WO2005029540A3 - Substrate carrier for electroplating solar cells - Google Patents

Substrate carrier for electroplating solar cells Download PDF

Info

Publication number
WO2005029540A3
WO2005029540A3 PCT/US2004/025423 US2004025423W WO2005029540A3 WO 2005029540 A3 WO2005029540 A3 WO 2005029540A3 US 2004025423 W US2004025423 W US 2004025423W WO 2005029540 A3 WO2005029540 A3 WO 2005029540A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
frame
support frame
auxiliary
support
Prior art date
Application number
PCT/US2004/025423
Other languages
French (fr)
Other versions
WO2005029540A2 (en
Inventor
Luca Pavani
Neil Kaminar
Pongsthorn Uralwong
Thomas Phu
Douglas H Rose
Thomas Pass
Original Assignee
Sunpower Corp
Luca Pavani
Neil Kaminar
Pongsthorn Uralwong
Thomas Phu
Douglas H Rose
Thomas Pass
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunpower Corp, Luca Pavani, Neil Kaminar, Pongsthorn Uralwong, Thomas Phu, Douglas H Rose, Thomas Pass filed Critical Sunpower Corp
Publication of WO2005029540A2 publication Critical patent/WO2005029540A2/en
Publication of WO2005029540A3 publication Critical patent/WO2005029540A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/90—Supporting structure having work holder receiving apertures or projections

Abstract

A carrier includes a support frame (10) on which a plurality of wafers (12) are mounted with at least one auxiliary frame (20) for holding the wafers on the support frame. A plurality of clips (24) extend from the auxiliary frame and engage the wafers in pressure engagement, and fasteners (32) retain the auxiliary frame in position with the support frame. Two auxiliary frames can be employed for holding the wafers on opposing sides of the support frame. The support frame and auxiliary frame have electrically nonconducting surfaces. The clips extending from the auxiliary frame are electrically conductive and bridge current from the support frame to the wafers during plating operations. The support frame can also be made to include wafer retention clips, so that the auxiliary frame is not used. The carrier support of the invention can support multiple wafers and yield no significant mechanical stress on the wafers during processing.
PCT/US2004/025423 2003-08-06 2004-08-06 Substrate carrier for electroplating solar cells WO2005029540A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US49282803P 2003-08-06 2003-08-06
US60/492,828 2003-08-06
US10/912,348 2004-08-04
US10/912,348 US7172184B2 (en) 2003-08-06 2004-08-04 Substrate carrier for electroplating solar cells

Publications (2)

Publication Number Publication Date
WO2005029540A2 WO2005029540A2 (en) 2005-03-31
WO2005029540A3 true WO2005029540A3 (en) 2006-02-16

Family

ID=34316350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/025423 WO2005029540A2 (en) 2003-08-06 2004-08-06 Substrate carrier for electroplating solar cells

Country Status (2)

Country Link
US (1) US7172184B2 (en)
WO (1) WO2005029540A2 (en)

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Also Published As

Publication number Publication date
US20050061665A1 (en) 2005-03-24
US7172184B2 (en) 2007-02-06
WO2005029540A2 (en) 2005-03-31

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