WO2005034180A3 - System and method for on-tool semiconductor simulation - Google Patents
System and method for on-tool semiconductor simulation Download PDFInfo
- Publication number
- WO2005034180A3 WO2005034180A3 PCT/US2004/028801 US2004028801W WO2005034180A3 WO 2005034180 A3 WO2005034180 A3 WO 2005034180A3 US 2004028801 W US2004028801 W US 2004028801W WO 2005034180 A3 WO2005034180 A3 WO 2005034180A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- processing tool
- semiconductor processing
- process performed
- principles
- semiconductor simulation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/08—Probabilistic or stochastic CAD
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006533873A JP4795957B2 (en) | 2003-09-30 | 2004-09-20 | A system and method using a first principle simulation for controlling a semiconductor manufacturing process. |
EP04788575A EP1668501A2 (en) | 2003-09-30 | 2004-09-20 | System and method for on-tool semiconductor simulation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/673,507 | 2003-09-30 | ||
US10/673,507 US8073667B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to control a semiconductor manufacturing process |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005034180A2 WO2005034180A2 (en) | 2005-04-14 |
WO2005034180A3 true WO2005034180A3 (en) | 2006-03-30 |
Family
ID=34376623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/028801 WO2005034180A2 (en) | 2003-09-30 | 2004-09-20 | System and method for on-tool semiconductor simulation |
Country Status (7)
Country | Link |
---|---|
US (1) | US8073667B2 (en) |
EP (1) | EP1668501A2 (en) |
JP (1) | JP4795957B2 (en) |
KR (1) | KR20060116192A (en) |
CN (1) | CN1867896A (en) |
TW (1) | TWI304527B (en) |
WO (1) | WO2005034180A2 (en) |
Families Citing this family (36)
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US8073667B2 (en) | 2003-09-30 | 2011-12-06 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process |
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US8296687B2 (en) * | 2003-09-30 | 2012-10-23 | Tokyo Electron Limited | System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool |
US8050900B2 (en) * | 2003-09-30 | 2011-11-01 | Tokyo Electron Limited | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
US8036869B2 (en) | 2003-09-30 | 2011-10-11 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model |
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2003
- 2003-09-30 US US10/673,507 patent/US8073667B2/en not_active Expired - Fee Related
-
2004
- 2004-09-20 KR KR1020067006628A patent/KR20060116192A/en not_active Application Discontinuation
- 2004-09-20 WO PCT/US2004/028801 patent/WO2005034180A2/en active Application Filing
- 2004-09-20 CN CNA2004800285176A patent/CN1867896A/en active Pending
- 2004-09-20 JP JP2006533873A patent/JP4795957B2/en not_active Expired - Fee Related
- 2004-09-20 EP EP04788575A patent/EP1668501A2/en not_active Withdrawn
- 2004-09-29 TW TW093129403A patent/TWI304527B/en not_active IP Right Cessation
Patent Citations (2)
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Title |
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YONEMURA N.: "Heat Analysis on Insulated Metal Substrates.", IEEE., vol. 3, 1996, pages 1407 - 1410, XP000696276 * |
Also Published As
Publication number | Publication date |
---|---|
CN1867896A (en) | 2006-11-22 |
JP4795957B2 (en) | 2011-10-19 |
US20050071038A1 (en) | 2005-03-31 |
WO2005034180A2 (en) | 2005-04-14 |
JP2007507886A (en) | 2007-03-29 |
US8073667B2 (en) | 2011-12-06 |
TW200523701A (en) | 2005-07-16 |
TWI304527B (en) | 2008-12-21 |
KR20060116192A (en) | 2006-11-14 |
EP1668501A2 (en) | 2006-06-14 |
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