WO2007050114A3 - A substantially continuous layer of embedded transient protection for printed circuit boards - Google Patents

A substantially continuous layer of embedded transient protection for printed circuit boards Download PDF

Info

Publication number
WO2007050114A3
WO2007050114A3 PCT/US2006/005639 US2006005639W WO2007050114A3 WO 2007050114 A3 WO2007050114 A3 WO 2007050114A3 US 2006005639 W US2006005639 W US 2006005639W WO 2007050114 A3 WO2007050114 A3 WO 2007050114A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit boards
substantially continuous
continuous layer
transient protection
Prior art date
Application number
PCT/US2006/005639
Other languages
French (fr)
Other versions
WO2007050114A2 (en
Inventor
George Dudnikov
Gregory Schroeder
Franz Gisin
Original Assignee
Sanmina Sci Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanmina Sci Corp filed Critical Sanmina Sci Corp
Priority to JP2007553396A priority Critical patent/JP5241238B2/en
Priority to CN200680004950.5A priority patent/CN101189365B/en
Publication of WO2007050114A2 publication Critical patent/WO2007050114A2/en
Publication of WO2007050114A3 publication Critical patent/WO2007050114A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Abstract

The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.
PCT/US2006/005639 2005-02-16 2006-02-16 A substantially continuous layer of embedded transient protection for printed circuit boards WO2007050114A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007553396A JP5241238B2 (en) 2005-02-16 2006-02-16 Substantially continuous layers of embedded transient protection for printed circuit boards
CN200680004950.5A CN101189365B (en) 2005-02-16 2006-02-16 The embedding instantaneous protection layer of the basic continous of printed circuit board (PCB)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65372305P 2005-02-16 2005-02-16
US60/653,723 2005-02-16

Publications (2)

Publication Number Publication Date
WO2007050114A2 WO2007050114A2 (en) 2007-05-03
WO2007050114A3 true WO2007050114A3 (en) 2007-12-21

Family

ID=36917156

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2006/005984 WO2006089272A2 (en) 2005-02-16 2006-02-16 Selective deposition of embedded transient protection for printed circuit boards
PCT/US2006/005639 WO2007050114A2 (en) 2005-02-16 2006-02-16 A substantially continuous layer of embedded transient protection for printed circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2006/005984 WO2006089272A2 (en) 2005-02-16 2006-02-16 Selective deposition of embedded transient protection for printed circuit boards

Country Status (5)

Country Link
US (2) US7593203B2 (en)
JP (3) JP5241238B2 (en)
CN (2) CN101189365B (en)
TW (2) TWI375494B (en)
WO (2) WO2006089272A2 (en)

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US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
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US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
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Also Published As

Publication number Publication date
JP5588362B2 (en) 2014-09-10
JP5241238B2 (en) 2013-07-17
CN101595769B (en) 2011-09-14
US20060181827A1 (en) 2006-08-17
JP2008529309A (en) 2008-07-31
US7688598B2 (en) 2010-03-30
TW200642547A (en) 2006-12-01
CN101189365A (en) 2008-05-28
TWI397356B (en) 2013-05-21
TW200642548A (en) 2006-12-01
WO2006089272A2 (en) 2006-08-24
US7593203B2 (en) 2009-09-22
CN101595769A (en) 2009-12-02
US20060181826A1 (en) 2006-08-17
TWI375494B (en) 2012-10-21
CN101189365B (en) 2015-09-16
WO2007050114A2 (en) 2007-05-03
WO2006089272A3 (en) 2009-04-16
JP2008533699A (en) 2008-08-21
JP2011109121A (en) 2011-06-02

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