WO2007065012A3 - Apparatus and method for adjusting an orientation of probes - Google Patents

Apparatus and method for adjusting an orientation of probes Download PDF

Info

Publication number
WO2007065012A3
WO2007065012A3 PCT/US2006/046277 US2006046277W WO2007065012A3 WO 2007065012 A3 WO2007065012 A3 WO 2007065012A3 US 2006046277 W US2006046277 W US 2006046277W WO 2007065012 A3 WO2007065012 A3 WO 2007065012A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
card assembly
test apparatus
probes
orientation
Prior art date
Application number
PCT/US2006/046277
Other languages
French (fr)
Other versions
WO2007065012A2 (en
Inventor
Benjamin N Eldridge
Eric D Hobbs
Gaetan L Mathieu
Makarand S Shinde
Alexander H Slocum
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Eric D Hobbs
Gaetan L Mathieu
Makarand S Shinde
Alexander H Slocum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Benjamin N Eldridge, Eric D Hobbs, Gaetan L Mathieu, Makarand S Shinde, Alexander H Slocum filed Critical Formfactor Inc
Priority to EP06838946A priority Critical patent/EP1960798A4/en
Priority to JP2008543540A priority patent/JP5322654B2/en
Publication of WO2007065012A2 publication Critical patent/WO2007065012A2/en
Publication of WO2007065012A3 publication Critical patent/WO2007065012A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.
PCT/US2006/046277 2005-12-02 2006-12-04 Apparatus and method for adjusting an orientation of probes WO2007065012A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP06838946A EP1960798A4 (en) 2005-12-02 2006-12-04 Apparatus and method for adjusting an orientation of probes
JP2008543540A JP5322654B2 (en) 2005-12-02 2006-12-04 Apparatus and method for adjusting probe orientation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/164,737 2005-12-02
US11/164,737 US7671614B2 (en) 2005-12-02 2005-12-02 Apparatus and method for adjusting an orientation of probes

Publications (2)

Publication Number Publication Date
WO2007065012A2 WO2007065012A2 (en) 2007-06-07
WO2007065012A3 true WO2007065012A3 (en) 2009-02-12

Family

ID=38092895

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/046277 WO2007065012A2 (en) 2005-12-02 2006-12-04 Apparatus and method for adjusting an orientation of probes

Country Status (7)

Country Link
US (1) US7671614B2 (en)
EP (1) EP1960798A4 (en)
JP (1) JP5322654B2 (en)
KR (1) KR20080076992A (en)
CN (1) CN101506671A (en)
TW (1) TWI410645B (en)
WO (1) WO2007065012A2 (en)

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US20070176615A1 (en) * 2006-01-27 2007-08-02 Xandex, Inc. Active probe contact array management
US20070229105A1 (en) * 2006-03-28 2007-10-04 Octavian Scientific, Inc. Desktop wafer analysis station
US7825675B2 (en) * 2006-11-01 2010-11-02 Formfactor, Inc. Method and apparatus for providing active compliance in a probe card assembly
US7808259B2 (en) * 2007-09-26 2010-10-05 Formfactor, Inc. Component assembly and alignment
WO2009072341A1 (en) * 2007-12-04 2009-06-11 Tokyo Electron Limited Probe apparatus
KR20100030867A (en) * 2008-09-11 2010-03-19 삼성전자주식회사 Inspecting apparatus for solar cell and inspecting method using the same
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
TWI402509B (en) * 2009-05-21 2013-07-21 Roger Chen Flat head probe test socket
TWI384227B (en) * 2009-09-01 2013-02-01 Advanced Semiconductor Eng Active non-contact probe card
US9494642B2 (en) * 2009-11-30 2016-11-15 Essai, Inc. Systems and methods for conforming test tooling to integrated circuit device profiles with ejection mechanisms
US8896336B2 (en) * 2010-07-06 2014-11-25 Formfactor, Inc. Testing techniques for through-device vias
KR101185860B1 (en) * 2010-12-17 2012-09-25 에스케이하이닉스 주식회사 Semiconductor chip and semiconductor package having the same
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
US9364925B2 (en) * 2012-04-30 2016-06-14 Globalfoundries Inc. Assembly of electronic and optical devices
CN105453244B (en) * 2013-05-14 2018-04-06 佛姆法克特股份有限公司 The automatic attachment and dismounting of interchangeable probe head
KR101332588B1 (en) * 2013-06-25 2013-11-25 주식회사 프로이천 Film type probe card
JP6220596B2 (en) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 Prober
US20150070037A1 (en) * 2013-09-09 2015-03-12 Apple Inc. Test fixture for probe application
US9851569B2 (en) 2015-11-06 2017-12-26 Microsoft Technology Licensing, Llc Mounting apparatus for head-mounted display device
EP3258279A1 (en) * 2016-06-16 2017-12-20 Multitest elektronische Systeme GmbH Pressing device and method of pressing a carrier against an electrical contact unit
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
US10527649B2 (en) 2017-07-14 2020-01-07 International Business Machines Corporation Probe card alignment
US10345136B2 (en) 2017-07-14 2019-07-09 International Business Machines Corporation Adjustable load transmitter
US10775414B2 (en) * 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
JP6881354B2 (en) * 2018-03-07 2021-06-02 オムロン株式会社 Inspection unit and inspection equipment
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
WO2020191295A1 (en) * 2019-03-20 2020-09-24 Celadon Systems, Inc. Portable probe card assembly
CN114019334A (en) * 2020-07-16 2022-02-08 京元电子股份有限公司 Test equipment with horizontal adjustment module
CN114167094B (en) * 2021-11-29 2023-03-24 强一半导体（苏州）有限公司 Film probe card and probe head thereof
CN114200278B (en) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 Film probe card and probe head thereof

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4677474A (en) * 1984-07-02 1987-06-30 Canon Kabushiki Kaisha Wafer prober
US5798651A (en) * 1995-06-08 1998-08-25 Tokyo Electron Limited Probe system
US6246251B1 (en) * 1998-04-24 2001-06-12 International Rectifier Corp. Test process and apparatus for testing singulated semiconductor die
US6784678B2 (en) * 2000-08-04 2004-08-31 Infineon Technologies Ag Test apparatus for semiconductor circuit and method of testing semiconductor circuits

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US5399983A (en) * 1991-08-08 1995-03-21 Tokyo Electron Yamanashi Limited Probe apparatus
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
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US7498825B2 (en) * 2005-07-08 2009-03-03 Formfactor, Inc. Probe card assembly with an interchangeable probe insert
US7622935B2 (en) * 2005-12-02 2009-11-24 Formfactor, Inc. Probe card assembly with a mechanically decoupled wiring substrate
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7825675B2 (en) * 2006-11-01 2010-11-02 Formfactor, Inc. Method and apparatus for providing active compliance in a probe card assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677474A (en) * 1984-07-02 1987-06-30 Canon Kabushiki Kaisha Wafer prober
US5798651A (en) * 1995-06-08 1998-08-25 Tokyo Electron Limited Probe system
US6246251B1 (en) * 1998-04-24 2001-06-12 International Rectifier Corp. Test process and apparatus for testing singulated semiconductor die
US6784678B2 (en) * 2000-08-04 2004-08-31 Infineon Technologies Ag Test apparatus for semiconductor circuit and method of testing semiconductor circuits

Non-Patent Citations (1)

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Title
See also references of EP1960798A4 *

Also Published As

Publication number Publication date
TWI410645B (en) 2013-10-01
EP1960798A4 (en) 2012-05-16
JP2009527728A (en) 2009-07-30
TW200825426A (en) 2008-06-16
US20070126435A1 (en) 2007-06-07
JP5322654B2 (en) 2013-10-23
EP1960798A2 (en) 2008-08-27
US7671614B2 (en) 2010-03-02
WO2007065012A2 (en) 2007-06-07
KR20080076992A (en) 2008-08-20
CN101506671A (en) 2009-08-12

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