WO2006063268B1 - Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle - Google Patents
Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticleInfo
- Publication number
- WO2006063268B1 WO2006063268B1 PCT/US2005/044695 US2005044695W WO2006063268B1 WO 2006063268 B1 WO2006063268 B1 WO 2006063268B1 US 2005044695 W US2005044695 W US 2005044695W WO 2006063268 B1 WO2006063268 B1 WO 2006063268B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- defects
- images
- dies
- reticle
- interest
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70653—Metrology techniques
- G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
Abstract
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020137005609A KR101345030B1 (en) | 2004-12-07 | 2005-12-07 | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle |
KR1020077014859A KR101296532B1 (en) | 2004-12-07 | 2005-12-07 | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle |
JP2007545680A JP4955570B2 (en) | 2004-12-07 | 2005-12-07 | Computer-implemented method for detecting and / or sorting defects in reticle design patterns |
EP05853577A EP1820066A2 (en) | 2004-12-07 | 2005-12-07 | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/005,658 US7729529B2 (en) | 2004-12-07 | 2004-12-07 | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle |
US11/005,658 | 2004-12-07 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2006063268A2 WO2006063268A2 (en) | 2006-06-15 |
WO2006063268A3 WO2006063268A3 (en) | 2006-08-03 |
WO2006063268B1 true WO2006063268B1 (en) | 2007-07-26 |
Family
ID=36101436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/044695 WO2006063268A2 (en) | 2004-12-07 | 2005-12-07 | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle |
Country Status (5)
Country | Link |
---|---|
US (2) | US7729529B2 (en) |
EP (1) | EP1820066A2 (en) |
JP (2) | JP4955570B2 (en) |
KR (2) | KR101296532B1 (en) |
WO (1) | WO2006063268A2 (en) |
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US8204296B2 (en) | 2007-07-20 | 2012-06-19 | Kla-Tencor Corp. | Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer |
US8775101B2 (en) | 2009-02-13 | 2014-07-08 | Kla-Tencor Corp. | Detecting defects on a wafer |
US8781781B2 (en) | 2010-07-30 | 2014-07-15 | Kla-Tencor Corp. | Dynamic care areas |
US8826200B2 (en) | 2012-05-25 | 2014-09-02 | Kla-Tencor Corp. | Alteration for wafer inspection |
US8831334B2 (en) | 2012-01-20 | 2014-09-09 | Kla-Tencor Corp. | Segmentation for wafer inspection |
US8923600B2 (en) | 2005-11-18 | 2014-12-30 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US9134254B2 (en) | 2013-01-07 | 2015-09-15 | Kla-Tencor Corp. | Determining a position of inspection system output in design data space |
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US9170211B2 (en) | 2011-03-25 | 2015-10-27 | Kla-Tencor Corp. | Design-based inspection using repeating structures |
US8831334B2 (en) | 2012-01-20 | 2014-09-09 | Kla-Tencor Corp. | Segmentation for wafer inspection |
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US9189844B2 (en) | 2012-10-15 | 2015-11-17 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific information |
US9134254B2 (en) | 2013-01-07 | 2015-09-15 | Kla-Tencor Corp. | Determining a position of inspection system output in design data space |
US9311698B2 (en) | 2013-01-09 | 2016-04-12 | Kla-Tencor Corp. | Detecting defects on a wafer using template image matching |
US9310320B2 (en) | 2013-04-15 | 2016-04-12 | Kla-Tencor Corp. | Based sampling and binning for yield critical defects |
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WO2006063268A2 (en) | 2006-06-15 |
US20060291714A1 (en) | 2006-12-28 |
EP1820066A2 (en) | 2007-08-22 |
US20100226562A1 (en) | 2010-09-09 |
KR101296532B1 (en) | 2013-08-13 |
KR20130028990A (en) | 2013-03-20 |
JP5567527B2 (en) | 2014-08-06 |
KR101345030B1 (en) | 2013-12-26 |
KR20070091633A (en) | 2007-09-11 |
JP2008523395A (en) | 2008-07-03 |
US7729529B2 (en) | 2010-06-01 |
JP2012015529A (en) | 2012-01-19 |
WO2006063268A3 (en) | 2006-08-03 |
JP4955570B2 (en) | 2012-06-20 |
US8111900B2 (en) | 2012-02-07 |
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