WO2005020646A3 - Reactive atom plasma torch aperture system - Google Patents

Reactive atom plasma torch aperture system Download PDF

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Publication number
WO2005020646A3
WO2005020646A3 PCT/US2004/025410 US2004025410W WO2005020646A3 WO 2005020646 A3 WO2005020646 A3 WO 2005020646A3 US 2004025410 W US2004025410 W US 2004025410W WO 2005020646 A3 WO2005020646 A3 WO 2005020646A3
Authority
WO
WIPO (PCT)
Prior art keywords
aperture
plasma
workpiece
reactive atom
tool
Prior art date
Application number
PCT/US2004/025410
Other languages
French (fr)
Other versions
WO2005020646A2 (en
Inventor
Andrew Chang
Jeffrey W Carr
Jude Kelley
Peter Fiske
Original Assignee
Rapt Ind Inc
Andrew Chang
Jeffrey W Carr
Jude Kelley
Peter Fiske
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rapt Ind Inc, Andrew Chang, Jeffrey W Carr, Jude Kelley, Peter Fiske filed Critical Rapt Ind Inc
Publication of WO2005020646A2 publication Critical patent/WO2005020646A2/en
Publication of WO2005020646A3 publication Critical patent/WO2005020646A3/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/30—Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy

Abstract

The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
PCT/US2004/025410 2003-08-14 2004-08-06 Reactive atom plasma torch aperture system WO2005020646A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US49517603P 2003-08-14 2003-08-14
US60/495,176 2003-08-14
US10/911,821 US7304263B2 (en) 2003-08-14 2004-08-05 Systems and methods utilizing an aperture with a reactive atom plasma torch
US10/911,821 2004-08-05

Publications (2)

Publication Number Publication Date
WO2005020646A2 WO2005020646A2 (en) 2005-03-03
WO2005020646A3 true WO2005020646A3 (en) 2009-04-02

Family

ID=34221377

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/025410 WO2005020646A2 (en) 2003-08-14 2004-08-06 Reactive atom plasma torch aperture system

Country Status (2)

Country Link
US (2) US7304263B2 (en)
WO (1) WO2005020646A2 (en)

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Also Published As

Publication number Publication date
WO2005020646A2 (en) 2005-03-03
US7304263B2 (en) 2007-12-04
US20050061782A1 (en) 2005-03-24
US20080035612A1 (en) 2008-02-14

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