WO2007036610A1

WO2007036610A1 - Attachment of conductor structure to object

Info

Publication number: WO2007036610A1
Application number: PCT/FI2006/050415
Authority: WO
Inventors: Juha Hagberg; Teija Kekonen
Original assignee: Aspact Oy
Priority date: 2005-09-28
Filing date: 2006-09-28
Publication date: 2007-04-05
Also published as: WO2007036610A8; FI20055515A; FI20055515A0

Abstract

A conductor structure (100) and an object (104) made of a thermoplastic material are pressed between a press (900) and a support substrate (910) into a mechanical contact with each other. The press (900) heats the conductor structure (100) to a temperature higher than the thermoplastic softening temperature, the heated conductor structure (100) producing in the object (104) a reversible temperature change that attaches the conductor structure (100) to the object (104) in such a way that the shape of the object (104) remains unchanged at least outside the point of attachment of the conductor structure (100).

Description

ATTACHMENT OF CONDUCTOR STRUCTURE TO OBJECT

FIELD

[0001] The invention relates to a method of forming an electrically conductive conductor structure to a thermoplastic object, a production series needed in the method and a production apparatus implementing the method.

BACKGROUND

[0002] There are various ways of providing plastic parts, such as housings of different electronic devices, with an electrical conductor structure. Usually the electrical conductor structure is made of metal.

[0003] In two-stage moulding the plastic part is moulded in consecutive stages from two different plastic components, one of which is activated for depositing a copper layer on the surface thereof in a chemical bath. Disadvantages of this method are high costs of the mould and the casting apparatuses, and the poor quality of deposited chemical copper as compared with electrolytic copper. Moreover, the rate of deposition is low, and the moulding process requires two separate stages.

[0004] Laser activation is a method that employs a specific kind of plastic on the surface of which an activated pattern may be formed by means of a laser beam. The patterned area on the surface of the plastic part can then be provided with a copper layer deposited in a chemical bath. The disadvantages here, as compared with electrolytic copper, are the poor quality of chemical copper and low deposition rate. 3D laser activation of the parts requires expensive software and equipment.

[0005] Laser patterning, in turn, is performed by first plating the surface of a plastic part with a copper layer that can be subsequently removed by means of laser ablation to produce a desired pattern. This method requires several work phases and is substractive in nature. 3D laser processing of the parts requires expensive software and equipment.

[0006] When a plastic part is to be formed by moulding, the mould may be provided with inserts, which are films matching with the mould surface and having a shape that may be three-dimensional. The surfaces of the films are provided with conductive patterns. In the moulding process the circuitry, with or without the carrier film, remains attached to the plastic part. Problems of this method include lack of precision in the alignment of the inserts in the mould and the fact that the conductive pattern of an already moulded plastic part cannot be changed.

[0007] The plastic part may be covered with a layer which is formed by chemical or electrolytical coppering and which may then be patterned using photoresist and (3D) illumination. The conductive pattern can be etched. The processing involved is complicated and requires a number of stages. Moreover, 3D resist processing requires expensive and complex equipment.

[0008] Hot embossing is a method in which a copper film on top of a uniform plastic part can be embossed by means of a hot, sharp-edged tool to produce patterns that the thermal energy of the tool attaches to the plastic part, possibly embedding it therein. For the embossing to be possible, a particularly fragile copper quality has to be used. A further problem with this method is poor resolution and conductive pattern shapes, and limited 3D shapes.

BRIEF DESCRIPTION

[0009] It is an object of the invention to provide an improved method and a production apparatus and production series implementing the method. This is achieved by a method for providing a thermoplastic object with an electrically conductive conductor structure. The method comprises heating a pre-patterned conductor structure to a temperature higher than the thermoplastic softening temperature of the object; pressing the conductor structure to bring it into a mechanical contact with the object, the shape of which remains unchanged during the pressing; and producing in the object a reversible temperature change with the heated conductor structure to attach the conductor structure to the object.

[0010] The invention also relates to a production apparatus for producing an object provided with an electrically conductive conductor structure. The production apparatus comprises a press and a support substrate for pressing together a pre-patterned conductor structure and an object made of a thermoplastic material and meant to have an unchanging shape to bring them into a mechanical contact with each other; the press being configured to heat the conductor structure to a temperature higher than the thermoplastic softening temperature, the heated conductor structure producing in the object a reversible temperature change that attaches the conductor structure to the object. [0011] The invention further relates to a production series for producing an object provided with an electrically conductive conductor structure. The production series comprises an object made of a thermoplastic material and meant to have an unchanging shape; a pre-pattemed conductor structure configured to be heated to a temperature higher than the thermoplastic softening temperature of the object; the conductor structure and the object being configured to be pressed to bring them into a mechanical contact with each other, the heated conductor structure being arranged to produce in the object a reversible temperature change that attaches the conductor structure to the object.

[0012] Preferred embodiments of the invention are disclosed in the independent claims.

[0013] The method and arrangement of the invention provide several advantages. They allow the manufacture and attachment of each conductor structure to be carried out with precision and good resolution, and the attachment to be performed in a single stage. In addition, the attachment operation is simple and does not require complicated equipment. The conductor structure and the object can be manufactured separately from one another, and the attachment of the conductor structure may be carried out independently of the production of the conductor structure and the object. Further still, since the object needs to be heated only locally, thermal stresses are low.

LIST OF FIGURES

[0014] In the following, the invention will be described in greater detail and with reference to the accompanying drawings, in which

Figure 1 shows an object, conductor structure and auxiliary substrate when unattached;

Figure 2 shows an object and conductor structure when attached;

Figure 3 shows a conductor structure embedded into an object;

Figure 4 shows conductor structures and their auxiliary substrates when unattached to an object;

Figure 5 shows conductor structures and their auxiliary substrates when attached to an object;

Figure 6 is a side view of a folded conductor structure on the surface of an object; Figure 7 is a perspective view of a folded conductor structure on the surface of an object;

Figure 8 shows a conductor structure on the surface of an L-shaped object;

Figure 9 is a schematic view of the structure of a production apparatus;

Figure 10 is a schematic view of the structure of a production apparatus suitable for serial production;

Figure 11 shows pressing and attachment carried out using rolls;

Figure 12A shows the attachment of a conductor structure to a primary target;

Figure 12B shows the forming of a conductor-patterned primary object;

Figure 12C shows the attachment of a conductor-patterned primary object to a secondary object; and

Figure 13 is a flow diagram of the method.

DESCRIPTION OF EMBODIMENTS

[0015] Figure 1 shows a pre-patterned conductor structure 100, an auxiliary substrate 102 and an object 104. The auxiliary substrate 102 is not a necessity, but the conductor structure 100 can be pressed against the object 104 also without the auxiliary substrate 102. Alternatively, there may also be other layers between the auxiliary substrate 102 and the conductor structure 100, or the auxiliary substrate may consist of a plural number of layers. The arrow in Figure 1 shows the movement of the conductor structure 100 and the plastic part 104 towards each other. The conductor structure 100 is made of an electrically conductive material, such as metal, or an electrically conductive polymer. The auxiliary substrate 102 may be made of almost any solid material, such as metal or plastic. The object 104, in turn, may be a thermoplastic plastic part formed in advance into a desired shape, the general shape of which is not meant to change when the conductor structure 100 is attached to the object. However, some change may take place in connection with the attachment. The surface of the object 104 naturally changes (slightly) at the point of attachment of the conductor structure 100, but otherwise the object 100 is meant to remain unchanged. The object 104 may typically be a housing part or some other constructional part of an electronic device. It is also possible that the object 104 is a thermoplastic piece serving only as a circuit board substrate or support. The object 104 may also be a part of a car or some other vehicle, for example.

[0016] Figure 2 shows the attachment of the conductor structure 100 to the object 104 carried out by heating the pre-patterned conductor structure 100 to a temperature higher than the thermoplastic softening temperature of the object and by pressing the conductor structure 100 to bring it into a mechanical contact with the object 104. The hot conductor structure 100 creates in the object 104 a reversible temperature change that attaches the conductor structure to the object 104. Usually the attachment is carried out without changing the shape of the object 104. The hot conductor structure 100 softens at least the uppermost surface layer 200 of the object 104 at the contact area of the conductor structure, and as the layer cools down and hardens, the conductor structure 100 remains attached to the object 104. The auxiliary substrate 102 can then be removed or left in place. In other words, only the part of the object 104 that is left underneath the conductor structure 100 softens, the rest of the object 104 remaining macroscopically unchanged.

[0017] Figure 3 shows a solution in which the conductor structure 100 is used to heat the object 104 to such an extent that the conductor structure 100 may be embedded into the soft object 104 entirely or almost entirely. Also in this case the softened and then hardened surface 300 of the object attaches to the conductor structure 100. In this example the auxiliary substrate 102 is left in place after the conductor structure 100 has been attached. The auxiliary substrate 102 may be detached from the object 104 and the conductor structure 100 mechanically or by etching. If the auxiliary substrate 102 consists of a plural number of layers, the different layers may be detached at different times. For example, a conductor structure on the housing of an apparatus may need a protective layer until the apparatus is fully completed. Since the assembly of the apparatus may take place at a different location than the production of the housing, it is reasonable to protect the conductor structure on the housing for the duration of transport, for example. The auxiliary substrate 102, into which contact surfaces needed in the apparatus are opened by means of laser or some other means, may also be left in the finished apparatus.

[0018] Generally, the conductor structure 100 may be adhesion- treated to improve attachment. For example, the conductor structure 100 may be roughened by a method known per se, such as etching or a mechanical treatment. In addition, or alternatively, an adhesion layer may be added to the surface of the conductor structure 100 or that of the object 104 electrolytically, chemically, or by adding one or more materials components, such as quartz.

[0019] Figure 4 illustrates a solution in which the conductor structures 100 and 400 are to be attached to different sides of the object 104. The conductor structures 100 and 400 are pressed to bring them into contact with the object 104, whereby the hot conductor structures 100, 400 soften the object 104, and the conductor structures 100, 400 attach to the surface, possibly becoming entirely or partly embedded into the soft object 104.

[0020] Objects having multi-layered conductor structures may be produced by pressing one or more conductor structures onto an already pressed conductor structure. By means of lead-throughs conductor structures in the different layers can be coupled together as desired. It is also possible that the conductor structure 100 in itself is multi-layered, in which case an object may be provided with a multi-layered conductor structure by a single pressing.

[0021] In Figure 5 the attachment has been completed and the conductor structures 100 and 400 are attached to the object 104, one or more optional auxiliary substrate layers 102, 402 or some of the auxiliary substrate layers being at this point possibly still attached to the conductor structures 100, 400 (or they may have been removed).

[0022] Figures 6 and 7 show the object 104 with a conductor structure embedded on both sides thereof. The layered structure, which comprises an optional auxiliary substrate 102 and a conductor structure 100, may be folded to cover both sides of the isolating object 104. The upper and lower sides of the object 104 may be contacted to each other by a fold 600. The fold 600 may be on one or several sides of the object 104.

[0023] In addition to enabling the conductor structure and the object to be produced as a planar two-dimensional structure (a 2D conductive pattern), the disclosed solution allows two-and-half-dimensional or three- dimensional conductor structures (2.5D or 3D conductor structures) to be produced as well. It is therefore possible to provide a 2D object with a 2.5D conductor pattern, as shown in Figures 6 and 7. In this context, a 2.5D shape refers to a shape achieved by folding a planar figure. [0024] Structures with a 2.5D shape are easy to produce for example by providing the conductor structure and its auxiliary substrate with the same shape as the object, such as an L shape, as shown in Figure 8. In Figure 8 the conductor structure 100 is on the inner surface of the object 104, but it may naturally also be arranged on the outer surface or, alternatively, on both surfaces, which may be connected by a fold extending across the edge of the object or by through-holes.

[0025] A conductor structure with a three-dimensional shape may be produced as follows, for example. The conductor structure 100 and the auxiliary substrate may be provided with or produced in a 3D shape using pressure and heat or other known shaping methods, such as hot pressing, pressure shaping or high-speed shaping. These shaping methods are material- dependent. The conductor structure may be adhesion-treated to improve adhesion to the electricity insulating material to which the conductor structure is to be attached and possibly embedded.

[0026] Figure 9 shows a production apparatus for heating the conductor structure and pressing it to the object. A press 900, which may be shaped to match the shape of the object 104, presses the conductor structure 100, which may be on the auxiliary substrate 102, to the object 104. The press may be angular or curved. With a curved press the conductor structure can be pressed to the object irrespective of the shape of the surface of the object, because a curved press can be rotated along the surface of the object in an angle of rotation determined by its curvature. The press is rotated in different angles in such a way that different parts of its curved surface press the conductor structure to the object. Instead of rotating the press, the object may be rotated in relation to the press.

[0027] The press 900, which may be made of metal or silicon, for example, may include a heated 902. The heater 902 may be an electric resistance that may be fed with electric energy from an electric power source 904 to heat the conductor structure 100. Alternatively, or additionally, when electric energy is supplied from the source 904, the heater 902 may create a strongly changing magnetic field around itself, whereby the conductor structure and/or the auxiliary substrate heat up due to eddy current. The heater 902 may also be an oil pipe into which heated oil is supplied from a heated container serving as the source 904. [0028] The press 900 may further contain a cooler 906 into which liquid or gas cooler than the thermoplastic softening temperature of the object may be fed from the source 908 to cool the conductor structure 100.

[0029] The object 104 may be placed onto a support substrate 910. The conductor structure 100 and the object 104 are pressed against each other between the press 900 and the support substrate 910. The support structure 910 may contain a cooler 912 into which liquid or gas cooler than the thermoplastic softening temperature of the object may be fed from the source 914 to cool the object 104 and the conductor structure 100. If conductor structures are attached to both sides of the object, the support substrate 910 may further contain a heater, similarly as the press 900. In that case the press and the support substrate may comprise similar heating and cooling structures.

[0030] The heater 902 may produce a pulsed temperature change in the conductor structure 100 so that the temperature first rises and then drops. In other words, the temperature change is reversible. When the temperature is higher than the thermoplastic softening temperature of the object 104, at least the surface of the object 104 softens, and when the temperature of the object 104 drops towards the end of a pulse, the object 104 hardens and thereby attaches the conductor structure 100 and the object 104 to each other.

[0031] The pulsed change may be produced in such a way that the heater 902 heats the conductor structure 100. Once the conductor structure 100 is sufficiently hot, the heating of the heater 902 is switched off. Although the supply of thermal energy from the heater 902 to the conductor structure 100 is cut off, for a while the temperature of the conductor structure 100 still remains higher than the thermoplastic softening temperature of the object 104. The conductor structure 100, whose temperature is still higher than the thermoplastic temperature, can then be pressed to the object 104 so as to attach the conductor structure 100 and the object to each other. When in contact with the object 104, the temperature of the conductor structure 100 drops and thereby only the surface of the object 104 is momentarily softened at a desired depth. In other words, the amount of energy stored into the conductor structure is less than what would be needed for softening the entire object. The natural rate of temperature drop in the conductor structure 100 and the object 104 may be accelerated by cooling carried out by at least one cooler 906, 912 possibly available. [0032] Another way to carry out the pulsed change is to use the heater 902 for heating the conductor structure 100 also when the conductor structure 100 and the object 104 are in contact with each other. In this solution the heater 902 may produce a thermal pulse, which heats the conductor structure 100 to a temperature higher than the thermoplastic temperature of the object 104 and during the thermal pulse the conductor structure 100 may be pressed to bring it into a mechanical contact with the object 104. The thermal pulse creates a temperature change in the object 104, whereby a rise in the temperature of the object softens at least the surface of the object 104 and a drop in the temperature of the object 104 hardens the object 104, attaching the conductor structure 100 and the object 104 to each other. However, the conductor structure is heated using less thermal energy than what would be needed for softening the entire object. Similarly as above, also in this case it is possible to accelerate the natural rate of the temperature drop in the conductor structure 100 and the object 104 by cooling carried out using at least one cooler 906, 912 possibly available.

[0033] It is also possible that the conductor structure 100 is first pressed to bring it into contact with the object 104, and the heating of the conductor structure 100 only begins thereafter. The thermal pulse creates a temperature change in the object 104, whereby a rise in the temperature of the object softens at least the surface of the object 104 and a drop in the temperature of the object 104 in turn hardens the object 104, attaching the conductor structure 100 and the object 104 to each other. Similarly as above, the conductor structure is heated using less thermal energy than what would be needed for softening the entire object. Also in this case it is possible to accelerate the natural rate of the temperature drop in the conductor structure 100 and the object 104 by cooling carried out by coolers 906, 912. However, the coolers 906, 912 are not absolutely necessary in any of the solutions.

[0034] The conductor structure 100 may be delivered to the vicinity of the object 104 supported by a carrier band serving as the auxiliary substrate 102, thus allowing the conductor structure 100 supported by the carrier band to be pressed to the object 104. The carrier band may comprise one or more layers. If the carrier band comprises a plural number of layers, some or all of the layers may remain attached to the conductor structure after the pressing.

[0035] Instead of a press made of a solid material, the conductor structure and the object may be pressed against each other by means of a magnetic field, for example. The magnetic field, whose strength may rapidly or abruptly rise surprisingly high, throws the conductor structure to the object, for example. Alternatively, the conductor structure and the object may be brought into contact with each other by means of compressed gas or pressure fluid. In this solution, a rapid or an abrupt discharge of gas or fluid underneath the conductor structure may throw the conductor structure to the object. A sudden pressure increase may be created by means of a pump and a pressure tank, or using an explosive charge.

[0036] Figure 10 shows a solution in which the carrier band 1000 operates according to a "from a roll - to a roll" principle. This means that the carrier band 1000 supporting separate conductor structures 100 is fed from a roll 1002 to the vicinity of separate objects 103 to 105. Since the conductor structures 100 are pressed to the objects 103 to 105, the empty carrier band 1000 is rolled into a roll 1004. The objects 103 to 105 may be carried to the support substrate 910 and from the support substrate 910 by means of a conveyor belt 1006, for example. Each conductor structure 100 is placed to one object 103 to 105 and the press 900 is used to press each conductor structure 100 supported by a carrier band 1000 to the object 103 to 105.

[0037] Figure 11 shows a solution in which the conductor structure is pressed to the object between rolls. In this solution the objects 104 are delivered from a roll 1102 to a roll 1104 by means of a carrier band 1100 on the basis of the "from a roil - to a roil" principle. Similarly, the conductor structures 100 are delivered from a roll 1002 to a roll 1004 by means of the carrier band 1000 on the basis of the "from a roll - to a roll" principle. The conductor structures 100 and the objects 104 are aligned to come into contact with each other during the pressing. In this solution the press 900 of Figure 9 is a roll 1106 and the support substrate 910 is a roll 1108. The pressing is carried out using the rolls 1106 and 1108, which press each conductor structure 100 and object 104 against each other. The rolls 1106, 1108 may comprise a heater and/or a cooler, similarly as the press 900 and the support substrate 910 of Figure 9. Unlike in Figure 11 , both the objects and the conductor structures may be continuous structures partly or entirely equal in length with the carrier band.

[0038] Figures 12A to 12C illustrate a solution in which the object 104 may be an IML (In Mould Labeling) blank, for example, made of a thermoplastic material. The production of a desired component or part may be started by pressing the conductor structure 100 to the primary structure 104, which may be an IML blank or the like. The conductor structure may be pressed to the upper and/or lower surface of the object. Next, the primary object 104 is placed into a mould 1200. The mould 1200 may have a shape that at least preliminarily forms the shape of the primary object 104, or a shape that does not force the primary object to conform to the mould; instead, the pressure of air (or some other gas or a fluid), for example, is used to provide the primary object 104 with a form conforming to the mould. In the mould 1200 the primary object 104 is heated and forced into the shape of the mould 1200. The conductor structure 100 may be between the mould 1200 and the primary object 104, or on a surface of the object that is not in contact with the mould 1200. Finally, the formed primary object 104 together with the conductor structure 100 may be attached to a secondary object 1202, such as a housing of an electrical device, or the like. The attachment may be carried out for example by placing the primary object 104 and the conductor structure associated therewith into an injection mould, the material to be moulded into the shape of the mould being injected therein. The material to be moulded thus forms the secondary object to which the primary object 104 and its conductor structure 104 attach during the moulding. There are also other alternatives for carrying out the attaching. The primary object 104 together with the conductor structure 100 may be cut into a desired shape before attachment to the secondary object 1202.

[0039] The primary object can also be formed at the same time with the attachment of the primary object to the secondary object. In this case an unformed primary object is placed into an injection mould, and during the injection moulding, hot pressurized injection mould mass forms the primary object provided with the conductor structure into the shape of the injection mould.

[0040] Generally, the conductors in the conductor structure 100 do not need to be deposited of a single material, but they may consist of a plural number of different metal layers (or other material layers). For example, gold may be deposited as the bottom layer, on top of which nickel and copper layers are then deposited. In this kind of layered structure the conductor structure components attached to the object may be contacted to the gold layer, which is often necessary for providing the contact. The conductor structure attached to the object may function not only as a circuit meant of connecting components or as a fully completed circuit, but also as an antenna, for example.

[0041] In addition to conductors, the conductor structure 100 may also comprise components. The components in the conductor structure 100 are deposited, pressed, glued or soldered, for example, to the conductors of the conductor structure.

[0042] Figure 13 is a flow diagram of a method for producing a conductor pattern. In step 1300, a pre-patterned conductor structure 100 is heated to a temperature higher than the thermoplastic softening temperature of the object 104. In step 1302 the conductor structure 100 is pressed to bring it into a mechanical contact with the object 104, which is in its completed form. In step 1304 the heated conductor structure 100 is used for producing in the object 104 a temperature change that attaches the conductor structure 100 to the object 104 so that the shape of the object 104 remains unchanged at least outside the point of attachment of the conductor structure 100. Steps 1300 and 1302 may be carried out in an order in which step 1300 comes first and then step 1302, but it is also possible to carry out first step 1302 and then step 1300. In any case, these two steps are followed by step 1304.

[0043] Although the invention is disclosed above with reference to an example according to the accompanying drawings, it is obvious that the invention is not limited thereto but may be varied in many ways within the scope of the accompanying claims.

Claims

1. A method of forming an electrically conductive conductor structure to a thermoplastic object, characterized by heating (1300) a pre-patterned conductor structure (100, 400) to a temperature higher than the thermoplastic softening temperature of the object (104); pressing (1302) the conductor structure (100, 400) to bring it into a mechanical contact with the object (104), the shape of which remains unchanged during the pressing; and producing (1304) in the object (104) a reversible temperature change with the heated conductor structure (100, 400) to attach the conductor structure (100) to the object (104).

2. A method according to claim ^characterized in that the object (104) is a component in its completed form.

3. A method according to claim 1 , characterized by subjecting the conductor structure (100) to an adhesion treatment.

4. A method according to claim 1, characterized by providing the conductor structure with a three-dimensional shape.

5. A method according to claim 1, characterized by delivering the conductor structure (100) on a carried band (1000) for pressing.

6. A method according to claim 5, characterized by roughening the conductor structure (100) to make it rougher than the carrier band (1000).

7. A method according to claim 1 , characterized by attaching the conductor structure (100) to the object (104) in such a way that the shape of the object (104) remains unchanged at least outside the point of attachment of the conductor structure (100, 400).

8. A method according to claim 1, characterized by producing in the object (104) a pulsed temperature change by means of the heated conductor structure (100, 400); when the change increases the temperature of the object (104), it softens at least the surface of the object (104), and when it decreases the temperature of the object (104), it hardens the object (104) and attaches the conductor structure (100, 400) to the object (104).

9. A method according to claim ^characterized by heating the conductor structure (100, 400) by subjecting the conductor structure (100, 400) to a thermal pulse during which the conductor structure (100, 400) is pressed to bring it into a mechanical contact with the object (104) and a temperature change is produced in the object (104), a rise in the temperature of the object softening at least the surface of the object (104) and a drop in the temperature of the object (104) hardening the object (104) and attaching the conductor structure (100, 400) to the object (104).

10. A method according to claim 1, characterized by heating the conductor structure (100, 400) and by pressing the conductor structure (100, 400) to bring it into contact with the object (104), the conductor structure (100, 400) being first heated and the heated conductor structure (100, 400) being then pressed to bring it into contact with the object (104).

11. A method according to claim 1, characterized by heating the conductor structure (100, 400) and by pressing the conductor structure (100, 400) to bring it into contact with the object (104), the conductor structure (100, 400) being first pressed into contact with the object (104) and the conductor structure (100, 400) being then heated.

12. A method according to claim 1, characterized by delivering the conductor structure (100, 400) supported by a carrier band (1000) to the vicinity of the object (104) and by pressing the conductor structure (100, 400) supported by the carried band (1000) to the object (104).

13. A method according to claim 1, characterized by delivering a carrier band (1000) supporting the conductor structure (100, 400) to the vicinity of the object (104) by means of a "from a roll - to a roll" method and by pressing the conductor structure (100, 400) supported by the carrier band (1000) to the object (104) by means of a press (900).

14. A method according to claim 1, characterized by heating a pre-patterned conductor structure (100, 400) to a temperature higher than the thermoplastic softening temperature by storing in the conductor structure (100, 400) less thermal energy than what would be needed for softening the entire object (104) meant for the conductor structure (100, 400).

15. A method according to claim 1, characterized by producing in the object (104) a temperature change by means of the heated conductor structure (100, 400) to soften the surface of the object (104), and by attaching the conductor structure (100, 400) by embedding the conductor structure (100, 400) into the object (104).

16. A method according to claim 1, characterized by cooling the object (104) after the heating to accelerate the hardening of the object (104) and its attachment to the conductor structure (100).

17. A method according to claim 1, characterized by using an IML blank, or the like, as a primary object (104) and by attaching the conductor structure (100) together with the primary object (104) to a secondary object (1202).

18. A method according to claim 17, characterized by forming the primary object (104) together with the conductor structure (100) prior to attaching it to the secondary object.

19. A method according to claim 17, characterized by cutting the primary object (104) together with the conductor structure (100) to a desired shape before attaching it to the secondary object (1202).

20. A method according to claim 17, characterized by forming the primary object (104) together with the conductor structure (100) into a desired shape at the same time as it is being attached to the secondary object (1202).

21. A method according to claim 17, characterized by forming the primary object (104) together with the conductor structure (100) and by attaching it to a secondary, injection-moulded object (1202) in connection with the injection moulding.

22. A method according to claim 18, characterized by placing the primary object (104) together with the conductor structure (100) into an injection mould and attaching the primary object (104) together with the conductor structure (100) to the secondary object by moulding.

23. A method according to claim ^ characterized in that the material used for the conductor structure is copper.

24. A production apparatus for producing an object provided with an electrically conductive conductor structure, characterized in that the production apparatus comprises a press (900, 1106) and a support substrate (910, 1108) for pressing a pre-patterned conductor structure (100, 400) and an object (104) made of a thermoplastic material and meant to have an unchanging shape together to bring them into a mechanical contact with each other; the press (900, 1106) being configured to heat the conductor structure (100, 400) to a temperature higher than the thermoplastic softening temperature, the heated conductor structure (100, 400) producing in the object (104) a reversible temperature change that attaches the conductor structure (100, 400) to the object (104).

25. A production apparatus according to claim 24, characterized in that the production apparatus is configured to press the conductor structure to a three-dimensional object (104).

26. A production apparatus according to claim 24, characterized in that the production apparatus is configured to deliver the conductor structure (100) on a carried band (1000) for pressing.

27. A production apparatus according to claim 26, characterized in that the carrier band (1000) comprises layers some of which remain attached to the conductor structure (100) after the pressing.

28. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to heat the conductor structure (100, 400) in such a way that a temperature change caused by the conductor structure (100, 400) attaches the conductor structure (100, 400) to the object (104) in such a way that the shape of the object (104) remains unchanged at least outside the point of attachment.

29. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to produce in the conductor structure (100, 400) a pulsed temperature change; when the change increases the temperature of the object (104), it softens at least the surface of the object (104), and when it decreases the temperature of the object (104), it hardens the object (104) and attaches the conductor structure (100, 400) to the object (104).

30. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to heat the conductor structure (100, 400) by feeding to the conductor structure (100, 400) a thermal pulse during which the press (900, 1106) is configured to press the conductor structure (100, 400) to bring it into a mechanical contact with the object (104) to produce a temperature change in the object (104), a rise in the temperature of the object softening at least the surface of the object (104) and a drop in the temperature of the object (104) hardening the object (104) and attaching the conductor structure (100, 400) to the object (104).

31. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to heat the conductor structure (100, 400) first and then press the heated conductor structure (100, 400) to bring it into contact with the object (104).

32. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to press the conductor structure (100, 400) first to bring it into contact with the object (104) and then heat the conductor structure (100, 400).

33. A production apparatus according to claim 24, characterized in that the production apparatus is configured to deliver the conductor structure (100, 400) supported by a carried band (1000) to the vicinity of the object (104) and the press is configured to press the conductor structure (100, 400) supported by the carried band (1000) to the object (104).

34. A production apparatus according to claim 24, characterized in that the production apparatus is configured to deliver a carrier band (1000) supporting the conductor structure (100, 400) by means of a "from a roll - to a roll" principle to the vicinity of the object (104) and to press the conductor structure (100, 400) supported by the carried band (1000) to the object (104) by means of the press (900, 1106).

35. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to heat a pre- patterned conductor structure (100, 400) to a temperature higher than the thermoplastic softening temperature by storing in the conductor structure (100, 400) less thermal energy than what would be needed for softening the entire object (104) meant for the conductor structure (100, 400).

36. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to produce in the object (104) a temperature change by means of the heated conductor structure (100, 400) to soften the surface of the object (104), and to attach the conductor structure (100, 400) by embedding the conductor structure (100, 400) into the object (104).

37. A production apparatus according to claim 24, characterized in that the press (900, 1106) is configured to cool the object (104) after the heating to accelerate the hardening of the object (104) and the attachment of the conductor structure (100).

38. A production apparatus according to claim 24, characterized in that the support substrate (910, 1108) is configured to cool the object (104) after the heating to accelerate the hardening of the object (104) and the attachment of the conductor structure (100).

39. A production apparatus according to claim 24, characterized in that the production apparatus comprises means (900, 910) for pressing the conductor structure (100) to an IML blank, or the like, serving as the primary object (104), a mould (1200) configured to shape the primary object (1200) and the conductor structure (100), and means for attaching the primary object (104) and the conductor structure (100) to a secondary object (1202).

40. A production apparatus according to claim 39, characterized in that the production apparatus is configured to shape the primary object (104) and the conductor structure (100) prior to the attachment to the secondary object.

41. A production apparatus according to claim 39, characterized in that the production apparatus is configured to shape the primary object (104) and the conductor structure (100) at the same time with the attachment to the secondary object (1202).

42. A production series for producing an object provided with a conductive conductor structure, characterized in that the production series comprises an object (104) made of a thermoplastic material and meant to have an unchanging shape; a pre-patterned conductor structure (100, 400) configured to be heated to a temperature higher than the thermoplastic softening temperature of the object (104); the conductor structure (100, 400) and the object (104) being configured to be pressed to bring them into a mechanical contact with each other, the heated conductor structure (100, 400) being arranged to produce in the object (104) a reversible temperature change that attaches the conductor structure (100) to the object (104).

43. A production series according to claim 42, characterized in that the object (104) is a component in its completed form.

44. A production series according to claim 42, characterized in that the object is three-dimensional.

45. A production series according to claim 42, characterized in that the conductor structure (100) is on a carrier band (1000).

46. A production series according to claim 45, characterized in that the conductor structure (100) is roughened to be rougher than the carrier band (1000).

47. A production series according to claim 46, characterized in that the carrier band (1000) comprises layers some of which remain attached to the conductor structure (100) after the pressing.

48. A production series according to claim 42, characterized in that the conductor structure (100, 400) is configured to produce in the object (104) a temperature change in such a way that the shape of the object (104) remains unchanged at least outside the point of attachment of the conductor structure (100, 400).

49. A production series according to claim 42, characterized in that the production series comprises a carrier band (1000) supporting the conductor structure (100, 400), the conductor structure (100, 400) being configured to be delivered to the vicinity of the object (104) supported by the carrier band (1000) and to be pressed to the object (104).

50. A production series according to claim 42, characterized in that the production series comprises a carrier band (1000) operated on the basis of a "from a roll - to a roll" method and configured to support the conductor structure (100, 400) when the conductor structure (100, 400) is being delivered to the vicinity of the object (104) and when the conductor structure (100, 400) is being pressed to the object (104) with a press (900).

51. A production series according to claim 42, characterized in that the pre-patterned conductor structure (100, 400) is arranged to store less energy than what would be needed for softening the entire object (104) meant for the conductor structure (100, 400) when the conductor structure (100, 400) is heated to a temperature higher than the thermoplastic softening temperature.

52. A production series according to claim 42, characterized in that the conductor structure (100, 400) is arranged to produce in the object (104) a temperature change that softens the surface of the object (104) to allow the conductor structure (100, 400) to be attached to the object (104) by embedding.

53. A production series according to claim 42, characterized in that the primary object (104) is an IML blank, or the like, to which the conductor structure (100) is configured to be pressed, and the secondary object (1202) is a component to which the primary object (104) together with the conductor pattern (100) is arranged to be attached.

54. A production series according to claim 42, characterized in that the conductor structure is made of copper.