WO2005060586A3 - Electronic device contact structures - Google Patents

Electronic device contact structures Download PDF

Info

Publication number
WO2005060586A3
WO2005060586A3 PCT/US2004/040900 US2004040900W WO2005060586A3 WO 2005060586 A3 WO2005060586 A3 WO 2005060586A3 US 2004040900 W US2004040900 W US 2004040900W WO 2005060586 A3 WO2005060586 A3 WO 2005060586A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
contact structures
device contact
structures
disclosed
Prior art date
Application number
PCT/US2004/040900
Other languages
French (fr)
Other versions
WO2005060586A2 (en
Inventor
Alexei A Erchak
Eleftrios Lidorikis
John W Graff
Original Assignee
Luminus Devices Inc
Alexei A Erchak
Eleftrios Lidorikis
John W Graff
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/735,498 external-priority patent/US7166871B2/en
Priority claimed from US10/794,244 external-priority patent/US20040259279A1/en
Priority claimed from US10/794,452 external-priority patent/US7074631B2/en
Priority claimed from US10/871,877 external-priority patent/US7105861B2/en
Application filed by Luminus Devices Inc, Alexei A Erchak, Eleftrios Lidorikis, John W Graff filed Critical Luminus Devices Inc
Publication of WO2005060586A2 publication Critical patent/WO2005060586A2/en
Publication of WO2005060586A3 publication Critical patent/WO2005060586A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Electronic device contact structures are disclosed.
PCT/US2004/040900 2003-12-12 2004-12-08 Electronic device contact structures WO2005060586A2 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US10/735,498 US7166871B2 (en) 2003-04-15 2003-12-12 Light emitting systems
US10/735,498 2003-12-12
US10/794,244 2004-03-05
US10/794,244 US20040259279A1 (en) 2003-04-15 2004-03-05 Light emitting device methods
US10/794,452 US7074631B2 (en) 2003-04-15 2004-03-05 Light emitting device methods
US10/794,452 2004-03-05
US55389404P 2004-03-16 2004-03-16
US60/553,894 2004-03-16
US10/871,877 US7105861B2 (en) 2003-04-15 2004-06-18 Electronic device contact structures
US10/871,877 2004-06-18

Publications (2)

Publication Number Publication Date
WO2005060586A2 WO2005060586A2 (en) 2005-07-07
WO2005060586A3 true WO2005060586A3 (en) 2006-03-30

Family

ID=34714664

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/040900 WO2005060586A2 (en) 2003-12-12 2004-12-08 Electronic device contact structures

Country Status (2)

Country Link
TW (1) TWI371866B (en)
WO (1) WO2005060586A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006013408A1 (en) * 2006-03-17 2007-09-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Light emitting diode unit for use as signal unit, has electrical conductors led along outer surface of electrically conducting electrodes based on electrical contact, overlapping electrodes in area wise, and forming power supply line
DE102008019049B4 (en) 2008-04-15 2013-12-24 Novaled Ag Light emitting organic device and device
TWI471069B (en) * 2013-05-22 2015-01-21 Takamatsu Plating Co Ltd Metal board used for led
KR102302564B1 (en) * 2016-03-09 2021-09-15 어플라이드 머티어리얼스, 인코포레이티드 Pad structure and manufacturing methods

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293513A (en) * 1962-08-08 1966-12-20 Texas Instruments Inc Semiconductor radiant diode
US3922706A (en) * 1965-07-31 1975-11-25 Telefunken Patent Transistor having emitter with high circumference-surface area ratio
US4864370A (en) * 1987-11-16 1989-09-05 Motorola, Inc. Electrical contact for an LED
US6307218B1 (en) * 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
US20050051785A1 (en) * 2003-04-15 2005-03-10 Erchak Alexei A. Electronic device contact structures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293513A (en) * 1962-08-08 1966-12-20 Texas Instruments Inc Semiconductor radiant diode
US3922706A (en) * 1965-07-31 1975-11-25 Telefunken Patent Transistor having emitter with high circumference-surface area ratio
US4864370A (en) * 1987-11-16 1989-09-05 Motorola, Inc. Electrical contact for an LED
US6307218B1 (en) * 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
US20050051785A1 (en) * 2003-04-15 2005-03-10 Erchak Alexei A. Electronic device contact structures

Also Published As

Publication number Publication date
TWI371866B (en) 2012-09-01
WO2005060586A2 (en) 2005-07-07
TW200531311A (en) 2005-09-16

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