WO2005008348A3 - System and method for thermal management using distributed synthetic jet actuators - Google Patents

System and method for thermal management using distributed synthetic jet actuators Download PDF

Info

Publication number
WO2005008348A3
WO2005008348A3 PCT/US2004/021706 US2004021706W WO2005008348A3 WO 2005008348 A3 WO2005008348 A3 WO 2005008348A3 US 2004021706 W US2004021706 W US 2004021706W WO 2005008348 A3 WO2005008348 A3 WO 2005008348A3
Authority
WO
WIPO (PCT)
Prior art keywords
synthetic jet
thermal management
jet actuator
housing
tube
Prior art date
Application number
PCT/US2004/021706
Other languages
French (fr)
Other versions
WO2005008348A2 (en
Inventor
Ari Glezer
Raghavendran Mahalingam
Original Assignee
Georgia Tech Res Inst
Ari Glezer
Raghavendran Mahalingam
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Res Inst, Ari Glezer, Raghavendran Mahalingam filed Critical Georgia Tech Res Inst
Priority to JP2006518864A priority Critical patent/JP2007527618A/en
Priority to AU2004258530A priority patent/AU2004258530A1/en
Priority to GB0600751A priority patent/GB2419644B/en
Publication of WO2005008348A2 publication Critical patent/WO2005008348A2/en
Publication of WO2005008348A3 publication Critical patent/WO2005008348A3/en
Priority to US11/325,239 priority patent/US20060196638A1/en
Priority to US11/406,924 priority patent/US20060185822A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
    • F04B45/047—Pumps having electric drive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Reciprocating Pumps (AREA)
  • Spray Control Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Jet Pumps And Other Pumps (AREA)

Abstract

One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60), though not required, typically comprises a housing (47) defining an internal chamber (45) and having an orifice (46) in a wall (44) of the housing (47). The synthetic jet actuator (60) typically also comprises a flexible diaphragm (42) forming a portion of the housing (47). The tube (61) of this exemplary embodiment typically comprises a proximal end (64) and a distal end (65), the proximal end (64) being positioned adjacent to the synthetic jet actuator (60). In this embodiment, operation of the synthetic jet actuator (60) causes a synthetic jet stream (52) to form at the distal end (65) of the tube (61).
PCT/US2004/021706 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators WO2005008348A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006518864A JP2007527618A (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators
AU2004258530A AU2004258530A1 (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators
GB0600751A GB2419644B (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators
US11/325,239 US20060196638A1 (en) 2004-07-07 2006-01-04 System and method for thermal management using distributed synthetic jet actuators
US11/406,924 US20060185822A1 (en) 2004-07-07 2006-04-18 System and method for thermal management using distributed synthetic jet actuators

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US48517703P 2003-07-07 2003-07-07
US60/485,177 2003-07-07
US53278503P 2003-12-23 2003-12-23
US60/532,785 2003-12-23

Publications (2)

Publication Number Publication Date
WO2005008348A2 WO2005008348A2 (en) 2005-01-27
WO2005008348A3 true WO2005008348A3 (en) 2005-07-14

Family

ID=34083331

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/021706 WO2005008348A2 (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators

Country Status (4)

Country Link
JP (2) JP2007527618A (en)
AU (1) AU2004258530A1 (en)
GB (1) GB2419644B (en)
WO (1) WO2005008348A2 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677744B2 (en) 2003-11-04 2011-04-27 ソニー株式会社 Jet generating device, electronic device and jet generating method
JP4572548B2 (en) 2004-03-18 2010-11-04 ソニー株式会社 Gas ejection device
JP4887652B2 (en) 2005-04-21 2012-02-29 ソニー株式会社 Jet generator and electronic device
JP4747657B2 (en) 2005-04-21 2011-08-17 ソニー株式会社 Jet generator and electronic device
JP2006310586A (en) 2005-04-28 2006-11-09 Sony Corp Air current generator and electronic apparatus
US7932535B2 (en) * 2005-11-02 2011-04-26 Nuventix, Inc. Synthetic jet cooling system for LED module
US8035966B2 (en) * 2006-02-23 2011-10-11 Nuventix, Inc. Electronics package for synthetic jet ejectors
EP1999381B1 (en) * 2006-03-21 2017-11-22 Philips Lighting Holding B.V. Cooling device and electronic device comprising such a cooling device
US20100012301A1 (en) * 2006-12-15 2010-01-21 Koninklijke Philips Electronics N.V. Pulsating fluid cooling with frequency control
EP1975505A1 (en) 2007-03-26 2008-10-01 Koninklijke Philips Electronics N.V. Lighting device
US8218318B2 (en) 2007-12-07 2012-07-10 Koninklijke Philips Electronics N.V. Low noise cooling device
EP2220921A1 (en) * 2007-12-07 2010-08-25 Koninklijke Philips Electronics N.V. Cooling device utilizing internal synthetic jets
ATE479567T1 (en) * 2008-05-06 2010-09-15 Fiat Ricerche AIR DIFFUSER OR DISTRIBUTOR WITH SYNTHETIC NOZZLES
JP5110159B2 (en) 2008-06-05 2012-12-26 株式会社村田製作所 Piezoelectric micro blower
WO2010004469A1 (en) * 2008-07-10 2010-01-14 Philips Intellectual Property & Standards Gmbh Remote cooling by combining heat pipe and resonator for synthetic jet cooling
US20110164383A1 (en) 2008-09-12 2011-07-07 Koninklijke Philips Electronics N.V Device provided with a gap-like space and a synthetic jet generator coupled there-to
DE112011100524T5 (en) 2010-02-13 2012-11-29 Nuventix, Inc. Synthetic jet ejector and its structural design to promote mass production
CH703357A1 (en) * 2010-06-25 2011-12-30 Alstom Technology Ltd HEAT-LOADED, COOLED COMPONENT.
US20120170216A1 (en) * 2011-01-04 2012-07-05 General Electric Company Synthetic jet packaging

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938742A (en) * 1988-02-04 1990-07-03 Smits Johannes G Piezoelectric micropump with microvalves
US5224843A (en) * 1989-06-14 1993-07-06 Westonbridge International Ltd. Two valve micropump with improved outlet
JPH06147104A (en) * 1992-10-30 1994-05-27 Hitachi Ltd Piezoelectric multi-channel pump and drive control method
US5876187A (en) * 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6186748B1 (en) * 1998-07-21 2001-02-13 Kawasaki Jukogyo Kabushiki Kaisha Axial piston pump
US6280148B1 (en) * 1997-02-19 2001-08-28 Hahn-Schickard-Gesellschaft Fur Angewandte Forschung Microdosing device and method for operating same
US20020098097A1 (en) * 2001-01-22 2002-07-25 Angad Singh Magnetically-actuated micropump
US6481984B1 (en) * 1999-10-27 2002-11-19 Seiko Instruments Inc. Pump and method of driving the same
US20030151895A1 (en) * 2002-02-11 2003-08-14 Jon Zuo Heat spreader with oscillating flow
US6869275B2 (en) * 2002-02-14 2005-03-22 Philip Morris Usa Inc. Piezoelectrically driven fluids pump and piezoelectric fluid valve

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55101800A (en) * 1979-01-25 1980-08-04 Pioneer Electronic Corp Air pump
JPS63234594A (en) * 1987-03-23 1988-09-29 古野電気株式会社 Fluid circulator
JPH03116961A (en) * 1989-09-29 1991-05-17 Victor Co Of Japan Ltd Heat dissipating device
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
US6457654B1 (en) * 1995-06-12 2002-10-01 Georgia Tech Research Corporation Micromachined synthetic jet actuators and applications thereof
JPH11145659A (en) * 1997-11-10 1999-05-28 Sony Corp Air cooling apparatus
JPH11145661A (en) * 1997-11-10 1999-05-28 Sony Corp Air cooler
SE514735C2 (en) * 1998-12-11 2001-04-09 Ericsson Telefon Ab L M Device for increasing heat output
JP2002134975A (en) * 2000-10-23 2002-05-10 Nippon Keiki Works Ltd Cooling fan

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938742A (en) * 1988-02-04 1990-07-03 Smits Johannes G Piezoelectric micropump with microvalves
US5224843A (en) * 1989-06-14 1993-07-06 Westonbridge International Ltd. Two valve micropump with improved outlet
JPH06147104A (en) * 1992-10-30 1994-05-27 Hitachi Ltd Piezoelectric multi-channel pump and drive control method
US5876187A (en) * 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
US6280148B1 (en) * 1997-02-19 2001-08-28 Hahn-Schickard-Gesellschaft Fur Angewandte Forschung Microdosing device and method for operating same
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6186748B1 (en) * 1998-07-21 2001-02-13 Kawasaki Jukogyo Kabushiki Kaisha Axial piston pump
US6481984B1 (en) * 1999-10-27 2002-11-19 Seiko Instruments Inc. Pump and method of driving the same
US20020098097A1 (en) * 2001-01-22 2002-07-25 Angad Singh Magnetically-actuated micropump
US20030151895A1 (en) * 2002-02-11 2003-08-14 Jon Zuo Heat spreader with oscillating flow
US6869275B2 (en) * 2002-02-14 2005-03-22 Philip Morris Usa Inc. Piezoelectrically driven fluids pump and piezoelectric fluid valve

Also Published As

Publication number Publication date
AU2004258530A1 (en) 2005-01-27
GB0600751D0 (en) 2006-02-22
JP2010101325A (en) 2010-05-06
JP2007527618A (en) 2007-09-27
WO2005008348A2 (en) 2005-01-27
GB2419644A (en) 2006-05-03
GB2419644B (en) 2008-04-09

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