WO2005059618A3 - Microlithography projection objective with crystal lens - Google Patents

Microlithography projection objective with crystal lens Download PDF

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Publication number
WO2005059618A3
WO2005059618A3 PCT/EP2004/014290 EP2004014290W WO2005059618A3 WO 2005059618 A3 WO2005059618 A3 WO 2005059618A3 EP 2004014290 W EP2004014290 W EP 2004014290W WO 2005059618 A3 WO2005059618 A3 WO 2005059618A3
Authority
WO
WIPO (PCT)
Prior art keywords
microlithography projection
crystal lens
projection objective
crystalline
lenses
Prior art date
Application number
PCT/EP2004/014290
Other languages
French (fr)
Other versions
WO2005059618A2 (en
Inventor
Karl-Heinz Schuster
Wilfried Clauss
Original Assignee
Zeiss Carl Smt Ag
Karl-Heinz Schuster
Wilfried Clauss
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeiss Carl Smt Ag, Karl-Heinz Schuster, Wilfried Clauss filed Critical Zeiss Carl Smt Ag
Priority to US10/596,626 priority Critical patent/US7755839B2/en
Publication of WO2005059618A2 publication Critical patent/WO2005059618A2/en
Publication of WO2005059618A3 publication Critical patent/WO2005059618A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
    • G02B13/143—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation for use with ultraviolet radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties

Abstract

Very high aperture microlithography projection objectives operating at the wavelengths of 248 nm, 193 nm and also 157 nm, suitable for optical immersion or near-field operation with aperture values that can exceed 1.4 are made feasible with crystalline lenses and crystalline end plates P of NaCl, KCl, KI, RbI, CsI, and MgO, YAG with refractive indices up to and above 2.0. These crystalline lenses and end plates are placed between the system aperture stop AS and the wafer W, preferably as the last lenses on the image side of the objective.
PCT/EP2004/014290 2003-12-19 2004-12-15 Microlithography projection objective with crystal lens WO2005059618A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/596,626 US7755839B2 (en) 2003-12-19 2004-12-15 Microlithography projection objective with crystal lens

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53062303P 2003-12-19 2003-12-19
US60/530,623 2003-12-19
US56800604P 2004-05-04 2004-05-04
US60/568,006 2004-05-04

Publications (2)

Publication Number Publication Date
WO2005059618A2 WO2005059618A2 (en) 2005-06-30
WO2005059618A3 true WO2005059618A3 (en) 2006-01-19

Family

ID=34704297

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP2004/014100 WO2005059645A2 (en) 2003-12-19 2004-12-10 Microlithography projection objective with crystal elements
PCT/EP2004/014290 WO2005059618A2 (en) 2003-12-19 2004-12-15 Microlithography projection objective with crystal lens

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/014100 WO2005059645A2 (en) 2003-12-19 2004-12-10 Microlithography projection objective with crystal elements

Country Status (3)

Country Link
US (1) US7755839B2 (en)
JP (1) JP5102492B2 (en)
WO (2) WO2005059645A2 (en)

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US8941810B2 (en) 2005-12-30 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947631B2 (en) 2005-12-30 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9436096B2 (en) 2005-12-30 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9256136B2 (en) 2010-04-22 2016-02-09 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply

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JP5102492B2 (en) 2012-12-19
WO2005059645A2 (en) 2005-06-30
JP2007529762A (en) 2007-10-25
US7755839B2 (en) 2010-07-13
WO2005059645A3 (en) 2005-10-20
US20070091451A1 (en) 2007-04-26
WO2005059645A9 (en) 2006-06-08
WO2005059618A2 (en) 2005-06-30

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