WO2006129281A3 - Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module - Google Patents

Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module Download PDF

Info

Publication number
WO2006129281A3
WO2006129281A3 PCT/IB2006/051734 IB2006051734W WO2006129281A3 WO 2006129281 A3 WO2006129281 A3 WO 2006129281A3 IB 2006051734 W IB2006051734 W IB 2006051734W WO 2006129281 A3 WO2006129281 A3 WO 2006129281A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
module
assembly
sliding means
cooling assembly
Prior art date
Application number
PCT/IB2006/051734
Other languages
French (fr)
Other versions
WO2006129281A2 (en
Inventor
Dirck Seynaeve
Gratien A M Banckaert
Danny A J Delacroix
Original Assignee
Koninkl Philips Electronics Nv
Dirck Seynaeve
Gratien A M Banckaert
Danny A J Delacroix
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Dirck Seynaeve, Gratien A M Banckaert, Danny A J Delacroix filed Critical Koninkl Philips Electronics Nv
Priority to US11/915,742 priority Critical patent/US7800910B2/en
Priority to PL06745052T priority patent/PL1891847T3/en
Priority to AT06745052T priority patent/ATE538632T1/en
Priority to EP06745052A priority patent/EP1891847B1/en
Publication of WO2006129281A2 publication Critical patent/WO2006129281A2/en
Publication of WO2006129281A3 publication Critical patent/WO2006129281A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Abstract

The invention relates to an electronic appliance (1), provided with a cooling assembly (10) for cooling a module (4) that during use can be inserted in the appliance (1) by a consumer. The cooling assembly (10) comprises a cooling body (12) and sliding means (8A, 8B). The sliding means are arranged to engage the module with a low frictional contact surface, so as to facilitate insertion of the module. The sliding means are furthermore arranged to form a thermally conductive bridge between the module and the cooling body. At least one of the cooling body and the sliding means is resiliently deflectable, thereby allowing the sliding means to be pushed out of the way by the module, when this module is being inserted or removed.
PCT/IB2006/051734 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module WO2006129281A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/915,742 US7800910B2 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module
PL06745052T PL1891847T3 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module
AT06745052T ATE538632T1 (en) 2005-06-02 2006-05-31 ELECTRONIC APPARATUS HAVING A COOLING ASSEMBLY FOR COOLING A CONSUMER-INSERTABLE MODULE AND COOLING ASSEMBLY FOR COOLING SUCH A MODULE
EP06745052A EP1891847B1 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05104804.9 2005-06-02
EP05104804 2005-06-02

Publications (2)

Publication Number Publication Date
WO2006129281A2 WO2006129281A2 (en) 2006-12-07
WO2006129281A3 true WO2006129281A3 (en) 2007-08-02

Family

ID=37401201

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/051734 WO2006129281A2 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module

Country Status (5)

Country Link
US (1) US7800910B2 (en)
EP (1) EP1891847B1 (en)
AT (1) ATE538632T1 (en)
PL (1) PL1891847T3 (en)
WO (1) WO2006129281A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2463538B (en) * 2008-05-06 2012-04-25 Ibm Thermal link system for a computer system and computer system comprising a thermal link system
TWI357556B (en) * 2009-06-04 2012-02-01 Pegatron Corp Industrial computer
JP2013004783A (en) * 2011-06-17 2013-01-07 Sony Corp Heat radiation structure and display device
JP6110554B2 (en) * 2013-03-14 2017-04-05 ヒューレット パッカード エンタープライズ デベロップメント エル ピーＨｅｗｌｅｔｔ Ｐａｃｋａｒｄ Ｅｎｔｅｒｐｒｉｓｅ Ｄｅｖｅｌｏｐｍｅｎｔ ＬＰ Support member
TWM519879U (en) * 2015-08-03 2016-04-01 Dowton Electronic Materials Co Ltd Improved heat dissipation structure of electronic device
US9910231B2 (en) * 2016-01-04 2018-03-06 Infinera Corporation Stacked cage optical module heat relay system
US10945357B2 (en) * 2019-02-21 2021-03-09 Cisco Technology, Inc. Optical module cage with configurable heatsink
US11917797B2 (en) * 2019-12-03 2024-02-27 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US20220082771A1 (en) * 2020-09-17 2022-03-17 TE Connectivity Services Gmbh Heat exchange assembly for a pluggable module
DE102021205301A1 (en) * 2021-05-25 2022-12-01 Robert Bosch Gesellschaft mit beschränkter Haftung Plug-in module and module arrangement
US11864353B2 (en) * 2021-09-15 2024-01-02 Te Connectivity Solutions Gmbh Heat exchange assembly
DE102022200002A1 (en) 2022-01-03 2023-07-06 Continental Automotive Technologies GmbH heat dissipation device, electronic device and automobile
US20230239993A1 (en) * 2022-01-26 2023-07-27 Microsoft Technology Licensing, Llc Cooling systems for a circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0580412A1 (en) * 1992-07-21 1994-01-26 British Aerospace Public Limited Company Cooling of electronic components
US6191943B1 (en) * 1998-11-12 2001-02-20 Compaq Computer Corporation Docking station with thermoelectric heat dissipation system for docked portable computer
US20020114140A1 (en) * 2001-02-22 2002-08-22 Bash Cullen E. Thermal connector for cooling electronics
US20040080907A1 (en) * 2002-10-25 2004-04-29 Belady Christian L. Cell thermal connector

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US5414591A (en) * 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system
US5640302A (en) * 1992-06-29 1997-06-17 Elonex Ip Holdings Modular portable computer
US5473506A (en) * 1993-11-12 1995-12-05 Elonex Technologies, Inc. Cooling a large microprocessor in a small module
US5414592A (en) 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
SG64996A1 (en) * 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
JP4251452B2 (en) 2002-03-06 2009-04-08 タイコ・エレクトロニクス・コーポレイション Ejector mechanism of transceiver module assembly
US20060126306A1 (en) * 2002-04-05 2006-06-15 Blair Thomas H Multi-power optoelectric packages
DE10319984B4 (en) 2003-05-05 2009-09-03 Qimonda Ag Device for cooling memory modules
US20050161195A1 (en) * 2003-07-22 2005-07-28 Hein Gerald K. System for reliably removing heat from a semiconductor junction
JP5068919B2 (en) * 2003-09-25 2012-11-07 スリーエム イノベイティブ プロパティズ カンパニー Foam sheet-forming composition, thermally conductive foam sheet and method for producing the same
US7133285B2 (en) * 2004-01-23 2006-11-07 Yamaichi Electronics U.S.A., Inc. Electronics connector with heat sink
CN2689318Y (en) * 2004-02-27 2005-03-30 鸿富锦精密工业（深圳）有限公司 Fixer of data access device
JP4321413B2 (en) * 2004-09-02 2009-08-26 株式会社日立製作所 Disk array device
KR20080029510A (en) * 2006-09-29 2008-04-03 삼성전자주식회사 User identification card connecting device for broadcast reception apparatus and broadcast reception apparatus having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0580412A1 (en) * 1992-07-21 1994-01-26 British Aerospace Public Limited Company Cooling of electronic components
US6191943B1 (en) * 1998-11-12 2001-02-20 Compaq Computer Corporation Docking station with thermoelectric heat dissipation system for docked portable computer
US20020114140A1 (en) * 2001-02-22 2002-08-22 Bash Cullen E. Thermal connector for cooling electronics
US20040080907A1 (en) * 2002-10-25 2004-04-29 Belady Christian L. Cell thermal connector

Also Published As

Publication number Publication date
WO2006129281A2 (en) 2006-12-07
ATE538632T1 (en) 2012-01-15
US20090279261A1 (en) 2009-11-12
EP1891847A2 (en) 2008-02-27
PL1891847T3 (en) 2012-05-31
US7800910B2 (en) 2010-09-21
EP1891847B1 (en) 2011-12-21

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