WO2005092070A3 - Vertically stacked semiconductor device - Google Patents
Vertically stacked semiconductor device Download PDFInfo
- Publication number
- WO2005092070A3 WO2005092070A3 PCT/US2005/009809 US2005009809W WO2005092070A3 WO 2005092070 A3 WO2005092070 A3 WO 2005092070A3 US 2005009809 W US2005009809 W US 2005009809W WO 2005092070 A3 WO2005092070 A3 WO 2005092070A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- standoffs
- chips
- vertically stacked
- semiconductor device
- substrate
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000002161 passivation Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Abstract
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US10/806,520 US7095105B2 (en) | 2004-03-23 | 2004-03-23 | Vertically stacked semiconductor device |
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-
2004
- 2004-03-23 US US10/806,520 patent/US7095105B2/en active Active
-
2005
- 2005-03-23 WO PCT/US2005/009809 patent/WO2005092070A2/en active Application Filing
- 2005-03-23 CN CNA2005800165291A patent/CN1957462A/en active Pending
-
2006
- 2006-06-09 US US11/423,242 patent/US7279363B2/en not_active Expired - Lifetime
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US6531784B1 (en) * | 2000-06-02 | 2003-03-11 | Amkor Technology, Inc. | Semiconductor package with spacer strips |
US6650009B2 (en) * | 2000-07-18 | 2003-11-18 | Siliconware Precision Industries Co., Ltd. | Structure of a multi chip module having stacked chips |
US20030127719A1 (en) * | 2002-01-07 | 2003-07-10 | Picta Technology, Inc. | Structure and process for packaging multi-chip |
Also Published As
Publication number | Publication date |
---|---|
US7279363B2 (en) | 2007-10-09 |
US20050212109A1 (en) | 2005-09-29 |
WO2005092070A2 (en) | 2005-10-06 |
US7095105B2 (en) | 2006-08-22 |
US20060216858A1 (en) | 2006-09-28 |
CN1957462A (en) | 2007-05-02 |
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