WO2007033611A1 - Opto-electronic device for optical fibre applications - Google Patents

Opto-electronic device for optical fibre applications Download PDF

Info

Publication number
WO2007033611A1
WO2007033611A1 PCT/CN2006/002510 CN2006002510W WO2007033611A1 WO 2007033611 A1 WO2007033611 A1 WO 2007033611A1 CN 2006002510 W CN2006002510 W CN 2006002510W WO 2007033611 A1 WO2007033611 A1 WO 2007033611A1
Authority
WO
WIPO (PCT)
Prior art keywords
opto
electronic device
optical guide
signal conversion
conversion means
Prior art date
Application number
PCT/CN2006/002510
Other languages
French (fr)
Other versions
WO2007033611B1 (en
Inventor
Torsten Wipiejewski
Original Assignee
Hongkong Applied Science And Technology Research Institute Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongkong Applied Science And Technology Research Institute Co., Ltd. filed Critical Hongkong Applied Science And Technology Research Institute Co., Ltd.
Publication of WO2007033611A1 publication Critical patent/WO2007033611A1/en
Publication of WO2007033611B1 publication Critical patent/WO2007033611B1/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4292Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

An opto-electronic device (100) comprising an opto-electronic circuitry (140) on a lead-frame (132) and an optical guide receptacle (126) for receiving an optical guide coupler (152), the opto-electronic circuitry (140) comprises a signal conversion means (142) whereby an optical signal can be converted into an electrical signal or vice versa, the optical guide receptacle (126) comprises means for guiding reception of an optical guide coupler (152) whereby an optical guide coupler (152) is optically aligned with the signal conversion means (142) when received by said optical guide receptacle (126).

Description

OPTO-ELECTRONIC DEVICE FOR OPTICAL FIBRE APPLICATIONS
FIELD OF THE INVENTION
This invention relates to opto-electronic devices and, more particularly, to opto-electronic devices for optical fibre applications. More specifically, although not exclusively, this invention relates to opto-electronic devices for coupling with an optical fibre termination.
BACKGROUND OF THE INVENTION
Optical fibres are widely used in many applications, for example, optical communication, remote sensing and monitoring. The core of an optical fibre is typically very small and fragile. Therefore, optical fibres are commonly provided with termination connectors for convenient coupling with an opto-electronic device. For example, an optical fibre is terminated with a glass-ferrule for enhanced mechanical stability. The ferrule also provides additional convenience so that an optical fibre core can be more easily aligned with a signal conversion means such as a photo-detector or an optical transmitter. To take advantage of the characteristic optical fibre termination, it will be beneficial to provide optoelectronic devices which are compatible with the optical fibre terminations for more efficient coupling and uncoupling.
OBJECT OF THE INVENTION
Hence, it is an object of this invention to provide opto-electronic devices for coupling with common optical fibre terminations so as to facilitate efficient coupling and uncoupling between an optical fibre and the opto-electronic devices. At a minimum, it is an object of this invention to provide a useful choice of a packaged opto-electronic devices.
SUMMARY OF THE INVENTION
Accordingly, this invention has described an opto-electronic device comprising opto-electronic circuitry on a lead-frame and an optical guide receptacle for receiving an optical guide coupler, the opto-electronic circuitry comprises signal conversion means whereby an optical signal can be converted into an electrical signal or vice versa, the optical guide receptacle comprises means for guiding reception of an optical guide coupler whereby an optical guide coupler is optically aligned with the signal conversion means when received by said optical guide receptacle. An opto-electronic device with an optical guide receptacle mounted on a lead-frame package provides efficient and expeditious coupling.
Another advantage of a lead-frame packaged opto-electronic device for coupling with a terminated optical fibre is the production efficiency since a plurality of devices can be formed on a single metal sheet before the plurality of devices are separated from the metal sheet.
Preferably, said optical guide receptacle comprises an axially extending aperture for guiding an optical guide coupler towards said signal conversion means for optically aligned coupling axially therewith. Preferably, said axially extending aperture is formed on a cover lid, the cover lid and the optical guide receptacle are integrally moulded, the aperture on said cover lid is aligned with said signal conversion means.
Preferably, a focusing lens is formed on the cover lid and at an axial end of said axially extending aperture.
Preferably, a plastic housing is moulded on said lead-frame, the plastic housing forms a compartment which contains the opto-electronic circuitry, the compartment is sealed by said cover lid with said signal conversion means is optically communicable with said optical guide receptacle.
Preferably, the compartment of said plastic housing is filled with an optically transparent substance and the cover lid is fixed onto said plastic housing.
Preferably, said optical guide receptacle is adapted for receiving a packaged optical guide coupler which comprises an optical fibre with a ferule, the optical guide receptacle comprise an axially extending aperture the axis of which is optically aligned with said signal conversion means, the packaged optical guide coupler and the axially extending aperture of said optical guide receptacle is adapted so that the optical fibre is aligned with said signal conversion means when received by said optical guide receptacle.
Preferably, the axis of said optical guide receptacle is orthogonal to a mounting plane of the lead-frame. Preferably, said optical guide receptacle comprises a tubular guide for guiding a packaged optical guide coupler axially towards said signal conversion means.
Preferably, said lead-frame and said opto-electronic circuitry are contained in a moulded plastic housing, said moulded plastic housing comprises a window which exposes said signal conversion means, said optical guide receptacle comprises an axially extending aperture, the axially extending aperture meets the plastic housing at said window.
Preferably, said axially extending aperture protrudes orthogonally from said moulded plastic housing and axially away from said signal conversion means.
Preferably, said axially extending aperture has a circular cross-section.
Preferably, said optical guide receptacle comprises axially extending alignment means which are circumferentially distributed around said axially extending aperture.
Preferably, each said alignment means comprises an axially extending fin.
Preferably, said signal conversion means comprises a laser source.
Preferably, said laser source is a vertical-cavity surface emitting laser.
Preferably, said signal conversion means comprises a photo-detector.
Preferably, said opto-electronic circuitry comprises an optical receiver, an optical transmitter or an optical transceiver. Preferably, contact leads of said lead-frame are transversal to the axially extending aperture.
Preferably, said opto-electronic circuitry comprises a laser transmitted and a monitoring photo-detector for feedback control of the laser transmitter, laser output is transmitted through said optical guide receptacle.
Preferably, the opto-electronic circuitry comprises an optical receiver, said signal conversion means comprises a photo-diode.
Preferably, a partial reflector is disposed intermediate the optical guide receptacle and the signal conversion means whereby light travelling between the optical guide receptacle and the signal conversion means is partially reflected to a signal monitoring means for circuitry control.
Preferably, the partially reflected light is for feedback control of operating conditions of the signal conversion means.
BRIEF DESCRIPTION OF THE DRAWINGS
Preferred embodiments of the present invention will be explained in further detail below by way of examples and with reference to the accompanying drawings, in which:-
Fig. 1 shows a schematic cross-sectional view of a first preferred embodiment of an opto-electronic device of this invention,
Fig. 2 shows a partially removed schematic perspective view of a second preferred embodiment of an opto-electronic device of this invention, Fig. 3 illustrates an opto-electronic device of Fig. 2 aligned with an optical fibre termination,
Fig. 4 shows a plurality of opto-electronic devices of the second preferred embodiment on a common lead-frame package,
Fig. 4A shows the bottom view of the device of Fig. 3,
Fig. 5 shows schematically a third preferred embodiment of this invention,
Fig. 6 illustrates an exemplary application of an opto-electronic device of Fig. 1 when coupled with a terminated optical fibre,
Fig. 7 illustrates the termination of the optical fibre of Fig. 6 in a second configuration, and
Fig. 8 illustrates an opto-electronic device of this invention with a plurality of guiding fins.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring firstly to Figs. 1 to 3, an opto-electronic device 100 comprises a housing 110, a lead-frame 130 and opto-electronic circuitry 140 is shown. The opto-electronic circuitry 140 comprises an opto-electronic signal conversion device such as, for example, an optical transmitter with a laser or an LED source, an optical receiver with a photo-detector, or an optical transceiver where appropriate. Preferably, the opto-electronic circuitry 140 comprises an integrated circuit (IC) chip. The opto-electronic circuitry 140 is mounted and connected to a conductive lead-frame for external connection. The housing 110 comprises a lower housing 112 and an upper housing 120. The lower housing 112 is made of plastics and is moulded with the lead-frame at between the lateral ends of the legs 132 of the lead-frame 130. The plastic lower housing 112 is moulded so that a compartment 114 with a top aperture 116 surrounded by peripheral walls 118 is formed. The opto-electronic circuitry 140 is placed in this hollow compartment 114 and is supported by a platform of the lead-frame which is in turn supported by the lower plastic housing 112. The opto-electronic circuitry 140 is fixed in place by transparent fastening substances such as resin or other appropriate optically transparent medium. This transparent fastening medium also contributes to the fastening of the upper housing 120 to the lower housing 112 where appropriate.
The upper housing 120 is also made of plastics and comprises a cover lid 122, a focusing lens 124 and an optical guide receptacle 126. The optical guide receptacle 126 comprises an axial barrel defining an axially extending aperture for guiding an optical guide coupler axially towards the signal conversion means 142 (which is a photo-detector in case of an optical receiver or a laser or LED source in case of an optical transmitter) for optical alignment therewith. A stop 128 is disposed intermediate the top free end of the optical guide receptacle 126 and the focusing lens 124 which is disposed at the junction of the optical guide receptacle 126 and the cover lid 122. The stop 128 provides adequate clearance between the head of an optical guide 150 and the focusing lens 124. The internal bore 129 of the optical guide receptacle is adapted so that when an optical guide is duly received by the optical guide receptacle, the optical fibre 150 will be aligned with the signal conversion means 142 for optical communication. In the arrangement of Figs. 1 and 2, the axis of the optical receptacle and the core of the optical fibre are coaxial, with their common axis aligned to the signal conversion means 142. The upper housing 122 is attached to the lower housing 112 by, for example, ultra-sonic welding or glue fastening. To facilitate speedy assembly between the lower and upper housings, location means, such as slot and lug pairs may be correspondingly distributed on the corresponding periphery of the upper and lower housings. In order to ensure optimal alignment between the optical fibre module 152 and the opto-electronic signal conversion means 142, the upper and lower housing may be fastened with a referencing or testing optical fibre module 152 received and operating within the optical guide receptacle so that the upper and lower housings are fastened together when an optimal signal output is detected. The focusing lens 124 is convex towards the optical fibre 150. Of course, the focusing lens can be other appropriate lens such as a concave lens where appropriate.
The opto-electronic circuitry is mounted on a conductive platform of the lead-frame 130. The plane of the conductive platform is substantially parallel to a plane defined by the flat portions of the free ends of the legs of the lead-frame. This plane of the platform is substantially orthogonal to the axis of the internal bore of the optical receptacle.
Referring to Figs. 4 and 4A, a plurality of opto-electronic devices 100 are formed on a stamped metallic sheet 160 which comprises a plurality of lead- frames. Such lead-frame comprises a rigid legs and platform for mounting the opto-electronic circuitry. Hence, a plurality of lead-frame can be formed at the same time on a single metal sheet prior to the formation of separate lead-frame packaged devices and this substantially enhances production efficiency.
In a second preferred embodiment as shown in Fig. 5, the opto-electronic device comprises an optical transmitter with a vertical-cavity surface-emitter laser (VCSEL). The VCSEL drive current and output power is controlled by an electronic driver chip plus passive components inside the package formed by the upper and lower housing. The output power of the VCSEL can be controlled by closed-loop monitoring wherein output light of the VCSEL is partially reflected by a reflector 210 mounted intermediate the focusing lens and the laser source 142. The reflected light from the reflector 210 hits a monitor photo-diode mounted side- by-side to the laser source. The photo-current detected at the monitor photo- detector is a measure of the total laser output power which is fed back to the control circuitry for adjusting drive current and therefore stabilizing output power of the laser source. The additional components can be placed on an additional sub- mount inside the packaged device 200. The lead-frame package is typically a through-hole mountable design or a surface mount design as shown more particularly in Figs. 1-3. After the components have been mounted inside the device compartment, the cover lid of the upper housing can be attached to the lower housing by glue. The cover lid can be aligned with the components inside the lower housing by active or passive alignment. In the active alignment mould, the upper and lower housing will be aligned when the VCSEL is emitting light and the light emission detected by a test optical fibre inserted in the barrel of the optical guide receptacle. In the passive alignment mould, the cover lid 122 of the upper housing is fastened to the periphery of the lower housing using appropriate mechanical location means. The focusing means 124 is adapted for maximal coupling efficiency and/or wide alignment tolerances. The focusing lens 124 can be integrally formed with the upper housing or a detachable housing. The configuration comprising a lead- frame mounted with a housing with a pre-aligned optical barrel permits a wide mechanical alignment tolerances. This is particularly important because optical fibre termination modules often require a wide lateral alignment tolerance due to fabrication tolerances in fibre ferrule. A wide longitudinal alignment tolerance is preferred so as to facilitate elastic coupling between a fibre ferrule and an optical module. This characteristic is particularly useful in connection with an optical connector since a fibre ferrule can be very short to form a fibre stub type of device.
Figs. 6 and 7 shows an exemplary application of the opto-electronic device 100 in which the fibre stub and the opto-electronic device are mechanically connected by a spring-type connector device. The distance of the ferrule and- facite to the lid alignment plane will vary depending on the resilience of the spring 170. A wide longitudinal alignment tolerance of more than 0.5 mm can be obtained with such an arrangement. For example, in Fig. 6, the fibre stub is pushed by external force towards the stub inside the optical barrel. The compressive force can be due to connection with another fibre. In Fig. 7, there is no externally applied force on the fibre stub and the spring 170 is relaxed, whereby pushing the fibre stub away from the stub and the focusing lens. However, coupling of the signal conversion means with the fibre should remain as constant as possible over the entire longitudinal coupling range.
To further enhance speedy and accurate alignment between a fibre stub and the opto-electronic device, a plurality of radially extending fins may be formed on the formed on the exterior of the barrel 126 (as shown in Fig. 8) so as to guide insertion of an optical fibre stub into coupling with the signal-conversion means 124 of the device 100.
In this specification, parts which are common to the various embodiments or examples use the same numerals where appropriate for succinctness.
While the present invention has been explained by reference to the examples or preferred embodiments described above, it will be appreciated that those are examples to assist understanding of the present invention and are not meant to be restrictive. Variations or modifications which are obvious or trivial to persons skilled in the art, as well as improvements made thereon, should be considered as equivalents of this invention.
Furthermore, while the present invention has been explained by reference to a laser source, it should be appreciated that the invention can apply, whether with or without modification, to other opto-electronic devices without loss of generality.

Claims

1. An opto-electronic device according to Claim 1 , wherein the optical guide receptacle comprises an axially extending aperture for guiding an optical guide coupler towards said signal conversion means for optically aligned coupling axially therewith.
2. An opto-electronic device according to Claim 2, wherein said axially extending aperture is formed on a cover lid, the cover lid and the optical guide receptacle are integrally moulded, the aperture on said cover lid is aligned with said signal conversion means.
3. An opto-electronic device according to Claim 3, wherein a focusing lens is formed on the cover lid and at an axial end of said axially extending aperture.
4. An opto-electronic device according to Claim 3, wherein a plastic housing is moulded on said lead-frame, the plastic housing forms a compartment which contains the opto-electronic circuitry, the compartment is sealed by said cover lid with said signal conversion means is optically communicable with said optical guide receptacle.
5. An opto-electronic device according to Claim 5, wherein the compartment of said plastic housing is filled with an optically transparent substance and the cover lid is fixed onto said plastic housing.
6. An opto-electronic device according to Claim 1 , wherein said optical guide receptacle is adapted for receiving a packaged optical guide coupler which comprises an optical fibre with a ferule, the optical guide receptacle comprise an axially extending aperture the axis of which is optically aligned with said signal conversion means, the packaged optical guide coupler and the axially extending aperture of said optical guide receptacle is adapted so that the optical fibre is aligned with said signal conversion means when received by said optical guide receptacle.
7. An opto-eiectronic device according to Claim 7, wherein the axis of said optical guide receptacle is orthogonal to a mounting plane of the lead-frame.
8. An opto-electronic device according to Claim 7, wherein said optical guide receptacle comprises a tubular guide for guiding a packaged optical guide coupler axially towards said signal conversion means.
9. An opto-electronic device according to Claim 1 , wherein said lead-frame and said opto-electronic circuitry are contained in a moulded plastic housing, said moulded plastic housing comprises a window which exposes said signal conversion means, said optical guide receptacle comprises an axially extending aperture, the axially extending aperture meets the plastic housing at said window.
10. An opto-electronic device according to Claim 10, wherein said axially extending aperture protrudes orthogonally from said moulded plastic housing and axially away from said signal conversion means.
11. An opto-electronic device according to Claim 11 , wherein said axially extending aperture has a circular cross-section.
12. An opto-electronic device according to Claim 12, wherein said optical guide receptacle comprises axially extending alignment means which are circumferentially distributed around said axially extending aperture.
13. An opto-electronic device according to Claim 13, wherein each said alignment means comprises an axially extending fin.
14. An opto-electronic device according to Claim 1 , wherein said signal conversion means comprises a laser source.
15. An opto-electronic device according to Claim 16, wherein said laser source is a vertical-cavity surface emitting laser.
16. An opto-electronic device according to Claim 1 , wherein said signal conversion means comprises a photo-detector.
17. An opto-electronic device according to Claim 1 , wherein said opto-electronic circuitry comprises an optical receiver, an optical transmitter or an optical transceiver.
18. An opto-electronic device according to Claim 2, wherein contact leads of said lead-frame are transversal to the axially extending aperture.
19. An opto-electronic device according to Claim 1 , wherein said opto-electronic circuitry comprises a laser transmitted and a monitoring photo-detector for feedback control of the laser transmitter, laser output is transmitted through said optical guide receptacle.
20. An opto-electronic device according to Claim 1 , wherein the opto-electronic circuitry comprises an optical receiver, said signal conversion means comprises a photo-diode.
21. An opto-electronic device according to Claim 1 , wherein a partial reflector is disposed intermediate the optical guide receptacle and the signal conversion means whereby light travelling between the optical guide receptacle and the signal conversion means is partially reflected to a signal monitoring means for circuitry control.
22. An opto-electronic device according to Claim 22, wherein the partially reflected light is for feedback control of operating conditions of the signal conversion means.
23. An assembly of a plurality of opto-electronic devices according to any of the preceding claims on a common lead-frame.
PCT/CN2006/002510 2005-09-26 2006-09-25 Opto-electronic device for optical fibre applications WO2007033611A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
HK05108490 2005-09-26
HK05108490.3 2005-09-26

Publications (2)

Publication Number Publication Date
WO2007033611A1 true WO2007033611A1 (en) 2007-03-29
WO2007033611B1 WO2007033611B1 (en) 2007-05-10

Family

ID=37888563

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2006/002510 WO2007033611A1 (en) 2005-09-26 2006-09-25 Opto-electronic device for optical fibre applications

Country Status (1)

Country Link
WO (1) WO2007033611A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2202551A1 (en) * 2008-12-24 2010-06-30 Hosiden Corporation Optical connector
CN108155106A (en) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 A kind of length climbs the preparation process of electric light electric coupler

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995687A (en) * 1988-11-18 1991-02-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor laser device and a method of producing same
JPH0777639A (en) * 1993-09-10 1995-03-20 Nec Corp Method for assembling optical module
US5692086A (en) * 1995-10-25 1997-11-25 The Boeing Company Optical fiber locking submount and hermetic feedthrough assembly
CN2411493Y (en) * 2000-02-22 2000-12-20 汪中 Semi-conductor laser fiber-optical coaxial direct coupling device
US20010033720A1 (en) * 1998-01-31 2001-10-25 Jan Isaksson System and method for aligning optical components
US6364541B1 (en) * 1999-12-22 2002-04-02 New Focus, Inc. Method and apparatus for optical reception
US6659659B1 (en) * 2001-04-11 2003-12-09 Optical Communication Products, Inc. High-speed optical sub-assembly utilizing ceramic substrate, direct coupling and laser welding
US20040101020A1 (en) * 2002-11-26 2004-05-27 Photodigm, Inc. Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule
US20040161208A1 (en) * 2003-02-15 2004-08-19 Marco Scofet Low cost optical module
US6786652B2 (en) * 2001-12-19 2004-09-07 Northrop Grumman Corporation Process for fabricating a photonics package and for aligning an optical fiber with a photodetector surface during fabrication of such a package

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995687A (en) * 1988-11-18 1991-02-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor laser device and a method of producing same
JPH0777639A (en) * 1993-09-10 1995-03-20 Nec Corp Method for assembling optical module
US5692086A (en) * 1995-10-25 1997-11-25 The Boeing Company Optical fiber locking submount and hermetic feedthrough assembly
US20010033720A1 (en) * 1998-01-31 2001-10-25 Jan Isaksson System and method for aligning optical components
US6364541B1 (en) * 1999-12-22 2002-04-02 New Focus, Inc. Method and apparatus for optical reception
CN2411493Y (en) * 2000-02-22 2000-12-20 汪中 Semi-conductor laser fiber-optical coaxial direct coupling device
US6659659B1 (en) * 2001-04-11 2003-12-09 Optical Communication Products, Inc. High-speed optical sub-assembly utilizing ceramic substrate, direct coupling and laser welding
US6786652B2 (en) * 2001-12-19 2004-09-07 Northrop Grumman Corporation Process for fabricating a photonics package and for aligning an optical fiber with a photodetector surface during fabrication of such a package
US20040101020A1 (en) * 2002-11-26 2004-05-27 Photodigm, Inc. Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule
US20040161208A1 (en) * 2003-02-15 2004-08-19 Marco Scofet Low cost optical module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2202551A1 (en) * 2008-12-24 2010-06-30 Hosiden Corporation Optical connector
US8292520B2 (en) 2008-12-24 2012-10-23 Hosiden Corporation Optical connector
CN108155106A (en) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 A kind of length climbs the preparation process of electric light electric coupler

Also Published As

Publication number Publication date
WO2007033611B1 (en) 2007-05-10

Similar Documents

Publication Publication Date Title
US7410306B2 (en) Opto-electronic device for optical fibre applications
US5812717A (en) Optical package with alignment means and method of assembling an optical package
US7066657B2 (en) Optical subassembly
US6795461B1 (en) Optoelectric module
US9588307B2 (en) Parallel optical transceiver with top and bottom lenses
US7410307B2 (en) Modular optical device package compatible with multiple fiber connectors
US7284916B2 (en) Dual stage modular optical devices with insert digital diagnostics component
US7510338B2 (en) Optical transmitting/receiving apparatus
JP5246136B2 (en) Optical transceiver
KR20100133444A (en) Optical communication module
JP4867898B2 (en) Optical module, optical block reinforcement and optical block
US20050271391A1 (en) Dual stage modular optical devices
JP3896097B2 (en) Receptacle type optical module
US10295768B2 (en) Chip on leadframe optical subassembly
US6663296B1 (en) Optoelectric module
CN111458817A (en) Optical module
EP1610162B1 (en) A method of assembling optoelectronic devices and an optoelectronic device assembled according to this method
US6999644B1 (en) Discrete optoelectric package
WO2007033611A1 (en) Opto-electronic device for optical fibre applications
US6477056B1 (en) Optoelectric mounting and interconnect apparatus
CN111948767A (en) Optical module
US20150381278A1 (en) Low-profile optical transceiver system with top and bottom lenses
US20140023323A1 (en) Optical connector and fitted unit
US11428881B2 (en) Optical connector and optical connector device
KR19990079076A (en) Optical transceiver module

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06791099

Country of ref document: EP

Kind code of ref document: A1