WO2005050698A3 - System and method for on-tool semiconductor simulation - Google Patents

System and method for on-tool semiconductor simulation Download PDF

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Publication number
WO2005050698A3
WO2005050698A3 PCT/US2004/028804 US2004028804W WO2005050698A3 WO 2005050698 A3 WO2005050698 A3 WO 2005050698A3 US 2004028804 W US2004028804 W US 2004028804W WO 2005050698 A3 WO2005050698 A3 WO 2005050698A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing tool
semiconductor processing
process performed
principles
simulation result
Prior art date
Application number
PCT/US2004/028804
Other languages
French (fr)
Other versions
WO2005050698A2 (en
Inventor
Eric J Strang
Original Assignee
Tokyo Electron Ltd
Eric J Strang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Eric J Strang filed Critical Tokyo Electron Ltd
Priority to JP2006533875A priority Critical patent/JP4955393B2/en
Publication of WO2005050698A2 publication Critical patent/WO2005050698A2/en
Publication of WO2005050698A3 publication Critical patent/WO2005050698A3/en

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41885Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80Management or planning

Abstract

A method, system and computer readable medium for controlling a process performed by a semiconductor processing tool (802). The method includes inputting data relating to a process performed by the semiconductor processing tool (802), inputting a first principles physical model (804) relating to the semiconductor processing tool (802), performing first principles simulation using the input data and the physical model to provide a first principles simulation result. The first principles simulation result is used to build an empirical model (842), and at least one of the first principles simulation result and the empirical model (842) is selected to control the process performed by the semiconductor processing tool (802).
PCT/US2004/028804 2003-09-30 2004-09-22 System and method for on-tool semiconductor simulation WO2005050698A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006533875A JP4955393B2 (en) 2003-09-30 2004-09-22 A system and method using first principle simulation to control a semiconductor manufacturing process.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/673,467 2003-09-30
US10/673,467 US8036869B2 (en) 2003-09-30 2003-09-30 System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model

Publications (2)

Publication Number Publication Date
WO2005050698A2 WO2005050698A2 (en) 2005-06-02
WO2005050698A3 true WO2005050698A3 (en) 2006-01-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/028804 WO2005050698A2 (en) 2003-09-30 2004-09-22 System and method for on-tool semiconductor simulation

Country Status (4)

Country Link
US (1) US8036869B2 (en)
JP (1) JP4955393B2 (en)
TW (1) TWI309846B (en)
WO (1) WO2005050698A2 (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8862452B2 (en) * 2001-02-14 2014-10-14 Xio, Inc. Control system simulator and simplified interconnection control system
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8032348B2 (en) * 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8296687B2 (en) * 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8014991B2 (en) * 2003-09-30 2011-09-06 Tokyo Electron Limited System and method for using first-principles simulation to characterize a semiconductor manufacturing process
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
TWI336823B (en) * 2004-07-10 2011-02-01 Onwafer Technologies Inc Methods of and apparatuses for maintenance, diagnosis, and optimization of processes
US8676538B2 (en) * 2004-11-02 2014-03-18 Advanced Micro Devices, Inc. Adjusting weighting of a parameter relating to fault detection based on a detected fault
US20070239305A1 (en) * 2006-03-28 2007-10-11 Haoren Zhuang Process control systems and methods
US8544064B2 (en) * 2007-02-09 2013-09-24 Sony Corporation Techniques for automatic registration of appliances
JP2009224374A (en) * 2008-03-13 2009-10-01 Oki Semiconductor Co Ltd Peb apparatus, and control method thereof
JP5465954B2 (en) * 2008-09-29 2014-04-09 株式会社日立国際電気 Substrate processing apparatus, storage medium for storing determination program, and display method for substrate processing apparatus
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8618807B2 (en) 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
WO2011002804A2 (en) * 2009-06-30 2011-01-06 Lam Research Corporation Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber
US8560283B2 (en) * 2009-07-10 2013-10-15 Emerson Process Management Power And Water Solutions, Inc. Methods and apparatus to compensate first principle-based simulation models
ES2955230T3 (en) * 2010-03-22 2023-11-29 Xio Inc Enhanced Control System Simulator and Simplified Interconnection Control System
TWI427722B (en) * 2010-08-02 2014-02-21 Univ Nat Cheng Kung Advanced process control system and method utilizing virtual metrology with reliance index and computer program product thereof
US9002498B2 (en) 2012-02-02 2015-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Tool function to improve fab process in semiconductor manufacturing
US10222769B2 (en) 2012-10-12 2019-03-05 Emerson Process Management Power & Water Solutions, Inc. Method for determining and tuning process characteristic parameters using a simulation system
EP2784704A1 (en) * 2013-03-26 2014-10-01 Fujitsu Limited Multi-component computational fluid dynamics simulations
CN105765461B (en) 2013-10-02 2018-01-05 Asml荷兰有限公司 Method and apparatus for obtaining the diagnostic message relevant with industrial process
US10088836B2 (en) * 2015-07-29 2018-10-02 General Electric Company Methods, systems, and apparatus for resource allocation in a manufacturing environment
CN112640037A (en) * 2018-09-03 2021-04-09 首选网络株式会社 Learning device, inference device, learning model generation method, and inference method
TWI776015B (en) * 2019-01-30 2022-09-01 晶喬科技股份有限公司 Method and system for developing semiconductor device fabrication processes
JP7458808B2 (en) * 2020-02-07 2024-04-01 東京エレクトロン株式会社 Process estimation system, process data estimation method and program
JP7325356B2 (en) * 2020-02-20 2023-08-14 東京エレクトロン株式会社 Information processing system and simulation method
US11449028B2 (en) 2020-09-03 2022-09-20 Rockwell Automation Technologies, Inc. Industrial automation asset and control project analysis
US11561517B2 (en) 2020-09-09 2023-01-24 Rockwell Automation Technologies, Inc. Industrial development hub vault and design tools
US11294360B2 (en) 2020-09-09 2022-04-05 Rockwell Automation Technologies, Inc. Industrial automation project code development guidance and analysis
US20220084842A1 (en) * 2020-09-11 2022-03-17 Applied Materials, Inc. Antifragile systems for semiconductor processing equipment using multiple special sensors and algorithms
US11415969B2 (en) 2020-09-21 2022-08-16 Rockwell Automation Technologies, Inc. Connectivity to an industrial information hub
US11796983B2 (en) 2020-09-25 2023-10-24 Rockwell Automation Technologies, Inc. Data modeling and asset management using an industrial information hub
JP2022102821A (en) * 2020-12-25 2022-07-07 東京エレクトロン株式会社 Information processing device, information processing system, and parts order method
CN112966468B (en) * 2021-03-17 2022-06-07 武汉大学 Flexible PCB etching process on-line regulation and control method based on wet chemical etching simulation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377116A (en) * 1991-07-01 1994-12-27 Valenite Inc. Method and system for designing a cutting tool
JP3001351B2 (en) * 1993-06-24 2000-01-24 日本電気株式会社 Simulation method
US5474381A (en) 1993-11-30 1995-12-12 Texas Instruments Incorporated Method for real-time semiconductor wafer temperature measurement based on a surface roughness characteristic of the wafer
US5526293A (en) * 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5555474A (en) 1994-12-21 1996-09-10 Integrated Process Equipment Corp. Automatic rejection of diffraction effects in thin film metrology
US5583780A (en) * 1994-12-30 1996-12-10 Kee; Robert J. Method and device for predicting wavelength dependent radiation influences in thermal systems
US5539652A (en) 1995-02-07 1996-07-23 Hewlett-Packard Company Method for manufacturing test simulation in electronic circuit design
US6185472B1 (en) 1995-12-28 2001-02-06 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method, manufacturing apparatus, simulation method and simulator
US6628809B1 (en) * 1999-10-08 2003-09-30 Lumidigm, Inc. Apparatus and method for identification of individuals by near-infrared spectrum
US6757645B2 (en) * 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US7107571B2 (en) * 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US5866437A (en) 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
JPH11176906A (en) 1997-12-16 1999-07-02 Toshiba Corp Manufacturing method and system, designing method and storage medium for electronic parts
US6161051A (en) 1998-05-08 2000-12-12 Rockwell Technologies, Llc System, method and article of manufacture for utilizing external models for enterprise wide control
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
JP3660137B2 (en) * 1998-09-25 2005-06-15 株式会社東芝 Simulation method, simulator, recording medium recording simulation program, and method for manufacturing semiconductor device
US6198980B1 (en) * 1998-11-06 2001-03-06 John Costanza Institute Of Technology System and method for designing a mixed-model manufacturing process
US6581029B1 (en) 1999-05-11 2003-06-17 International Business Machines Corporation Method and system for optimizing execution of a collection of related module sequences by eliminating redundant modules
US6360133B1 (en) 1999-06-17 2002-03-19 Advanced Micro Devices, Inc. Method and apparatus for automatic routing for reentrant process
JP2003502771A (en) 1999-06-22 2003-01-21 ブルックス オートメーション インコーポレイテッド Run-to-run controller used for microelectronics fabrication
US6560503B1 (en) * 1999-10-05 2003-05-06 Advanced Micro Devices, Inc. Method and apparatus for monitoring controller performance using statistical process control
US6643616B1 (en) * 1999-12-07 2003-11-04 Yuri Granik Integrated device structure prediction based on model curvature
US20030078738A1 (en) * 2000-04-12 2003-04-24 Wouters Lucien Joseph Maria Rosalia Method and apparatus for detecting outliers in biological/parmaceutical screening experiments
JP2001297955A (en) 2000-04-14 2001-10-26 Toshiba Corp Simulation method, simulator, and recording medium recording simulation program
JP2002023823A (en) 2000-07-12 2002-01-25 Mitsubishi Electric Corp Production control system
US6410351B1 (en) 2000-07-13 2002-06-25 Advanced Micro Devices, Inc. Method and apparatus for modeling thickness profiles and controlling subsequent etch process
CN1154045C (en) 2000-07-25 2004-06-16 华为技术有限公司 Combined simulation system across platforms
US6812045B1 (en) * 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US6625497B2 (en) * 2000-11-20 2003-09-23 Applied Materials Inc. Semiconductor processing module with integrated feedback/feed forward metrology
US6819963B2 (en) * 2000-12-06 2004-11-16 Advanced Micro Devices, Inc. Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP)
US6571371B1 (en) * 2000-12-27 2003-05-27 Advanced Micro Devices, Inc. Method and apparatus for using latency time as a run-to-run control parameter
DE10296328B4 (en) 2001-02-14 2010-04-08 Advanced Micro Devices, Inc., Sunnyvale Process line and method for controlling an etching process
US6615098B1 (en) 2001-02-21 2003-09-02 Advanced Micro Devices, Inc. Method and apparatus for controlling a tool using a baseline control script
KR100912748B1 (en) 2001-03-23 2009-08-18 도쿄엘렉트론가부시키가이샤 Method and apparatus for endpoint detection using partial least squares
JP3993396B2 (en) 2001-03-30 2007-10-17 株式会社東芝 Manufacturing method of semiconductor device
US6802045B1 (en) * 2001-04-19 2004-10-05 Advanced Micro Devices, Inc. Method and apparatus for incorporating control simulation environment
JP2002367875A (en) 2001-06-07 2002-12-20 Matsushita Electric Ind Co Ltd Process control system and process control method
JP3708031B2 (en) 2001-06-29 2005-10-19 株式会社日立製作所 Plasma processing apparatus and processing method
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6763277B1 (en) * 2001-07-16 2004-07-13 Advanced Micro Devices, Inc. Method and apparatus for proactive dispatch system to improve line balancing
US6728591B1 (en) * 2001-08-01 2004-04-27 Advanced Micro Devices, Inc. Method and apparatus for run-to-run control of trench profiles
US20030101251A1 (en) * 2001-11-27 2003-05-29 Varros Telecom Customizable element management system and method using element modeling and protocol adapters
US6774998B1 (en) * 2001-12-27 2004-08-10 Advanced Micro Devices, Inc. Method and apparatus for identifying misregistration in a complimentary phase shift mask process
AU2002367375A1 (en) * 2001-12-28 2003-07-24 Electro Scientific Industries, Inc. Method for automatically defining a part model
US7972483B2 (en) 2001-12-31 2011-07-05 Tokyo Electron Limited Method of fault detection for material process system
AU2002343588A1 (en) 2002-01-10 2003-07-30 Advanced Micro Devices, Inc. Agent-based control architecture
US6678581B2 (en) 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
US6905895B1 (en) * 2002-06-28 2005-06-14 Advanced Micro Devices, Inc. Predicting process excursions based upon tool state variables
JP2004094738A (en) 2002-09-02 2004-03-25 Toshiba Corp Distributed simulation system
US7184850B1 (en) * 2002-09-06 2007-02-27 National Semiconductor Corporation System and method for allocating multi-function resources for a wetdeck process in semiconductor wafer fabrication
US6893800B2 (en) 2002-09-24 2005-05-17 Agere Systems, Inc. Substrate topography compensation at mask design: 3D OPC topography anchored
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
US7752099B2 (en) * 2002-10-17 2010-07-06 Itg Software Solutions, Inc. Factor risk model based system, method, and computer program product for generating risk forecasts
US7457736B2 (en) * 2002-11-21 2008-11-25 Synopsys, Inc. Automated creation of metrology recipes
US7047095B2 (en) 2002-12-06 2006-05-16 Tokyo Electron Limited Process control system and process control method
US7333871B2 (en) * 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20050010319A1 (en) * 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8014991B2 (en) 2003-09-30 2011-09-06 Tokyo Electron Limited System and method for using first-principles simulation to characterize a semiconductor manufacturing process
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US7356377B2 (en) * 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
YONEMURA N. ET AL.: "Heat Analysis on Insulated Mteal Substrates.", IEEE, 1996, pages 1407 - 1410, XP010201205 *

Also Published As

Publication number Publication date
TW200532748A (en) 2005-10-01
JP4955393B2 (en) 2012-06-20
US8036869B2 (en) 2011-10-11
US20050071035A1 (en) 2005-03-31
WO2005050698A2 (en) 2005-06-02
JP2007507888A (en) 2007-03-29
TWI309846B (en) 2009-05-11

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