WO2006057729A3 - Monolithic multi-level module and method - Google Patents

Monolithic multi-level module and method Download PDF

Info

Publication number
WO2006057729A3
WO2006057729A3 PCT/US2005/037159 US2005037159W WO2006057729A3 WO 2006057729 A3 WO2006057729 A3 WO 2006057729A3 US 2005037159 W US2005037159 W US 2005037159W WO 2006057729 A3 WO2006057729 A3 WO 2006057729A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pcb
cavity
geometry
monolithic
Prior art date
Application number
PCT/US2005/037159
Other languages
French (fr)
Other versions
WO2006057729A2 (en
Inventor
John Gregory
Original Assignee
Intraglobal Corp
John Gregory
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intraglobal Corp, John Gregory filed Critical Intraglobal Corp
Publication of WO2006057729A2 publication Critical patent/WO2006057729A2/en
Publication of WO2006057729A3 publication Critical patent/WO2006057729A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

An interposer (1) having a substrate (10) composed of a flat flexible thin sheet of plastic dielectric material having a copper film laminated on one side. The substrate defines a component site in the form of a cavity (20) in the substrate. The copper film defines a plurality of separated interconnects, each having a tab (22) extending into the cavity (20) formed in the substrate. An electrical component (18) having contacts is positioned in the cavity and its contacts are bonded to the tabs. At least a plurality of the separate interconnects extend laterally beyond the substrate to define flanges (14). The substrate is profiled to be easily oriented in a PCB (30). A monolithic multi-level micropackage (110) having a plurality of layers of copper foils (112) laminated on flexible thin substrates (116) processed to embed in at least one layer of an interposer according to the above, the layers being bonded together by a bonding material and compressed to form a monolithic structure. Monolithic structure can have geometry to enable registration in a PCB. The geometry can be cylindrical with protrusions. The top layer (103) can define connecting flanges to connect with leads on the PCB. Heat sinks (60) can be incorporated into the structure.
PCT/US2005/037159 2004-11-22 2005-10-18 Monolithic multi-level module and method WO2006057729A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US63030504P 2004-11-22 2004-11-22
US60/630,305 2004-11-22
US63088104P 2004-11-24 2004-11-24
US60/630,881 2004-11-24
US66137705P 2005-03-14 2005-03-14
US60/661,377 2005-03-14

Publications (2)

Publication Number Publication Date
WO2006057729A2 WO2006057729A2 (en) 2006-06-01
WO2006057729A3 true WO2006057729A3 (en) 2006-12-07

Family

ID=36498395

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/037159 WO2006057729A2 (en) 2004-11-22 2005-10-18 Monolithic multi-level module and method

Country Status (1)

Country Link
WO (1) WO2006057729A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6040739A (en) * 1998-09-02 2000-03-21 Trw Inc. Waveguide to microstrip backshort with external spring compression
US6099677A (en) * 1998-02-13 2000-08-08 Merrimac Industries, Inc. Method of making microwave, multifunction modules using fluoropolymer composite substrates
US20050236178A1 (en) * 2004-04-27 2005-10-27 Lauriello Philip J Fusion bonded assembly with attached leads

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099677A (en) * 1998-02-13 2000-08-08 Merrimac Industries, Inc. Method of making microwave, multifunction modules using fluoropolymer composite substrates
US6040739A (en) * 1998-09-02 2000-03-21 Trw Inc. Waveguide to microstrip backshort with external spring compression
US20050236178A1 (en) * 2004-04-27 2005-10-27 Lauriello Philip J Fusion bonded assembly with attached leads

Also Published As

Publication number Publication date
WO2006057729A2 (en) 2006-06-01

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