WO2005068681A3 - Cleaning tantalum-containing deposits from process chamber components - Google Patents
Cleaning tantalum-containing deposits from process chamber components Download PDFInfo
- Publication number
- WO2005068681A3 WO2005068681A3 PCT/US2004/016518 US2004016518W WO2005068681A3 WO 2005068681 A3 WO2005068681 A3 WO 2005068681A3 US 2004016518 W US2004016518 W US 2004016518W WO 2005068681 A3 WO2005068681 A3 WO 2005068681A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cleaning
- containing deposits
- process chamber
- tantalum
- chamber components
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 3
- 229910052715 tantalum Inorganic materials 0.000 title abstract 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title abstract 3
- 239000007800 oxidant agent Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 229910017604 nitric acid Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
- C22B3/065—Nitric acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B34/00—Obtaining refractory metals
- C22B34/20—Obtaining niobium, tantalum or vanadium
- C22B34/24—Obtaining niobium or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/086—Iron or steel solutions containing HF
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/106—Other heavy metals refractory metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/12—Light metals
- C23G1/125—Light metals aluminium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/19—Iron or steel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
- C23G1/205—Other heavy metals refractory metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/22—Light metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/36—Regeneration of waste pickling liquors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127000547A KR101164570B1 (en) | 2003-12-19 | 2004-05-25 | Cleaning tantalium-containing deposits from process chamber components |
JP2006545314A JP2007528938A (en) | 2003-12-19 | 2004-05-25 | Cleaning tantalum-containing deposits from process chamber components |
KR1020127000548A KR101270192B1 (en) | 2003-12-19 | 2004-05-25 | Cleaning tantalium-containing deposits from process chamber components |
KR1020127000546A KR101223154B1 (en) | 2003-12-19 | 2004-05-25 | Cleaning tantalium-containing deposits from process chamber components |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/742,604 | 2003-12-19 | ||
US10/742,604 US6902627B2 (en) | 2002-11-25 | 2003-12-19 | Cleaning chamber surfaces to recover metal-containing compounds |
US10/846,894 US20050028838A1 (en) | 2002-11-25 | 2004-05-13 | Cleaning tantalum-containing deposits from process chamber components |
US10/846,894 | 2004-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005068681A2 WO2005068681A2 (en) | 2005-07-28 |
WO2005068681A3 true WO2005068681A3 (en) | 2005-09-15 |
Family
ID=34798987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/016518 WO2005068681A2 (en) | 2003-12-19 | 2004-05-25 | Cleaning tantalum-containing deposits from process chamber components |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050028838A1 (en) |
JP (1) | JP2007528938A (en) |
KR (4) | KR101270192B1 (en) |
TW (1) | TWI304612B (en) |
WO (1) | WO2005068681A2 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7964085B1 (en) | 2002-11-25 | 2011-06-21 | Applied Materials, Inc. | Electrochemical removal of tantalum-containing materials |
US20060105182A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Erosion resistant textured chamber surface |
US7910218B2 (en) | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
US7579067B2 (en) * | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US7554052B2 (en) * | 2005-07-29 | 2009-06-30 | Applied Materials, Inc. | Method and apparatus for the application of twin wire arc spray coatings |
US7762114B2 (en) * | 2005-09-09 | 2010-07-27 | Applied Materials, Inc. | Flow-formed chamber component having a textured surface |
US7981262B2 (en) * | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
US20090000641A1 (en) * | 2007-06-28 | 2009-01-01 | Applied Materials, Inc. | Methods and apparatus for cleaning deposition chamber parts using selective spray etch |
US20090084317A1 (en) * | 2007-09-28 | 2009-04-02 | Applied Materials, Inc. | Atomic layer deposition chamber and components |
US9481937B2 (en) | 2009-04-30 | 2016-11-01 | Asm America, Inc. | Selective etching of reactor surfaces |
NL2014497B1 (en) * | 2015-03-20 | 2017-01-19 | Asm Int Nv | Method for cleaning deposition apparatus. |
KR101722371B1 (en) * | 2016-08-05 | 2017-04-05 | 피에스테크놀러지(주) | Method for cleaning a process chamber by using an electropolishing |
KR101959760B1 (en) * | 2017-02-23 | 2019-03-19 | 피에스테크놀러지(주) | Method for cleaning a process chamber by using an electropolishing |
CN109371405A (en) * | 2018-12-14 | 2019-02-22 | 惠州市四维化工有限公司 | A kind of secondary chemical synthesizing method of lossless magnesium and magnesium alloy |
US11371159B2 (en) * | 2019-06-22 | 2022-06-28 | Applied Materials, Inc. | Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2562097A1 (en) * | 1984-03-28 | 1985-10-04 | Andritz Ag Maschf | Process for pickling alloy steels, copper, alloys of non-ferrous heavy metals, titanium, zirconium, tantalum and the like by means of nitric acid baths |
JPS63149396A (en) * | 1986-12-12 | 1988-06-22 | Kobe Steel Ltd | Pre-treatment of anodic oxidation of valve metal |
US5660640A (en) * | 1995-06-16 | 1997-08-26 | Joray Corporation | Method of removing sputter deposition from components of vacuum deposition equipment |
EP1049133A2 (en) * | 1999-04-30 | 2000-11-02 | Applied Materials, Inc. | Enhancing adhesion of deposits on exposed surfaces in process chamber |
US20030047464A1 (en) * | 2001-07-27 | 2003-03-13 | Applied Materials, Inc. | Electrochemically roughened aluminum semiconductor processing apparatus surfaces |
US20030136428A1 (en) * | 2002-01-23 | 2003-07-24 | Applied Materials, Inc. | Cleaning process residues on a process chamber component |
USH2087H1 (en) * | 1998-05-19 | 2003-11-04 | H. C. Starck, Inc. | Pickling of refractory metals |
US20040056211A1 (en) * | 2002-03-13 | 2004-03-25 | Applied Materials, Inc. | Method of surface texturizing |
US20040099285A1 (en) * | 2002-11-25 | 2004-05-27 | Applied Materials, Inc. | Method of cleaning a coated process chamber component |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3117833A (en) * | 1958-09-25 | 1964-01-14 | Fansteel Metallurgical Corp | Process of purifying and separating columbium and tantalum values from each other |
DK449074A (en) | 1974-08-22 | 1976-02-23 | Atomenergikommissionen | PROCEDURE FOR EXTRACTING TANTALS AND / OR NIOB IN FREE OR BASED FORM FROM TANTAL AND NIOB CONTAINING SOLUTIONS |
US4100252A (en) * | 1976-04-26 | 1978-07-11 | Engelhard Minerals & Chemicals Corporation | Metal extraction process |
JPS58153782A (en) * | 1982-03-08 | 1983-09-12 | Hitachi Denshi Ltd | Regeneration of boat made of tantalum |
JPS61146717A (en) * | 1984-12-18 | 1986-07-04 | Sumitomo Chem Co Ltd | Purification of tantalum |
JPH0353084A (en) * | 1989-07-18 | 1991-03-07 | Citizen Watch Co Ltd | Etching solution of tantalum |
US5180563A (en) * | 1989-10-24 | 1993-01-19 | Gte Products Corporation | Treatment of industrial wastes |
JP3581890B2 (en) * | 1994-04-26 | 2004-10-27 | 東京エレクトロン株式会社 | Heat treatment method and heat treatment apparatus |
US6323055B1 (en) * | 1998-05-27 | 2001-11-27 | The Alta Group, Inc. | Tantalum sputtering target and method of manufacture |
SE512978C2 (en) * | 1998-10-26 | 2000-06-12 | G S G As | Processing of niobium and tantalum-containing materials |
JP2000265276A (en) * | 1999-01-12 | 2000-09-26 | Central Glass Co Ltd | Cleaning gas |
JP4709358B2 (en) * | 2000-08-30 | 2011-06-22 | 株式会社東芝 | Sputtering target and sputtering apparatus, thin film, and electronic component using the same |
US20020119245A1 (en) * | 2001-02-23 | 2002-08-29 | Steven Verhaverbeke | Method for etching electronic components containing tantalum |
JP2002292346A (en) * | 2001-03-29 | 2002-10-08 | Sharp Corp | Method and apparatus for recovering deposited film |
JP2002363662A (en) * | 2001-06-01 | 2002-12-18 | Nikko Materials Co Ltd | Method for recovery of high-purity tantalum, high-purity tantalum sputtering target, and thin film deposited by using this sputtering target |
US6656535B2 (en) * | 2001-12-21 | 2003-12-02 | Applied Materials, Inc | Method of fabricating a coated process chamber component |
US6899798B2 (en) * | 2001-12-21 | 2005-05-31 | Applied Materials, Inc. | Reusable ceramic-comprising component which includes a scrificial surface layer |
US6953120B2 (en) * | 2002-02-08 | 2005-10-11 | Cabot Corporation | Method of recovering metal and/or oxide thereof in a slurry and tailings obtained from said method |
-
2004
- 2004-05-13 US US10/846,894 patent/US20050028838A1/en not_active Abandoned
- 2004-05-25 KR KR1020127000548A patent/KR101270192B1/en active IP Right Grant
- 2004-05-25 KR KR20067014433A patent/KR20070026369A/en not_active Application Discontinuation
- 2004-05-25 KR KR1020127000547A patent/KR101164570B1/en active IP Right Grant
- 2004-05-25 KR KR1020127000546A patent/KR101223154B1/en active IP Right Grant
- 2004-05-25 JP JP2006545314A patent/JP2007528938A/en active Pending
- 2004-05-25 WO PCT/US2004/016518 patent/WO2005068681A2/en active Application Filing
- 2004-05-26 TW TW93114915A patent/TWI304612B/en active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2562097A1 (en) * | 1984-03-28 | 1985-10-04 | Andritz Ag Maschf | Process for pickling alloy steels, copper, alloys of non-ferrous heavy metals, titanium, zirconium, tantalum and the like by means of nitric acid baths |
JPS63149396A (en) * | 1986-12-12 | 1988-06-22 | Kobe Steel Ltd | Pre-treatment of anodic oxidation of valve metal |
US5660640A (en) * | 1995-06-16 | 1997-08-26 | Joray Corporation | Method of removing sputter deposition from components of vacuum deposition equipment |
USH2087H1 (en) * | 1998-05-19 | 2003-11-04 | H. C. Starck, Inc. | Pickling of refractory metals |
EP1049133A2 (en) * | 1999-04-30 | 2000-11-02 | Applied Materials, Inc. | Enhancing adhesion of deposits on exposed surfaces in process chamber |
US20030047464A1 (en) * | 2001-07-27 | 2003-03-13 | Applied Materials, Inc. | Electrochemically roughened aluminum semiconductor processing apparatus surfaces |
US20030136428A1 (en) * | 2002-01-23 | 2003-07-24 | Applied Materials, Inc. | Cleaning process residues on a process chamber component |
US20040056211A1 (en) * | 2002-03-13 | 2004-03-25 | Applied Materials, Inc. | Method of surface texturizing |
US20040099285A1 (en) * | 2002-11-25 | 2004-05-27 | Applied Materials, Inc. | Method of cleaning a coated process chamber component |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 012, no. 410 (C - 540) 28 October 1988 (1988-10-28) * |
Also Published As
Publication number | Publication date |
---|---|
KR20120016176A (en) | 2012-02-22 |
US20050028838A1 (en) | 2005-02-10 |
KR20120014234A (en) | 2012-02-16 |
TWI304612B (en) | 2008-12-21 |
JP2007528938A (en) | 2007-10-18 |
TW200522186A (en) | 2005-07-01 |
KR101270192B1 (en) | 2013-05-30 |
KR101223154B1 (en) | 2013-01-17 |
KR101164570B1 (en) | 2012-07-10 |
WO2005068681A2 (en) | 2005-07-28 |
KR20070026369A (en) | 2007-03-08 |
KR20120016177A (en) | 2012-02-22 |
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