WO2005069914A3 - Probe card configuration for low mechanical flexural strength electrical routing substrates - Google Patents

Probe card configuration for low mechanical flexural strength electrical routing substrates Download PDF

Info

Publication number
WO2005069914A3
WO2005069914A3 PCT/US2005/001551 US2005001551W WO2005069914A3 WO 2005069914 A3 WO2005069914 A3 WO 2005069914A3 US 2005001551 W US2005001551 W US 2005001551W WO 2005069914 A3 WO2005069914 A3 WO 2005069914A3
Authority
WO
WIPO (PCT)
Prior art keywords
support
substrate
flexural strength
probe card
low mechanical
Prior art date
Application number
PCT/US2005/001551
Other languages
French (fr)
Other versions
WO2005069914A2 (en
Inventor
Makarand S Shinde
Richard A Larder
Timothy E Cooper
Ravindra V Shenoy
Benjamin N Eldridge
Original Assignee
Formfactor Inc
Makarand S Shinde
Richard A Larder
Timothy E Cooper
Ravindra V Shenoy
Benjamin N Eldridge
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Makarand S Shinde, Richard A Larder, Timothy E Cooper, Ravindra V Shenoy, Benjamin N Eldridge filed Critical Formfactor Inc
Priority to JP2006549691A priority Critical patent/JP2007520702A/en
Priority to EP05711587A priority patent/EP1716421A2/en
Publication of WO2005069914A2 publication Critical patent/WO2005069914A2/en
Publication of WO2005069914A3 publication Critical patent/WO2005069914A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Abstract

A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface
PCT/US2005/001551 2004-01-16 2005-01-18 Probe card configuration for low mechanical flexural strength electrical routing substrates WO2005069914A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006549691A JP2007520702A (en) 2004-01-16 2005-01-18 Probe card structure for electrical circuit boards with low mechanical bending strength
EP05711587A EP1716421A2 (en) 2004-01-16 2005-01-18 Probe card configuration for low mechanical flexural strength electrical routing substrates

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53732404P 2004-01-16 2004-01-16
US60/537,324 2004-01-16
US10/771,099 US7071715B2 (en) 2004-01-16 2004-02-02 Probe card configuration for low mechanical flexural strength electrical routing substrates
US10/771,099 2004-02-02

Publications (2)

Publication Number Publication Date
WO2005069914A2 WO2005069914A2 (en) 2005-08-04
WO2005069914A3 true WO2005069914A3 (en) 2006-08-31

Family

ID=34753069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/001551 WO2005069914A2 (en) 2004-01-16 2005-01-18 Probe card configuration for low mechanical flexural strength electrical routing substrates

Country Status (6)

Country Link
US (2) US7071715B2 (en)
EP (1) EP1716421A2 (en)
JP (1) JP2007520702A (en)
KR (1) KR101033454B1 (en)
CN (1) CN1957262A (en)
WO (1) WO2005069914A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN106164680A (en) * 2014-04-04 2016-11-23 精炼金属股份有限公司 Contact spacing transducer, electric detection means and the method being used for manufacturing contact spacing transducer

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CN106164680A (en) * 2014-04-04 2016-11-23 精炼金属股份有限公司 Contact spacing transducer, electric detection means and the method being used for manufacturing contact spacing transducer

Also Published As

Publication number Publication date
US20050156611A1 (en) 2005-07-21
CN1957262A (en) 2007-05-02
KR20060126773A (en) 2006-12-08
US7071715B2 (en) 2006-07-04
KR101033454B1 (en) 2011-05-09
WO2005069914A2 (en) 2005-08-04
US7825674B2 (en) 2010-11-02
JP2007520702A (en) 2007-07-26
EP1716421A2 (en) 2006-11-02
US20060244470A1 (en) 2006-11-02

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