WO2007062122A3 - Semiconductor devices including voltage switchable materials for over-voltage protection - Google Patents

Semiconductor devices including voltage switchable materials for over-voltage protection Download PDF

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Publication number
WO2007062122A3
WO2007062122A3 PCT/US2006/045206 US2006045206W WO2007062122A3 WO 2007062122 A3 WO2007062122 A3 WO 2007062122A3 US 2006045206 W US2006045206 W US 2006045206W WO 2007062122 A3 WO2007062122 A3 WO 2007062122A3
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WO
WIPO (PCT)
Prior art keywords
voltage
over
voltage switchable
semiconductor devices
devices including
Prior art date
Application number
PCT/US2006/045206
Other languages
French (fr)
Other versions
WO2007062122A2 (en
Inventor
Lex Kosowsky
Original Assignee
Shocking Technologies Inc
Lex Kosowsky
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shocking Technologies Inc, Lex Kosowsky filed Critical Shocking Technologies Inc
Priority to EP06838276A priority Critical patent/EP1969627A4/en
Publication of WO2007062122A2 publication Critical patent/WO2007062122A2/en
Publication of WO2007062122A3 publication Critical patent/WO2007062122A3/en

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    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.
PCT/US2006/045206 2005-11-22 2006-11-21 Semiconductor devices including voltage switchable materials for over-voltage protection WO2007062122A2 (en)

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US7923844B2 (en) 2011-04-12
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US20110140273A1 (en) 2011-06-16

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