WO2007005915A3 - Piezo actuator for cooling - Google Patents

Piezo actuator for cooling Download PDF

Info

Publication number
WO2007005915A3
WO2007005915A3 PCT/US2006/026107 US2006026107W WO2007005915A3 WO 2007005915 A3 WO2007005915 A3 WO 2007005915A3 US 2006026107 W US2006026107 W US 2006026107W WO 2007005915 A3 WO2007005915 A3 WO 2007005915A3
Authority
WO
WIPO (PCT)
Prior art keywords
piezo actuator
cooling
layers
plate
actuator
Prior art date
Application number
PCT/US2006/026107
Other languages
French (fr)
Other versions
WO2007005915A2 (en
Inventor
Cengiz A Palanduz
Ioan Sauciuc
Reza Paydar
Original Assignee
Intel Corp
Cengiz A Palanduz
Ioan Sauciuc
Reza Paydar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Cengiz A Palanduz, Ioan Sauciuc, Reza Paydar filed Critical Intel Corp
Priority to DE112006001734.9T priority Critical patent/DE112006001734B4/en
Priority to JP2008514984A priority patent/JP4792500B2/en
Priority to CN2006800212831A priority patent/CN101199062B/en
Publication of WO2007005915A2 publication Critical patent/WO2007005915A2/en
Publication of WO2007005915A3 publication Critical patent/WO2007005915A3/en
Priority to HK08112591.0A priority patent/HK1118954A1/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8536—Alkaline earth metal based oxides, e.g. barium titanates

Abstract

A piezo actuator includes a plurality of layers of ceramic material (301-305) a plurality of layers of conductive material (306-309) interspersed between the plurality of layers of ceramic material, and a plate (330) attached to a end of the actuator. The plate of the piezo actuator includes an overhang portion (332). Preferably the actuator further comprises a balde (310), injection molded around the plate, to constitute a fan.
PCT/US2006/026107 2005-06-30 2006-06-30 Piezo actuator for cooling WO2007005915A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112006001734.9T DE112006001734B4 (en) 2005-06-30 2006-06-30 Piezo fan with a piezo actuator for cooling and method for producing a piezo fan
JP2008514984A JP4792500B2 (en) 2005-06-30 2006-06-30 Piezo actuator for cooling
CN2006800212831A CN101199062B (en) 2005-06-30 2006-06-30 Piezo actuator for cooling and its forming method
HK08112591.0A HK1118954A1 (en) 2005-06-30 2008-11-18 Piezo actuator for cooling and forming method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/173,903 2005-06-30
US11/173,903 US7638928B2 (en) 2005-06-30 2005-06-30 Piezo actuator for cooling

Publications (2)

Publication Number Publication Date
WO2007005915A2 WO2007005915A2 (en) 2007-01-11
WO2007005915A3 true WO2007005915A3 (en) 2007-04-05

Family

ID=37056893

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/026107 WO2007005915A2 (en) 2005-06-30 2006-06-30 Piezo actuator for cooling

Country Status (8)

Country Link
US (1) US7638928B2 (en)
JP (1) JP4792500B2 (en)
KR (1) KR20080025094A (en)
CN (1) CN101199062B (en)
DE (1) DE112006001734B4 (en)
HK (1) HK1118954A1 (en)
TW (1) TWI337411B (en)
WO (1) WO2007005915A2 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
US20080218972A1 (en) * 2007-03-06 2008-09-11 Ioan Sauciuc Cooling device, system containing same, and cooling method
US7642698B2 (en) * 2007-03-30 2010-01-05 Intel Corporation Dual direction rake piezo actuator
US7692922B2 (en) * 2007-06-30 2010-04-06 Intel Corporation Heatsink, method of manufacturing same, and microelectronic package containing same
US7633753B2 (en) * 2007-09-27 2009-12-15 Intel Corporation Piezoelectric air jet augmented cooling for electronic devices
US7550901B2 (en) * 2007-09-27 2009-06-23 Intel Corporation Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same
PL2587706T3 (en) * 2007-10-23 2018-07-31 Nokia Technologies Oy Improved re-transmission capability in semi-persistent transmission
US7786654B2 (en) * 2008-03-13 2010-08-31 Intel Corporation Compact rake piezoelectric assembly and method of manufacturing same
WO2009119431A1 (en) * 2008-03-25 2009-10-01 株式会社村田製作所 Piezoelectric fan apparatus and air-cooling apparatus using the same
US20090281089A1 (en) * 2008-04-11 2009-11-12 Genentech, Inc. Pyridyl inhibitors of hedgehog signalling
EP2322019A1 (en) * 2008-09-12 2011-05-18 Koninklijke Philips Electronics N.V. A device provided with a gap-like space and a synthetic jet generator coupled thereto
TWI465647B (en) * 2009-05-20 2014-12-21 Hon Hai Prec Ind Co Ltd Piezoelectric fan
KR101529169B1 (en) * 2009-06-11 2015-06-16 삼성전자주식회사 SAW Sensor Device
KR101653826B1 (en) * 2009-06-29 2016-09-02 삼성전자주식회사 Ultrasonic motor and method for manufacturing the ultrasonic motor
JP2013537600A (en) * 2010-08-25 2013-10-03 インフルーエント コーポレイション Cantilever fan
US20120145359A1 (en) * 2010-12-09 2012-06-14 Research In Motion Limited Method and apparatus for handheld device airflow
US8926272B2 (en) * 2011-09-07 2015-01-06 Textron Innovations Inc. System for heat dissipation from an internal actuator in a rotor blade
JP5882053B2 (en) * 2011-12-28 2016-03-09 太陽誘電株式会社 Method for manufacturing acoustic wave device
US9180965B2 (en) * 2012-08-28 2015-11-10 Bell Helicopter Textron Inc. Actuation system for an active element in a rotor blade
US9938006B2 (en) 2012-08-28 2018-04-10 Bell Helicopter Textron Inc. Actuation system for an active element in a rotor blade
US9180966B2 (en) 2012-08-28 2015-11-10 Bell Helicopter Textron Inc. Actuation system for an active element in a rotor blade
CN103857225B (en) * 2012-12-03 2017-03-01 联想(北京)有限公司 A kind of electronic equipment
EP2743513B1 (en) * 2012-12-13 2019-02-06 Goodrich Lighting Systems GmbH Device for generating an airflow for cooling a heat dissipating electronic element such as an LED
US9367103B2 (en) * 2013-08-22 2016-06-14 Asia Vital Components Co., Ltd. Heat dissipation device
US9422944B2 (en) 2014-08-15 2016-08-23 Dell Products, Lp Carbon fiber laminate piezoelectric cooler and method therefor
TWI667871B (en) * 2018-08-07 2019-08-01 國立交通大學 Fan device
DE102018214598A1 (en) * 2018-08-29 2020-03-05 Robert Bosch Gmbh Assembly for an environmental sensor, lidar sensor and means of transportation

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419682A (en) * 1992-10-12 1995-05-30 Behr Gmbh & Co. Axial fan having plastic blades
WO1998054765A1 (en) * 1997-05-30 1998-12-03 Cts Corporation Low-profile axial-flow single-blade piezoelectric fan
US6114798A (en) * 1996-03-25 2000-09-05 Canon Kabushiki Kaisha Stacked element and vibration drive device
JP2000334381A (en) * 1999-06-01 2000-12-05 Sony Corp Fan device and its usage
US6291929B1 (en) * 1998-12-05 2001-09-18 Robert Bosch Gmbh Piezoelectric actuator
JP2002305331A (en) * 2001-04-09 2002-10-18 Sony Corp Laminated ceramic element and piezoelectric fan using the same
WO2003071132A2 (en) * 2002-02-15 2003-08-28 Siemens Technology-To-Business Center, Llc Small piezoelectric air pumps with unobstructed airflow

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Publication number Priority date Publication date Assignee Title
US4595338A (en) * 1983-11-17 1986-06-17 Piezo Electric Products, Inc. Non-vibrational oscillating blade piezoelectric blower
US4780062A (en) * 1985-10-09 1988-10-25 Murata Manufacturing Co., Ltd. Piezoelectric fan
EP0761011B1 (en) * 1995-03-27 1999-07-21 Koninklijke Philips Electronics N.V. Method of manufacturing an electronic multilayer component
EP1384272B1 (en) * 2001-04-30 2005-06-22 Siemens Aktiengesellschaft Additional contacting for an electric component and piezoelectric component in the form of a multilayer structure
US20030020377A1 (en) * 2001-07-30 2003-01-30 Ngk Insulators, Ltd. Piezoelectric/electrostrictive element and piezoelectric/electrostrictive device and production method thereof
JP4053822B2 (en) * 2002-06-10 2008-02-27 日本碍子株式会社 Piezoelectric / electrostrictive device and manufacturing method thereof
JP2005159606A (en) * 2003-11-25 2005-06-16 Tdk Corp Piezoelectric thin film resonator and its manufacturing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419682A (en) * 1992-10-12 1995-05-30 Behr Gmbh & Co. Axial fan having plastic blades
US6114798A (en) * 1996-03-25 2000-09-05 Canon Kabushiki Kaisha Stacked element and vibration drive device
WO1998054765A1 (en) * 1997-05-30 1998-12-03 Cts Corporation Low-profile axial-flow single-blade piezoelectric fan
US6291929B1 (en) * 1998-12-05 2001-09-18 Robert Bosch Gmbh Piezoelectric actuator
JP2000334381A (en) * 1999-06-01 2000-12-05 Sony Corp Fan device and its usage
JP2002305331A (en) * 2001-04-09 2002-10-18 Sony Corp Laminated ceramic element and piezoelectric fan using the same
WO2003071132A2 (en) * 2002-02-15 2003-08-28 Siemens Technology-To-Business Center, Llc Small piezoelectric air pumps with unobstructed airflow

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
YORINAGA M ET AL: "A piezoelectric fan using PZT ceramics", JAPANESE JOURNAL OF APPLIED PHYSICS, SUPPLEMENT 24-3, vol. 24, 1985, pages 203 - 205, XP009073636, ISSN: 0021-4922 *

Also Published As

Publication number Publication date
KR20080025094A (en) 2008-03-19
TWI337411B (en) 2011-02-11
JP2008545357A (en) 2008-12-11
DE112006001734T5 (en) 2008-08-28
CN101199062B (en) 2011-04-13
CN101199062A (en) 2008-06-11
HK1118954A1 (en) 2009-02-20
DE112006001734B4 (en) 2014-06-18
WO2007005915A2 (en) 2007-01-11
TW200717889A (en) 2007-05-01
JP4792500B2 (en) 2011-10-12
US7638928B2 (en) 2009-12-29
US20070001550A1 (en) 2007-01-04

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