WO2005122285A2 - Methods and devices for fabricating and assembling printable semiconductor elements - Google Patents
Methods and devices for fabricating and assembling printable semiconductor elements Download PDFInfo
- Publication number
- WO2005122285A2 WO2005122285A2 PCT/US2005/019354 US2005019354W WO2005122285A2 WO 2005122285 A2 WO2005122285 A2 WO 2005122285A2 US 2005019354 W US2005019354 W US 2005019354W WO 2005122285 A2 WO2005122285 A2 WO 2005122285A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor element
- printable
- printable semiconductor
- substrate
- semiconductor elements
- Prior art date
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S977/707—Integrated with dissimilar structures on a common substrate having different types of nanoscale structures or devices on a common substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/724—Devices having flexible or movable element
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Thin Film Transistor (AREA)
- Photovoltaic Devices (AREA)
- Junction Field-Effect Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
- Electrodes Of Semiconductors (AREA)
- Led Device Packages (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims
Priority Applications (34)
Application Number | Priority Date | Filing Date | Title |
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KR1020127030789A KR101368748B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
JP2007515549A JP2008502151A (en) | 2004-06-04 | 2005-06-02 | Method and device for manufacturing and assembling printable semiconductor elements |
KR1020157017151A KR101746412B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
CN2005800181595A CN101120433B (en) | 2004-06-04 | 2005-06-02 | Method for fabricating and assembling printable semiconductor elements |
KR1020127010094A KR101260981B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
KR1020077000216A KR101307481B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
EP05755193.9A EP1759422B1 (en) | 2004-06-04 | 2005-06-02 | Electrical device comprising printable semiconductor elements |
KR1020137022416A KR101429098B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
EP13003426.7A EP2650905B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
KR1020137034843A KR101572992B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
KR1020137022417A KR101504579B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
MYPI20062537 MY151572A (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
MYPI20062536A MY145225A (en) | 2005-06-02 | 2006-06-01 | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
TW102142517A TWI533459B (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
CN201110077508.8A CN102176465B (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
EP22164385.1A EP4040474A1 (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
KR1020087000080A KR101269566B1 (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
EP15163216.3A EP2937896B1 (en) | 2005-06-02 | 2006-06-01 | Method of transfering a printable semiconductor element |
PCT/US2006/021161 WO2006130721A2 (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
CN2006800196400A CN101632156B (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
MYPI20113695 MY152238A (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
KR1020127032629A KR101308548B1 (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
JP2008514820A JP5164833B2 (en) | 2005-06-02 | 2006-06-01 | Method for manufacturing a printable semiconductor structure |
TW095119520A TWI427802B (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
TW095119788A TWI420237B (en) | 2005-06-02 | 2006-06-01 | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
EP20060771761 EP1915774B1 (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
KR1020137011761A KR101347687B1 (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
KR1020060050058A KR100798431B1 (en) | 2005-06-02 | 2006-06-02 | Pattern Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp |
JP2006154975A JP5297581B2 (en) | 2005-06-02 | 2006-06-02 | Pattern transfer printing with dynamic control of adhesion to elastomeric stamps |
IL179784A IL179784A0 (en) | 2004-06-04 | 2006-12-03 | Methods and devices for fabricating and assembling printable semiconductor elements |
MYPI2013003185A MY180515A (en) | 2005-06-02 | 2011-08-08 | Printable semiconductor structures and related methods of making and assembling |
JP2012246602A JP5734261B2 (en) | 2005-06-02 | 2012-11-08 | Printable semiconductor structure and related manufacturing and assembly methods |
JP2013095896A JP5701331B2 (en) | 2005-06-02 | 2013-04-30 | Pattern transfer printing with dynamic control of adhesion to elastomeric stamps |
JP2014177486A JP6002725B2 (en) | 2005-06-02 | 2014-09-01 | Printable semiconductor structure and related manufacturing and assembly methods |
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Application Number | Priority Date | Filing Date | Title |
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US57707704P | 2004-06-04 | 2004-06-04 | |
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PCT/US2005/019354 WO2005122285A2 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
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US (11) | US7622367B1 (en) |
EP (4) | EP2650905B1 (en) |
JP (7) | JP2008502151A (en) |
KR (7) | KR101429098B1 (en) |
CN (6) | CN101120433B (en) |
HK (2) | HK1176742A1 (en) |
IL (1) | IL179784A0 (en) |
MY (5) | MY161998A (en) |
TW (1) | TWI284423B (en) |
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Cited By (114)
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US7229901B2 (en) | 2004-12-16 | 2007-06-12 | Wisconsin Alumni Research Foundation | Fabrication of strained heterojunction structures |
WO2007085044A1 (en) * | 2006-01-24 | 2007-08-02 | Mycrolab Pty Ltd | Stamping methods and devices |
JP2007281406A (en) * | 2006-04-07 | 2007-10-25 | Board Of Trustees Of The Univ Of Illinois | Shrinkable single crystal silicon for high performance electronics on rubber substrate |
US7354809B2 (en) | 2006-02-13 | 2008-04-08 | Wisconsin Alumi Research Foundation | Method for double-sided processing of thin film transistors |
WO2008143635A1 (en) | 2007-01-17 | 2008-11-27 | The Board Of Trustees Of The University Of Illinois | Optical systems fabricated by printing-based assembly |
EP2064710A2 (en) * | 2006-09-06 | 2009-06-03 | The Board of Trustees of the University of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
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US7772042B2 (en) | 2008-09-24 | 2010-08-10 | Eastman Kodak Company | Solvent softening to allow die placement |
US7777290B2 (en) | 2006-06-13 | 2010-08-17 | Wisconsin Alumni Research Foundation | PIN diodes for photodetection and high-speed, high-resolution image sensing |
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US7879691B2 (en) | 2008-09-24 | 2011-02-01 | Eastman Kodak Company | Low cost die placement |
US7915707B2 (en) | 2006-08-14 | 2011-03-29 | Koninklijke Philips Electronics N.V. | Deformable integrated circuit device |
US7927976B2 (en) | 2008-07-23 | 2011-04-19 | Semprius, Inc. | Reinforced composite stamp for dry transfer printing of semiconductor elements |
US7932123B2 (en) | 2006-09-20 | 2011-04-26 | The Board Of Trustees Of The University Of Illinois | Release strategies for making transferable semiconductor structures, devices and device components |
US7960218B2 (en) | 2006-09-08 | 2011-06-14 | Wisconsin Alumni Research Foundation | Method for fabricating high-speed thin-film transistors |
US7977173B2 (en) | 2008-01-24 | 2011-07-12 | Soligie, Inc. | Silicon thin film transistors, systems, and methods of making same |
US8034663B2 (en) | 2008-09-24 | 2011-10-11 | Eastman Kodak Company | Low cost die release wafer |
US8080615B2 (en) | 2007-06-19 | 2011-12-20 | Micron Technology, Inc. | Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide |
US8083953B2 (en) | 2007-03-06 | 2011-12-27 | Micron Technology, Inc. | Registered structure formation via the application of directed thermal energy to diblock copolymer films |
US8101261B2 (en) | 2008-02-13 | 2012-01-24 | Micron Technology, Inc. | One-dimensional arrays of block copolymer cylinders and applications thereof |
US8114300B2 (en) | 2008-04-21 | 2012-02-14 | Micron Technology, Inc. | Multi-layer method for formation of registered arrays of cylindrical pores in polymer films |
US8114301B2 (en) | 2008-05-02 | 2012-02-14 | Micron Technology, Inc. | Graphoepitaxial self-assembly of arrays of downward facing half-cylinders |
US8179336B2 (en) | 2008-06-30 | 2012-05-15 | Global Oled Technology, Llc. | Tiled electronic display |
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US8261660B2 (en) | 2009-07-22 | 2012-09-11 | Semprius, Inc. | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements |
US8283258B2 (en) | 2007-08-16 | 2012-10-09 | Micron Technology, Inc. | Selective wet etching of hafnium aluminum oxide films |
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