WO2005010927A3 - Anisotropic electroconductive film and method for the production thereof - Google Patents

Anisotropic electroconductive film and method for the production thereof Download PDF

Info

Publication number
WO2005010927A3
WO2005010927A3 PCT/FR2004/050344 FR2004050344W WO2005010927A3 WO 2005010927 A3 WO2005010927 A3 WO 2005010927A3 FR 2004050344 W FR2004050344 W FR 2004050344W WO 2005010927 A3 WO2005010927 A3 WO 2005010927A3
Authority
WO
WIPO (PCT)
Prior art keywords
film
production
electroconductive film
anisotropic electroconductive
anisotropic
Prior art date
Application number
PCT/FR2004/050344
Other languages
French (fr)
Other versions
WO2005010927A2 (en
Inventor
Jean Brun
Original Assignee
Commissariat Energie Atomique
Jean Brun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique, Jean Brun filed Critical Commissariat Energie Atomique
Publication of WO2005010927A2 publication Critical patent/WO2005010927A2/en
Publication of WO2005010927A3 publication Critical patent/WO2005010927A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Abstract

The invention relates to an anisotropic electroconductive film (300) and to a method for the production thereof. The inventive film (300) comprises an insulating layer (307) and through conductive inserts (301) which are characterised in that they can be dissymetrical with respect to the normal to a main plane of said film (300) when they are assembled with one or several connection components. Said film makes it possible to connect electronic components at a high interconnection density.
PCT/FR2004/050344 2003-07-18 2004-07-16 Anisotropic electroconductive film and method for the production thereof WO2005010927A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR03/50350 2003-07-18
FR0350350A FR2857782B1 (en) 2003-07-18 2003-07-18 ANISOTROPIC CONDUCTIVE FILM WITH IMPROVED CONDUCTOR INSERTS

Publications (2)

Publication Number Publication Date
WO2005010927A2 WO2005010927A2 (en) 2005-02-03
WO2005010927A3 true WO2005010927A3 (en) 2005-10-20

Family

ID=33548341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2004/050344 WO2005010927A2 (en) 2003-07-18 2004-07-16 Anisotropic electroconductive film and method for the production thereof

Country Status (2)

Country Link
FR (1) FR2857782B1 (en)
WO (1) WO2005010927A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007041892A1 (en) 2007-09-04 2009-03-05 Robert Bosch Gmbh Electrical switching arrangement with a MID circuit carrier and a connection interface connected thereto

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793814A (en) * 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5135606A (en) * 1989-12-08 1992-08-04 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5434452A (en) * 1993-11-01 1995-07-18 Motorola, Inc. Z-axis compliant mechanical IC wiring substrate and method for making the same
JPH07320543A (en) * 1994-04-01 1995-12-08 Whitaker Corp:The Anisotropic conductive bonded structure and its manufacture
US5513430A (en) * 1994-08-19 1996-05-07 Motorola, Inc. Method for manufacturing a probe
EP1009027A2 (en) * 1998-12-10 2000-06-14 Soshotech Co., Ltd. Multipoint conductive sheet
US20010028102A1 (en) * 2000-04-10 2001-10-11 Hans-Jurgen Hacke Electronic component having microscopically small contact areas and method for fabricating it
US20020055282A1 (en) * 2000-11-09 2002-05-09 Eldridge Benjamin N. Electronic components with plurality of contoured microelectronic spring contacts

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793814A (en) * 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US5135606A (en) * 1989-12-08 1992-08-04 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5434452A (en) * 1993-11-01 1995-07-18 Motorola, Inc. Z-axis compliant mechanical IC wiring substrate and method for making the same
JPH07320543A (en) * 1994-04-01 1995-12-08 Whitaker Corp:The Anisotropic conductive bonded structure and its manufacture
US5513430A (en) * 1994-08-19 1996-05-07 Motorola, Inc. Method for manufacturing a probe
EP1009027A2 (en) * 1998-12-10 2000-06-14 Soshotech Co., Ltd. Multipoint conductive sheet
US20010028102A1 (en) * 2000-04-10 2001-10-11 Hans-Jurgen Hacke Electronic component having microscopically small contact areas and method for fabricating it
US20020055282A1 (en) * 2000-11-09 2002-05-09 Eldridge Benjamin N. Electronic components with plurality of contoured microelectronic spring contacts

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 07 31 March 1999 (1999-03-31) *

Also Published As

Publication number Publication date
FR2857782A1 (en) 2005-01-21
FR2857782B1 (en) 2005-10-14
WO2005010927A2 (en) 2005-02-03

Similar Documents

Publication Publication Date Title
WO2005011343A3 (en) Circuit board with embedded components and method of manufacture
EP1717857A3 (en) Semiconductor apparatus and manufacturing method thereof
EP1667510A4 (en) Method for manufacturing double-sided printed glass board
WO2006056648A3 (en) Electronics module and method for manufacturing the same
WO2008143358A1 (en) Electric device, connecting method and adhesive film
WO2006007166A3 (en) Device and method of manufacture of an interconnection structure for printed circuit boards
WO2006010639A3 (en) Method of manufacturing an electronic circuit device through a direct write technique
SG170113A1 (en) Integrated circuit package with open substrate
AU2003303968A1 (en) An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
EP1505858A3 (en) Circuit module and manufacturing method thereof
TW200746974A (en) Method for manufacturing wiring board
WO2007120959A3 (en) Method for planarizing vias formed in a substrate
WO2007001505A3 (en) Die module system and method
WO2008003287A3 (en) Electric component comprising a sensor element, method for encapsulating a sensor element and method for producing a board assembly
WO2005117508A3 (en) Printed wiring board with conductive constraining core including resin filled channels
WO2007050608A3 (en) Testing and recovery in a multilayer device
SG127856A1 (en) Interconnects with harmonized stress and methods for fabricating the same
TW200633631A (en) Electronic component with conductive film, conductive film, and manufacturing method thereof
TW200629998A (en) Printed circuit board and forming method thereof
WO2008133037A1 (en) Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle
EP1069811A3 (en) Multi-layer wiring board and method for manufacturing the same
EP1868422A3 (en) Electronic component built-in substrate and method of manufacturing the same
EP2048922A3 (en) COF Board
TW200739428A (en) Method for interconnecting tracks present on opposite sides of a substrate
US10187984B1 (en) Circuit board and method for making the same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase