WO2007035834A3 - Methods and systems for creating a recipe for a defect review process - Google Patents

Methods and systems for creating a recipe for a defect review process Download PDF

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Publication number
WO2007035834A3
WO2007035834A3 PCT/US2006/036707 US2006036707W WO2007035834A3 WO 2007035834 A3 WO2007035834 A3 WO 2007035834A3 US 2006036707 W US2006036707 W US 2006036707W WO 2007035834 A3 WO2007035834 A3 WO 2007035834A3
Authority
WO
WIPO (PCT)
Prior art keywords
review process
defect review
recipe
identity
creating
Prior art date
Application number
PCT/US2006/036707
Other languages
French (fr)
Other versions
WO2007035834A2 (en
Inventor
S Mark Borowicz
Mehran Nasser-Ghodsi
Kenneth J Krzeczowski
Original Assignee
Kla Tencor Tech Corp
S Mark Borowicz
Mehran Nasser-Ghodsi
Kenneth J Krzeczowski
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp, S Mark Borowicz, Mehran Nasser-Ghodsi, Kenneth J Krzeczowski filed Critical Kla Tencor Tech Corp
Publication of WO2007035834A2 publication Critical patent/WO2007035834A2/en
Publication of WO2007035834A3 publication Critical patent/WO2007035834A3/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Systems or methods specially adapted for specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31304—Identification of workpiece and data for control, inspection, safety, calibration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37206—Inspection of surface
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37224—Inspect wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Abstract

Methods and systems for creating a recipe for a defect review process are provided. One method includes determining an identity of a specimen on which the defect review process will be performed. The method also includes identifying inspection results for the specimen based on the identity. In addition, the method includes creating the recipe for the defect review process based on the inspection results. One system includes a sensor configured to generate output responsive to an identity of a specimen on which the defect review process will be performed. The system also includes a processor configured to determine the identity of the specimen using the output, to identify inspection results for the specimen based on the identity, and to create the recipe for the defect review process based on the inspection results.
PCT/US2006/036707 2005-09-21 2006-09-20 Methods and systems for creating a recipe for a defect review process WO2007035834A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71900905P 2005-09-21 2005-09-21
US60/719,009 2005-09-21

Publications (2)

Publication Number Publication Date
WO2007035834A2 WO2007035834A2 (en) 2007-03-29
WO2007035834A3 true WO2007035834A3 (en) 2007-12-13

Family

ID=37889514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/036707 WO2007035834A2 (en) 2005-09-21 2006-09-20 Methods and systems for creating a recipe for a defect review process

Country Status (2)

Country Link
US (1) US7440086B2 (en)
WO (1) WO2007035834A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
JP4959149B2 (en) * 2005-05-02 2012-06-20 株式会社荏原製作所 Sample inspection equipment
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
US20090122304A1 (en) * 2006-05-02 2009-05-14 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Exclusion Measurement
US20090116727A1 (en) * 2006-05-02 2009-05-07 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Defects Detection
US8135204B1 (en) * 2007-09-21 2012-03-13 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe
JP2009272497A (en) * 2008-05-08 2009-11-19 Hitachi High-Technologies Corp Recipe parameter management apparatus and recipe parameter management method
US8000922B2 (en) * 2008-05-29 2011-08-16 Kla-Tencor Corp. Methods and systems for generating information to be used for selecting values for one or more parameters of a detection algorithm
US9768082B2 (en) * 2009-02-13 2017-09-19 Hermes Microvision Inc. Method and machine for examining wafers
JP5544344B2 (en) * 2011-09-26 2014-07-09 株式会社日立ハイテクノロジーズ Defect observation method and defect observation apparatus
US10560369B2 (en) * 2016-06-23 2020-02-11 Wipro Limited Methods and systems for detecting and transferring defect information during manufacturing processes
US10902576B2 (en) * 2016-08-12 2021-01-26 Texas Instruments Incorporated System and method for electronic die inking after automatic visual defect inspection
US20220126345A1 (en) * 2020-10-23 2022-04-28 Ford Global Technologies, Llc Stamping line defect quality monitoring systems and methods of monitoring stamping line defects
DE102021125343A1 (en) * 2021-09-30 2023-03-30 Schott Ag Method and device for the production of a large number of components with at least one electrical feedthrough and an information memory, component and method and device for the further processing of such components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6259960B1 (en) * 1996-11-01 2001-07-10 Joel Ltd. Part-inspecting system
US20040158409A1 (en) * 2002-11-12 2004-08-12 Janet Teshima Defect analyzer
US7020582B1 (en) * 2004-04-28 2006-03-28 Altera Corporation Methods and apparatus for laser marking of integrated circuit faults

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6259960B1 (en) * 1996-11-01 2001-07-10 Joel Ltd. Part-inspecting system
US20040158409A1 (en) * 2002-11-12 2004-08-12 Janet Teshima Defect analyzer
US7020582B1 (en) * 2004-04-28 2006-03-28 Altera Corporation Methods and apparatus for laser marking of integrated circuit faults

Also Published As

Publication number Publication date
WO2007035834A2 (en) 2007-03-29
US7440086B2 (en) 2008-10-21
US20070067134A1 (en) 2007-03-22

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