WO2005031789A3 - Method, system and device for microscopic examination employing fib-prepared sample grasping element - Google Patents
Method, system and device for microscopic examination employing fib-prepared sample grasping element Download PDFInfo
- Publication number
- WO2005031789A3 WO2005031789A3 PCT/US2004/031482 US2004031482W WO2005031789A3 WO 2005031789 A3 WO2005031789 A3 WO 2005031789A3 US 2004031482 W US2004031482 W US 2004031482W WO 2005031789 A3 WO2005031789 A3 WO 2005031789A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- grasping element
- microscopic examination
- substrate
- prepared sample
- fib
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
- G01N2001/2886—Laser cutting, e.g. tissue catapult
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/32—Micromanipulators structurally combined with microscopes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/204—Means for introducing and/or outputting objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31749—Focused ion beam
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04785036A EP1671346A2 (en) | 2003-09-23 | 2004-09-23 | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
JP2006528252A JP2007506981A (en) | 2003-09-23 | 2004-09-23 | Method, system, and apparatus for microscopy using an element that grips a sample prepared with FIB |
KR1020067007692A KR100984608B1 (en) | 2003-09-23 | 2004-09-23 | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
CN2004800311077A CN1871684B (en) | 2003-09-23 | 2004-09-23 | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50502603P | 2003-09-23 | 2003-09-23 | |
US60/505,026 | 2003-09-23 | ||
US54684004P | 2004-02-23 | 2004-02-23 | |
US60/546,840 | 2004-02-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005031789A2 WO2005031789A2 (en) | 2005-04-07 |
WO2005031789A3 true WO2005031789A3 (en) | 2005-05-06 |
Family
ID=34396231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/031482 WO2005031789A2 (en) | 2003-09-23 | 2004-09-23 | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
Country Status (6)
Country | Link |
---|---|
US (2) | US7227140B2 (en) |
EP (1) | EP1671346A2 (en) |
JP (1) | JP2007506981A (en) |
KR (1) | KR100984608B1 (en) |
CN (1) | CN1871684B (en) |
WO (1) | WO2005031789A2 (en) |
Cited By (2)
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US7675300B2 (en) | 2004-02-23 | 2010-03-09 | Zyvex Instruments, Llc | Charged particle beam device probe operation |
US7799132B2 (en) | 2004-03-26 | 2010-09-21 | Zyvex Labs, Llc | Patterned atomic layer epitaxy |
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US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
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Also Published As
Publication number | Publication date |
---|---|
KR20060073966A (en) | 2006-06-29 |
US20050178980A1 (en) | 2005-08-18 |
US7227140B2 (en) | 2007-06-05 |
CN1871684B (en) | 2011-08-24 |
US20070187623A1 (en) | 2007-08-16 |
WO2005031789A2 (en) | 2005-04-07 |
KR100984608B1 (en) | 2010-09-30 |
EP1671346A2 (en) | 2006-06-21 |
JP2007506981A (en) | 2007-03-22 |
CN1871684A (en) | 2006-11-29 |
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