WO2005076353A3 - Apparatus incorporating small-feature-size and large-feature-size components and method for making same - Google Patents

Apparatus incorporating small-feature-size and large-feature-size components and method for making same Download PDF

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Publication number
WO2005076353A3
WO2005076353A3 PCT/US2005/002534 US2005002534W WO2005076353A3 WO 2005076353 A3 WO2005076353 A3 WO 2005076353A3 US 2005002534 W US2005002534 W US 2005002534W WO 2005076353 A3 WO2005076353 A3 WO 2005076353A3
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WO
WIPO (PCT)
Prior art keywords
feature
size
conductor
apparatus incorporating
incorporating small
Prior art date
Application number
PCT/US2005/002534
Other languages
French (fr)
Other versions
WO2005076353A2 (en
Inventor
Susan Swindlehurst
Mark A Hadley
Paul S Drzaic
Gordon S W Craig
Glenn Gengel
Scott Herrmann
Aly Tootoochi
Randolph W Eisenhardt
Original Assignee
Alien Technology Corp
Susan Swindlehurst
Mark A Hadley
Paul S Drzaic
Gordon S W Craig
Glenn Gengel
Scott Herrmann
Aly Tootoochi
Randolph W Eisenhardt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alien Technology Corp, Susan Swindlehurst, Mark A Hadley, Paul S Drzaic, Gordon S W Craig, Glenn Gengel, Scott Herrmann, Aly Tootoochi, Randolph W Eisenhardt filed Critical Alien Technology Corp
Priority to EP05726384A priority Critical patent/EP1709686A2/en
Priority to JP2006551455A priority patent/JP2007520085A/en
Priority to AU2005211112A priority patent/AU2005211112A1/en
Publication of WO2005076353A2 publication Critical patent/WO2005076353A2/en
Publication of WO2005076353A3 publication Critical patent/WO2005076353A3/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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Abstract

An apparatus incorporating small-feature size and large-feature­-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-­scale component to the integrated circuit. The large-scale component includes a second substrate.
PCT/US2005/002534 2004-01-30 2005-01-28 Apparatus incorporating small-feature-size and large-feature-size components and method for making same WO2005076353A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP05726384A EP1709686A2 (en) 2004-01-30 2005-01-28 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
JP2006551455A JP2007520085A (en) 2004-01-30 2005-01-28 Apparatus incorporating small and large dimension parts and method of making the same
AU2005211112A AU2005211112A1 (en) 2004-01-30 2005-01-28 Apparatus incorporating small-feature-size and large-feature-size components and method for making same

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US10/769,572 US7214569B2 (en) 2002-01-23 2004-01-30 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US10/769,572 2004-01-30

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WO2005076353A3 true WO2005076353A3 (en) 2006-02-02

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EP (1) EP1709686A2 (en)
JP (1) JP2007520085A (en)
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Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
KR101107555B1 (en) * 2004-01-22 2012-01-31 미코 코포레이션 A modular radio frequency identification tagging method
US7667589B2 (en) * 2004-03-29 2010-02-23 Impinj, Inc. RFID tag uncoupling one of its antenna ports and methods
US7528728B2 (en) * 2004-03-29 2009-05-05 Impinj Inc. Circuits for RFID tags with multiple non-independently driven RF ports
US7423539B2 (en) 2004-03-31 2008-09-09 Impinj, Inc. RFID tags combining signals received from multiple RF ports
US7630233B2 (en) * 2004-04-02 2009-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7551141B1 (en) * 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7615479B1 (en) * 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
BRPI0519478A2 (en) 2004-12-27 2009-02-03 Quantum Paper Inc addressable and printable emissive display
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
EP1880417A2 (en) * 2005-05-11 2008-01-23 STMicroelectronics SA Silicon chips provided with inclined contact pads and an electronic module comprising said silicon chip
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US7576656B2 (en) * 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding
US7968426B1 (en) * 2005-10-24 2011-06-28 Microwave Bonding Instruments, Inc. Systems and methods for bonding semiconductor substrates to metal substrates using microwave energy
FR2893735A1 (en) * 2005-11-21 2007-05-25 Gemplus Sa METHOD FOR MAKING A CONTACTLESS CONTACTOR TRANSPONDER FROM A CONTACTLESS MODULE TO AN ANTENNA AND A TRANSPONDER OBTAINED
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US20070219285A1 (en) * 2006-03-17 2007-09-20 3M Innovative Properties Company Uv b-stageable, moisture curable composition useful for rapid electronic device assembly
US20080227294A1 (en) * 2007-03-12 2008-09-18 Daewoong Suh Method of making an interconnect structure
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8133768B2 (en) 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8456393B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US7868465B2 (en) * 2007-06-04 2011-01-11 Infineon Technologies Ag Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
US20090033495A1 (en) * 2007-08-03 2009-02-05 Akash Abraham Moldable radio frequency identification device
US20090061177A1 (en) * 2007-08-30 2009-03-05 Kriha James A Method of printing using high performance two-component reactive inks and coatings with flexographic printing processes
KR101143837B1 (en) * 2007-10-15 2012-07-12 삼성테크윈 주식회사 Electronic chip embedded circuit board and method of manufacturing the same
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
US9846833B1 (en) 2013-02-25 2017-12-19 Impinj, Inc. High-speed RFID tag assembly using impulse heating
US8188927B1 (en) * 2008-03-11 2012-05-29 Impinj, Inc. RFID tag assembly methods
US11288564B1 (en) 2008-03-11 2022-03-29 Impinj, Inc. High-speed RFID tag assembly using impulse heating
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
TW201008542A (en) * 2008-08-26 2010-03-01 Everest Display Inc Capsule endoscope with embedded metal contacts
DE102009032219A1 (en) * 2009-07-06 2011-02-24 Institut Für Mikroelektronik Stuttgart Method for producing an integrated circuit and resulting film chip
US10672748B1 (en) 2010-06-02 2020-06-02 Maxim Integrated Products, Inc. Use of device assembly for a generalization of three-dimensional heterogeneous technologies integration
US8349653B2 (en) 2010-06-02 2013-01-08 Maxim Integrated Products, Inc. Use of device assembly for a generalization of three-dimensional metal interconnect technologies
US8511569B1 (en) * 2010-11-02 2013-08-20 Impinj, Inc. RFID integrated circuit to strap mounting system
US10331993B1 (en) 2011-03-22 2019-06-25 Impinj, Inc. RFID integrated circuits with large contact pads
US11423278B1 (en) * 2010-06-11 2022-08-23 Impinj, Inc. RFID integrated circuits with large contact pads
US9495631B1 (en) * 2011-03-22 2016-11-15 Impinj Inc. RFID integrated circuits with contact islands
WO2014023287A2 (en) * 2012-08-10 2014-02-13 Smartrac Technology Gmbh Contact bump connection and contact bump and method for producing a contact bump connection
US9171989B2 (en) * 2013-12-20 2015-10-27 SumPower Corporation Metal bond and contact formation for solar cells
DE102014205361A1 (en) * 2014-03-21 2015-09-24 Robert Bosch Gmbh Sensor device and method for producing a sensor device
US20160049434A1 (en) * 2014-08-13 2016-02-18 Excelitas Technologies Singapore Pte Ltd. Digital radiation sensor package
CN106793534A (en) * 2015-11-20 2017-05-31 富泰华工业(深圳)有限公司 Circuit board steel mesh printing process
US9953198B2 (en) 2015-12-09 2018-04-24 Smartrac Technology Gmbh Systems and methods for a cloud connected transponder
US9997467B2 (en) * 2016-08-19 2018-06-12 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages and methods of forming the same
DE102016219557B4 (en) * 2016-10-07 2019-05-29 Continental Automotive Gmbh Method for printing connection materials on contact surfaces on a circuit carrier
WO2018125977A1 (en) 2016-12-29 2018-07-05 Avery Dennison Retail Information Services, Llc Rfid tags with shielding structure for incorporation into microwavable food packaging
KR101938976B1 (en) * 2017-06-05 2019-01-16 한국과학기술원 Method for interconnecting ultra-fine pitch semiconductor chip to substrates using thin film metallization
SE542007C2 (en) * 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
US11120323B2 (en) * 2018-04-20 2021-09-14 Avery Dennison Retail Information Services, Llc Method of using shielded RFID straps with RFID tag designs
CN112334913A (en) 2018-04-20 2021-02-05 艾利丹尼森零售信息服务公司 Shielded RFID tag for incorporation into microwavable food packaging
EP3782225A1 (en) 2018-04-20 2021-02-24 Avery Dennison Retail Information Services, LLC Rfid straps with a top and bottom conductor
CN112639825B (en) 2018-06-27 2024-03-19 艾利丹尼森零售信息服务公司 RFID tag resistant to operation in high frequency band of microwave oven
JP7183651B2 (en) * 2018-09-18 2022-12-06 大日本印刷株式会社 RF tag label
DE102022102367A1 (en) * 2022-02-01 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung TARGET CARRIER, SEMICONDUCTOR ARRANGEMENT AND METHOD OF TRANSFERRING A SEMICONDUCTOR DEVICE AND SUPPORTING STRUCTURE

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5517752A (en) * 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5798050A (en) * 1997-01-10 1998-08-25 International Business Machines Corporation Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
WO2000052109A1 (en) * 1999-03-02 2000-09-08 Motorola Inc. Electronic tag assembly and method therefor
US20010055835A1 (en) * 2000-03-10 2001-12-27 Pendse Rajendra D. Flip chip interconnection structure
EP1167068A1 (en) * 1999-10-08 2002-01-02 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
WO2003063211A1 (en) * 2002-01-23 2003-07-31 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Family Cites Families (170)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (en) * 1973-03-10 1974-11-13
CH642594A5 (en) * 1979-06-25 1984-04-30 Hunkeler Jos Ag Fabrik Fuer Gr METHOD AND DEVICE FOR AUTOMATICALLY APPLYING STICKERS ON A CONTINUOUS RAILWAY.
US4670770A (en) * 1984-02-21 1987-06-02 American Telephone And Telegraph Company Integrated circuit chip-and-substrate assembly
US4818855A (en) 1985-01-11 1989-04-04 Indala Corporation Identification system
FR2599893B1 (en) * 1986-05-23 1996-08-02 Ricoh Kk METHOD FOR MOUNTING AN ELECTRONIC MODULE ON A SUBSTRATE AND INTEGRATED CIRCUIT CARD
US4857893A (en) 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
US4918811A (en) 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4783695A (en) 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
JPH0834264B2 (en) * 1987-04-21 1996-03-29 住友電気工業株式会社 Semiconductor device and manufacturing method thereof
JP2517341B2 (en) 1988-01-14 1996-07-24 三洋電機株式会社 Method for manufacturing optical information recording disk
US4937653A (en) * 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
US5008213A (en) * 1988-12-09 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
JPH02295050A (en) * 1989-05-09 1990-12-05 Olympus Optical Co Ltd Apparatus and method for circuit pattern formation using mu-stm
US5099227A (en) 1989-07-18 1992-03-24 Indala Corporation Proximity detecting apparatus
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
JPH0777258B2 (en) 1990-03-16 1995-08-16 株式会社東芝 Semiconductor device
US5241456A (en) 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
JP2557278B2 (en) * 1990-08-10 1996-11-27 ローレルバンクマシン株式会社 Coin sorter
US5205032A (en) * 1990-09-28 1993-04-27 Kabushiki Kaisha Toshiba Electronic parts mounting apparatus
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
USD343261S (en) 1991-07-11 1994-01-11 Indala Corporation Transponder tag housing for attachment to the ear of an animal
US5231751A (en) 1991-10-29 1993-08-03 International Business Machines Corporation Process for thin film interconnect
US5221831A (en) 1991-11-29 1993-06-22 Indala Corporation Flap-type portal reader
JPH05169885A (en) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp Thin ic card
US5382952A (en) 1992-01-22 1995-01-17 Indala Corporation Transponder for proximity identification system
USD353343S (en) 1992-03-17 1994-12-13 Indala Corporation Identification transponder tag for fabric-type articles
DE4345610B4 (en) 1992-06-17 2013-01-03 Micron Technology Inc. Method for producing a radio-frequency identification device (HFID)
US5779839A (en) 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5612254A (en) 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5422513A (en) * 1992-10-16 1995-06-06 Martin Marietta Corporation Integrated circuit chip placement in a high density interconnect structure
US6274391B1 (en) * 1992-10-26 2001-08-14 Texas Instruments Incorporated HDI land grid array packaged device having electrical and optical interconnects
US5382784A (en) 1993-02-08 1995-01-17 Indala Corporation Hand-held dual technology identification tag reading head
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5420757A (en) 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
ZA941671B (en) 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
JPH06337354A (en) 1993-05-27 1994-12-06 Nikon Corp Zoom lens
US5378880A (en) 1993-08-20 1995-01-03 Indala Corporation Housing structure for an access control RFID reader
US5430441A (en) 1993-10-12 1995-07-04 Motorola, Inc. Transponding tag and method
US5373627A (en) 1993-11-23 1994-12-20 Grebe; Kurt R. Method of forming multi-chip module with high density interconnections
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5444223A (en) 1994-01-11 1995-08-22 Blama; Michael J. Radio frequency identification tag and method
US5514613A (en) * 1994-01-27 1996-05-07 Integrated Device Technology Parallel manufacturing of semiconductor devices and the resulting structure
US6222212B1 (en) * 1994-01-27 2001-04-24 Integrated Device Technology, Inc. Semiconductor device having programmable interconnect layers
USD378578S (en) 1994-02-25 1997-03-25 Indala Corporation Identification transponder tag
US5434751A (en) 1994-04-11 1995-07-18 Martin Marietta Corporation Reworkable high density interconnect structure incorporating a release layer
US5565846A (en) 1994-04-25 1996-10-15 Indala Corporation Reader system for waste bin pickup vehicles
CA2152860A1 (en) 1994-07-15 1996-01-16 Argyrios A. Chatzipetros Antenna for communication device
US5554821A (en) 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
US5682143A (en) 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5574470A (en) 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
CA2187539C (en) 1995-03-13 2000-05-02 Thomas Joseph Walczak Method and radio frequency identification system for a novel protocol for reliable communication
CA2176625C (en) 1995-05-19 2008-07-15 Donald Harold Fergusen Radio frequency identification tag
US5745984A (en) * 1995-07-10 1998-05-05 Martin Marietta Corporation Method for making an electronic module
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
US6040773A (en) 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6252508B1 (en) 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US5754110A (en) 1996-03-07 1998-05-19 Checkpoint Systems, Inc. Security tag and manufacturing method
DE19616819A1 (en) 1996-04-26 1997-10-30 Giesecke & Devrient Gmbh CD with built-in chip
US5627931A (en) * 1996-05-28 1997-05-06 Motorola Optoelectronic transducer
US5842672A (en) * 1996-06-07 1998-12-01 Ergotron, Inc. Mounting system for flat panel display, keyboard and stand
US5708419A (en) 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
FR2751767B1 (en) 1996-07-26 1998-12-18 Thomson Csf SECURE DATA STORAGE SYSTEM ON CD-ROM
DE19703057A1 (en) 1996-12-20 1998-07-02 Siemens Ag Carrier element for semiconductor chip esp. for combination chip card
AU724795B2 (en) 1997-01-25 2000-09-28 Philip Noel Leonard Identification or control arrangements
AU734390B2 (en) 1997-03-10 2001-06-14 Precision Dynamics Corporation Reactively coupled elements in circuits on flexible substrates
US6229203B1 (en) * 1997-03-12 2001-05-08 General Electric Company Semiconductor interconnect structure for high temperature applications
US6094173A (en) 1997-04-18 2000-07-25 Motorola, Inc. Method and apparatus for detecting an RFID tag signal
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
JP3438565B2 (en) 1997-08-22 2003-08-18 ユニ電子工業株式会社 Anti-theft tag
FR2769389B1 (en) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD
US6164551A (en) 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
JP2001510670A (en) 1997-12-05 2001-07-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Identification transponder
US6268796B1 (en) 1997-12-12 2001-07-31 Alfred Gnadinger Radio frequency identification transponder having integrated antenna
US6019284A (en) 1998-01-27 2000-02-01 Viztec Inc. Flexible chip card with display
US6094138A (en) 1998-02-27 2000-07-25 Motorola, Inc. Integrated circuit assembly and method of assembly
US6206282B1 (en) 1998-03-03 2001-03-27 Pyper Products Corporation RF embedded identification device
FR2775810B1 (en) * 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
JP3625646B2 (en) * 1998-03-23 2005-03-02 東レエンジニアリング株式会社 Flip chip mounting method
US6288559B1 (en) * 1998-03-30 2001-09-11 International Business Machines Corporation Semiconductor testing using electrically conductive adhesives
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6107921A (en) 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6282407B1 (en) 1998-04-16 2001-08-28 Motorola, Inc. Active electrostatic transceiver and communicating system
US6275681B1 (en) 1998-04-16 2001-08-14 Motorola, Inc. Wireless electrostatic charging and communicating system
EP0951068A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US6246327B1 (en) 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6091332A (en) 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
DE19840210A1 (en) * 1998-09-03 2000-03-09 Fraunhofer Ges Forschung Method for handling a plurality of circuit chips
US6189208B1 (en) * 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
US6147605A (en) 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
AU5809099A (en) 1998-09-11 2000-04-03 Motorola, Inc. Radio frequency identification tag apparatus and related method
JP2000132871A (en) 1998-10-22 2000-05-12 Hitachi Ltd Disk and recording and reproducing device using it
US6100804A (en) 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6902111B2 (en) 1998-11-12 2005-06-07 Wenyu Han Method and apparatus for impeding the counterfeiting of discs
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
US6031450A (en) 1999-02-03 2000-02-29 Huang; Tien-Tsai Tire pressure alarm system with centrifugal force-controlled power switch
US6274508B1 (en) 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
EP1157421A1 (en) * 1999-02-05 2001-11-28 Alien Technology Corporation Apparatuses and methods for forming assemblies
US6281038B1 (en) 1999-02-05 2001-08-28 Alien Technology Corporation Methods for forming assemblies
US6122492A (en) 1999-02-08 2000-09-19 Motorola, Inc. Adjustable radio frequency power amplifier and transmitter
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6133833A (en) 1999-02-25 2000-10-17 Motorola, Inc. Wireless add-on keyboard system and method
FR2790849B1 (en) * 1999-03-12 2001-04-27 Gemplus Card Int MANUFACTURING METHOD FOR CONTACTLESS CARD TYPE ELECTRONIC DEVICE
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6410415B1 (en) * 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
JP2000278009A (en) * 1999-03-24 2000-10-06 Nec Corp Microwave/millimeter wave circuit device
EP1043684A1 (en) 1999-03-29 2000-10-11 OMD Productions AG Data carrier
JP3928682B2 (en) * 1999-06-22 2007-06-13 オムロン株式会社 Wiring board bonded body, wiring board bonding method, data carrier manufacturing method, and electronic component module mounting apparatus
US6134130A (en) 1999-07-19 2000-10-17 Motorola, Inc. Power reception circuits for a device receiving an AC power signal
US6147662A (en) 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6271060B1 (en) * 1999-09-13 2001-08-07 Vishay Intertechnology, Inc. Process of fabricating a chip scale surface mount package for semiconductor device
US6420266B1 (en) 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
EP1232477A1 (en) 1999-11-18 2002-08-21 Siemens Aktiengesellschaft Mobile data carrier with a transponder made from a surface wave component with a slot antenna
FR2801708B1 (en) 1999-11-29 2003-12-26 A S K METHOD OF MANUFACTURING A CONTACTLESS CHIP CARD WITH AN ANTENNA SUPPORT OF FIBROUS MATERIAL
JP3390389B2 (en) 1999-12-08 2003-03-24 チェックポイント・マニュファクチュアリング・ジャパン株式会社 Resonance tag
US6275156B1 (en) 2000-02-07 2001-08-14 Westvaco Corporation EAS ready paperboard
CN1200822C (en) 2000-02-22 2005-05-11 东丽工程株式会社 Noncontact ID card or the like and method of manufacturing the same
US6229442B1 (en) 2000-03-14 2001-05-08 Motorola, Inc, Radio frequency identification device having displacement current control and method thereof
CN1421019A (en) * 2000-04-04 2003-05-28 东丽工程株式会社 Method of mfg. COF package
DE10017431C2 (en) * 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Method and device for producing data carriers with an integrated transponder
US6366468B1 (en) * 2000-04-28 2002-04-02 Hewlett-Packard Company Self-aligned common carrier
AU2001274896A1 (en) * 2000-05-22 2001-12-03 Avery Dennison Corporation Trackable files and systems for using the same
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
US6309912B1 (en) * 2000-06-20 2001-10-30 Motorola, Inc. Method of interconnecting an embedded integrated circuit
JP4239439B2 (en) * 2000-07-06 2009-03-18 セイコーエプソン株式会社 OPTICAL DEVICE, ITS MANUFACTURING METHOD, AND OPTICAL TRANSMISSION DEVICE
JP3840926B2 (en) * 2000-07-07 2006-11-01 セイコーエプソン株式会社 Organic EL display, method for manufacturing the same, and electronic device
JP3815269B2 (en) * 2000-07-07 2006-08-30 セイコーエプソン株式会社 Organic EL display and manufacturing method thereof, perforated substrate, electro-optical device and manufacturing method thereof, and electronic apparatus
JP3915868B2 (en) * 2000-07-07 2007-05-16 セイコーエプソン株式会社 Ferroelectric memory device and manufacturing method thereof
US6483473B1 (en) 2000-07-18 2002-11-19 Marconi Communications Inc. Wireless communication device and method
US6780696B1 (en) * 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
US6853087B2 (en) * 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
US6392213B1 (en) 2000-10-12 2002-05-21 The Charles Stark Draper Laboratory, Inc. Flyer assembly
US6448109B1 (en) * 2000-11-15 2002-09-10 Analog Devices, Inc. Wafer level method of capping multiple MEMS elements
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6794221B2 (en) * 2000-11-29 2004-09-21 Hrl Laboratories, Llc Method of placing elements into receptors in a substrate
US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7101091B2 (en) 2001-02-21 2006-09-05 Zarlink Semiconductor, Inc. Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same
US6417025B1 (en) * 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
DE10120269C1 (en) * 2001-04-25 2002-07-25 Muehlbauer Ag Microchip transponder manufacturing method has chip module carrier band combined with antenna carrier band with chip module terminals coupled to antenna
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6727970B2 (en) 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6590346B1 (en) * 2001-07-16 2003-07-08 Alien Technology Corporation Double-metal background driven displays
US7112138B2 (en) 2001-08-03 2006-09-26 Igt Player tracking communication mechanisms in a gaming machine
US20030036249A1 (en) * 2001-08-06 2003-02-20 Bauer Donald G. Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
US6530649B1 (en) * 2001-08-16 2003-03-11 Hewlett-Packard Company Hermetic seal in microelectronic devices
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US6528351B1 (en) * 2001-09-24 2003-03-04 Jigsaw Tek, Inc. Integrated package and methods for making same
US6844673B1 (en) * 2001-12-06 2005-01-18 Alien Technology Corporation Split-fabrication for light emitting display structures
KR20030076274A (en) * 2002-03-18 2003-09-26 도레 엔지니아린구 가부시키가이샤 Non-contact id card and the method for producing thereof
US20040005494A1 (en) * 2002-07-05 2004-01-08 Drake Javit A. Chemical sensing in fuel cell systems
US6867983B2 (en) 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US20040052202A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. RFID enabled information disks
US20040052203A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. Light enabled RFID in information disks
US7017807B2 (en) * 2003-09-08 2006-03-28 Francis M. Claessens Apparatus and method for detecting tampering with containers and preventing counterfeiting thereof
WO2005048181A1 (en) * 2003-11-04 2005-05-26 Avery Dennison Corporation Rfid tag with enhanced readability
US7158037B2 (en) * 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5517752A (en) * 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5798050A (en) * 1997-01-10 1998-08-25 International Business Machines Corporation Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
WO2000052109A1 (en) * 1999-03-02 2000-09-08 Motorola Inc. Electronic tag assembly and method therefor
EP1167068A1 (en) * 1999-10-08 2002-01-02 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
US20010055835A1 (en) * 2000-03-10 2001-12-27 Pendse Rajendra D. Flip chip interconnection structure
WO2003063211A1 (en) * 2002-01-23 2003-07-31 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same

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US7214569B2 (en) 2007-05-08
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