WO2006019596A3 - High frequency via - Google Patents

High frequency via Download PDF

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Publication number
WO2006019596A3
WO2006019596A3 PCT/US2005/024116 US2005024116W WO2006019596A3 WO 2006019596 A3 WO2006019596 A3 WO 2006019596A3 US 2005024116 W US2005024116 W US 2005024116W WO 2006019596 A3 WO2006019596 A3 WO 2006019596A3
Authority
WO
WIPO (PCT)
Prior art keywords
high frequency
accordance
wiring board
printed wiring
ipc
Prior art date
Application number
PCT/US2005/024116
Other languages
French (fr)
Other versions
WO2006019596A2 (en
Inventor
John S Greeley
Original Assignee
Bae System Information And Ele
John S Greeley
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bae System Information And Ele, John S Greeley filed Critical Bae System Information And Ele
Publication of WO2006019596A2 publication Critical patent/WO2006019596A2/en
Publication of WO2006019596A3 publication Critical patent/WO2006019596A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

[0047] Techniques that enable the transitioning of high frequency signals on a printed wiring board processed in accordance with industry standards (such as the IPC specifications) are disclosed. One embodiment provides a high frequency via structure for a printed wiring board, where the via structure includes a via pad configured in accordance with IPC standards. A printed microwave transmission line having an inductive section is connected to the via pad, wherein the inductive section has dimensions to compensate for transition discontinuity.
PCT/US2005/024116 2004-07-30 2005-07-07 High frequency via WO2006019596A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/903,566 US7166877B2 (en) 2004-07-30 2004-07-30 High frequency via
US10/903,566 2004-07-30

Publications (2)

Publication Number Publication Date
WO2006019596A2 WO2006019596A2 (en) 2006-02-23
WO2006019596A3 true WO2006019596A3 (en) 2007-04-12

Family

ID=35731183

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/024116 WO2006019596A2 (en) 2004-07-30 2005-07-07 High frequency via

Country Status (2)

Country Link
US (1) US7166877B2 (en)
WO (1) WO2006019596A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2928066A1 (en) * 2008-02-27 2009-08-28 Thomson Licensing Sas SYSTEM FOR INTERCONNECTING TWO SUBSTRATES COMPRISING EACH AT LEAST ONE TRANSMISSION LINE
TWI449475B (en) * 2012-01-09 2014-08-11 Novatek Microelectronics Corp Printed circuit board
US9433083B2 (en) * 2014-04-04 2016-08-30 Macom Technology Solutions Holdings, Inc. Edge mount connector arrangement with improved characteristic impedance
US9864826B2 (en) * 2014-11-03 2018-01-09 Toshiba Memory Corporation Multilayer printed board and layout method for multilayer printed board
CN105101685B (en) * 2015-09-02 2018-01-23 广东欧珀移动通信有限公司 The preparation method and multi-layer PCB of a kind of multi-layer PCB
US9848488B1 (en) 2016-06-17 2017-12-19 Macom Technology Solutions Holdings, Inc. Electrical interface for printed circuit board, package and die
WO2019207830A1 (en) * 2018-04-25 2019-10-31 株式会社村田製作所 Millimeter wave module, and method for manufacturing millimeter module
CN111640682B (en) * 2020-05-31 2022-07-08 西南电子技术研究所（中国电子科技集团公司第十研究所） Gold wire bonding transition structure of separation device
CN112614813A (en) * 2020-12-17 2021-04-06 中国电子科技集团公司第十三研究所 Ultrahigh frequency surface-mounted ceramic vertical interconnection structure and packaging structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713853B1 (en) * 2002-07-23 2004-03-30 Applied Micro Circuits Corporation Electronic package with offset reference plane cutout

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927784A (en) 1987-05-01 1990-05-22 Raytheon Company Simultaneous formation of via hole and tube structures for GaAs monolithic microwave integrated circuits
US4807022A (en) 1987-05-01 1989-02-21 Raytheon Company Simultaneous formation of via hole and tub structures for GaAs monolithic microwave integrated circuits
US5023994A (en) 1988-09-29 1991-06-18 Microwave Power, Inc. Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes
US4925723A (en) 1988-09-29 1990-05-15 Microwave Power, Inc. Microwave integrated circuit substrate including metal filled via holes and method of manufacture
US5089880A (en) * 1989-06-07 1992-02-18 Amdahl Corporation Pressurized interconnection system for semiconductor chips
US5208726A (en) 1992-04-03 1993-05-04 Teledyne Monolithic Microwave Metal-insulator-metal (MIM) capacitor-around-via structure for a monolithic microwave integrated circuit (MMIC) and method of manufacturing same
JPH08167630A (en) * 1994-12-15 1996-06-25 Hitachi Ltd Chip connection structure
JPH09321175A (en) 1996-05-30 1997-12-12 Oki Electric Ind Co Ltd Microwave circuit and chip
JP3472430B2 (en) 1997-03-21 2003-12-02 シャープ株式会社 Antenna integrated high frequency circuit
JP3663898B2 (en) 1997-04-14 2005-06-22 株式会社村田製作所 High frequency module
EP0985243B1 (en) 1997-05-26 2009-03-11 Telefonaktiebolaget LM Ericsson (publ) Microwave transmission device
US6356173B1 (en) 1998-05-29 2002-03-12 Kyocera Corporation High-frequency module coupled via aperture in a ground plane
US6538538B2 (en) 1999-02-25 2003-03-25 Formfactor, Inc. High frequency printed circuit board via
TW531866B (en) 2002-02-27 2003-05-11 Apack Comm Inc Monolithic microwave integrated circuit chip package with thermal via
US6900395B2 (en) 2002-11-26 2005-05-31 International Business Machines Corporation Enhanced high-frequency via interconnection for improved reliability

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713853B1 (en) * 2002-07-23 2004-03-30 Applied Micro Circuits Corporation Electronic package with offset reference plane cutout

Also Published As

Publication number Publication date
US7166877B2 (en) 2007-01-23
US20060022312A1 (en) 2006-02-02
WO2006019596A2 (en) 2006-02-23

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