WO2007001653A3 - Reticle alignment technique - Google Patents
Reticle alignment technique Download PDFInfo
- Publication number
- WO2007001653A3 WO2007001653A3 PCT/US2006/018380 US2006018380W WO2007001653A3 WO 2007001653 A3 WO2007001653 A3 WO 2007001653A3 US 2006018380 W US2006018380 W US 2006018380W WO 2007001653 A3 WO2007001653 A3 WO 2007001653A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- reticle alignment
- alignment technique
- patterned layer
- alignment grid
- shrink
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
Abstract
A method for aligning a reticle is provided (304, 324). A first patterned layer with a first alignment grid is formed (308). Sidewall layers are formed over the first patterned layer to perform a first shrink (312). The first alignment grid after shrink is etched into an etch layer to form an etched first alignment grid (316). The patterned layer is removed (320).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800213270A CN101313403B (en) | 2005-06-21 | 2006-05-10 | Reticle alignment technique |
KR1020077030027A KR101234891B1 (en) | 2005-06-21 | 2006-05-10 | Reticle alignment technique |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/158,680 US7629259B2 (en) | 2005-06-21 | 2005-06-21 | Method of aligning a reticle for formation of semiconductor devices |
US11/158,680 | 2005-06-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007001653A2 WO2007001653A2 (en) | 2007-01-04 |
WO2007001653A3 true WO2007001653A3 (en) | 2007-08-23 |
Family
ID=37573030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/018380 WO2007001653A2 (en) | 2005-06-21 | 2006-05-10 | Reticle alignment technique |
Country Status (6)
Country | Link |
---|---|
US (1) | US7629259B2 (en) |
KR (1) | KR101234891B1 (en) |
CN (1) | CN101313403B (en) |
MY (1) | MY142277A (en) |
TW (1) | TWI460558B (en) |
WO (1) | WO2007001653A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7629259B2 (en) | 2005-06-21 | 2009-12-08 | Lam Research Corporation | Method of aligning a reticle for formation of semiconductor devices |
JP5259380B2 (en) * | 2008-12-24 | 2013-08-07 | 株式会社東芝 | Manufacturing method of semiconductor device |
US8559001B2 (en) | 2010-01-11 | 2013-10-15 | Kla-Tencor Corporation | Inspection guided overlay metrology |
US8745546B2 (en) | 2011-12-29 | 2014-06-03 | Nanya Technology Corporation | Mask overlay method, mask, and semiconductor device using the same |
US9171703B2 (en) | 2013-12-20 | 2015-10-27 | Seagate Technology Llc | Apparatus with sidewall protection for features |
DE102017213330A1 (en) * | 2017-08-02 | 2019-02-07 | Dr. Johannes Heidenhain Gmbh | Scanning plate for an optical position measuring device |
US11055464B2 (en) * | 2018-08-14 | 2021-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Critical dimension uniformity |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6661105B2 (en) * | 2001-04-13 | 2003-12-09 | Oki Electric Industry Co., Ltd. | Alignment mark structure |
US20030229880A1 (en) * | 2002-06-07 | 2003-12-11 | David White | Test masks for lithographic and etch processes |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4547446A (en) | 1983-06-20 | 1985-10-15 | The Perkin-Elmer Corporation | Motion measurement and alignment method and apparatus |
US4778739A (en) | 1986-08-25 | 1988-10-18 | International Business Machines Corporation | Photoresist process for reactive ion etching of metal patterns for semiconductor devices |
US6109775A (en) * | 1991-07-19 | 2000-08-29 | Lsi Logic Corporation | Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon |
US5795830A (en) * | 1995-06-06 | 1998-08-18 | International Business Machines Corporation | Reducing pitch with continuously adjustable line and space dimensions |
KR100230430B1 (en) * | 1997-07-16 | 1999-11-15 | 윤종용 | Gas compound and method for etching electrode layer using the same |
CA2246087A1 (en) * | 1998-08-28 | 2000-02-28 | Northern Telecom Limited | Method of cleaving a semiconductor wafer |
JP2000294490A (en) * | 1999-04-07 | 2000-10-20 | Nec Corp | Semiconductor device and its manufacture |
US6251745B1 (en) | 1999-08-18 | 2001-06-26 | Taiwan Semiconductor Manufacturing Company | Two-dimensional scaling method for determining the overlay error and overlay process window for integrated circuits |
US6396569B2 (en) * | 1999-09-02 | 2002-05-28 | Texas Instruments Incorporated | Image displacement test reticle for measuring aberration characteristics of projection optics |
US7317531B2 (en) | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
JP2004523906A (en) | 2000-10-12 | 2004-08-05 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | Templates for room-temperature and low-pressure micro and nano-transfer lithography |
US6819426B2 (en) | 2001-02-12 | 2004-11-16 | Therma-Wave, Inc. | Overlay alignment metrology using diffraction gratings |
US20040023253A1 (en) * | 2001-06-11 | 2004-02-05 | Sandeep Kunwar | Device structure for closely spaced electrodes |
US6486549B1 (en) * | 2001-11-10 | 2002-11-26 | Bridge Semiconductor Corporation | Semiconductor module with encapsulant base |
US6809824B1 (en) | 2001-11-30 | 2004-10-26 | Lsi Logic Corporation | Alignment process for integrated circuit structures on semiconductor substrate using scatterometry measurements of latent images in spaced apart test fields on substrate |
US6759180B2 (en) * | 2002-04-23 | 2004-07-06 | Hewlett-Packard Development Company, L.P. | Method of fabricating sub-lithographic sized line and space patterns for nano-imprinting lithography |
EP1532670A4 (en) * | 2002-06-07 | 2007-09-12 | Praesagus Inc | Characterization adn reduction of variation for integrated circuits |
US6734107B2 (en) * | 2002-06-12 | 2004-05-11 | Macronix International Co., Ltd. | Pitch reduction in semiconductor fabrication |
US7170604B2 (en) * | 2002-07-03 | 2007-01-30 | Tokyo Electron Limited | Overlay metrology method and apparatus using more than one grating per measurement direction |
US6936386B2 (en) * | 2003-10-17 | 2005-08-30 | United Microelectronics Corp. | Reticle alignment procedure |
US7241538B2 (en) * | 2003-11-05 | 2007-07-10 | Promos Technologies | Method for providing representative features for use in inspection of photolithography mask and for use in inspection photo-lithographically developed and/or patterned wafer layers, and products of same |
US7629259B2 (en) | 2005-06-21 | 2009-12-08 | Lam Research Corporation | Method of aligning a reticle for formation of semiconductor devices |
US7572572B2 (en) * | 2005-09-01 | 2009-08-11 | Micron Technology, Inc. | Methods for forming arrays of small, closely spaced features |
-
2005
- 2005-06-21 US US11/158,680 patent/US7629259B2/en not_active Expired - Fee Related
-
2006
- 2006-05-10 CN CN2006800213270A patent/CN101313403B/en not_active Expired - Fee Related
- 2006-05-10 WO PCT/US2006/018380 patent/WO2007001653A2/en active Application Filing
- 2006-05-10 KR KR1020077030027A patent/KR101234891B1/en active IP Right Grant
- 2006-05-18 TW TW095117690A patent/TWI460558B/en not_active IP Right Cessation
- 2006-05-19 MY MYPI20062324A patent/MY142277A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6661105B2 (en) * | 2001-04-13 | 2003-12-09 | Oki Electric Industry Co., Ltd. | Alignment mark structure |
US20030229880A1 (en) * | 2002-06-07 | 2003-12-11 | David White | Test masks for lithographic and etch processes |
Also Published As
Publication number | Publication date |
---|---|
CN101313403A (en) | 2008-11-26 |
CN101313403B (en) | 2011-03-16 |
US20060285113A1 (en) | 2006-12-21 |
WO2007001653A2 (en) | 2007-01-04 |
TW200710613A (en) | 2007-03-16 |
KR20080017386A (en) | 2008-02-26 |
US7629259B2 (en) | 2009-12-08 |
TWI460558B (en) | 2014-11-11 |
KR101234891B1 (en) | 2013-02-19 |
MY142277A (en) | 2010-11-15 |
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