCT/US2004/022401
Other languages
French (fr)
Other versions
WO2005008170A2 (en
Inventor
Cory Watkins
Mark Harless
Francy Abraham
Hak Chuah Sim
Original Assignee
August Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by August Technology Corp filed Critical August Technology Corp
Priority to KR1020067000874A priority Critical patent/KR101060428B1/en
Priority to JP2006520266A priority patent/JP4949024B2/en
Priority claimed from US10/890,762 external-priority patent/US7340087B2/en
Priority claimed from US10/890,692 external-priority patent/US6947588B2/en
Publication of WO2005008170A2 publication Critical patent/WO2005008170A2/en
Publication of WO2005008170A3 publication Critical patent/WO2005008170A3/en
Priority to US11/331,619 priority patent/US7366344B2/en
Priority to US12/036,679 priority patent/US7706599B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/12—Edge-based segmentation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

An edge inspection method (Figure 10) for detecting defects on a wafer surface (step 302 in Figure 10) includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands (step 306 in Figure 10). Adjacent edge clusters (step 314 in Figure 10) about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis (step 316 in Figure 10) to identify defects. The edge pixel bins are also analyzed via blob analysis (step 318 in Figure 10) to determine defects.
PCT/US2004/022401 2003-07-14 2004-07-14 Edge normal process WO2005008170A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020067000874A KR101060428B1 (en) 2003-07-14 2004-07-14 Edge inspection method for substrates such as semiconductors
JP2006520266A JP4949024B2 (en) 2003-07-14 2004-07-14 Edge vertical part processing
US11/331,619 US7366344B2 (en) 2003-07-14 2006-01-13 Edge normal process
US12/036,679 US7706599B2 (en) 2003-07-14 2008-02-25 Edge normal process

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US48695303P 2003-07-14 2003-07-14
US48695203P 2003-07-14 2003-07-14
US60/486,952 2003-07-14
US60/486,953 2003-07-14
US10/890,762 2004-07-14
US10/890,692 2004-07-14
US10/890,762 US7340087B2 (en) 2003-07-14 2004-07-14 Edge inspection
US10/890,692 US6947588B2 (en) 2003-07-14 2004-07-14 Edge normal process

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/331,619 Continuation US7366344B2 (en) 2003-07-14 2006-01-13 Edge normal process

Publications (2)

Publication Number Publication Date
WO2005008170A2 WO2005008170A2 (en) 2005-01-27
WO2005008170A3 true WO2005008170A3 (en) 2005-05-06

Family

ID=34084733

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/022401 WO2005008170A2 (en) 2003-07-14 2004-07-14 Edge normal process

Country Status (3)

Country Link
JP (1) JP4949024B2 (en)
KR (1) KR101060428B1 (en)
WO (1) WO2005008170A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101467023B (en) * 2006-04-03 2011-08-17 鲁道夫科技公司 Wafer bevel inspection mechanism

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294969A (en) * 2005-04-13 2006-10-26 Reitetsukusu:Kk Inspection apparatus and method for wafer
JP5085953B2 (en) * 2006-02-24 2012-11-28 株式会社日立ハイテクノロジーズ Surface inspection device
JP4827127B2 (en) * 2006-03-24 2011-11-30 株式会社トプコン Inspection device
JP2007303853A (en) * 2006-05-09 2007-11-22 Nikon Corp End inspection device
EP2023130B1 (en) 2006-05-09 2018-03-07 Nikon Corporation Edge inspection apparatus
JP5245212B2 (en) * 2006-05-09 2013-07-24 株式会社ニコン Edge inspection device
US7616804B2 (en) * 2006-07-11 2009-11-10 Rudolph Technologies, Inc. Wafer edge inspection and metrology
US7486878B2 (en) * 2006-09-29 2009-02-03 Lam Research Corporation Offset correction methods and arrangement for positioning and inspecting substrates
JP4886549B2 (en) * 2007-02-26 2012-02-29 株式会社東芝 Position detection apparatus and position detection method
DE102007047935A1 (en) * 2007-03-19 2008-09-25 Vistec Semiconductor Systems Gmbh Apparatus and method for inspection of defects at the edge region of a wafer and use of the device in a wafer inspection device
KR101202883B1 (en) * 2007-10-23 2012-11-19 시바우라 메카트로닉스 가부시키가이샤 Inspection device for disk-shaped substrate
JP5183146B2 (en) * 2007-10-23 2013-04-17 芝浦メカトロニクス株式会社 Disc-shaped substrate inspection equipment
JP5183147B2 (en) * 2007-10-23 2013-04-17 芝浦メカトロニクス株式会社 Disc-shaped substrate inspection equipment
PL2202814T3 (en) 2008-12-23 2013-11-29 Mmc Copper Products Oy A metal assembly constituting a precursor for a superconductor and a method suitable for the production of a superconductor
DE102010026351B4 (en) * 2010-07-07 2012-04-26 Siltronic Ag Method and apparatus for inspecting a semiconductor wafer
US20130162806A1 (en) * 2011-12-23 2013-06-27 Mitutoyo Corporation Enhanced edge focus tool
DE102012101301B4 (en) * 2012-02-17 2014-11-06 Kocos Automation Gmbh Device for non-contact edge profile determination on a thin disc-shaped object

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
US5822055A (en) * 1995-06-06 1998-10-13 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6432800B2 (en) * 2000-02-03 2002-08-13 Selight Co., Ltd. Inspection of defects on the circumference of semiconductor wafers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4464705A (en) 1981-05-07 1984-08-07 Horowitz Ross M Dual light source and fiber optic bundle illuminator
US4823494A (en) 1987-12-17 1989-04-25 Waterman Phillip S Combination tip-up and hole cover
JPH0694643A (en) * 1992-09-17 1994-04-08 Kawasaki Steel Corp Detecting method of surface defect
US5408537A (en) * 1993-11-22 1995-04-18 At&T Corp. Mounted connector pin test using image processing
JP2000114329A (en) * 1998-09-29 2000-04-21 Yuhi Denshi Kk Method and device for inspecting ground edge section of substrate
JP2001221749A (en) * 2000-02-10 2001-08-17 Hitachi Ltd Observation device and observation method
JP3629244B2 (en) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 Wafer inspection equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
US5822055A (en) * 1995-06-06 1998-10-13 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6432800B2 (en) * 2000-02-03 2002-08-13 Selight Co., Ltd. Inspection of defects on the circumference of semiconductor wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101467023B (en) * 2006-04-03 2011-08-17 鲁道夫科技公司 Wafer bevel inspection mechanism

Also Published As

Publication number Publication date
KR20060056942A (en) 2006-05-25
JP2007536723A (en) 2007-12-13
WO2005008170A2 (en) 2005-01-27
JP4949024B2 (en) 2012-06-06
KR101060428B1 (en) 2011-08-29

Similar Documents

Publication Publication Date Title
WO2005008170A3 (en) Edge normal process
EP1696227A3 (en) Method and apparatus for detecting defects in wafers
WO2006105473A3 (en) Automatic detection of red lesions in digital color fundus photographs
WO1997000452A3 (en) Mura detection apparatus and method
TWI264793B (en) Defect detection apparatus and defect detection method
TW200834059A (en) Defect inspection apparatus and method therefor
KR20100015628A (en) Lumber inspection method, device and program
SG164293A1 (en) System and method for inspecting a wafer
JP5085860B2 (en) Wood inspection method, apparatus and program
JP4213142B2 (en) Colony counting method
TW200722740A (en) Image defect inspection apparatus, image defect inspection system, and image defect inspection method
US7415362B2 (en) Image defect inspection apparatus
Boukouvalas et al. ASSIST: automatic system for surface inspection and sorting of tiles
TW200710387A (en) A method of detecting incomplete edge bead removal from a disk-like object
JP6696323B2 (en) Pattern inspection apparatus and pattern inspection method
WO2007026360A3 (en) A method and a system for creating a reference image using unknown quality patterns
JP3572750B2 (en) Automatic evaluation method for concrete defects
JP2000180374A (en) Method for detecting defect
CN113177925A (en) Method for nondestructive detection of fruit surface defects
EP0969498A3 (en) Visual inspection apparatus and method
JP2002257736A (en) Method and device for inspecting end face of honeycomb structure
Boukouvalas et al. An integrated system for quality inspection of tiles
WO2003010622A3 (en) Automatic separation of subject pixels using segmentation based on multiple planes of measurement data
JPH09199560A (en) Inspecting method of semiconductor surface defect and its automatic inspecting equipment
JP2003203218A (en) Visual inspection device and method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006520266

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 11331619

Country of ref document: US

Ref document number: 1020067000874

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 11331619

Country of ref document: US

122 Ep: pct application non-entry in european phase