WO2005017617A8 - Planarization films for advanced microelectronic applications and devices and methods of production thereof - Google Patents

Planarization films for advanced microelectronic applications and devices and methods of production thereof

Info

Publication number
WO2005017617A8
WO2005017617A8 PCT/US2003/034347 US0334347W WO2005017617A8 WO 2005017617 A8 WO2005017617 A8 WO 2005017617A8 US 0334347 W US0334347 W US 0334347W WO 2005017617 A8 WO2005017617 A8 WO 2005017617A8
Authority
WO
WIPO (PCT)
Prior art keywords
disclosed
solvent system
planarization composition
planarization
film
Prior art date
Application number
PCT/US2003/034347
Other languages
French (fr)
Other versions
WO2005017617A1 (en
Inventor
Wei Huang
Joseph Kennedy
Ronald Katsanes
Original Assignee
Honeywell Int Inc
Wei Huang
Joseph Kennedy
Ronald Katsanes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, Wei Huang, Joseph Kennedy, Ronald Katsanes filed Critical Honeywell Int Inc
Priority to AU2003286758A priority Critical patent/AU2003286758A1/en
Priority to EP03777970A priority patent/EP1649322A4/en
Priority to US10/518,201 priority patent/US7910223B2/en
Priority to JP2005507927A priority patent/JP4426526B2/en
Priority to TW92130707A priority patent/TWI262130B/en
Publication of WO2005017617A1 publication Critical patent/WO2005017617A1/en
Publication of WO2005017617A8 publication Critical patent/WO2005017617A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02—Macromolecular compounds
    • C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/12—Condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312—Organic layers, e.g. photoresist
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00482—Coating or impregnation materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31942—Of aldehyde or ketone condensation product

Abstract

A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.
PCT/US2003/034347 2003-07-17 2003-10-27 Planarization films for advanced microelectronic applications and devices and methods of production thereof WO2005017617A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2003286758A AU2003286758A1 (en) 2003-07-17 2003-10-27 Planarization films for advanced microelectronic applications and devices and methods of production thereof
EP03777970A EP1649322A4 (en) 2003-07-17 2003-10-27 Planarization films for advanced microelectronic applications and devices and methods of production thereof
US10/518,201 US7910223B2 (en) 2003-07-17 2003-10-27 Planarization films for advanced microelectronic applications and devices and methods of production thereof
JP2005507927A JP4426526B2 (en) 2003-07-17 2003-10-27 State-of-the-art planarization films for microelectronics applications and devices and methods for their manufacture
TW92130707A TWI262130B (en) 2003-07-17 2003-11-03 Planarization films for advanced microelectronic applications and devices and methods of production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48848403P 2003-07-17 2003-07-17
US60/488,484 2003-07-17

Publications (2)

Publication Number Publication Date
WO2005017617A1 WO2005017617A1 (en) 2005-02-24
WO2005017617A8 true WO2005017617A8 (en) 2006-06-01

Family

ID=34193075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/034347 WO2005017617A1 (en) 2003-07-17 2003-10-27 Planarization films for advanced microelectronic applications and devices and methods of production thereof

Country Status (8)

Country Link
US (1) US7910223B2 (en)
EP (1) EP1649322A4 (en)
JP (1) JP4426526B2 (en)
KR (1) KR101020164B1 (en)
CN (1) CN1802603A (en)
AU (1) AU2003286758A1 (en)
TW (1) TWI262130B (en)
WO (1) WO2005017617A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4723822B2 (en) * 2003-08-22 2011-07-13 旭有機材工業株式会社 Phenol resin molding material for sliding parts production and resin sliding parts
US9910523B2 (en) * 2015-12-28 2018-03-06 Lg Display Co., Ltd. Display device with connection interface for common signal lines placed under planarization layer

Family Cites Families (630)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930868A (en) * 1973-05-23 1976-01-06 The Richardson Company Light sensitive arylglyoxyacrylate compositions
JPS5421089B2 (en) 1973-05-29 1979-07-27
US3935339A (en) * 1973-07-16 1976-01-27 Exxon Production Research Company Method for coating particulate material thereof
US4092296A (en) 1973-08-13 1978-05-30 Skiff Russell A Epoxy resin compositions
SU548037A1 (en) 1973-10-08 1984-05-15 Предприятие П/Я Г-4059 Composition for making foamed plastic
US4011180A (en) 1974-01-30 1977-03-08 The Upjohn Company Novel cocatalyst system for trimerizing polyisocyanates
US3986991A (en) 1974-01-30 1976-10-19 The Upjohn Company Novel polyisocyanate trimerization catalyst
US4259430A (en) 1974-05-01 1981-03-31 International Business Machines Corporation Photoresist O-quinone diazide containing composition and resist mask formation process
US3933677A (en) * 1974-05-24 1976-01-20 E. I. Du Pont De Nemours & Company Preparation of aqueous dispersions of blocked aromatic polyisocyanates
US3954684A (en) 1974-07-09 1976-05-04 The Upjohn Company Foam process using tertiary amine/quaternary ammonium salt catalyst
US4058403A (en) 1975-11-12 1977-11-15 Hooker Chemicals & Plastics Corporation Refractory compositions
US4065314A (en) 1975-06-09 1977-12-27 The Richardson Company Photoreactive compositions comprising polymers containing alkoxyaromaticglyoxy groups
US4118535A (en) 1975-11-03 1978-10-03 General Electric Company Novel polyetheramide-imide epoxy resin blends
US4199651A (en) 1975-11-03 1980-04-22 General Electric Company Novel polyetheramide-imide phenolic resin blends
US4039487A (en) 1976-01-19 1977-08-02 The Upjohn Company Cellular isocyanurate polymer
US4066628A (en) * 1976-08-02 1978-01-03 Mitsubishi Chemical Industries Ltd. Oxazolidone catalyst
US4101465A (en) 1976-10-06 1978-07-18 The Upjohn Company A cocatalyst system for trimerizing isocyanates
US4074760A (en) * 1976-11-01 1978-02-21 The Dow Chemical Company Method for forming a consolidated gravel pack
US4081030A (en) 1976-11-01 1978-03-28 The Dow Chemical Company Aqueous based slurry with chelating agent and method of forming a consolidated gravel pack
US4075139A (en) * 1977-02-22 1978-02-21 The Upjohn Company Process of making a cured resole foam and product produced therefrom
US4151219A (en) 1977-05-11 1979-04-24 The Dow Chemical Company Vinyl ester resins containing polyoxyalkylene low profile additives
US4254006A (en) 1977-08-12 1981-03-03 Ford Motor Company Adhesion of vinyl plastisol coatings
JPS6044137B2 (en) 1977-11-14 1985-10-02 株式会社ブリヂストン laminate
US4268608A (en) 1977-11-25 1981-05-19 The Richardson Company Device for use in photochemical and photomechanical processes
US4338232A (en) 1977-12-27 1982-07-06 The Dow Chemical Company Radiation-curable resins
US4165413A (en) 1978-03-15 1979-08-21 Koppers Company, Inc. Process for producing phenolic foams with a uniform appearance
US4288565A (en) 1978-06-22 1981-09-08 Ciba-Geigy Corporation Storable, solid mixture for the preparation of plastics which are based on epoxide resin and are stable to hydrolysis, the use of this mixture for the preparation of such plastics and plastics obtained in this way
JPS5852491B2 (en) 1978-08-18 1983-11-22 株式会社ブリヂストン fire resistant laminate
JPS5852492B2 (en) 1978-08-18 1983-11-22 株式会社ブリヂストン fire resistant laminate
CH645410A5 (en) 1979-01-12 1984-09-28 Akzo Nv METHOD FOR PRODUCING WATER-BASED FIBERS.
GB2045682B (en) 1979-03-06 1983-02-23 Bridgestone Tire Co Ltd Fireproof laminates
US4604436A (en) 1979-06-12 1986-08-05 Occidental Chemical Corporation Process for metal modified phenolic novolac resin
US4304700A (en) 1979-08-27 1981-12-08 Celanese Corporation Two component aqueous based coating composition
US4323658A (en) 1980-09-02 1982-04-06 Texaco Inc. Polyisocyanurates from diols modified with epoxy resins
US4588419A (en) 1980-10-08 1986-05-13 Carborundum Abrasives Company Resin systems for high energy electron curable resin coated webs
US4332923A (en) 1980-10-23 1982-06-01 Dow Corning Corporation Composition for coating heat sensitive substrates
US4460674A (en) 1981-01-16 1984-07-17 Konishiroku Photo Industry Co., Ltd. Posi-type quinone diazide photosensitive composition with sensitizer therefor
DE3104991A1 (en) 1981-02-12 1982-08-19 Hoechst Ag, 6000 Frankfurt ANIONIC INTERFACE-ACTIVE COMPOUNDS BASED ON OXALKYLATED NAPHTHOL NOVOLAKES AND THEIR USE
JPS57192952A (en) 1981-05-25 1982-11-27 Konishiroku Photo Ind Co Ltd Composition of developing solution
GB2109392B (en) * 1981-11-03 1985-06-26 Sericol Group Ltd Photopolymerisable materials for use in producing screen printing stencils
US4788236A (en) 1981-12-29 1988-11-29 Union Carbide Corporation Process for producing particulate novolac resins and aqueous dispersions
US4499171A (en) * 1982-04-20 1985-02-12 Japan Synthetic Rubber Co., Ltd. Positive type photosensitive resin composition with at least two o-quinone diazides
JPS58190952A (en) 1982-04-30 1983-11-08 Fuji Photo Film Co Ltd Developing solution of photosensitive printing plate
JPS59152A (en) 1982-06-25 1984-01-05 Hitachi Chem Co Ltd Image forming resin composition
US4544801A (en) 1982-06-28 1985-10-01 International Business Machines Corporation Circuit board including multiple wire photosensitive adhesive
US4855333A (en) 1982-06-28 1989-08-08 International Business Machines Corp. Multiple wire photosensitive adhesive for wire embedment
US4451550A (en) 1982-07-29 1984-05-29 James River Graphics, Inc. Vesicular film and composition with phenoxy resin matrix
US4530948A (en) 1982-08-16 1985-07-23 The Dow Chemical Company Room temperature coating compositions containing hydrolyzed epoxy novolac resins
US4553596A (en) 1982-10-27 1985-11-19 Santrol Products, Inc. Well completion technique
US4797456A (en) * 1982-12-09 1989-01-10 The Dow Chemical Company Aqueous-dispersible cyclic sulfonium compounds that cure to form water-insoluble polymers
US4885355A (en) 1982-12-09 1989-12-05 The Dow Chemical Company Water-insoluble polymers from cyclic sulfonium compounds
DE3400164A1 (en) 1983-01-14 1984-07-19 Sandoz-Patent-GmbH, 7850 Lörrach LIQUID LOSS REDUCING ADDITIVES FOR PUNCHING LIQUIDS
GB2139369B (en) 1983-05-06 1987-01-21 Sericol Group Ltd Photosensitive systems showing visible indication of exposure
US4533713A (en) 1983-05-06 1985-08-06 Minnesota Mining And Manufacturing Company Fluoroaliphaticsulfonamides containing oxirane groups and/or N-β-hydroxyalkylene groups
US4526856A (en) 1983-05-23 1985-07-02 Allied Corporation Low striation positive diazoketone resist composition with cyclic ketone(s) and aliphatic alcohol as solvents
GB8329881D0 (en) 1983-11-09 1983-12-14 Shell Int Research Preparation of binders for coatings
GB8315230D0 (en) 1983-06-03 1983-07-06 Shell Int Research Polyglycidyl ethers
GB8405139D0 (en) 1984-02-28 1984-04-04 Shell Int Research Binders for thermosetting coating compositions
US4661436A (en) 1983-06-17 1987-04-28 Petrarch System, Inc. Process of forming high contrast resist pattern in positive photoagent material using alkalai developer with fluorocarbon surfactant
US4557979A (en) 1984-02-17 1985-12-10 Monsanto Company Process for deposition of resin dispersions on metal substrates
US4507428A (en) 1984-02-17 1985-03-26 Monsanto Company Aqueous dispersions of polyamines and poly(dihydrobenzoxazines)
US4513060A (en) 1984-02-08 1985-04-23 E. I. Du Pont De Nemours And Company Chlorosulfonated polyethylene coating composition
US4686248A (en) 1984-02-28 1987-08-11 Shell Oil Company Preparation of binders for coatings, thermosetting coating compositions and their use
US5188924A (en) * 1984-05-14 1993-02-23 Kabushiki Kaisha Toshiba Pattern forming method utilizing material with photoresist film underlayer and contrast enhancement overlayer containing photosensitive diazonium salt
US4572870A (en) * 1984-08-09 1986-02-25 E. I. Du Pont De Nemours And Company Chlorosulfonated ethylene vinyl acetate polymer coating composition
US4539347A (en) 1984-09-20 1985-09-03 Celanese Corporation Novolac based epoxy resin curing agents for use in aqueous systems
US4613561A (en) 1984-10-17 1986-09-23 James Marvin Lewis Method of high contrast positive O-quinone diazide photoresist developing using pretreatment solution
US4946733A (en) 1984-10-25 1990-08-07 Amoco Corporation Electric carrier devices and methods of manufacture
US4759970A (en) 1984-10-25 1988-07-26 Amoco Corporation Electronic carrier devices and methods of manufacture
DE3643241C2 (en) 1985-03-29 1990-07-26 Nisshinbo Industries, Inc., Tokio/Tokyo, Jp
US4617165A (en) 1985-05-13 1986-10-14 Tsang Peter H S Molded brake pad
US4626474A (en) 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination
US5418271A (en) 1985-07-05 1995-05-23 The Dow Chemical Company Coating composition comprising solids having reversible stress-induced fluidity
US4822722A (en) 1985-07-18 1989-04-18 Petrarch Systems, Inc. Process of using high contrast photoresist developer with enhanced sensitivity to form positive resist image
EP0210637B1 (en) 1985-07-31 1991-09-11 E.I. Du Pont De Nemours And Company Optical coating composition
US4650743A (en) 1985-07-31 1987-03-17 E. I. Du Pont De Nemours And Company Optical coating composition
JPS6231859A (en) 1985-08-01 1987-02-10 Fuji Photo Film Co Ltd Manufacture of printing plate
US4784937A (en) 1985-08-06 1988-11-15 Tokyo Ohka Kogyo Co., Ltd. Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant
JPS6232453A (en) 1985-08-06 1987-02-12 Tokyo Ohka Kogyo Co Ltd Developing solution for positive type photoresist
US4929536A (en) 1985-08-12 1990-05-29 Hoechst Celanese Corporation Image reversal negative working O-napthoquinone diazide and cross-linking compound containing photoresist process with thermal curing
US5256522A (en) 1985-08-12 1993-10-26 Hoechst Celanese Corporation Image reversal negative working O-naphthoquinone diazide and cross-linking compound containing photoresist process with thermal curing
US4621042A (en) 1985-08-16 1986-11-04 Rca Corporation Absorptive planarizing layer for optical lithography
SU1364051A1 (en) * 1985-11-20 1996-07-20 Л.Ф. Котлова Positive photoresist
US4624998A (en) 1985-12-30 1986-11-25 Dow Corning Corporation Silicone-modified epoxy resins having improved impact resistance
US4710449A (en) 1986-01-29 1987-12-01 Petrarch Systems, Inc. High contrast low metal ion positive photoresist developing method using aqueous base solutions with surfactants
US4732702A (en) 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
GB8607938D0 (en) 1986-04-01 1986-05-08 Shell Int Research Aqueous paint composition
US4699931A (en) 1986-04-25 1987-10-13 Olin Corporation Oxazolidone-modified isocyanurate foams and a composition and method for their production
US4774136A (en) 1986-05-02 1988-09-27 Kureha Kagaku Kogyo Kabushiki Kaisha Solvent for the chromogenic dye-precursor material for a pressure-sensitive recording paper sheet and a pressure-sensitive recording paper sheet prepared by using the solvent
JPS62257879A (en) 1986-05-02 1987-11-10 Kureha Chem Ind Co Ltd Dye solvent for pressure-sensitive recording paper and pressure-sensitive recording paper using said solvent
JPS62257880A (en) 1986-05-02 1987-11-10 Kureha Chem Ind Co Ltd Dye solvent for pressure-sensitive recording paper and pressure sensitive recording paper using said solvent
US4785884A (en) 1986-05-23 1988-11-22 Acme Resin Corporation Consolidation of partially cured resin coated particulate material
US4690955A (en) 1986-06-30 1987-09-01 Union Carbide Corporation Polyether silicone copolymers with mixed hydroxy alkoxy capping for stabilizing high solid content, molded, flexible urethane foam
GB8616162D0 (en) 1986-07-02 1986-08-06 Shell Int Research Cationic coating compositions
JPH07113773B2 (en) * 1986-07-04 1995-12-06 株式会社日立製作所 Pattern formation method
JPH0638159B2 (en) 1986-07-18 1994-05-18 東京応化工業株式会社 Developer for positive photoresist
GB8621491D0 (en) 1986-09-05 1986-10-15 Shell Int Research Cationic coating compositions
JPS63103099A (en) * 1986-10-17 1988-05-07 Kao Corp Organic polymer composite zinc and zinc alloy plated film and production thereof
US4769437A (en) 1986-12-22 1988-09-06 Blount David H Process for the production of phenolic resins
US4711911A (en) 1986-12-22 1987-12-08 Blount David H Process for the production of phenolic resins
US5128230A (en) 1986-12-23 1992-07-07 Shipley Company Inc. Quinone diazide containing photoresist composition utilizing mixed solvent of ethyl lactate, anisole and amyl acetate
GB8701057D0 (en) 1987-01-16 1987-02-18 Shell Int Research Preparation of carboxylated amide binders
US5364731A (en) 1987-01-30 1994-11-15 Konica Corporation Multi-color transfer image forming method to form color proofs
US5236784A (en) 1987-02-09 1993-08-17 Kabushiki Kaisha Sankyo Seiki Seisakusho Bearing material and plastic bearing
EP0279630B1 (en) 1987-02-16 1993-10-13 Konica Corporation Developer for light-sensitive lithographic printing plate capable of processing commonly the negative-type and the positive type and developer composition for light-sensitive material
US6048799A (en) * 1987-02-27 2000-04-11 Lucent Technologies Inc. Device fabrication involving surface planarization
US4857566A (en) 1987-04-21 1989-08-15 The Dow Chemical Company Curable latex composition, films and foams formed therefrom and method for curing the composition
US5624978A (en) 1987-05-11 1997-04-29 Morton International, Inc. Conductive, internally lubricated barrier coating for metal
JPS6476965A (en) 1987-06-22 1989-03-23 Kureha Chemical Ind Co Ltd Carbonaceous cylindrical unit and production thereof
CA1329719C (en) 1987-07-31 1994-05-24 Tadao Toyama Lithographic printing plate and method of treating the same
US4766158A (en) 1987-08-03 1988-08-23 Olin Corporation Urethane-containing oxazolidone-modified isocyanurate foams and a composition and method for their production
JPS6451467A (en) 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
US4746683A (en) 1987-09-29 1988-05-24 Union Carbide Corporation Polyether silicone copolymers with secondary or tertiary hydroxy termination for stabilizing high resiliency urethane foam
US4769174A (en) 1987-09-29 1988-09-06 Union Carbide Corporation Polyether silicone copolymers with secondary or tertiary hydroxy terminated for stabilizing high resiliency urethane foam
US4772407A (en) 1987-12-02 1988-09-20 Lord Corporation Electrorheological fluids
JPH01147449A (en) 1987-12-03 1989-06-09 Konica Corp Silver halide photographic sensitive material for laser source
JPH0791475B2 (en) * 1988-02-29 1995-10-04 東レ・ダウコーニング・シリコーン株式会社 Curable resin composition
US4885319A (en) 1988-02-29 1989-12-05 Gaf Corporation Solvent resistant irradiation curable coatings
JP2626992B2 (en) 1988-05-10 1997-07-02 富士写真フイルム株式会社 Developer composition for photosensitive lithographic printing plate and developing method
US5238771A (en) 1988-05-31 1993-08-24 Konica Corporation Lithographic printing plate utilizing aluminum substrate with photosensitive layer containing o-naphthoquinonediazide sulfonic acid ester, alkali soluble resin and select additive
US4976813A (en) 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
US5045141A (en) 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
EP0353873B1 (en) 1988-07-11 1993-12-29 Konica Corporation Photsensitive composition
JP2585070B2 (en) 1988-08-02 1997-02-26 日本ペイント株式会社 Image forming method
CA1334897C (en) 1988-08-02 1995-03-28 Mamoru Seio Electrodeposition coating composition and image-forming method using the same
DE3837500A1 (en) 1988-11-04 1990-05-23 Hoechst Ag NEW RADIATION-SENSITIVE COMPOUNDS, MADE BY THIS RADIATION-SENSITIVE MIXTURE AND RECORDING MATERIAL
US5138424A (en) 1988-11-07 1992-08-11 Brewer Science, Inc. Positive working polyamic acid/imide photoresist compositions and their use as dielectrics
US5024922A (en) 1988-11-07 1991-06-18 Moss Mary G Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake
EP0373510A3 (en) 1988-12-13 1990-07-11 Konica Corporation Process for preparing a light-sensitive lithographic printing plate
US5340888A (en) 1988-12-22 1994-08-23 Borden Inc. Phenolic resin composition
US4962165A (en) 1989-01-12 1990-10-09 Rohm And Haas Company Process for making silicone particles
US4933421A (en) 1989-03-30 1990-06-12 Shell Oil Company Epoxy resin composition containing metal tetrafluoroborate and boron ester
US4981882A (en) * 1989-03-31 1991-01-01 Union Carbide Chemicals And Plastics Company Inc. Method for enhancing encapsulation efficiency in coating particles in aqueous dispersions
JP2788053B2 (en) 1989-04-07 1998-08-20 関西ペイント株式会社 Cationic electrodeposition paint
US5260161A (en) 1989-05-06 1993-11-09 Konica Corporation Photosensitive composition and photosensitive lithographic printing plate comprising in admixture a tetrapolymer and a diazo resin
US5391465A (en) * 1989-06-20 1995-02-21 Rohm And Haas Company Method of using selected photoactive compounds in high resolution, acid hardening photoresists with near ultraviolet radiation wherein the photoresist comprise conventional deep UV photoacid generators
US4950433A (en) 1989-07-26 1990-08-21 Borden, Inc. Method of spray drying phenol-formaldehyde resin compositions
US5047275A (en) 1989-07-26 1991-09-10 Borden, Inc. Spray dried phenol-formaldehyde resin compositions
US5019618A (en) 1989-07-26 1991-05-28 Borden, Inc. Spray dried phenol-formaldehyde resin compositions
US5166038A (en) 1989-07-27 1992-11-24 International Business Machines Corporation Etch resistant pattern formation via interfacial silylation process
US5279922A (en) * 1989-08-07 1994-01-18 Konica Corporation Light-sensitive coating liquid
US5207954A (en) 1989-09-25 1993-05-04 Union Carbide Chemicals & Plastics Technology Corporation Method of making coreactable powdered coatings
US5006575A (en) 1989-10-20 1991-04-09 E. I. Du Pont De Nemours And Company Die attach adhesive composition
JP2717602B2 (en) 1990-01-16 1998-02-18 富士写真フイルム株式会社 Photosensitive composition
US5225309A (en) 1990-02-08 1993-07-06 Konica Corporation Light-sensitive litho printing plate with cured diazo primer layer, diazo resin/salt light-sensitive layer containing a coupler and silicone rubber overlayer
US5464913A (en) 1990-03-15 1995-11-07 Kansai Paint Co., Ltd. Cycloaliphatic epoxy and primary hydroxyl groups-containing cationic resin
US5252375A (en) 1990-03-22 1993-10-12 Interface, Inc. Permanent stain resistant treatment for polyamide fibers
US5188767A (en) * 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
US5279918A (en) * 1990-05-02 1994-01-18 Mitsubishi Kasei Corporation Photoresist composition comprising a quinone diazide sulfonate of a novolac resin
EP0459395B1 (en) 1990-05-29 1999-08-18 Sumitomo Bakelite Company Limited Positive photo-sensitive resin composition
US5066684A (en) 1990-06-08 1991-11-19 The United States Of America As Represented By The United States Department Of Energy Low density microcellular foams
US5116883A (en) 1990-06-08 1992-05-26 The United States Of America As Represented By The United States Department Of Energy Low density microcellular foams
ATE185000T1 (en) 1990-06-27 1999-10-15 Coates Brothers Plc IMAGE GENERATION METHOD
JPH0480758A (en) 1990-07-23 1992-03-13 Fuji Photo Film Co Ltd Photosensitive composition
US5089547A (en) * 1990-08-06 1992-02-18 Eastman Kodak Company Cross-linked low surface adhesion additives for toner compositions
US5206349A (en) 1990-08-10 1993-04-27 Toyo Gosei Kogy Co., Ltd. Aromatic diazo compounds and photosensitive compositions using the same
US5284912A (en) * 1990-08-16 1994-02-08 Japan Synthetic Rubber Co., Ltd. Thermoset resin with polyunsaturated monomer-grafted seed particles
US5262449A (en) 1990-09-10 1993-11-16 Isp Investments Inc. Radiation curable coating compositions
DE4134526A1 (en) 1990-10-18 1992-05-14 Toyo Gosei Kogyo Kk Positive photoresist compsns. - contain alkali-soluble resin and, as light-sensitive additive, ester or amide of 1,2-naphthoquinone-(2)-di:azide-6-sulphonic acid
DE69130701T2 (en) 1990-10-29 1999-08-26 Toyo Gosei Kogyo Kk Photosensitive colored resin, colored image, method of manufacturing color filters and method of manufacturing a black matrix
US5102856A (en) 1990-11-07 1992-04-07 The Standard Register Company High solids self-contained printing ink
CA2083868A1 (en) 1990-11-14 1993-06-12 Chong Soo Lee Coated abrasive having a coating of an epoxy resin coatable from water
US5204385A (en) 1990-11-27 1993-04-20 Reichhold Chemicals, Inc. Water reducible epoxy resin curing agent
US5344856A (en) 1990-12-17 1994-09-06 The Dow Chemical Company Water-emulsifiable epoxy resin composition
US5236472A (en) 1991-02-22 1993-08-17 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising an aminoplast binder
JPH04274428A (en) * 1991-03-01 1992-09-30 Nippon Paint Co Ltd Photosensitive composition for offeset printing
EP0507271A3 (en) 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5316850A (en) 1991-04-12 1994-05-31 Peach State Labs, Inc. Permanently stain resistant textile fibers
US5403695A (en) 1991-04-30 1995-04-04 Kabushiki Kaisha Toshiba Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups
US5180689A (en) * 1991-09-10 1993-01-19 Taiwan Semiconductor Manufacturing Company Tapered opening sidewall with multi-step etching process
CA2078361A1 (en) 1991-09-17 1993-03-18 Seiji Arimatsu Method for directly making printing plates using ink-jet system
US5171722A (en) 1991-10-09 1992-12-15 University Of Florida SiC fibers having low oxygen content and methods of preparation
US5276126A (en) * 1991-11-04 1994-01-04 Ocg Microelectronic Materials, Inc. Selected novolak resin planarization layer for lithographic applications
US5370965A (en) 1991-12-10 1994-12-06 Fuji Photo Film Co., Ltd. Positive-working light-sensitive composition containing diazonium salt and novolak resin
US5215147A (en) 1991-12-19 1993-06-01 Mobil Oil Corporation Method for selectively closing an intermediate zone of a near wellbore area
US5364925A (en) 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
WO1993015157A1 (en) 1992-01-31 1993-08-05 Kansai Paint Co., Ltd. Resin composition for water-base coating material
JP3391471B2 (en) 1992-02-25 2003-03-31 住友化学工業株式会社 Positive resist composition
JPH05249666A (en) 1992-03-05 1993-09-28 Sumitomo Chem Co Ltd Positive type photoresist composition
JPH05295318A (en) 1992-04-15 1993-11-09 Kansai Paint Co Ltd Resin composition for water-base paint
US5260357A (en) 1992-04-30 1993-11-09 The Dexter Corporation Corrosion resistant waterbone adhesive primers
US5378740A (en) * 1992-04-30 1995-01-03 The Dexter Corporation Waterborne epoxy derivative composition
JPH05323604A (en) 1992-05-27 1993-12-07 Sumitomo Chem Co Ltd Positive type resist composition
US5756256A (en) * 1992-06-05 1998-05-26 Sharp Microelectronics Technology, Inc. Silylated photo-resist layer and planarizing method
JP2790595B2 (en) 1992-06-16 1998-08-27 株式会社日本触媒 Resin particles, production method and use thereof
US5330883A (en) 1992-06-29 1994-07-19 Lsi Logic Corporation Techniques for uniformizing photoresist thickness and critical dimension of underlying features
US5198474A (en) 1992-06-30 1993-03-30 Union Carbide Chemicals & Plastics Technology Corporation Silicone surfactants having t-butyl terminated polyether pendants for use in high resilience polyurethane foam
US5444098A (en) 1992-07-13 1995-08-22 Recticel Mainly closed cell phenolic foam and process for producing this foam
US5266611A (en) 1992-07-21 1993-11-30 The Dexter Corporation Waterborne epoxy derived adhesive primers
JP3315757B2 (en) 1992-07-24 2002-08-19 東洋合成工業株式会社 Photosensitive polyfunctional aromatic diazo compound and photosensitive composition using the same
US5431777A (en) 1992-09-17 1995-07-11 International Business Machines Corporation Methods and compositions for the selective etching of silicon
EP0669960B1 (en) 1992-11-20 1998-09-02 The Dow Chemical Company Polyurea polymers having improved high temperature stability and method of making same
JPH06164102A (en) 1992-11-25 1994-06-10 Nippon Paint Co Ltd Surface treatment method for electrodeposition type photosensitive resin coating
JPH06204162A (en) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp Manufacture of semiconductor device and resist composition to be used in the same
US5269890A (en) 1992-12-31 1993-12-14 The United States Of America As Represented By The Secretary Of The Navy Electrochemical process and product therefrom
US5395729A (en) 1993-04-30 1995-03-07 E. I. Du Pont De Nemours And Company Laser-induced thermal transfer process
US5401606A (en) 1993-04-30 1995-03-28 E. I. Du Pont De Nemours And Company Laser-induced melt transfer process
US5413894A (en) 1993-05-07 1995-05-09 Ocg Microelectronic Materials, Inc. High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions
JPH0743522A (en) * 1993-05-28 1995-02-14 Nippon Oil Co Ltd Method for forming, substrate having light-shading layer, substrate having light-shading layer, counter electrode substrate for black-and-white display thin film transistor(tft) array substrate, and black-and-white liquid crystal display device
US5886092A (en) 1993-06-21 1999-03-23 Comalco Aluminuim Limited Binder systems
JP3078153B2 (en) 1993-07-08 2000-08-21 富士写真フイルム株式会社 Photosensitive composition
JP2950714B2 (en) * 1993-09-28 1999-09-20 シャープ株式会社 Solid-state imaging device and method of manufacturing the same
JP3318408B2 (en) * 1993-10-06 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 Powdered silicone cured product and method for producing the same
US6037968A (en) 1993-11-09 2000-03-14 Markem Corporation Scanned marking of workpieces
US5757313A (en) 1993-11-09 1998-05-26 Markem Corporation Lacer-induced transfer printing medium and method
DE69416984T3 (en) * 1993-12-21 2007-06-21 Basf Corp., Southfield Cyclic carbonate curable coating composition
JP2715881B2 (en) 1993-12-28 1998-02-18 日本電気株式会社 Photosensitive resin composition and pattern forming method
US5866304A (en) * 1993-12-28 1999-02-02 Nec Corporation Photosensitive resin and method for patterning by use of the same
JP2776273B2 (en) 1994-01-31 1998-07-16 日本電気株式会社 Monomer having vinyl group
JP3434340B2 (en) * 1994-03-29 2003-08-04 東京応化工業株式会社 High-sensitivity positive photoresist composition
US5480603A (en) * 1994-05-19 1996-01-02 The Dow Chemical Company Method for preparing preforms for molding processes
JP3464527B2 (en) 1994-05-27 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 Curable resin composition and cured resin
US6025059A (en) * 1998-02-18 2000-02-15 Mobil Oil Corporation Coated plastic substrates having wet-scratch resistance
DE69525883T2 (en) 1994-07-04 2002-10-31 Fuji Photo Film Co Ltd Positive photoresist composition
US5858547A (en) * 1994-07-06 1999-01-12 Alliedsignal, Inc. Novolac polymer planarization films for microelectronic structures
EP0720057A4 (en) * 1994-07-11 1997-01-22 Konishiroku Photo Ind Original form for lithographic plate and process for preparing lithographic plate
KR100195595B1 (en) 1994-07-11 1999-06-15 니시무로 타이죠 Photosensitive material
JP2770740B2 (en) 1994-07-14 1998-07-02 日本電気株式会社 Sulfonium salt compound having bridged cyclic alkyl group and photoacid generator
WO1996013468A1 (en) 1994-10-31 1996-05-09 Tower Technologies (Proprietary) Limited Method of preparing an exfoliated vermiculite for the manufacture of a finished product
US5508328A (en) 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
JP2951554B2 (en) 1994-11-29 1999-09-20 日本ペイント株式会社 Flexographic printing plate material resin composition
US5527839A (en) 1994-12-13 1996-06-18 Air Products And Chemicals, Inc. Self-emulsifying epoxy curing agent based on the reaction product of epoxy resin and polyether polyol
GB2296125B (en) 1994-12-16 1998-04-29 Moli Energy Pre-graphitic carbonaceous insertion compounds and use as anodes in rechargeable batteries
US6441122B1 (en) 1995-01-05 2002-08-27 Johns Manville International, Inc. Melamine in urea-extended phenol/formaldehyde fiberglass binders
JP2856116B2 (en) 1995-01-26 1999-02-10 日本電気株式会社 Vinyl monomer, polymer, photoresist composition and pattern forming method using the same
US5755910A (en) 1995-04-06 1998-05-26 Mitsubishi Chemical Corporation Method of transferring a color proof
GB2299585A (en) 1995-04-06 1996-10-09 Coates Brothers Plc Coating compositions
US5736619A (en) 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
US5534356A (en) 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
US5605944A (en) * 1995-04-27 1997-02-25 Union Camp Corporation Heat-resistant adhesive for use especially in making sterilizable packaging
US5556732A (en) 1995-05-30 1996-09-17 Xerox Corporation Processes for preparing toners with selectable gloss
US6204453B1 (en) 1998-12-02 2001-03-20 International Business Machines Corporation Two signal one power plane circuit board
US6750405B1 (en) 1995-06-07 2004-06-15 International Business Machines Corporation Two signal one power plane circuit board
JPH0966666A (en) 1995-06-19 1997-03-11 Fuji Photo Film Co Ltd Recording material
JPH0954203A (en) 1995-08-17 1997-02-25 Nippon Oil Co Ltd Light shielding layer, formation of light shielding layer and production of substrate
US5883164A (en) 1995-09-13 1999-03-16 Katoot; Mohammad W. Polymer additives for forming objects
US5872168A (en) * 1995-09-13 1999-02-16 Katoot; Mohammad W. Polymer additives for forming objects
US5693684A (en) 1995-10-24 1997-12-02 Jiffy Foam, Inc. Sprayable, foam-forming, phenolic resin compostion, method of spraying a foam-forming, phenolic resin composition, and a sprayed foam
US6528157B1 (en) 1995-11-01 2003-03-04 Borden Chemical, Inc. Proppants with fiber reinforced resin coatings
US5670571A (en) 1995-11-03 1997-09-23 Georgia-Pacific Resins, Inc. Process for producing a dispersed novolac resin and use in a binder system for thermal insulation
JPH09124954A (en) 1995-11-06 1997-05-13 Nippon Oil Co Ltd Curable composition
US5820932A (en) * 1995-11-30 1998-10-13 Sun Chemical Corporation Process for the production of lithographic printing plates
JP2845225B2 (en) 1995-12-11 1999-01-13 日本電気株式会社 Polymer compound, photosensitive resin composition and pattern forming method using the same
JP2907144B2 (en) 1995-12-11 1999-06-21 日本電気株式会社 Acid derivative compound, polymer compound, photosensitive resin composition using the same, and pattern forming method
US5698269A (en) 1995-12-20 1997-12-16 Ppg Industries, Inc. Electrostatic deposition of charged coating particles onto a dielectric substrate
US5830274A (en) 1995-12-20 1998-11-03 Ppg Industries, Inc. Electrostatic deposition of charged coating particles onto a dielectric substrate
US5681361A (en) 1996-01-11 1997-10-28 Minnesota Mining And Manufacturing Company Method of making an abrasive article and abrasive article produced thereby
US6383652B1 (en) 1996-01-30 2002-05-07 Tt Technologies, Inc. Weatherable building products
JP3589365B2 (en) 1996-02-02 2004-11-17 富士写真フイルム株式会社 Positive image forming composition
JP3591672B2 (en) * 1996-02-05 2004-11-24 富士写真フイルム株式会社 Positive photosensitive composition
US6225376B1 (en) 1996-02-29 2001-05-01 The Dow Chemical Company In-situ emulsified reactive epoxy polymer compositions
US6245835B1 (en) 1996-02-29 2001-06-12 The Dow Chemical Company Polymeric amines and reactive epoxy polymer compositions
TW322680B (en) * 1996-02-29 1997-12-11 Tokyo Ohka Kogyo Co Ltd
US5695907A (en) 1996-03-14 1997-12-09 Minnesota Mining And Manufacturing Company Laser addressable thermal transfer imaging element and method
US5691098A (en) 1996-04-03 1997-11-25 Minnesota Mining And Manufacturing Company Laser-Induced mass transfer imaging materials utilizing diazo compounds
US5747217A (en) 1996-04-03 1998-05-05 Minnesota Mining And Manufacturing Company Laser-induced mass transfer imaging materials and methods utilizing colorless sublimable compounds
US5981144A (en) 1996-04-09 1999-11-09 Agfa-Gevaert, N.V. Heat sensitive imaging element and a method for producing lithographic plates therewith
US5993945A (en) 1996-05-30 1999-11-30 International Business Machines Corporation Process for high resolution photoimageable dielectric
US5886102A (en) 1996-06-11 1999-03-23 Shipley Company, L.L.C. Antireflective coating compositions
JP3645362B2 (en) * 1996-07-22 2005-05-11 富士写真フイルム株式会社 Negative image recording material
US5866237A (en) * 1996-08-23 1999-02-02 International Business Machines Corporation Organic electronic package and method of applying palladium-tin seed layer thereto
JPH1088028A (en) * 1996-09-02 1998-04-07 J M Huber Corp Silane-treated clay product, preparation thereof, and composition thereof
WO1998010013A1 (en) 1996-09-02 1998-03-12 J.M. Huber Corporation Silane-treated clay production method, silane-treated clay and composition containing same
US5705309A (en) * 1996-09-24 1998-01-06 Eastman Kodak Company Photosensitive composition and element containing polyazide and an infrared absorber in a photocrosslinkable binder
US5705322A (en) * 1996-09-30 1998-01-06 Eastman Kodak Company Method of providing an image using a negative-working infrared photosensitive element
US6117610A (en) 1997-08-08 2000-09-12 Kodak Polychrome Graphics Llc Infrared-sensitive diazonaphthoquinone imaging composition and element containing non-basic IR absorbing material and methods of use
US5705308A (en) * 1996-09-30 1998-01-06 Eastman Kodak Company Infrared-sensitive, negative-working diazonaphthoquinone imaging composition and element
US5766826A (en) 1996-10-11 1998-06-16 Eastman Kodak Company Alkaline developing composition and method of use to process lithographic printing plates
US5888283A (en) 1996-11-05 1999-03-30 The Standard Register Company High solids direct thermal ink composition and method of making and using same
US5910358A (en) 1996-11-06 1999-06-08 The Dow Chemical Company PVC-free foamed flooring and wall coverings
US5919601A (en) 1996-11-12 1999-07-06 Kodak Polychrome Graphics, Llc Radiation-sensitive compositions and printing plates
US5782300A (en) 1996-11-13 1998-07-21 Schlumberger Technology Corporation Suspension and porous pack for reduction of particles in subterranean well fluids, and method for treating an underground formation
US6060222A (en) 1996-11-19 2000-05-09 Kodak Polcyhrome Graphics Llc 1Postitve-working imaging composition and element and method of forming positive image with a laser
JP3190967B2 (en) 1996-12-16 2001-07-23 住友ベークライト株式会社 Alkaline aqueous solution and pattern forming method of photosensitive resin composition
US5853954A (en) 1996-12-18 1998-12-29 Clariant Finance (Bvi) Limited Fractionated novolak resin and photoresist composition therefrom
US5910559A (en) 1996-12-18 1999-06-08 Clariant Finance (Bvi) Limited Fractionated novolak resin from cresol-formaldehyde reaction mixture and photoresist composition therefrom
US6068963A (en) 1997-01-20 2000-05-30 Fuji Photo Film Co., Ltd. Negative-type image recording materials
US5853894A (en) 1997-02-03 1998-12-29 Cytonix Corporation Laboratory vessel having hydrophobic coating and process for manufacturing same
US6495624B1 (en) 1997-02-03 2002-12-17 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US6156389A (en) * 1997-02-03 2000-12-05 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US7268179B2 (en) 1997-02-03 2007-09-11 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US5939236A (en) 1997-02-07 1999-08-17 Shipley Company, L.L.C. Antireflective coating compositions comprising photoacid generators
GB9702568D0 (en) 1997-02-07 1997-03-26 Horsell Graphic Ind Ltd Planographic printing
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6063544A (en) 1997-03-21 2000-05-16 Kodak Polychrome Graphics Llc Positive-working printing plate and method of providing a positive image therefrom using laser imaging
TW372337B (en) 1997-03-31 1999-10-21 Mitsubishi Electric Corp Material for forming micropattern and manufacturing method of semiconductor using the material and semiconductor apparatus
JP2943759B2 (en) 1997-04-16 1999-08-30 日本電気株式会社 (Meth) acrylate, polymer, photoresist composition and pattern forming method using the same
JP3798504B2 (en) 1997-04-21 2006-07-19 富士写真フイルム株式会社 Negative type image recording material
US6165676A (en) * 1997-04-22 2000-12-26 Konica Corporation Light sensitive composition, image forming material and image forming material manufacturing method
US6197378B1 (en) 1997-05-05 2001-03-06 3M Innovative Properties Company Treatment of fibrous substrates to impart repellency, stain resistance, and soil resistance
US6022670A (en) * 1997-05-08 2000-02-08 International Business Machines Corporation Process for high resolution photoimageable dielectric
US5948591A (en) 1997-05-27 1999-09-07 Agfa-Gevaert, N.V. Heat sensitive imaging element and a method for producing lithographic plates therewith
US6083662A (en) 1997-05-30 2000-07-04 Kodak Polychrome Graphics Llc Methods of imaging and printing with a positive-working infrared radiation sensitive printing plate
US5811221A (en) 1997-05-30 1998-09-22 Kodak Polychrome Graphics, Llc Alkaline developing composition and method of use to process lithographic printing plates
US6136513A (en) 1997-06-13 2000-10-24 International Business Machines Corporation Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
US5997997A (en) 1997-06-13 1999-12-07 International Business Machines Corp. Method for reducing seed deposition in electroless plating
JP3779444B2 (en) 1997-07-28 2006-05-31 富士写真フイルム株式会社 Positive photosensitive composition for infrared laser
WO1999008321A1 (en) 1997-08-07 1999-02-18 Matsushita Electric Works, Ltd. Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same
JPH1159007A (en) 1997-08-26 1999-03-02 Fuji Photo Film Co Ltd Light-sensitive lithographic printing plate
US6261740B1 (en) 1997-09-02 2001-07-17 Kodak Polychrome Graphics, Llc Processless, laser imageable lithographic printing plate
US6060217A (en) 1997-09-02 2000-05-09 Kodak Polychrome Graphics Llc Thermal lithographic printing plates
JP3486341B2 (en) 1997-09-18 2004-01-13 株式会社東芝 Photosensitive composition and pattern forming method using the same
US5877240A (en) 1997-09-26 1999-03-02 Owens Corning Fiberglas Technology, Inc. Sizing composition for glass fibers for reinforcement of engineered thermoplastic materials
US5928836A (en) * 1997-09-29 1999-07-27 Clariant Finance (Bvi) Limited Fractionated novolak resin copolymer and photoresist composition therefrom
US6251563B1 (en) 1997-10-08 2001-06-26 Agfa-Gevaert, N.V. Method for making positive working printing plates from a heat mode sensitive image element
US20010004490A1 (en) 1997-10-08 2001-06-21 Michael R. Wait Multiple layered waterproofing coating
US6060218A (en) 1997-10-08 2000-05-09 Agfa-Gevaert, N.V. Method for making positive working printing plates from a heat mode sensitive image element
US6235451B1 (en) 1997-10-08 2001-05-22 Agfa-Gevaert Method for making positive working printing plates from a heat mode sensitive image element
US6165689A (en) 1997-10-08 2000-12-26 Agfa-Gevaert, N.V. Method for making positive working printing plates from a light sensitive imaging element
US6083663A (en) 1997-10-08 2000-07-04 Agfa-Gevaert, N.V. Method for making positive working printing plates from a heat mode sensitive image element
US6004728A (en) 1997-10-08 1999-12-21 Agfa-Gevaert, N.V. Method for making positive working printing plates from a heat mode sensitive image element
US5955413A (en) 1997-10-24 1999-09-21 3M Innovative Properties Company Carpet cleaning and reapplication system based on methacrylic acid polymer, sequestrant, and anionic surfactant
US6171774B1 (en) * 1997-11-13 2001-01-09 Konica Corporation Silver halide photographic light-sensitive material
EP0918048A1 (en) 1997-11-19 1999-05-26 Wako Pure Chemical Industries, Ltd. A novel monomer and a polymer obtained therefrom
US6143472A (en) 1998-11-18 2000-11-07 Wako Pure Chemical Industries, Ltd. Resist composition and a method for formation of a pattern using the composition
US6025057A (en) * 1997-12-17 2000-02-15 International Business Machines Corporation Organic electronic package and method of applying palladium-tin seed layer thereto
KR100444134B1 (en) 1997-12-26 2004-08-09 구레하 가가쿠 고교 가부시키가이샤 Polymer electrolyte and nonaqueous battery containing the same
JP3189773B2 (en) 1998-01-09 2001-07-16 三菱電機株式会社 Method of forming resist pattern, method of manufacturing semiconductor device using the same, and semiconductor device
US6027853A (en) * 1998-01-16 2000-02-22 Olin Microelectronic Chemicals, Inc. Process for preparing a radiation-sensitive composition
US6511782B1 (en) * 1998-01-23 2003-01-28 Agfa-Gevaert Heat sensitive element and a method for producing lithographic plates therewith
US6680440B1 (en) * 1998-02-23 2004-01-20 International Business Machines Corporation Circuitized structures produced by the methods of electroless plating
GB2334727A (en) 1998-02-28 1999-09-01 Horsell Graphic Ind Ltd Planographic printing member
US6342336B2 (en) * 1998-03-06 2002-01-29 Agfa-Gevaert Heat mode sensitive imaging element for making positive working printing plates
US6153353A (en) 1998-03-14 2000-11-28 Agfa-Gevaert, N.V. Method for making positive working printing plates from a heat mode sensitive imaging element
US6045963A (en) 1998-03-17 2000-04-04 Kodak Polychrome Graphics Llc Negative-working dry planographic printing plate
US6444393B2 (en) 1998-03-26 2002-09-03 Fuji Photo Film Co., Ltd. Anionic infrared-ray absorbing agent, photosensitive composition and planographic printing plate precursor using same
JP3853967B2 (en) * 1998-04-13 2006-12-06 富士写真フイルム株式会社 Thermosetting composition, lithographic printing plate precursor using the same, and sulfonate compound
US6569594B2 (en) 1998-04-15 2003-05-27 Agfa-Gevaert Heat mode sensitive imaging element for making positive working printing plates
US6391517B1 (en) 1998-04-15 2002-05-21 Agfa-Gevaert Heat mode sensitive imaging element for making positive working printing plates
US6340815B1 (en) * 1998-04-15 2002-01-22 Agfa-Gevaert Heat mode sensitive imaging element for making positive working printing plates
US6447977B2 (en) 1998-04-15 2002-09-10 Agfa-Gevaert Heat mode sensitive imaging element for making positive working printing plates
US6192799B1 (en) * 1998-04-15 2001-02-27 Agfa-Gevaert, N.V. Heat mode sensitive imaging element for making positive working printing plates
US6146556A (en) 1998-04-29 2000-11-14 Katoot; Mohammad W. Polymer additives for forming objects
US6221989B1 (en) 1998-05-14 2001-04-24 Shin-Etsu Chemical Co., Ltd. Polymers and positive resist compositions
US6258510B1 (en) 1998-05-21 2001-07-10 Fuji Photo Film Co., Ltd. Photosensitive planographic printing plate precursor
US6152036A (en) 1998-05-28 2000-11-28 Agfa-Gevaert, N.V. Heat mode sensitive imaging element for making positive working printing plates
JP3796982B2 (en) * 1998-06-02 2006-07-12 住友化学株式会社 Positive resist composition
JP3606738B2 (en) 1998-06-05 2005-01-05 東京応化工業株式会社 Treatment liquid after ashing and treatment method using the same
US6455476B1 (en) 1998-06-09 2002-09-24 Henkel Corporation Composition and process for lubricated plastic working of metals
US6016870A (en) * 1998-06-11 2000-01-25 Halliburton Energy Services, Inc. Compositions and methods for consolidating unconsolidated subterranean zones
US5945493A (en) 1998-06-19 1999-08-31 E. I. Du Pont De Nemours And Company Fluorine-containing maleic acid terpolymer soil and stain resists
US6352811B1 (en) 1998-06-23 2002-03-05 Kodak Polychrome Graphics Llc Thermal digital lithographic printing plate
KR100572646B1 (en) 1998-07-17 2006-04-24 제이에스알 가부시끼가이샤 A Polyimide-type Composite and Electronic Elements Using the Same, and Aqueous Polyimide-type Dispersions
WO2000005302A1 (en) 1998-07-22 2000-02-03 Borden Chemical, Inc. Composite proppant, composite filtration media and methods for making and using same
US6406789B1 (en) 1998-07-22 2002-06-18 Borden Chemical, Inc. Composite proppant, composite filtration media and methods for making and using same
US6582819B2 (en) 1998-07-22 2003-06-24 Borden Chemical, Inc. Low density composite proppant, filtration media, gravel packing media, and sports field media, and methods for making and using same
JP3365318B2 (en) 1998-08-12 2003-01-08 信越化学工業株式会社 Polymer compound, resist material and pattern forming method
AU757644B2 (en) 1998-09-09 2003-02-27 Kuraray Co., Ltd. Antifouling structure having effect of preventing attachment of aquatic organisms thereto
MY144573A (en) 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
US6066889A (en) 1998-09-22 2000-05-23 International Business Machines Corporation Methods of selectively filling apertures
US6204456B1 (en) 1998-09-24 2001-03-20 International Business Machines Corporation Filling open through holes in a multilayer board
JP3635203B2 (en) 1998-10-06 2005-04-06 富士写真フイルム株式会社 Master for lithographic printing plate
US6489079B1 (en) 1998-10-26 2002-12-03 Agfa-Gevaert Heat mode sensitive imaging element for making positive working printing plates
US6274291B1 (en) 1998-11-18 2001-08-14 International Business Machines Corporation Method of reducing defects in I/C card and resulting card
US6195264B1 (en) * 1998-11-18 2001-02-27 International Business Machines Corporation Laminate substrate having joining layer of photoimageable material
US6201194B1 (en) 1998-12-02 2001-03-13 International Business Machines Corporation Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
US6175087B1 (en) 1998-12-02 2001-01-16 International Business Machines Corporation Composite laminate circuit structure and method of forming the same
US6399270B1 (en) 1998-12-04 2002-06-04 Konica Corporation Support for printing plate and printing plate
JP3328250B2 (en) 1998-12-09 2002-09-24 岸本産業株式会社 Resist residue remover
US6528218B1 (en) 1998-12-15 2003-03-04 International Business Machines Corporation Method of fabricating circuitized structures
US6506831B2 (en) * 1998-12-20 2003-01-14 Honeywell International Inc. Novolac polymer planarization films with high temperature stability
US6630274B1 (en) 1998-12-21 2003-10-07 Seiko Epson Corporation Color filter and manufacturing method therefor
JP3791735B2 (en) 1998-12-22 2006-06-28 富士写真フイルム株式会社 Method for developing photosensitive lithographic printing plate material
US6472119B1 (en) 1999-01-26 2002-10-29 Agfa-Gavaert Heat mode sensitive imaging element for making positive working printing plates
US6455229B1 (en) 1999-02-02 2002-09-24 Agfa-Gevaert Method for making positive working printing plates
US6458510B1 (en) 1999-02-02 2002-10-01 Agfa-Gevaert Method for making positive working printing plates
US6271181B1 (en) 1999-02-04 2001-08-07 Halliburton Energy Services, Inc. Sealing subterranean zones
US6328106B1 (en) 1999-02-04 2001-12-11 Halliburton Energy Services, Inc. Sealing subterranean zones
US6244344B1 (en) 1999-02-09 2001-06-12 Halliburton Energy Services, Inc. Methods and compositions for cementing pipe strings in well bores
US6090905A (en) 1999-02-12 2000-07-18 Calgon Corporation Compositions and methods for controlling stickies
US6234251B1 (en) 1999-02-22 2001-05-22 Halliburton Energy Services, Inc. Resilient well cement compositions and methods
JP3918369B2 (en) * 1999-03-05 2007-05-23 コニカミノルタホールディングス株式会社 Silver halide emulsion, silver halide photosensitive material, photothermographic material, image recording method and image forming method using the same, and method for producing photothermographic material
US6258514B1 (en) 1999-03-10 2001-07-10 Lsi Logic Corporation Top surface imaging technique using a topcoat delivery system
JP2000275828A (en) 1999-03-25 2000-10-06 Fuji Photo Film Co Ltd Photosensitive composition and original plate of planographic printing plate using same
AU4475700A (en) 1999-04-23 2000-11-10 Foto-Wear, Inc. Coated transfer sheet comprising a thermosetting or uv curable material
JP4270708B2 (en) 1999-04-23 2009-06-03 富士通株式会社 Silicon-containing polymer, method for producing the same, resist composition using the same, pattern forming method, and method for producing electronic device
TW550438B (en) 1999-04-26 2003-09-01 Jsr Corp Radiation-sensitive resin composition
US7521405B2 (en) 2002-08-12 2009-04-21 Air Products And Chemicals, Inc. Process solutions containing surfactants
US20040029395A1 (en) 2002-08-12 2004-02-12 Peng Zhang Process solutions containing acetylenic diol surfactants
US7129199B2 (en) 2002-08-12 2006-10-31 Air Products And Chemicals, Inc. Process solutions containing surfactants
US6383714B1 (en) 1999-05-31 2002-05-07 Fuji Photo Film Co., Ltd. Image recording material and planographic printing plate using same
TW552475B (en) 1999-06-09 2003-09-11 Wako Pure Chem Ind Ltd A resist composition
JP3931486B2 (en) 1999-06-24 2007-06-13 住友化学株式会社 Positive resist composition
ATE319122T1 (en) 1999-07-27 2006-03-15 Fuji Photo Film Co Ltd IMAGE RECORDING MATERIAL
US6361923B1 (en) 1999-08-17 2002-03-26 International Business Machines Corporation Laser ablatable material and its use
US6746896B1 (en) 1999-08-28 2004-06-08 Georgia Tech Research Corp. Process and material for low-cost flip-chip solder interconnect structures
US6143479A (en) 1999-08-31 2000-11-07 Kodak Polychrome Graphics Llc Developing system for alkaline-developable lithographic printing plates
US6589889B2 (en) * 1999-09-09 2003-07-08 Alliedsignal Inc. Contact planarization using nanoporous silica materials
US6479216B1 (en) 1999-09-15 2002-11-12 Agfa-Gevaert Method for obtaining a heat sensitive element by spray-coating
WO2001025856A1 (en) * 1999-10-01 2001-04-12 Foto-Wear, Inc. Image transfer material with image receiving layer and heat transfer process using the same
JP4369570B2 (en) 1999-10-15 2009-11-25 富士フイルム株式会社 Quality control method for lithographic printing plates
US6232031B1 (en) 1999-11-08 2001-05-15 Ano-Coil Corporation Positive-working, infrared-sensitive lithographic printing plate and method of imaging
TWI224617B (en) 1999-11-08 2004-12-01 Kaneka Corp Copper foil with insulating adhesive
US6492432B1 (en) 1999-11-09 2002-12-10 American Foam Technologies, Inc. Novolac-epoxy resin foam, foamable composition for making novolac-epoxy resin foam and method of making novolac-epoxy resin foam
US6255042B1 (en) 1999-11-24 2001-07-03 Kodak Polychrome Graphics, Llc Developing system for alkaline-developable lithographic printing plates with different interlayers
FR2801602B1 (en) * 1999-11-30 2002-02-08 Weber A PHENOLIC RESIN PRODUCT HAVING IMPROVED FLEXIBILITY CHARACTERISTICS NEARS EXPANDED POLYURETHANES, FOR INJECTION FOR CONSOLIDATION OF LANDS
JP3965547B2 (en) 1999-12-01 2007-08-29 信越化学工業株式会社 Polymer compound, resist material, and pattern forming method
JP2001166462A (en) 1999-12-10 2001-06-22 Fuji Photo Film Co Ltd Original plate of planographic printing plate
US6723483B1 (en) 1999-12-27 2004-04-20 Wako Pure Chemical Industries, Ltd. Sulfonium salt compounds
US6740464B2 (en) 2000-01-14 2004-05-25 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor
JP2001281856A (en) 2000-01-24 2001-10-10 Fuji Photo Film Co Ltd Infrared ray(ir) sensitive image forming material
DE60111283T2 (en) 2000-01-31 2006-05-11 Fuji Photo Film Co., Ltd., Minami-Ashigara Method for replenishing developer in an automatic processor
US20010017643A1 (en) 2000-01-31 2001-08-30 Mitsubishi Paper Mills Limited Ink jet recording material for non-aqueous ink
JP2001220420A (en) 2000-02-08 2001-08-14 Shin Etsu Chem Co Ltd Polymer compound and positive type resist material
US6423458B2 (en) 2000-02-08 2002-07-23 Fuji Photo Film Co., Ltd. Monitoring method of developing solution for lithographic printing plates
JP3743490B2 (en) 2000-02-16 2006-02-08 信越化学工業株式会社 Thermosetting photosensitive material
JP3796564B2 (en) 2000-02-23 2006-07-12 信越化学工業株式会社 Lift-off resist composition
US7021666B2 (en) * 2000-02-25 2006-04-04 Foto-Wear Inc. Transferable greeting cards
US6972893B2 (en) 2001-06-11 2005-12-06 Sipix Imaging, Inc. Process for imagewise opening and filling color display components and color displays manufactured thereof
JP2001266737A (en) 2000-03-24 2001-09-28 Toshiba Corp Electron source unit, its manufacturing method, and flat display unit equipped with the electron source unit
US6440567B1 (en) 2000-03-31 2002-08-27 Isola Laminate Systems Corp. Halogen free flame retardant adhesive resin coated composite
US6331583B1 (en) 2000-04-04 2001-12-18 Air Products And Chemicals, Inc. Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof
CN1311293C (en) 2000-04-07 2007-04-18 富士胶片株式会社 Original plate of lithographic plate galley
TWI282811B (en) 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device
JP2001357567A (en) 2000-04-14 2001-12-26 Tdk Corp Method for manufacturing optical disk master
US6635400B2 (en) 2000-04-17 2003-10-21 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
DE60133508T2 (en) 2000-04-20 2009-04-30 Fujifilm Corp. Lithographic printing plate precursors
US20040154489A1 (en) 2000-05-08 2004-08-12 Deutsch Albert S. Chemical imaging of a lithographic printing plate
US6691618B2 (en) 2000-05-08 2004-02-17 Pisces-Print Imaging Sciences, Inc. Chemical imaging of a lithographic printing plate
US6806031B2 (en) 2000-05-15 2004-10-19 Fuji Photo Film Co., Ltd. Support for lithographic printing plate and presensitized plate
JP4177952B2 (en) * 2000-05-22 2008-11-05 富士フイルム株式会社 Positive resist composition
US6506533B1 (en) 2000-06-07 2003-01-14 Kodak Polychrome Graphics Llc Polymers and their use in imagable products and image-forming methods
EP1298491B1 (en) 2000-06-13 2005-02-09 Asahi Glass Company Ltd. Resist composition
US20020040122A1 (en) 2000-06-19 2002-04-04 Mirasol Sol M. Water blown rigid polyurethane foam with improved fire retardancy
AU2001274579A1 (en) 2000-06-21 2002-01-02 Asahi Glass Company, Limited Resist composition
US7049021B2 (en) 2000-06-29 2006-05-23 Osaka Gas Company Limited Conductive composition for solid polymer type fuel cell separator, solid polymer type fuel cell separator, solid polymer type fuel cell and solid polymer type fuel cell system using the separator
JP3589160B2 (en) 2000-07-07 2004-11-17 日本電気株式会社 Resist material, chemically amplified resist, and pattern forming method using the same
TW526389B (en) 2000-07-12 2003-04-01 Mitsubishi Rayon Co Resin for resist and chemically amplified resist composition
JP4654544B2 (en) 2000-07-12 2011-03-23 日産化学工業株式会社 Gap fill material forming composition for lithography
US6548155B1 (en) 2000-07-19 2003-04-15 Johns Manville International, Inc. Fiber glass mat
US6730256B1 (en) 2000-08-04 2004-05-04 Massachusetts Institute Of Technology Stereolithographic patterning with interlayer surface modifications
US6833234B1 (en) 2000-08-04 2004-12-21 Massachusetts Institute Of Technology Stereolithographic patterning with variable size exposure areas
US6777170B1 (en) 2000-08-04 2004-08-17 Massachusetts Institute Of Technology Stereolithographic patterning by variable dose light delivery
JP3458096B2 (en) * 2000-08-11 2003-10-20 株式会社半導体先端テクノロジーズ Resist composition and method for manufacturing semiconductor device
US6649324B1 (en) 2000-08-14 2003-11-18 Kodak Polychrome Graphics Llc Aqueous developer for lithographic printing plates
US6511790B2 (en) * 2000-08-25 2003-01-28 Fuji Photo Film Co., Ltd. Alkaline liquid developer for lithographic printing plate and method for preparing lithographic printing plate
US6388204B1 (en) 2000-08-29 2002-05-14 International Business Machines Corporation Composite laminate circuit structure and methods of interconnecting the same
CN1297537C (en) 2000-08-30 2007-01-31 和光纯药工业株式会社 Sulfonium salt compound
US6830646B2 (en) * 2000-08-30 2004-12-14 Lexmark International, Inc. Radiation curable resin layer
JP2002079769A (en) 2000-09-06 2002-03-19 Fuji Photo Film Co Ltd Supporting body for lithographic printing plate and manufacturing method of the same
JP3767676B2 (en) 2000-09-12 2006-04-19 信越化学工業株式会社 Organosiloxane polymer compound, photocurable resin composition, pattern forming method, and film for protecting substrate
EP1188580B1 (en) 2000-09-14 2008-08-13 FUJIFILM Corporation Aluminum support for planographic printing plate, process for its production, and planographic printing master place
KR100760146B1 (en) 2000-09-18 2007-09-18 제이에스알 가부시끼가이샤 Radiation Sensitive Resin Composition
JP3772077B2 (en) 2000-09-27 2006-05-10 株式会社東芝 Pattern formation method
US6548166B2 (en) 2000-09-29 2003-04-15 E. I. Du Pont De Nemours And Company Stretchable fibers of polymers, spinnerets useful to form the fibers, and articles produced therefrom
GB2368364B (en) 2000-10-12 2004-06-02 Mdf Inc Fire door and method of assembly
JP2002134379A (en) 2000-10-19 2002-05-10 Sony Corp Pattern formation method
US6716567B2 (en) 2000-10-26 2004-04-06 Fuji Photo Film Co., Ltd. Supporting body for lithography block and original lithography block
US6346353B1 (en) 2000-10-30 2002-02-12 Eastman Kodak Company Protective epoxy overcoat for imaging elements
US6376160B1 (en) 2000-10-30 2002-04-23 Eastman Kodak Company Protective epoxy overcoat for photographic elements
US6436617B1 (en) 2000-10-30 2002-08-20 Eastman Kodak Company Protective epoxy overcoat for imaging elements
JP4034538B2 (en) 2000-10-31 2008-01-16 株式会社東芝 Polymer compound for photoresist, monomer compound, photosensitive resin composition, pattern forming method using the same, and method for producing electronic component
US6391530B1 (en) 2000-11-03 2002-05-21 Kodak Polychrome Graphics, Llc Process for developing exposed radiation-sensitive printing plate precursors
US6660362B1 (en) 2000-11-03 2003-12-09 Kimberly-Clark Worldwide, Inc. Deflection members for tissue production
US6841330B2 (en) 2000-11-30 2005-01-11 Fuji Photo Film Co., Ltd. Planographic printing plate precursor
JP2002169291A (en) 2000-12-04 2002-06-14 Canon Inc Photosensitive resin composition, resist composition and method and device for forming pattern
US6525115B2 (en) 2000-12-05 2003-02-25 Eastman Kodak Company Method of making an aqueous dispersion of particles comprising an epoxy material for use in coatings
US7041838B2 (en) 2000-12-06 2006-05-09 Mitsubishi Rayon Co., Ltd. (Meth)acrylate esters, starting alcohols for the preparation thereof, processes for preparing both, polymers of the esters, chemically amplifiable resist compositions, and method for forming patterns
US6703324B2 (en) 2000-12-21 2004-03-09 Intel Corporation Mechanically reinforced highly porous low dielectric constant films
EP1219668B1 (en) 2000-12-28 2005-10-26 Fuji Photo Film Co., Ltd. Process for producing fine polymer particles and lithographic printing plate precursor containing the same
US6586483B2 (en) 2001-01-08 2003-07-01 3M Innovative Properties Company Foam including surface-modified nanoparticles
CN100470365C (en) 2001-01-12 2009-03-18 富士胶片株式会社 Positive imaging material
CN1281660C (en) 2001-01-24 2006-10-25 富士胶片株式会社 Hydrophilic Polymer containing silane couple end base and lithographic printing plate bottom material
DE60217477T2 (en) 2001-01-29 2007-10-11 Jsr Corp. COMPOSITE PARTICLES FOR DIELECTRICS, ULTRAFINE RESIN COMPOSITES, COMPOSITION FOR THE PRODUCTION OF DIELECTRICS AND THE USE THEREOF
JP2002221801A (en) 2001-01-29 2002-08-09 Hitachi Ltd Method of manufacturing wiring board
US6927266B2 (en) 2001-02-22 2005-08-09 Nissan Chemical Industries, Ltd. Bottom anti-reflective coat forming composition for lithography
US6623817B1 (en) 2001-02-22 2003-09-23 Ghartpak, Inc. Inkjet printable waterslide transferable media
US6777102B2 (en) * 2001-02-23 2004-08-17 Fuji Photo Film Co., Ltd. Curable composition and hardcoated article employing same
TWI245774B (en) 2001-03-01 2005-12-21 Shinetsu Chemical Co Silicon-containing polymer, resist composition and patterning process
JP4225699B2 (en) * 2001-03-12 2009-02-18 富士フイルム株式会社 Positive photosensitive composition
JP4019645B2 (en) 2001-03-12 2007-12-12 東洋インキ製造株式会社 Polymerizable composition
US6613494B2 (en) 2001-03-13 2003-09-02 Kodak Polychrome Graphics Llc Imageable element having a protective overlayer
TWI226973B (en) 2001-03-19 2005-01-21 Fuji Photo Film Co Ltd Positive resist composition
JP3838053B2 (en) 2001-03-19 2006-10-25 ブラザー工業株式会社 Active energy ray-curable composition and ink
US6806021B2 (en) 2001-04-02 2004-10-19 Kabushiki Kaisha Toshiba Method for forming a pattern and method of manufacturing semiconductor device
US7118848B2 (en) 2001-04-03 2006-10-10 Fuji Photo Film Co., Ltd. Support for lithographic printing plate and original forme for lithographic printing plate
US6656661B2 (en) 2001-04-04 2003-12-02 Kodak Polychrome Graphics, Llc Waterless imageable element with crosslinked silicone layer
JP4268345B2 (en) 2001-04-20 2009-05-27 富士フイルム株式会社 Support for lithographic printing plate
ATE490490T1 (en) 2001-04-23 2010-12-15 Fujifilm Corp ALKALINE DEVELOPER FOR A LITHOGRAPHIC PRINTING PLATE AND METHOD FOR PRODUCING A LITHOGRAPHIC PRINTING PLATE
JP3988517B2 (en) 2001-04-27 2007-10-10 Ｊｓｒ株式会社 Radiation sensitive resin composition
JP3856425B2 (en) 2001-05-02 2006-12-13 住友ベークライト株式会社 Manufacturing method of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device
KR100917731B1 (en) 2001-05-11 2009-09-15 파나소닉 주식회사 Biomolecular substrate and method and apparatus for examination and diagnosis using the same
US6739260B2 (en) * 2001-05-17 2004-05-25 Agfa-Gevaert Method for the preparation of a negative working printing plate
US20020187427A1 (en) 2001-05-18 2002-12-12 Ulrich Fiebag Additive composition for both rinse water recycling in water recycling systems and simultaneous surface treatment of lithographic printing plates
JP2002341536A (en) * 2001-05-21 2002-11-27 Kodak Polychrome Graphics Japan Ltd Negative photosensitive composition and negative photosensitive planographic printing plate
BR0102218B1 (en) 2001-05-31 2012-10-16 radiation sensitive product, and the process of printing or developing image using said product.
JP4431958B2 (en) 2001-06-01 2010-03-17 セイコーエプソン株式会社 Color filter and electro-optical device
US6788452B2 (en) 2001-06-11 2004-09-07 Sipix Imaging, Inc. Process for manufacture of improved color displays
US6503694B1 (en) * 2001-06-12 2003-01-07 Chi Mei Corporation Developer solution and edge bead remover composition
US7132212B2 (en) 2001-06-13 2006-11-07 Fuji Photo Film Co., Ltd. Presensitized plate
US6476174B1 (en) 2001-06-15 2002-11-05 Industrial Technology Research Institute Process for preparing a silica-based organic-inorganic hybrid resin and the organic-inorganic hybrid resin prepared therefrom
GB0114653D0 (en) 2001-06-15 2001-08-08 Enigma Nv Aqueous fire retardant
JP4240850B2 (en) 2001-06-26 2009-03-18 コニカミノルタホールディングス株式会社 Photothermographic material and image recording method
US6627691B2 (en) * 2001-06-28 2003-09-30 Lord Corporation Aqueous resin adhesive composition having pre-bake resistance
SG120873A1 (en) 2001-06-29 2006-04-26 Jsr Corp Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition
KR100863984B1 (en) 2001-07-03 2008-10-16 후지필름 가부시키가이샤 Positive resist composition
CN1272186C (en) 2001-07-06 2006-08-30 富士胶片株式会社 Original plate of plane printing plate
EP1275498A3 (en) 2001-07-09 2005-05-04 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor and production method of lithographic printing plate
JP3696131B2 (en) * 2001-07-10 2005-09-14 株式会社東芝 Active matrix substrate and manufacturing method thereof
CA2454128A1 (en) 2001-07-13 2003-01-23 Foto-Wear, Inc. Sublimation dye thermal transfer paper and transfer method
DE60225358T2 (en) 2001-07-23 2009-02-19 Fujifilm Corp. Precursor for a lithographic printing plate
JP3917422B2 (en) 2001-07-26 2007-05-23 富士フイルム株式会社 Image forming material
US6863859B2 (en) 2001-08-16 2005-03-08 Objet Geometries Ltd. Reverse thermal gels and the use thereof for rapid prototyping
US6752545B2 (en) 2001-08-16 2004-06-22 Nagase & Co., Ltd. Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment
US7244549B2 (en) 2001-08-24 2007-07-17 Jsr Corporation Pattern forming method and bilayer film
US6524777B1 (en) 2001-08-30 2003-02-25 Eastman Kodak Company Method of activating a protective layer on a photographic element employing an organic solvent in the wash solution
US7198754B2 (en) 2001-08-31 2007-04-03 Kabushiki Kaisha Toshiba Biological material detection element, biological material detection method and apparatus, charged material moving apparatus
US6593055B2 (en) 2001-09-05 2003-07-15 Kodak Polychrome Graphics Llc Multi-layer thermally imageable element
US6673514B2 (en) * 2001-09-07 2004-01-06 Kodak Polychrome Graphics Llc Imagable articles and compositions, and their use
US20030049377A1 (en) 2001-09-11 2003-03-13 Chesnut W. Richard Machine and method for making a rotogravure printing medium
JP4216494B2 (en) 2001-09-21 2009-01-28 富士フイルム株式会社 Planographic printing plate precursor
US7041427B2 (en) 2001-09-27 2006-05-09 Agfa Gevaert Heat-sensitive lithographic printing plate precursor
US7029820B2 (en) 2001-10-05 2006-04-18 Fuji Photo Film Co., Ltd. Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate
JP2003119207A (en) 2001-10-11 2003-04-23 Jsr Corp Photocuring composition, cured product thereof, and laminated product
JP2003119344A (en) 2001-10-12 2003-04-23 Shin Etsu Chem Co Ltd Hybrid compound, resist material and method of forming pattern
TWI291953B (en) 2001-10-23 2008-01-01 Mitsubishi Rayon Co
US6855487B2 (en) 2001-10-26 2005-02-15 Kodak Polychrome Graphics, Llc Method and apparatus for refreshment and reuse of loaded developer
JP4238003B2 (en) 2001-10-31 2009-03-11 三菱製紙株式会社 Photosensitive composition and planographic printing plate
US6716767B2 (en) * 2001-10-31 2004-04-06 Brewer Science, Inc. Contact planarization materials that generate no volatile byproducts or residue during curing
US6913694B2 (en) 2001-11-06 2005-07-05 Saehan Industries Incorporation Selective membrane having a high fouling resistance
US6632511B2 (en) 2001-11-09 2003-10-14 Polyclad Laminates, Inc. Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
US6759185B2 (en) 2001-11-14 2004-07-06 Kodak Polychrome Graphics Llc Method for reuse of loaded developer
US6723490B2 (en) 2001-11-15 2004-04-20 Kodak Polychrome Graphics Llc Minimization of ablation in thermally imageable elements
US7189783B2 (en) 2001-11-27 2007-03-13 Fujitsu Limited Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof
US6977132B2 (en) 2001-12-07 2005-12-20 Fuji Photo Film Co., Ltd. Planographic printing plate precursor
US6699636B2 (en) 2001-12-12 2004-03-02 Kodak Polychrome Graphics Llc Imaging element comprising a thermally activated crosslinking agent
US6800426B2 (en) 2001-12-13 2004-10-05 Kodak Polychrome Graphics Llc Process for making a two layer thermal negative plate
US20030196685A1 (en) 2001-12-18 2003-10-23 Shipley Company, L.L.C. Cleaning composition and method
JP4123920B2 (en) 2001-12-20 2008-07-23 Ｊｓｒ株式会社 Copolymer, polymer mixture and radiation-sensitive resin composition
US6737225B2 (en) 2001-12-28 2004-05-18 Texas Instruments Incorporated Method of undercutting micro-mechanical device with super-critical carbon dioxide
US6677106B2 (en) * 2002-01-03 2004-01-13 Kodak Polychrome Graphics Llc Method and equipment for using photo- or thermally imagable, negatively working patterning compositions
US6599676B2 (en) 2002-01-03 2003-07-29 Kodak Polychrome Graphics Llc Process for making thermal negative printing plate
US6668926B2 (en) 2002-01-08 2003-12-30 Halliburton Energy Services, Inc. Methods of consolidating proppant in subterranean fractures
JP3820160B2 (en) 2002-01-23 2006-09-13 富士写真フイルム株式会社 Photosensitive transfer material and color filter
JP2003212965A (en) 2002-01-28 2003-07-30 Brother Ind Ltd Active-energy-ray-curable composition
US20030162911A1 (en) 2002-01-31 2003-08-28 Yue Xiao No flow underfill composition
US6624216B2 (en) 2002-01-31 2003-09-23 National Starch And Chemical Investment Holding Corporation No-flow underfill encapsulant
JP2003302755A (en) 2002-02-05 2003-10-24 Fuji Photo Film Co Ltd Photosensitive composition
EP1335016A1 (en) 2002-02-06 2003-08-13 Shipley Company LLC Cleaning composition
JP4184813B2 (en) 2002-02-19 2008-11-19 コダックグラフィックコミュニケーションズ株式会社 Photosensitive composition, photosensitive lithographic printing plate and method for producing lithographic printing plate using the same
JP2003315987A (en) 2002-02-21 2003-11-06 Fuji Photo Film Co Ltd Method for making lithographic printing plate
CN100335268C (en) 2002-02-26 2007-09-05 东丽株式会社 Directly formed image original edition without horizontal printing plate
DE60329343D1 (en) 2002-02-26 2009-11-05 Fujifilm Corp Aluminum support for a planographic printing plate and process for its production, and a presensitized printing plate using the same
US6830862B2 (en) 2002-02-28 2004-12-14 Kodak Polychrome Graphics, Llc Multi-layer imageable element with a crosslinked top layer
US7037399B2 (en) 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
US20030164555A1 (en) 2002-03-01 2003-09-04 Tong Quinn K. B-stageable underfill encapsulant and method for its application
JP2004038142A (en) 2002-03-03 2004-02-05 Shipley Co Llc Method for preparing polysiloxane and photoresist composition comprising same
JP4557497B2 (en) 2002-03-03 2010-10-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Method for producing silane monomer and polymer and photoresist composition comprising the same
EP1343063A2 (en) * 2002-03-06 2003-09-10 Fuji Photo Film Co., Ltd. Wastewater treatment control system, terminal, computer program and accounting method
EP1343048A3 (en) 2002-03-08 2004-01-14 JSR Corporation Anthracene derivative and radiation-sensitive resin composition
JP3811082B2 (en) 2002-03-08 2006-08-16 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
US6608162B1 (en) 2002-03-15 2003-08-19 Borden Chemical, Inc. Spray-dried phenol formaldehyde resins
US7531286B2 (en) 2002-03-15 2009-05-12 Jsr Corporation Radiation-sensitive resin composition
JP3976598B2 (en) 2002-03-27 2007-09-19 Ｎｅｃ液晶テクノロジー株式会社 Resist pattern formation method
US7510822B2 (en) 2002-04-10 2009-03-31 Fujifilm Corporation Stimulation sensitive composition and compound
AU2003222042A1 (en) 2002-04-11 2003-10-27 Schenectady International, Inc. Waterborne printed circuit board coating compositions
US6900003B2 (en) * 2002-04-12 2005-05-31 Shipley Company, L.L.C. Photoresist processing aid and method
JP3901565B2 (en) * 2002-04-15 2007-04-04 富士フイルム株式会社 Heat sensitive planographic printing plate
US6764552B1 (en) 2002-04-18 2004-07-20 Novellus Systems, Inc. Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
JP4007581B2 (en) 2002-04-19 2007-11-14 富士フイルム株式会社 Positive resist composition
JP4019254B2 (en) 2002-04-24 2007-12-12 信越化学工業株式会社 Conductive resin composition
US7232638B2 (en) 2002-05-02 2007-06-19 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
JP2004252395A (en) 2002-05-07 2004-09-09 Shipley Co Llc Stable concentrate with reduced residue
US6887654B2 (en) 2002-05-07 2005-05-03 Shipley Company, L.L.C. Residue and scum reducing composition and method
JP2003345014A (en) * 2002-05-28 2003-12-03 Fuji Photo Film Co Ltd Photosensitive composition
KR100955454B1 (en) * 2002-05-31 2010-04-29 후지필름 가부시키가이샤 Positive-working resist composition
US7153575B2 (en) 2002-06-03 2006-12-26 Borden Chemical, Inc. Particulate material having multiple curable coatings and methods for making and using same
US20040009426A1 (en) * 2002-06-05 2004-01-15 Fuji Photo Film Co., Ltd. Infrared photosensitive composition and image recording material for infrared exposure
KR101001936B1 (en) 2002-06-07 2010-12-17 후지필름 가부시키가이샤 Dye-containing curable composition, color filter and method of producing the same
EP1376241A1 (en) * 2002-06-24 2004-01-02 Fuji Photo Film Co., Ltd. Method for preparing lithographic printing plate
US6791839B2 (en) 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
JP2004027145A (en) * 2002-06-28 2004-01-29 Tamura Kaken Co Ltd Curable resin composition for coating, multilayer printed circuit board, printed circuit board, and dry film
US6919161B2 (en) * 2002-07-02 2005-07-19 Shin-Etsu Chemical Co., Ltd. Silicon-containing polymer, resist composition and patterning process
JP3912512B2 (en) * 2002-07-02 2007-05-09 信越化学工業株式会社 Silicon-containing polymer compound, resist material, and pattern forming method
US6638853B1 (en) 2002-07-03 2003-10-28 Taiwan Semiconductor Manufacturing Co. Ltd. Method for avoiding photoresist resist residue on semioconductor feature sidewalls
US6902865B2 (en) * 2002-07-22 2005-06-07 Gary Ganghui Teng Non-alkaline aqueous development of thermosensitive lithographic printing plates
US6841335B2 (en) 2002-07-29 2005-01-11 Kodak Polychrome Graphics Llc Imaging members with ionic multifunctional epoxy compounds
US20040023155A1 (en) 2002-08-01 2004-02-05 Eiji Hayakawa Composition for a thermal lithographic printing plate and lithographic printing plate comprising the composition
US6887643B2 (en) 2002-08-05 2005-05-03 Toray Industries, Inc. Photosensitive resin precursor composition
US6773858B2 (en) 2002-08-06 2004-08-10 Shin-Etsu Chemical Co., Ltd. Positive photoresist composition
US6893796B2 (en) 2002-08-20 2005-05-17 Kodak Polychrome Graphics Llc Flexographic element having an integral thermally bleachable mask layer
US6705400B1 (en) 2002-08-28 2004-03-16 Halliburton Energy Services, Inc. Methods and compositions for forming subterranean fractures containing resilient proppant packs
US20040265500A1 (en) 2003-06-27 2004-12-30 Kucera Helmut W. Coating process utilizing automated systems
US7048988B2 (en) 2002-09-06 2006-05-23 Fuji Photo Film Co., Ltd. Support for lithographic printing plate and presensitized plate
US20040109853A1 (en) 2002-09-09 2004-06-10 Reactive Surfaces, Ltd. Biological active coating components, coatings, and coated surfaces
US7090957B2 (en) 2002-09-11 2006-08-15 Fuji Photo Film Co., Ltd. Polymerizable composition and planographic printing plate precursor using the same
JP2004106200A (en) 2002-09-13 2004-04-08 Fuji Photo Film Co Ltd Support for lithographic printing plate, its manufacturing method, and lithographic printing original plate
US20040067435A1 (en) 2002-09-17 2004-04-08 Fuji Photo Film Co., Ltd. Image forming material
US7056642B2 (en) 2002-09-18 2006-06-06 Fuji Photo Film Co., Ltd. Method of graft polymerization and variety of materials utilizing the same as well as producing method thereof
EP2244129B1 (en) 2002-10-02 2012-07-18 Canon Kabushiki Kaisha Silica fine particle, toner, two-component developer and image forming method
US6858359B2 (en) 2002-10-04 2005-02-22 Kodak Polychrome Graphics, Llp Thermally sensitive, multilayer imageable element
US7038328B2 (en) 2002-10-15 2006-05-02 Brewer Science Inc. Anti-reflective compositions comprising triazine compounds
FR2846467B1 (en) 2002-10-25 2005-01-28 Cogema Logistics NEUTRONIC SHIELDING AND DE-CRITICITE MAINTAINING MATERIAL, PREPARATION METHOD AND APPLICATIONS THEREOF
US6737158B1 (en) 2002-10-30 2004-05-18 Gore Enterprise Holdings, Inc. Porous polymeric membrane toughened composites
US7056978B2 (en) 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
US20040192876A1 (en) 2002-11-18 2004-09-30 Nigel Hacker Novolac polymer planarization films with high temparature stability
TWI249045B (en) 2002-12-02 2006-02-11 Shipley Co Llc Methods of forming waveguides and waveguides formed therefrom
US6803167B2 (en) 2002-12-04 2004-10-12 Kodak Polychrome Graphics, Llc Preparation of lithographic printing plates
JP2004188848A (en) 2002-12-12 2004-07-08 Konica Minolta Holdings Inc Print plate material
US6809269B2 (en) 2002-12-19 2004-10-26 Endicott Interconnect Technologies, Inc. Circuitized substrate assembly and method of making same
JP2004212681A (en) 2002-12-27 2004-07-29 Fuji Photo Film Co Ltd Automatic development method of photosensitive planographic printing plate and its automatic development apparatus
JP2004219452A (en) 2003-01-09 2004-08-05 Fuji Photo Film Co Ltd Development replenishing method for automatic development apparatus for photosensitive planographic printing plate
JP3944734B2 (en) 2003-01-10 2007-07-18 信越化学工業株式会社 Organosiloxane polymer compound, photocurable resin composition, pattern forming method, and film for protecting substrate
JP2004219261A (en) 2003-01-15 2004-08-05 Fuji Photo Film Co Ltd Method of analyzing thin film
US7160667B2 (en) 2003-01-24 2007-01-09 Fuji Photo Film Co., Ltd. Image forming material
US7097956B2 (en) 2003-01-27 2006-08-29 Eastman Kodak Company Imageable element containing silicate-coated polymer particle
US6790590B2 (en) 2003-01-27 2004-09-14 Kodak Polychrome Graphics, Llp Infrared absorbing compounds and their use in imageable elements
JP4251612B2 (en) 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Negative photosensitive resin composition containing epoxy-containing substance
JP2004297032A (en) 2003-02-03 2004-10-21 Toshiba Corp Exposing method and manufacturing method of semiconductor device using the same
US20040158008A1 (en) 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
JP4397601B2 (en) 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Negative photosensitive resin composition containing phenol-biphenylene resin
US6905589B2 (en) 2003-02-24 2005-06-14 Endicott Interconnect Technologies, Inc. Circuitized substrate and method of making same
JP2004264380A (en) 2003-02-28 2004-09-24 Tdk Corp Method for forming resist pattern and resist pattern forming apparatus
EP1455237B1 (en) 2003-03-07 2011-05-25 Canon Kabushiki Kaisha Toner and two-component developer
US6902861B2 (en) 2003-03-10 2005-06-07 Kodak Polychrome Graphics, Llc Infrared absorbing compounds and their use in photoimageable elements
JP2004271985A (en) 2003-03-10 2004-09-30 Fuji Photo Film Co Ltd Developing solution for photosensitive lithographic printing plate and platemaking method for lithographic printing plate
US7045269B2 (en) 2003-03-10 2006-05-16 Eastman Kodak Company Method for forming images using negative working imageable elements
JP2004272152A (en) 2003-03-12 2004-09-30 Fuji Photo Film Co Ltd Developing solution for thermosensitive lithographic printing plate and platemaking method for lithographic printing plate
US7229744B2 (en) 2003-03-21 2007-06-12 Eastman Kodak Company Method for preparing lithographic printing plates
KR20040084779A (en) 2003-03-25 2004-10-06 닛뽕 뻬인또 가부시키가이샤 Method of producing oil-in-water type emulsion containing internally crosslinked fine resin particle, oil-in-water type emulsion containing internally crosslinked fine resin particle, cation electrodeposition coating composition and substance coated
US7114570B2 (en) 2003-04-07 2006-10-03 Halliburton Energy Services, Inc. Methods and compositions for stabilizing unconsolidated subterranean formations
US6908726B2 (en) 2003-04-07 2005-06-21 Kodak Polychrome Graphics Llc Thermally imageable elements imageable at several wavelengths
US20040214108A1 (en) 2003-04-25 2004-10-28 Ray Kevin B. Ionic liquids as dissolution inhibitors in imageable elements
US7047633B2 (en) 2003-05-23 2006-05-23 National Starch And Chemical Investment Holding, Corporation Method of using pre-applied underfill encapsulant
US6978836B2 (en) 2003-05-23 2005-12-27 Halliburton Energy Services, Inc. Methods for controlling water and particulate production
US20040235996A1 (en) 2003-05-23 2004-11-25 Jayesh Shah Foamable underfill encapsulant
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
JP4360844B2 (en) 2003-06-16 2009-11-11 富士フイルム株式会社 Positive resist composition
US7267782B2 (en) 2003-06-19 2007-09-11 Owens-Corning Fiberglas Technology Ii, Llc Two-part combination of compositions for forming substantially colorless thermoplastic reinforcements
US7790231B2 (en) * 2003-07-10 2010-09-07 Brewer Science Inc. Automated process and apparatus for planarization of topographical surfaces

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