WO2005059617A2 - Projection objective having a high aperture and a planar end surface - Google Patents
Projection objective having a high aperture and a planar end surface Download PDFInfo
- Publication number
- WO2005059617A2 WO2005059617A2 PCT/EP2004/014062 EP2004014062W WO2005059617A2 WO 2005059617 A2 WO2005059617 A2 WO 2005059617A2 EP 2004014062 W EP2004014062 W EP 2004014062W WO 2005059617 A2 WO2005059617 A2 WO 2005059617A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- projection objective
- optical element
- index
- projection
- refractive index
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0892—Catadioptric systems specially adapted for the UV
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B13/00—Measuring arrangements characterised by the use of fluids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/082—Catadioptric systems using three curved mirrors
- G02B17/0828—Catadioptric systems using three curved mirrors off-axis or unobscured systems in which all of the mirrors share a common axis of rotational symmetry
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
- G03F7/70966—Birefringence
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020067011811A KR101200654B1 (en) | 2003-12-15 | 2004-12-10 | Projection objective having a high aperture and a planar end surface |
EP04803712A EP1697798A2 (en) | 2003-12-15 | 2004-12-10 | Projection objective having a high aperture and a planar end surface |
JP2006543484A JP5106858B2 (en) | 2003-12-15 | 2004-12-10 | Projection objective having a high numerical aperture and a planar end face |
US11/151,465 US7466489B2 (en) | 2003-12-15 | 2005-06-14 | Projection objective having a high aperture and a planar end surface |
US12/269,686 US7782538B2 (en) | 2003-12-15 | 2008-11-12 | Projection objective having a high aperture and a planar end surface |
Applications Claiming Priority (24)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/734,623 US6995930B2 (en) | 1999-12-29 | 2003-12-15 | Catadioptric projection objective with geometric beam splitting |
US10/734,623 | 2003-12-15 | ||
US53062303P | 2003-12-19 | 2003-12-19 | |
US60/530,623 | 2003-12-19 | ||
US53097803P | 2003-12-22 | 2003-12-22 | |
US60/530,978 | 2003-12-22 | ||
US53624804P | 2004-01-14 | 2004-01-14 | |
US60/536,248 | 2004-01-14 | ||
US54496704P | 2004-02-13 | 2004-02-13 | |
US60/544,967 | 2004-02-13 | ||
US56800604P | 2004-05-04 | 2004-05-04 | |
US60/568,006 | 2004-05-04 | ||
US58750404P | 2004-07-14 | 2004-07-14 | |
US60/587,504 | 2004-07-14 | ||
US59177504P | 2004-07-27 | 2004-07-27 | |
US60/591,775 | 2004-07-27 | ||
US59220804P | 2004-07-29 | 2004-07-29 | |
US60/592,208 | 2004-07-29 | ||
US61282304P | 2004-09-24 | 2004-09-24 | |
US60/612,823 | 2004-09-24 | ||
US61767404P | 2004-10-13 | 2004-10-13 | |
US60/617,674 | 2004-10-13 | ||
DE102004051730.4 | 2004-10-22 | ||
DE102004051730 | 2004-10-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/734,623 Continuation-In-Part US6995930B2 (en) | 1999-12-29 | 2003-12-15 | Catadioptric projection objective with geometric beam splitting |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/151,465 Continuation-In-Part US7466489B2 (en) | 2003-12-15 | 2005-06-14 | Projection objective having a high aperture and a planar end surface |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005059617A2 true WO2005059617A2 (en) | 2005-06-30 |
WO2005059617A3 WO2005059617A3 (en) | 2006-02-09 |
Family
ID=34705483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/014062 WO2005059617A2 (en) | 2003-12-15 | 2004-12-10 | Projection objective having a high aperture and a planar end surface |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1697798A2 (en) |
JP (1) | JP5106858B2 (en) |
KR (1) | KR101200654B1 (en) |
WO (1) | WO2005059617A2 (en) |
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WO2005119371A1 (en) * | 2004-06-01 | 2005-12-15 | E.I. Dupont De Nemours And Company | Ultraviolet-transparent alkanes and processes using same in vacuum and deep ultraviolet applications |
WO2007017473A1 (en) | 2005-08-10 | 2007-02-15 | Carl Zeiss Smt Ag | Imaging system, in particular projection lens of a microlithographic projection exposure unit |
WO2007034838A1 (en) | 2005-09-21 | 2007-03-29 | Nikon Corporation | Exposure device, exposure method, and device fabrication method |
WO2007040254A1 (en) | 2005-10-05 | 2007-04-12 | Nikon Corporation | Exposure apparatus and exposure method |
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WO2007055199A1 (en) | 2005-11-09 | 2007-05-18 | Nikon Corporation | Exposure apparatus and method, and method for manufacturing device |
WO2007058354A1 (en) | 2005-11-21 | 2007-05-24 | Nikon Corporation | Exposure method and device manufacturing method using the same, exposure apparatus, and substrate treatment method and apparatus |
WO2007066758A1 (en) | 2005-12-08 | 2007-06-14 | Nikon Corporation | Substrate holding device, exposure device, exposure method, and device fabrication method |
WO2007071565A1 (en) * | 2005-12-23 | 2007-06-28 | Carl Zeiss Smt Ag | Projection objective of a microlithographic projection exposure apparatus |
WO2007076094A2 (en) * | 2005-12-22 | 2007-07-05 | Corning Incorporated | Submersive doublet for high numerical aperture optical system |
WO2007077875A1 (en) | 2005-12-28 | 2007-07-12 | Nikon Corporation | Exposure apparatus, exposure method, and device production method |
WO2007094470A1 (en) | 2006-02-16 | 2007-08-23 | Nikon Corporation | Exposure apparatus, exposure method and method for manufacturing device |
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WO2007094431A1 (en) | 2006-02-16 | 2007-08-23 | Nikon Corporation | Exposure apparatus, exposing method, and device manufacturing method |
WO2007097380A1 (en) | 2006-02-21 | 2007-08-30 | Nikon Corporation | Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method |
WO2007100087A1 (en) | 2006-03-03 | 2007-09-07 | Nikon Corporation | Exposure apparatus and device manufacturing method |
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