WO2006062730A3 - Airflow control system - Google Patents

Airflow control system Download PDF

Info

Publication number
WO2006062730A3
WO2006062730A3 PCT/US2005/042254 US2005042254W WO2006062730A3 WO 2006062730 A3 WO2006062730 A3 WO 2006062730A3 US 2005042254 W US2005042254 W US 2005042254W WO 2006062730 A3 WO2006062730 A3 WO 2006062730A3
Authority
WO
WIPO (PCT)
Prior art keywords
airflow control
control system
baffle assembly
airflow
chassis
Prior art date
Application number
PCT/US2005/042254
Other languages
French (fr)
Other versions
WO2006062730A2 (en
Inventor
Christopher Lucero
Javier Leija
James Shipley
Christopher Gonzales
Original Assignee
Intel Corp
Christopher Lucero
Javier Leija
James Shipley
Christopher Gonzales
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Christopher Lucero, Javier Leija, James Shipley, Christopher Gonzales filed Critical Intel Corp
Publication of WO2006062730A2 publication Critical patent/WO2006062730A2/en
Publication of WO2006062730A3 publication Critical patent/WO2006062730A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Abstract

A method according to one embodiment may include providing a baffle assembly (104) comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly (104) in a flow of air through a chassis (102). Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
PCT/US2005/042254 2004-12-06 2005-11-17 Airflow control system WO2006062730A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/005,910 2004-12-06
US11/005,910 US7652891B2 (en) 2004-12-06 2004-12-06 Airflow control system

Publications (2)

Publication Number Publication Date
WO2006062730A2 WO2006062730A2 (en) 2006-06-15
WO2006062730A3 true WO2006062730A3 (en) 2006-08-03

Family

ID=36573920

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/042254 WO2006062730A2 (en) 2004-12-06 2005-11-17 Airflow control system

Country Status (4)

Country Link
US (2) US7652891B2 (en)
CN (1) CN1787734A (en)
TW (1) TW200626848A (en)
WO (1) WO2006062730A2 (en)

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US7885066B2 (en) * 2008-07-17 2011-02-08 Juniper Networks, Inc. Airflow/cooling solution for chassis with orthogonal boards
US20100218920A1 (en) * 2008-10-17 2010-09-02 Emerson Network Power - Embedded Computing, Inc. System And Method For Airflow Dividers For Use With Cooling Systems For An Equipment Enclosure
US20100216390A1 (en) * 2008-10-17 2010-08-26 Emerson Network Power - Embedded Computing, Inc. Apparatus and Method for Restricting Air Flow Within an Electronic Equipment Enclosure
US10321601B2 (en) * 2008-10-17 2019-06-11 Artesyn Embedded Computing, Inc. System and method for restricting airflow through a portion of an electronics enclosure
US8363388B2 (en) * 2008-10-17 2013-01-29 Emerson Network Power—Embedded Computing, Inc. System and method for supplying power to electronics enclosures utilizing distributed DC power architectures
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
US7903405B1 (en) * 2009-09-18 2011-03-08 Fisher-Rosemount Systems, Inc. Electronic device enclosures having improved ventilation to dissipate heat
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US8446725B2 (en) * 2010-08-05 2013-05-21 Alcatel Lucent Airflow control in an electronic chassis
CN102480895A (en) * 2010-11-22 2012-05-30 鸿富锦精密工业（深圳）有限公司 Electronic device and wind scooper thereof
CN102647883A (en) * 2011-02-17 2012-08-22 鸿富锦精密工业（深圳）有限公司 Wind guide cover
TW201309179A (en) * 2011-08-04 2013-02-16 Wistron Corp Airflow adjusting device and blade server
US8848364B2 (en) * 2012-04-05 2014-09-30 Hewlett-Packard Development Company, L.P. Daughterboard having airflow path
EP2836057B1 (en) * 2013-08-09 2019-07-17 British Telecommunications public limited company Ventilation system
US10244666B2 (en) * 2014-02-14 2019-03-26 Hewlett Packard Enterprise Development Lp Controlling impedance of blank cartridges
JP6285299B2 (en) * 2014-07-07 2018-02-28 東芝三菱電機産業システム株式会社 Semiconductor device
US9788461B2 (en) * 2014-07-30 2017-10-10 Ciena Corporation Airflow divider for balancing airflow in a modular chassis system
US9915987B2 (en) 2015-02-02 2018-03-13 International Business Machines Corporation Implementing DIMM air flow baffle
US9949407B1 (en) * 2015-05-29 2018-04-17 Amazon Technologies, Inc. Computer system with partial bypass cooling
US10373169B2 (en) * 2015-08-11 2019-08-06 Paypal, Inc. Enhancing information security via the use of a dummy credit card number
US10403328B2 (en) * 2016-01-29 2019-09-03 Western Digital Technologies, Inc. Acoustic attenuation in data storage enclosures
US9949408B2 (en) * 2016-05-27 2018-04-17 Cisco Technology, Inc. Blank card with scalable airflow impedance for electronic enclosures
US10838470B1 (en) * 2017-02-17 2020-11-17 American Megatrends International, Llc Monitoring temperature inside computer chassis
US10037062B1 (en) 2017-03-17 2018-07-31 Microsoft Technology Licensing, Llc Thermal venting device with pressurized plenum
US10627877B2 (en) 2017-03-31 2020-04-21 Hewlett Packard Enterprise Development Lp Air impeding structures with snap-in tabs
CN108733175B (en) * 2017-04-17 2021-05-07 伊姆西Ip控股有限责任公司 Frame and heat dissipation device for same
US11102910B2 (en) * 2017-08-01 2021-08-24 Dell Products L.P. Flexible service air baffle
CN112445299B (en) * 2019-09-05 2023-03-10 英业达科技有限公司 Expansion card fixing frame
CN112236018A (en) * 2020-11-05 2021-01-15 阳光电源股份有限公司 Power cabinet and converter

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US20030141089A1 (en) * 2002-01-30 2003-07-31 Gravell Anthony R. Balanced flow cooling
US20040057210A1 (en) * 2002-09-20 2004-03-25 Wilson Jeremy I. Composite construction baffle for modular electronic systems
US20040218359A1 (en) * 2003-04-30 2004-11-04 Hewlett-Parckard Development Company, L.P. Circuit card divider to facilitate thermal management in an electronic system

Also Published As

Publication number Publication date
CN1787734A (en) 2006-06-14
WO2006062730A2 (en) 2006-06-15
US20100118490A1 (en) 2010-05-13
US7652891B2 (en) 2010-01-26
US7864541B2 (en) 2011-01-04
US20060120038A1 (en) 2006-06-08
TW200626848A (en) 2006-08-01

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