WO2005076977A3 - Plating apparatus and method - Google Patents

Plating apparatus and method Download PDF

Info

Publication number
WO2005076977A3
WO2005076977A3 PCT/US2005/003760 US2005003760W WO2005076977A3 WO 2005076977 A3 WO2005076977 A3 WO 2005076977A3 US 2005003760 W US2005003760 W US 2005003760W WO 2005076977 A3 WO2005076977 A3 WO 2005076977A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating apparatus
plating
autocatalytic
electroless
disposing
Prior art date
Application number
PCT/US2005/003760
Other languages
French (fr)
Other versions
WO2005076977A2 (en
Inventor
Martin Bleck
Robert Wayne Berner
Gerard Minogue
Fernando M Sanchez
Mathew Hannon
Thomas P Griego
Original Assignee
Surfect Technologies Inc
Martin Bleck
Robert Wayne Berner
Gerard Minogue
Fernando M Sanchez
Mathew Hannon
Thomas P Griego
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surfect Technologies Inc, Martin Bleck, Robert Wayne Berner, Gerard Minogue, Fernando M Sanchez, Mathew Hannon, Thomas P Griego filed Critical Surfect Technologies Inc
Priority to JP2006552314A priority Critical patent/JP2007525595A/en
Publication of WO2005076977A2 publication Critical patent/WO2005076977A2/en
Publication of WO2005076977A3 publication Critical patent/WO2005076977A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circulation of plating solutions wherein temperatures and pressure are highly controllable.
PCT/US2005/003760 2004-02-04 2005-02-04 Plating apparatus and method WO2005076977A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006552314A JP2007525595A (en) 2004-02-04 2005-02-04 Plating apparatus and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54168704P 2004-02-04 2004-02-04
US60/541,687 2004-02-04

Publications (2)

Publication Number Publication Date
WO2005076977A2 WO2005076977A2 (en) 2005-08-25
WO2005076977A3 true WO2005076977A3 (en) 2008-09-25

Family

ID=34860208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/003760 WO2005076977A2 (en) 2004-02-04 2005-02-04 Plating apparatus and method

Country Status (4)

Country Link
US (1) US20050230260A1 (en)
JP (1) JP2007525595A (en)
TW (1) TW200533791A (en)
WO (1) WO2005076977A2 (en)

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US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
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US20110226613A1 (en) * 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9062388B2 (en) 2010-08-19 2015-06-23 International Business Machines Corporation Method and apparatus for controlling and monitoring the potential
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US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
CN103433309B (en) * 2013-08-20 2015-07-15 首钢总公司 Device for controlling and simulating cooling rate of high-speed Steyr air cooling line
US10760178B2 (en) 2018-07-12 2020-09-01 Lam Research Corporation Method and apparatus for synchronized pressure regulation of separated anode chamber
KR20220078628A (en) * 2019-10-09 2022-06-10 도쿄엘렉트론가부시키가이샤 Substrate liquid processing apparatus and substrate liquid processing method
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IT202100033113A1 (en) * 2021-12-30 2023-06-30 Nuovo Pignone Tecnologie Srl SYSTEM AND METHOD FOR MAKING NON-ELECTROLYTIC NICKEL PLATING

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Also Published As

Publication number Publication date
JP2007525595A (en) 2007-09-06
WO2005076977A2 (en) 2005-08-25
TW200533791A (en) 2005-10-16
US20050230260A1 (en) 2005-10-20

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