WO2005098977A3 - Reflector packages and methods for packaging of a semiconductor light emitting device - Google Patents
Reflector packages and methods for packaging of a semiconductor light emitting device Download PDFInfo
- Publication number
- WO2005098977A3 WO2005098977A3 PCT/US2005/009779 US2005009779W WO2005098977A3 WO 2005098977 A3 WO2005098977 A3 WO 2005098977A3 US 2005009779 W US2005009779 W US 2005009779W WO 2005098977 A3 WO2005098977 A3 WO 2005098977A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- emitting device
- semiconductor light
- packaging
- methods
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05730896.7A EP1730794B1 (en) | 2004-03-31 | 2005-03-24 | Reflector packages and methods for packaging of a semiconductor light emitting device |
JP2007506265A JP5209959B2 (en) | 2004-03-31 | 2005-03-24 | Reflector package and semiconductor light emitting device packaging method |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55831404P | 2004-03-31 | 2004-03-31 | |
US60/558,314 | 2004-03-31 | ||
US11/044,779 US7326583B2 (en) | 2004-03-31 | 2005-01-27 | Methods for packaging of a semiconductor light emitting device |
US11/044,779 | 2005-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005098977A2 WO2005098977A2 (en) | 2005-10-20 |
WO2005098977A3 true WO2005098977A3 (en) | 2006-04-06 |
Family
ID=35054897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/009779 WO2005098977A2 (en) | 2004-03-31 | 2005-03-24 | Reflector packages and methods for packaging of a semiconductor light emitting device |
Country Status (5)
Country | Link |
---|---|
US (2) | US7326583B2 (en) |
EP (1) | EP1730794B1 (en) |
JP (1) | JP5209959B2 (en) |
TW (1) | TWI442578B (en) |
WO (1) | WO2005098977A2 (en) |
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PATENT ABSTRACTS OF JAPAN vol. 1996, no. 06 28 June 1996 (1996-06-28) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 05 30 May 1997 (1997-05-30) * |
Also Published As
Publication number | Publication date |
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TW200603417A (en) | 2006-01-16 |
WO2005098977A2 (en) | 2005-10-20 |
JP5209959B2 (en) | 2013-06-12 |
US20080087910A1 (en) | 2008-04-17 |
EP1730794B1 (en) | 2016-07-27 |
US20050221518A1 (en) | 2005-10-06 |
TWI442578B (en) | 2014-06-21 |
JP2007531318A (en) | 2007-11-01 |
US7326583B2 (en) | 2008-02-05 |
EP1730794A2 (en) | 2006-12-13 |
US7612383B2 (en) | 2009-11-03 |
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