WO2006039161A3 - Method and system for contamination detection and monitoring in a lithographic exposure tool and operating method for the same under controlled atmospheric conditions - Google Patents

Method and system for contamination detection and monitoring in a lithographic exposure tool and operating method for the same under controlled atmospheric conditions Download PDF

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Publication number
WO2006039161A3
WO2006039161A3 PCT/US2005/033818 US2005033818W WO2006039161A3 WO 2006039161 A3 WO2006039161 A3 WO 2006039161A3 US 2005033818 W US2005033818 W US 2005033818W WO 2006039161 A3 WO2006039161 A3 WO 2006039161A3
Authority
WO
WIPO (PCT)
Prior art keywords
monitoring
atmospheric conditions
under controlled
exposure tool
same under
Prior art date
Application number
PCT/US2005/033818
Other languages
French (fr)
Other versions
WO2006039161A2 (en
Inventor
Uwe Knappe
Uzodinma Okoroanyanwu
Original Assignee
Advanced Micro Devices Inc
Uwe Knappe
Uzodinma Okoroanyanwu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102004047677A external-priority patent/DE102004047677B4/en
Application filed by Advanced Micro Devices Inc, Uwe Knappe, Uzodinma Okoroanyanwu filed Critical Advanced Micro Devices Inc
Priority to JP2007534658A priority Critical patent/JP2008515232A/en
Priority to GB0706019A priority patent/GB2434456B/en
Publication of WO2006039161A2 publication Critical patent/WO2006039161A2/en
Publication of WO2006039161A3 publication Critical patent/WO2006039161A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
    • G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Abstract

By using highly efficient detection techniques, such as chromatography and absorption spectroscopy, one or more contaminants may be identified and the concentration thereof may quantitatively be determined. In this way, the adverse effect on critical components of exposure tools, such as reticles and lenses in the form of, for instance, deposited inorganic salts, may significantly be reduced and the process performance may be enhanced.
PCT/US2005/033818 2004-09-30 2005-09-21 Method and system for contamination detection and monitoring in a lithographic exposure tool and operating method for the same under controlled atmospheric conditions WO2006039161A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007534658A JP2008515232A (en) 2004-09-30 2005-09-21 Method and system for contamination detection and monitoring in a lithographic exposure apparatus and method of operation under conditioned atmospheric conditions
GB0706019A GB2434456B (en) 2004-09-30 2005-09-21 Contamination detection and monitoring in a lithographic exposure tool

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004047677.2 2004-09-30
DE102004047677A DE102004047677B4 (en) 2004-09-30 2004-09-30 Method and system for contamination detection and monitoring in a lithographic exposure apparatus and method for operating the same under controlled atmospheric conditions
US11/135,721 2005-05-24
US11/135,721 US20060066824A1 (en) 2004-09-30 2005-05-24 Method and system for contamination detection and monitoring a lithographic exposure tool and operating method for the same under controlled atmospheric conditions

Publications (2)

Publication Number Publication Date
WO2006039161A2 WO2006039161A2 (en) 2006-04-13
WO2006039161A3 true WO2006039161A3 (en) 2006-12-21

Family

ID=35539391

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/033818 WO2006039161A2 (en) 2004-09-30 2005-09-21 Method and system for contamination detection and monitoring in a lithographic exposure tool and operating method for the same under controlled atmospheric conditions

Country Status (4)

Country Link
JP (1) JP2008515232A (en)
KR (1) KR20070054716A (en)
GB (1) GB2434456B (en)
WO (1) WO2006039161A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7541603B2 (en) * 2006-09-27 2009-06-02 Asml Netherlands B.V. Radiation system and lithographic apparatus comprising the same
JP5007568B2 (en) * 2007-01-04 2012-08-22 富士通セミコンダクター株式会社 Reticle inspection method and reticle management method
ATE512389T1 (en) * 2007-10-23 2011-06-15 Imec DETECTION OF CONTAMINATIONS IN EUV SYSTEMS
EP2091068A1 (en) 2008-02-15 2009-08-19 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A sensor, a monitoring system and a method for detecting a substance in a gas sample
DE102008041592A1 (en) 2008-08-27 2010-03-04 Carl Zeiss Smt Ag Detection of contaminants in an EUV lithography system
JP6837274B2 (en) * 2015-06-30 2021-03-03 東京エレクトロン株式会社 Semiconductor manufacturing equipment and substrate transfer method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430303A (en) * 1992-07-01 1995-07-04 Nikon Corporation Exposure apparatus
EP1220038A1 (en) * 2000-12-22 2002-07-03 Asm Lithography B.V. Lithographic apparatus and device manufacturing method
US20030035087A1 (en) * 1996-03-27 2003-02-20 Nikon Corporation Exposure apparatus and air-conditioning apparatus for use with exposure apparatus
US20040056196A1 (en) * 2000-12-01 2004-03-25 Haruo Yoshida Method and apparatus for monitoring environment and apparatus for producing semiconductor
EP1452851A1 (en) * 2003-02-24 2004-09-01 ASML Netherlands B.V. Method and device for measuring contamination of a surface of a component of a lithographic apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430303A (en) * 1992-07-01 1995-07-04 Nikon Corporation Exposure apparatus
US20030035087A1 (en) * 1996-03-27 2003-02-20 Nikon Corporation Exposure apparatus and air-conditioning apparatus for use with exposure apparatus
US20040056196A1 (en) * 2000-12-01 2004-03-25 Haruo Yoshida Method and apparatus for monitoring environment and apparatus for producing semiconductor
EP1220038A1 (en) * 2000-12-22 2002-07-03 Asm Lithography B.V. Lithographic apparatus and device manufacturing method
EP1452851A1 (en) * 2003-02-24 2004-09-01 ASML Netherlands B.V. Method and device for measuring contamination of a surface of a component of a lithographic apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Watchplate", RESEARCH DISCLOSURE, MASON PUBLICATIONS, HAMPSHIRE, GB, vol. 432, no. 97, April 2000 (2000-04-01), XP007125952, ISSN: 0374-4353 *

Also Published As

Publication number Publication date
WO2006039161A2 (en) 2006-04-13
GB0706019D0 (en) 2007-05-09
GB2434456B (en) 2009-03-25
JP2008515232A (en) 2008-05-08
GB2434456A (en) 2007-07-25
KR20070054716A (en) 2007-05-29

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