WO2005036591A3 - System and method for using first-principles simulation to facilitate a semiconductor manufacturing process - Google Patents

System and method for using first-principles simulation to facilitate a semiconductor manufacturing process Download PDF

Info

Publication number
WO2005036591A3
WO2005036591A3 PCT/US2004/016618 US2004016618W WO2005036591A3 WO 2005036591 A3 WO2005036591 A3 WO 2005036591A3 US 2004016618 W US2004016618 W US 2004016618W WO 2005036591 A3 WO2005036591 A3 WO 2005036591A3
Authority
WO
WIPO (PCT)
Prior art keywords
facilitate
principles simulation
processing tool
semiconductor processing
manufacturing process
Prior art date
Application number
PCT/US2004/016618
Other languages
French (fr)
Other versions
WO2005036591A2 (en
Inventor
Andrej S Mitrovic
Original Assignee
Tokyo Electron Ltd
Andrej S Mitrovic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Andrej S Mitrovic filed Critical Tokyo Electron Ltd
Priority to JP2006533434A priority Critical patent/JP4740142B2/en
Priority to KR1020057024760A priority patent/KR101054710B1/en
Priority to EP04753447A priority patent/EP1668554A4/en
Publication of WO2005036591A2 publication Critical patent/WO2005036591A2/en
Publication of WO2005036591A3 publication Critical patent/WO2005036591A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00Details relating to CAD techniques
    • G06F2111/10Numerical modelling

Abstract

A method, system and computer readable medium for facilitating a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is then performed using the input data and the physical model to provide a first principles simulation result, and the first principles simulation result is used to facilitate the process performed by the semiconductor processing tool.
PCT/US2004/016618 2003-09-30 2004-06-16 System and method for using first-principles simulation to facilitate a semiconductor manufacturing process WO2005036591A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006533434A JP4740142B2 (en) 2003-09-30 2004-06-16 System and method using first principle simulation to facilitate semiconductor manufacturing process
KR1020057024760A KR101054710B1 (en) 2003-09-30 2004-06-16 Systems, methods, and computer readable media for use of first principles simulation to facilitate semiconductor manufacturing processes
EP04753447A EP1668554A4 (en) 2003-09-30 2004-06-16 System and method for using first-principles simulation to facilitate a semiconductor manufacturing process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/673,138 US8032348B2 (en) 2003-09-30 2003-09-30 System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US10/673,138 2003-09-30

Publications (2)

Publication Number Publication Date
WO2005036591A2 WO2005036591A2 (en) 2005-04-21
WO2005036591A3 true WO2005036591A3 (en) 2005-11-10

Family

ID=34376553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/016618 WO2005036591A2 (en) 2003-09-30 2004-06-16 System and method for using first-principles simulation to facilitate a semiconductor manufacturing process

Country Status (7)

Country Link
US (1) US8032348B2 (en)
EP (1) EP1668554A4 (en)
JP (1) JP4740142B2 (en)
KR (1) KR101054710B1 (en)
CN (1) CN100568249C (en)
TW (1) TW200515256A (en)
WO (1) WO2005036591A2 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8050900B2 (en) * 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
DE102004020466A1 (en) * 2004-04-26 2005-11-17 Applied Films Gmbh & Co. Kg Process for coating substrates in inline systems
US7729789B2 (en) * 2004-05-04 2010-06-01 Fisher-Rosemount Systems, Inc. Process plant monitoring based on multivariate statistical analysis and on-line process simulation
TWI336823B (en) * 2004-07-10 2011-02-01 Onwafer Technologies Inc Methods of and apparatuses for maintenance, diagnosis, and optimization of processes
US8676538B2 (en) * 2004-11-02 2014-03-18 Advanced Micro Devices, Inc. Adjusting weighting of a parameter relating to fault detection based on a detected fault
US7783455B1 (en) * 2005-03-04 2010-08-24 Globalfoundries Inc. Methods and systems for analyzing process equipment processing variations using sensor data
US8322616B2 (en) * 2006-10-06 2012-12-04 Nikon Precision Inc. Automated signature detection system and method of use
JP2009224374A (en) * 2008-03-13 2009-10-01 Oki Semiconductor Co Ltd Peb apparatus, and control method thereof
JP5465954B2 (en) * 2008-09-29 2014-04-09 株式会社日立国際電気 Substrate processing apparatus, storage medium for storing determination program, and display method for substrate processing apparatus
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
US8618807B2 (en) * 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
TWI427722B (en) * 2010-08-02 2014-02-21 Univ Nat Cheng Kung Advanced process control system and method utilizing virtual metrology with reliance index and computer program product thereof
US8539404B2 (en) 2011-09-23 2013-09-17 International Business Machines Corporation Functional simulation redundancy reduction by state comparison and pruning
US8887106B2 (en) * 2011-12-28 2014-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method of generating a bias-adjusted layout design of a conductive feature and method of generating a simulation model of a predefined fabrication process
US9400495B2 (en) 2012-10-16 2016-07-26 Rockwell Automation Technologies, Inc. Industrial automation equipment and machine procedure simulation
EP2784704A1 (en) * 2013-03-26 2014-10-01 Fujitsu Limited Multi-component computational fluid dynamics simulations
US9412673B2 (en) * 2013-08-23 2016-08-09 Kla-Tencor Corporation Multi-model metrology
KR101661993B1 (en) 2015-01-07 2016-10-05 서울시립대학교 산학협력단 Apparatus and method for estimation of sram performance margin using worst case sampling
CN107358188B (en) * 2015-01-13 2021-12-07 深圳市汇顶科技股份有限公司 Fingerprint sensor and correction method thereof
CN107798204B (en) 2017-12-08 2018-10-26 山东大学 A kind of tangential gradual change hot-spraying coating design method of complex profile workpiece
CN109814535A (en) * 2019-02-20 2019-05-28 上海奕信半导体设备有限公司 Diffusion furnace inline diagnosis method based on Wiener model discrimination method
US20220146991A1 (en) * 2019-03-15 2022-05-12 3M Innovative Properties Company Polishing semiconductor wafers using causal models
CN110262879B (en) * 2019-05-17 2021-08-20 杭州电子科技大学 Monte Carlo tree searching method based on balanced exploration and utilization
US11061321B1 (en) 2019-06-24 2021-07-13 Synopsys, Inc. Obtaining a mask using a cost function gradient from a Jacobian matrix generated from a perturbation look-up table
JP7325356B2 (en) * 2020-02-20 2023-08-14 東京エレクトロン株式会社 Information processing system and simulation method
US20230297740A1 (en) * 2022-03-15 2023-09-21 Applied Materials, Inc. Uniform radiation heating control architecture

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6802045B1 (en) * 2001-04-19 2004-10-05 Advanced Micro Devices, Inc. Method and apparatus for incorporating control simulation environment

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377116A (en) 1991-07-01 1994-12-27 Valenite Inc. Method and system for designing a cutting tool
JP3001351B2 (en) 1993-06-24 2000-01-24 日本電気株式会社 Simulation method
US5474381A (en) 1993-11-30 1995-12-12 Texas Instruments Incorporated Method for real-time semiconductor wafer temperature measurement based on a surface roughness characteristic of the wafer
US5526293A (en) * 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
JP3402412B2 (en) * 1994-09-20 2003-05-06 株式会社リコー Process simulation input data setting device
US5555474A (en) 1994-12-21 1996-09-10 Integrated Process Equipment Corp. Automatic rejection of diffraction effects in thin film metrology
US5583780A (en) * 1994-12-30 1996-12-10 Kee; Robert J. Method and device for predicting wavelength dependent radiation influences in thermal systems
US5539652A (en) 1995-02-07 1996-07-23 Hewlett-Packard Company Method for manufacturing test simulation in electronic circuit design
JPH0962718A (en) * 1995-08-23 1997-03-07 Sony Corp Device and method for simulation
US5719796A (en) 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
JP3593770B2 (en) * 1995-12-14 2004-11-24 ソニー株式会社 Semiconductor process simulator
US6185472B1 (en) 1995-12-28 2001-02-06 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method, manufacturing apparatus, simulation method and simulator
JPH09198368A (en) * 1996-01-16 1997-07-31 Matsushita Electric Ind Co Ltd Device and method for simulation
JPH09320917A (en) * 1996-05-30 1997-12-12 Matsushita Electric Ind Co Ltd Simulation device of semiconductor and method thereof
US6628809B1 (en) * 1999-10-08 2003-09-30 Lumidigm, Inc. Apparatus and method for identification of individuals by near-infrared spectrum
US7107571B2 (en) * 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US6757645B2 (en) * 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US5866437A (en) * 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
JPH11176906A (en) 1997-12-16 1999-07-02 Toshiba Corp Manufacturing method and system, designing method and storage medium for electronic parts
JPH11238655A (en) * 1998-02-20 1999-08-31 Ricoh Co Ltd Semiconductor process determination support device
US6161051A (en) 1998-05-08 2000-12-12 Rockwell Technologies, Llc System, method and article of manufacture for utilizing external models for enterprise wide control
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
JPH11330449A (en) * 1998-05-20 1999-11-30 Toshiba Corp Manufacture of semiconductor device, simulation device and method, storage medium recording simulation program, and storage medium recording with simulation data recorded therein
JP3660137B2 (en) * 1998-09-25 2005-06-15 株式会社東芝 Simulation method, simulator, recording medium recording simulation program, and method for manufacturing semiconductor device
US6198980B1 (en) * 1998-11-06 2001-03-06 John Costanza Institute Of Technology System and method for designing a mixed-model manufacturing process
JP2000269105A (en) * 1999-03-12 2000-09-29 Toshiba Corp Process simulator, process simulation, device simulator, and device simulation
US6581029B1 (en) 1999-05-11 2003-06-17 International Business Machines Corporation Method and system for optimizing execution of a collection of related module sequences by eliminating redundant modules
US6360133B1 (en) 1999-06-17 2002-03-19 Advanced Micro Devices, Inc. Method and apparatus for automatic routing for reentrant process
CN1239969C (en) 1999-06-22 2006-02-01 布鲁克斯自动化公司 Run-to-run controller for use in microelectronic fabrication
US6560503B1 (en) * 1999-10-05 2003-05-06 Advanced Micro Devices, Inc. Method and apparatus for monitoring controller performance using statistical process control
US6643616B1 (en) * 1999-12-07 2003-11-04 Yuri Granik Integrated device structure prediction based on model curvature
IL152198A0 (en) * 2000-04-12 2003-05-29 Janssen Pharmaceutica Nv Method and apparatus for detecting outliers in biological/pharmaceutical screening experiments
JP2001297955A (en) 2000-04-14 2001-10-26 Toshiba Corp Simulation method, simulator, and recording medium recording simulation program
JP2002023823A (en) 2000-07-12 2002-01-25 Mitsubishi Electric Corp Production control system
US6410351B1 (en) 2000-07-13 2002-06-25 Advanced Micro Devices, Inc. Method and apparatus for modeling thickness profiles and controlling subsequent etch process
CN1154045C (en) 2000-07-25 2004-06-16 华为技术有限公司 Combined simulation system across platforms
US6812045B1 (en) * 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US6625497B2 (en) 2000-11-20 2003-09-23 Applied Materials Inc. Semiconductor processing module with integrated feedback/feed forward metrology
US6819963B2 (en) * 2000-12-06 2004-11-16 Advanced Micro Devices, Inc. Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP)
US6571371B1 (en) * 2000-12-27 2003-05-27 Advanced Micro Devices, Inc. Method and apparatus for using latency time as a run-to-run control parameter
DE10296328B4 (en) 2001-02-14 2010-04-08 Advanced Micro Devices, Inc., Sunnyvale Process line and method for controlling an etching process
US6615098B1 (en) 2001-02-21 2003-09-02 Advanced Micro Devices, Inc. Method and apparatus for controlling a tool using a baseline control script
US7297287B2 (en) * 2001-03-23 2007-11-20 Tokyo Electron Limited Method and apparatus for endpoint detection using partial least squares
JP3993396B2 (en) 2001-03-30 2007-10-17 株式会社東芝 Manufacturing method of semiconductor device
JP2002367875A (en) 2001-06-07 2002-12-20 Matsushita Electric Ind Co Ltd Process control system and process control method
JP3708031B2 (en) 2001-06-29 2005-10-19 株式会社日立製作所 Plasma processing apparatus and processing method
US6763277B1 (en) * 2001-07-16 2004-07-13 Advanced Micro Devices, Inc. Method and apparatus for proactive dispatch system to improve line balancing
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6728591B1 (en) * 2001-08-01 2004-04-27 Advanced Micro Devices, Inc. Method and apparatus for run-to-run control of trench profiles
US20030101251A1 (en) * 2001-11-27 2003-05-29 Varros Telecom Customizable element management system and method using element modeling and protocol adapters
JP2003197493A (en) * 2001-12-25 2003-07-11 Toshiba Corp Device development assistance simulating method and device
US6774998B1 (en) * 2001-12-27 2004-08-10 Advanced Micro Devices, Inc. Method and apparatus for identifying misregistration in a complimentary phase shift mask process
AU2002367375A1 (en) * 2001-12-28 2003-07-24 Electro Scientific Industries, Inc. Method for automatically defining a part model
WO2003058699A1 (en) 2001-12-31 2003-07-17 Tokyo Electron Limited Method of fault detection for material process system
WO2003060779A1 (en) 2002-01-10 2003-07-24 Advanced Micro Devices, Inc. Agent-based control architecture
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
JP2003272981A (en) * 2002-03-19 2003-09-26 Sony Corp System and method for semiconductor simulation
US6905895B1 (en) * 2002-06-28 2005-06-14 Advanced Micro Devices, Inc. Predicting process excursions based upon tool state variables
JP2004094738A (en) 2002-09-02 2004-03-25 Toshiba Corp Distributed simulation system
US7184850B1 (en) * 2002-09-06 2007-02-27 National Semiconductor Corporation System and method for allocating multi-function resources for a wetdeck process in semiconductor wafer fabrication
US6893800B2 (en) 2002-09-24 2005-05-17 Agere Systems, Inc. Substrate topography compensation at mask design: 3D OPC topography anchored
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
US7752099B2 (en) * 2002-10-17 2010-07-06 Itg Software Solutions, Inc. Factor risk model based system, method, and computer program product for generating risk forecasts
US7457736B2 (en) * 2002-11-21 2008-11-25 Synopsys, Inc. Automated creation of metrology recipes
US7047095B2 (en) 2002-12-06 2006-05-16 Tokyo Electron Limited Process control system and process control method
US7333871B2 (en) * 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20050010319A1 (en) * 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8050900B2 (en) 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US7356377B2 (en) * 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6802045B1 (en) * 2001-04-19 2004-10-05 Advanced Micro Devices, Inc. Method and apparatus for incorporating control simulation environment

Also Published As

Publication number Publication date
KR101054710B1 (en) 2011-08-05
EP1668554A2 (en) 2006-06-14
US8032348B2 (en) 2011-10-04
US20050071034A1 (en) 2005-03-31
CN100568249C (en) 2009-12-09
JP4740142B2 (en) 2011-08-03
EP1668554A4 (en) 2009-11-04
JP2007510287A (en) 2007-04-19
WO2005036591A2 (en) 2005-04-21
CN1799054A (en) 2006-07-05
TW200515256A (en) 2005-05-01
KR20060062034A (en) 2006-06-09

Similar Documents

Publication Publication Date Title
WO2005036591A3 (en) System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
WO2005034182A3 (en) System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
WO2005034180A3 (en) System and method for on-tool semiconductor simulation
WO2005034185A3 (en) System and method for on-tool semiconductor simulation
WO2005050698A3 (en) System and method for on-tool semiconductor simulation
WO2005052720A3 (en) Knowledge modeling system using ontology
WO2003089995A3 (en) Methods and apparatus for process, factory-floor, environmental, computer aided manufacturing-based or other control system with real-time data distribution
WO2004072788A3 (en) Data set comparison and net change processing
TW200506733A (en) Apparatus and method for the co-simulation of CPU and DUT modules
WO2004036337A3 (en) Information extraction using an object based semantic network
WO2009002949A3 (en) System, method and apparatus for predictive modeling of specially distributed data for location based commercial services
AU2003288194A1 (en) Product and parts management system, data processing system, serial number management method, computer program product, and computer-readable medium
WO2004075078A3 (en) Method and apparatus for fundamental operations on token sequences: computing similarity, extracting term values, and searching efficiently
WO2004066089A3 (en) Method and system for converting engineering data into 3d modeling data
AU2003299969A1 (en) Method and system for computer aided manufacturing
WO2007075757A3 (en) Parallel multi-rate circuit simulation
TW200636411A (en) Automated throughput control system and method of operating the same
WO2005008412A8 (en) Shared input key method and apparatus
WO2007044826A3 (en) Xml schema template builder
ATE442616T1 (en) SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR MACHINE TOOL PROGRAMMING
WO2005048153A3 (en) Modeling an event in a spreadsheet environment
DE502004004043D1 (en) DEVICE AND METHOD FOR PROCESSING AT LEAST TWO INPUT VALUES
AU2003245924A8 (en) Method and system for simulating order processing processes, corresponding computer program product, and corresponding computer-readable storage medium
WO2005008544A8 (en) System and method for multiple model object sharing
WO2006036720A3 (en) Business process management system and method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004753447

Country of ref document: EP

Ref document number: 20048149307

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020057024760

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2006533434

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2004753447

Country of ref document: EP