WO2007087047A2 - Interconnect structure for mems device - Google Patents
Interconnect structure for mems device Download PDFInfo
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- WO2007087047A2 WO2007087047A2 PCT/US2006/048318 US2006048318W WO2007087047A2 WO 2007087047 A2 WO2007087047 A2 WO 2007087047A2 US 2006048318 W US2006048318 W US 2006048318W WO 2007087047 A2 WO2007087047 A2 WO 2007087047A2
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
Definitions
- the field of the invention relates to microelectromechanical systems (MEMS). More specifically, the invention relates to a MEMS device having interconnect structure.
- MEMS microelectromechanical systems
- Microelectromechanical systems include micro mechanical elements, actuators, and electronics. Micromechanical elements may be created using deposition, etching, and or other micromachining processes that etch away parts of substrates and/or deposited material layers or that add layers to form electrical and electromechanical devices.
- One type of MEMS device is called an interferometric modulator.
- interferometric modulator or interferometric light modulator refers to a device that selectively absorbs and/or reflects light using the principles of optical interference.
- an interferometric modulator may have a pair of conductive plates, one or both of which may be transparent and/or reflective in whole or part and capable of relative motion upon application of an appropriate electrical signal.
- one plate may be a stationary layer deposited on a substrate and the other plate may be a metallic membrane separated from the stationary layer by an air gap.
- the position of one plate in relation to another can change the optical interference of light incident on the interferometric modulator.
- interferometric light modulator formed on the substrate, wherein the modulator includes an upper layer, a lower layer, and a connector formed adjacent to the upper layer.
- Another embodiment is an electronic device, including a substrate, and an interferometric modulator disposed on the substrate.
- the interferometric modulator includes a cavity defined by an upper layer and a lower layer, and an encapsulation layer formed adjacent to the interferometric modulator.
- the encapsulation layer has an electrical connection that connects the interferometric modulator to an electronic circuit, and the encapsulation layer hermetically seals the cavity from the ambient environment.
- Another embodiment is a method of manufacturing a light modulator device.
- This method includes forming an interferometric modulator having first and second layers defining a cavity and configured to interferometr ⁇ cally modulate light, forming an encapsulation layer adjacent to the cavity, the layer including one or more orifices, inducing a vacuum or inert atmosphere in the cavity, and sealing the one or more holes where the sealing maintains the vacuum or inert atmosphere in the cavity.
- Another embodiment is an electronic device, including means for transmitting light, means for interferometrically modulating the light transmitted by the transmitting means, and means for electrically connecting the light modulating means to a connector.
- Figure 1 is an isometric view depicting a portion of one embodiment of an interferometric modulator display in which a movable reflective layer of a first interferometric modulator is in a relaxed position and a movable reflective layer of a second interferometric modulator is in an actuated position.
- Figure 2 is a system block diagram illustrating one embodiment of an electronic device incorporating a 3x3 interferometric modulator display.
- Figure 3 is a diagram of movable mirror position versus applied voltage for one exemplary embodiment of an interferometric modulator of FIG. 1.
- Figure 4 is an illustration of a set of row and column voltages that may be used to drive an interferometric modulator display.
- Figures 5 A and 5B illustrate one exemplary timing diagram for row and column signals that may be used to write a frame of display data to the 3x3 interferometric modulator display of Figure 2.
- Figures 6A and 6B are system block diagrams illustrating an embodiment of a visual display device comprising a plurality of interferometric modulators.
- Figure 7B is a cross section of an alternative embodiment of an interferometric modulator.
- Figure 7C is a cross section of another alternative embodiment of an interferometric modulator.
- Figure 7D is a cross section of yet another alternative embodiment of an interferometric modulator.
- Figure 7E is a cross section of an additional alternative embodiment of an interferometric modulator.
- Figure 8 is a cross section of an embodiment of an interferometric modulator with additional features.
- Figure 9 is another cross section of an embodiment of an interferometric modulator with additional features.
- Figures 1 OA and 1OB are cross-sectional and top views, respectively, of another embodiment of an interferometric modulator with additional features.
- the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP3 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and/or displays, display of camera views (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry).
- PDAs personal data assistants
- GPS receivers/navigators cameras
- MP3 players camcorders
- game consoles e.g., wrist watches, clocks, calculators
- television monitors flat panel displays
- computer monitors e.g., auto displays (e.g., odometer display
- MEMS devices of similar structure to those described herein can also be used in non-display applications such as in electronic switching devices.
- additional features One additional feature is an encapsulation layer which hermetically seals the interferometric modulator, and which may have one or more electrical connections to the interferometric modulator.
- Another additional feature is a connection bump formed near the interferometric modulator and configured to make an electrical connection to an electronic circuit.
- electrical circuitry may be included between the interferometric modulators and the bumps, and the electrical circuitry may connect to either or both of the interferometric modulators and the bumps.
- interferometric modulator display embodiment comprising an interferometric MEMS display element is illustrated in Figure 1.
- the pixels are in either a bright or dark state.
- the display element In the bright ("on” or “open") state, the display element reflects a large portion of incident visible light to a user.
- the dark (“off or “closed”) state When in the dark (“off or “closed”) state, the display element reflects little incident visible light to the user.
- the light reflectance properties of the "on” and "off states may be reversed.
- MEMS pixels can be configured to reflect predominantly at selected colors, allowing for a color display in addition to black and white.
- Figure 1 is an isometric view depicting two adjacent pixels in a series of pixels of a visual display, wherein each pixel comprises a MEMS interferometric modulator.
- an interferometric modulator display comprises a row/column array of these interferometric modulators.
- Each interferometric modulator includes a pair of reflective layers positioned at a variable and controllable distance from each other to form a resonant optical cavity with at least one variable dimension.
- one of the reflective layers may be moved between two positions. In the first position, referred to herein as the relaxed position, the movable reflective layer is positioned at a relatively large distance from a fixed partially reflective layer.
- the movable reflective layer In the second position, referred to herein as the actuated position, the movable reflective layer is positioned more closely adjacent to the partially reflective layer. Incident light that reflects from the two layers interferes constructively or destructively depending on the position of the movable reflective layer, producing either an overall reflective or non-reflective state for each pixel.
- the depicted portion of the pixel array in Figure 1 includes two adjacent interferometric modulators 12a and 12b.
- a movable reflective layer 14a In the interferometric modulator 12a on the left, a movable reflective layer 14a is illustrated in a relaxed position at a predetermined distance from an optical stack 16a, which includes a partially reflective layer. In the interferometric position adjacent to the optical stack 16b.
- optical stack 16 typically comprise of several fused layers, which can include an electrode layer, such as indium tin oxide (ITO), a partially reflective layer, such as chromium, and a transparent dielectric.
- ITO indium tin oxide
- the optical stack 16 is thus electrically conductive, partially transparent and partially reflective, and may be fabricated, for example, by depositing one or more of the above layers onto a transparent substrate 20.
- the partially reflective layer can be formed from a variety of materials that are partially reflective such as various metals, semiconductors, and dielectrics. Some examples of suitable materials include oxides, nitrides, and fluorides.
- the partially reflective layer can be formed of one or more layers of materials, and each of the layers can be formed of a single material or a combination of materials.
- the layers of the optical stack are patterned into parallel strips, and may form row electrodes in a display device as described further below.
- the movable reflective layers 14a, 14b may be formed as a series of parallel strips of a deposited metal layer or layers (orthogonal to the row electrodes of 16a, 16b) deposited on top of posts 18 and an intervening sacrificial material deposited between the posts 18.
- the movable reflective layers 14a, 14b are separated from the optical stacks 16a, 16b by a defined gap 19.
- a highly conductive and reflective material such as aluminum may be used for the reflective layers 14, and these strips may form column electrodes in a display device.
- the cavity 19 remains between the movable reflective layer 14a and optical stack 16a, with the movable reflective layer 14a in a mechanically relaxed state, as illustrated by the pixel 12a in Figure 1.
- a potential difference is applied to a selected row and column
- the capacitor formed at the intersection of the row and column electrodes at the corresponding pixel becomes charged, and electrostatic forces pull the electrodes together.
- the movable reflective layer 14 is deformed and is forced against the optical stack 16.
- a dielectric layer (not illustrated in this Figure) within the optical stack 16 may prevent shorting and control the separation distance between layers 14 and 16, as illustrated by pixel 12b on the right in Figure 1. The behavior is the same regardless of the polarity of the applied potential difference. In this way, row/column actuation that can control the reflective vs. non- other display technologies.
- Figures 2 through 5 illustrate one exemplary process and system for using an array of interferometric modulators in a display application.
- Figure 2 is a system block diagram illustrating one embodiment of an electronic device that may incorporate aspects of the invention.
- the electronic device includes a processor 21 which may be any general purpose single- or multi-chip microprocessor such as an ARM 5 Pentium ® , Pentium II ® , Pentium III ® , Pentium IV ® , Pentium ® Pro, an 8051, a MIPS ® , a Power PC ® , an ALPHA ® , or any special purpose microprocessor such as a digital signal processor, microcontroller, or a programmable gate array.
- a processor 21 which may be any general purpose single- or multi-chip microprocessor such as an ARM 5 Pentium ® , Pentium II ® , Pentium III ® , Pentium IV ® , Pentium ® Pro, an 8051, a MIPS
- the processor 21 may be configured to execute one or more software modules. In addition to executing an operating system, the processor may be configured to execute one or more software applications, including a web browser, a telephone application, an email program, or any other software application. In one embodiment, the processor 21 is also configured to communicate with an array driver 22. In one embodiment, the array driver 22 includes a row driver circuit 24 and a column driver circuit 26 that provide signals to a display array or panel 30. The cross section of the array illustrated in Figure 1 is shown by the lines 1-1 in Figure 2. For MEMS interferometric modulators, the row/column actuation protocol may take advantage of a hysteresis property of these devices illustrated in Figure 3.
- the row/column actuation protocol can be designed such that during row strobing, pixels in the strobed row that are to be actuated are exposed to a voltage difference of about 10 volts, and pixels that are to be relaxed are exposed to a voltage difference of close to zero volts. After the strobe, the pixels are exposed to a steady state voltage difference of about 5 volts such that they remain in whatever state the row strobe put them in.
- each pixel sees a potential difference within illustrated in Figure 1 stable under the same applied voltage conditions in either an actuated or relaxed pre-existing state. Since each pixel of the interferometric modulator, whether in the actuated or relaxed state, is essentially a capacitor formed by the fixed and moving reflective layers, this stable state can be held at a voltage within the hysteresis window with almost no power dissipation. Essentially no current flows into the pixel if the applied potential is fixed.
- a display frame may be created by asserting the set of column electrodes in accordance with the desired set of actuated pixels in the first row.
- a row pulse is then applied to the row 1 electrode, actuating the pixels corresponding to the asserted column lines.
- the asserted set of column electrodes is then changed to correspond to the desired set of actuated pixels in the second row.
- a pulse is then applied to the row 2 electrode, actuating the appropriate pixels in row 2 in accordance with the asserted column electrodes.
- the row 1 pixels are unaffected by the row 2 pulse, and remain in the state they were set to during the row 1 pulse. This may be repeated for the entire series of rows in a sequential fashion to produce the frame.
- the frames are refreshed and/or updated with new display data by continually repeating this process at some desired number of frames per second.
- protocols for driving row and column electrodes of pixel arrays to produce display frames are also well known and may be used in conjunction with the present invention.
- Figures 4 and 5 illustrate one possible actuation protocol for creating a display frame on the 3x3 array of Figure 2.
- Figure 4 illustrates a possible set of column and row voltage levels that may be used for pixels exhibiting the hysteresis curves of Figure 3.
- actuating a pixel involves setting the appropriate column to — Vbias, and the appropriate row to + ⁇ V, which may correspond to -5 volts and +5 volts respectively Relaxing the pixel is accomplished by setting the appropriate column to +Vbias, and the appropriate row to the same + ⁇ V, producing a zero volt potential difference across the pixel.
- Figure 5B is a timing diagram showing a series of row and column signals applied to the 3x3 array of Figure 2 which will result in the display arrangement illustrated in Figure 5A, where actuated pixels are non-reflective.
- the pixels Prior to writing the frame illustrated in Figure 5A 5 the pixels can be in any state, and in this example, all the rows are at 0 volts, and all the columns are at +5 volts. With these applied voltages, all pixels are stable in their existing actuated or relaxed states.
- pixels (1,1), (1,2), (2,2), (3,2) and (3,3) are actuated.
- columns 1 and 2 are set to -5 volts, and column 3 is set to +5 volts. This does not change the state of any pixels, because all the pixels remain in the 3-7 volt stability window.
- Row 1 is then strobed with a pulse that goes from 0, up to 5 volts, and back to zero. This actuates the (1,1) and (1,2) pixels and relaxes the (1,3) pixel. No other pixels in the array are affected.
- column 2 is set to -5 volts, and columns 1 and 3 are set to +5 volts.
- Row 3 is similarly set by setting columns 2 and 3 to -5 volts, and column 1 to +5 volts.
- the row 3 strobe sets the row 3 pixels as shown in Figure 5A. After writing the frame, the row potentials are zero, and the column potentials can remain at either +5 or -5 volts, and the display is then stable in the arrangement of Figure 5 A. It will be appreciated that the same procedure can be employed for arrays of dozens or hundreds of rows and columns.
- FIGS 6A and 6B are system block diagrams illustrating an embodiment of a display device 40.
- the display device 40 can be, for example, a cellular or mobile telephone.
- the same components of display device 40 or slight variations thereof are also illustrative of various types of display devices such as televisions and portable media players.
- the display device 40 includes a housing 41, a display 30, an antenna 43, a speaker 44, an input device 48, and a microphone 46.
- the housing 41 is generally formed from any of a variety of manufacturing processes as are well known to those of skill in the art, including injection molding, and vacuum forming.
- the housing 41 may be rubber, and ceramic, or a combination thereof.
- the housing 41 includes removable portions (not shown) that may be interchanged with other removable portions of different color, or containing different logos, pictures, or symbols.
- the display 30 of exemplary display device 40 may be any of a variety of displays, including a bi-stable display, as described herein.
- the display 30 includes a flat-panel display, such as plasma, EL 5 OLED, STN LCD, or TFT LCD as described above, or a non-flat-panel display, such as a CRT or other tube device, as is well known to those of skill in the art.
- the display 30 includes an interferometric modulator display, as described herein.
- the components of one embodiment of exemplary display device 40 are schematically illustrated in Figure 6B.
- the illustrated exemplary display device 40 includes a housing 41 and can include additional components at least partially enclosed therein.
- the exemplary display device 40 includes a network interface 27 that includes an antenna 43 which is coupled to a transceiver 47.
- the transceiver 47 is connected to a processor 21, which is connected to conditioning hardware 52.
- the conditioning hardware 52 may be configured to condition a signal (e.g. filter a signal).
- the conditioning hardware 52 is connected to a speaker 45 and a microphone 46.
- the processor 21 is also connected to an input device 48 and a driver controller 29.
- the driver controller 29 is coupled to a frame buffer 28, and to an array driver 22, which in turn is coupled to a display array 30.
- a power supply 50 provides power to all components as required by the particular exemplary display device 40 design.
- the network interface 27 includes the antenna 43 and the transceiver 47 so that the exemplary display device 40 can communicate with one ore more devices over a network. In one embodiment the network interface 27 may also have some processing capabilities to relieve requirements of the processor 21.
- the antenna 43 is any antenna known to those of skill in the art for transmitting and receiving signals. In one embodiment, the antenna transmits and receives RF signals according to the IEEE 802.11 standard, including IEEE 802.11 (a), (b), or (g). In another embodiment, the antenna transmits and receives RF signals according to the BLUETOOTH standard. In the case of a cellular telephone, the antenna is designed to receive CDMA, GSM, AMPS or other known signals that are used to communicate within a wireless cell phone network.
- the transceiver 47 pre-processes the signals received from the antenna 43 so that they may be received by and further the processor 21 so that they may be transmitted from the exemplary display device 40 via the antenna 43.
- the transceiver 47 can be replaced by a receiver.
- network interface 27 can be replaced by an image source, which can store or generate image data to be sent to the processor 21.
- the image source can be a digital video disc (DVD) or a hard-disc drive that contains image data, or a software module that generates image data.
- Processor 21 generally controls the overall operation of the exemplary display device 40.
- the processor 21 receives data, such as compressed image data from the network interface 27 or an image source, and processes the data into raw image data or into a format that is readily processed into raw image data.
- the processor 21 then sends the processed data to the driver controller 29 or to frame buffer 28 for storage.
- Raw data typically refers to the information that identifies the image characteristics at each location within an image. For example, such image characteristics can include color, saturation, and gray-scale level.
- the processor 21 includes a microcontroller, CPU, or logic unit to control operation of the exemplary display device 40.
- Conditioning hardware 52 generally includes amplifiers and filters for transmitting signals to the speaker 45, and for receiving signals from the microphone 46. Conditioning hardware 52 may be discrete components within the exemplary display device 40, or may be incorporated within the processor 21 or other components.
- the driver controller 29 takes the raw image data generated by the processor 21 either directly from the processor 21 or from the frame buffer 28 and reformats the raw image data appropriately for high speed transmission to the array driver 22. Specifically, the driver controller 29 reformats the raw image data into a data flow having a raster-like format, such that it has a time order suitable for scanning across the display array 30. Then the driver controller 29 sends the formatted information to the array driver 22.
- a driver controller 29, such as a LCD controller is often associated with the system processor 21 as a stand-alone Integrated Circuit (IC), such controllers may be implemented in many ways. They may be embedded in the processor 21 as hardware, embedded in the processor 21 as software, or fully integrated in hardware with the array driver 22.
- IC Integrated Circuit
- the array driver 22 receives the formatted information from the driver controller 29 and reformats the video data into a parallel set of waveforms that are applied display's x-y matrix of pixels.
- driver controller 29 is a conventional display controller or a bi-stable display controller (e.g., an interferometric modulator controller).
- array driver 22 is a conventional driver or a bi-stable display driver (e.g., an interferometric modulator display).
- a driver controller 29 is integrated with the array driver 22.
- display array 30 is a typical display array or a bi-stable display array (e.g., a display including an array of interferometric modulators).
- the input device 48 allows a user to control the operation of the exemplary display device 40.
- input device 48 includes a keypad, such as a QWERTY keyboard or a telephone keypad, a button, a switch, a touch-sensitive screen, a pressure- or heat-sensitive membrane.
- the microphone 46 is an input device for the exemplary display device 40. When the microphone 46 is used to input data to the device, voice commands may be provided by a user for controlling operations of the exemplary display device 40.
- Power supply 50 can include a variety of energy storage devices as are well known in the art.
- power supply 50 is a rechargeable battery, such as a nickel-cadmium battery or a lithium ion battery.
- power supply 50 is a renewable energy source, a capacitor, or a solar cell, including a plastic solar cell, and solar-cell paint.
- power supply 50 is configured to receive power from a wall outlet.
- control programmability resides, as described above, in a driver controller which can be located in several places in the electronic display system. In some cases control programmability resides in the array driver 22. Those of skill in the art will recognize that the above-described optimization may be implemented in any number of hardware and/or software components and in various configurations.
- Figures 7A-7E illustrate five different embodiments of the movable reflective layer 14 and its supporting structures.
- Figure 7 A is a cross section of the embodiment of Figure 1, where a strip of metal material reflective layer 14 is attached to supports at the corners only, on tethers 32.
- the moveable reflective layer 14 is suspended from a deformable layer 34, which may comprise a flexible metal.
- the deformable layer 34 connects, directly or indirectly, to the substrate 20 around the perimeter of the deformable layer 34. These connections are herein referred to as support posts.
- the embodiment illustrated in Figure 7D has support post plugs 42 upon which the deformable layer 34 rests.
- the movable reflective layer 14 remains suspended over the cavity, as in Figures 7A-7C, but the deformable layer 34 does not form the support posts by filling holes between the deformable layer 34 and the optical stack 16. Rather, the support posts are formed of a planarization material, which is used to form support post plugs 42.
- the embodiment illustrated in Figure 7E is based on the embodiment shown in Figure 7D, but may also be adapted to work with any of the embodiments illustrated in Figures 7A-7C as well as additional embodiments not shown. In the embodiment shown in Figure 7E, an extra layer of metal or other conductive material has been used to form a bus structure 44. This allows signal routing along the back of the interferometric modulators, eliminating a number of electrodes that may otherwise have had to be formed on the substrate 20.
- the interferometric modulators function as direct-view devices, in which images are viewed from the front side of the transparent substrate 20, the side opposite to that upon which the modulator is arranged.
- the reflective layer 14 optically shields the portions of the interferometric modulator on the side of the reflective layer opposite the substrate 20, including the deformable layer 34. This allows the shielded areas to be configured and operated upon without negatively affecting the image quality.
- Such shielding allows the bus structure 44 in Figure 7E, which provides the ability to separate the optical properties of the modulator from the electromechanical properties of the modulator, such as addressing and the movements that result from that addressing.
- This separable modulator architecture allows the structural design and materials used for the electromechanical aspects and the optical aspects of the modulator to be selected and to function independently of each other. Moreover, the embodiments shown in Figures 7C-7E have additional benefits deriving from the decoupling of the optical properties of the reflective layer 14 from its mechanical properties, which are carried out by the deformable layer 34. This allows the structural design and materials used for the reflective layer 14 to be optimized with respect to the optical properties, and the structural design and materials properties.
- FIG 8 is an illustration of an exemplary embodiment of an interferometric modulator array 800 showing a cross-sectional view of interferometric modulators 801a, 801b, and 801c.
- interferometric modulators 801a, 801b, and 801c each have features similar to those previously discussed above. Also shown are additional features which have been formed above the structures previously discussed. In some embodiments the interferometric modulator array may be processed above these additional features.
- these features are combinable with interferometric modulators of any of the previously discussed embodiments, as well as other interferometric modulator embodiments not discussed.
- interferometric modulator structures are formed on a transparent substrate 820.
- an array may comprise various types of interferometric modulators, in this embodiment the interferometric modulators 801a, 801b, and 801c are identical, and the structure of these interferometric modulators will now be described with reference to interferometric modulator 801b only.
- Posts 18a are formed on the substrate 820, and define the boundaries for adjacent interferometric modulators.
- An optical stack 816b is formed on the substrate 820 between the posts 18a. The posts 18a support a deformable layer 34b from which a reflective layer 814b is suspended.
- the reflective layer 814b is suspended so as to be spaced apart from the optical stack 816b such that an interferometric cavity 806b is formed between the optical stack 816b and the reflective layer 814b.
- movement of the reflective layer 814b with respect to the optical stack 816b affects the dimensions, and therefore the interferometric properties, of the cavity 806b.
- Movement of the reflective layer 814b is controlled by a providing a voltage difference between the optical stack 816b and the deformable layer 34b.
- the additional features above the interferometric modulator provide an electrical connection to the deformable layer 34b.
- posts 18a are extended vertically by addition of supports 18b.
- An encapsulation layer 802 is supported by the supports 18b, and has a via 804 adjacent to one of the supports 18b.
- the via 804 electrically connects the deformable layer 34b to a first interconnect layer 810, which is connected to additional circuitry.
- the circuitry comprises an inverter with PMOS transistor 822 and NMOS transistor 824.
- the input to the inverter 822 is connected to a connection bump 840 which is part of a 3x3 800.
- connection bumps 840 are not used.
- each deformable layer in the modulator array 800 can be directly connected to an external connector.
- the deformable layer 34b directly connects through interconnect layer 810 to the connection bump 840.
- All other, or substantially all other, deformable layers within the modulator array can similarly connect to individual connectors to that each deformable layer is capable of being individually addressed and controlled by the driver circuitry.
- a separate electronic device 860 provides a 3x3 array of connection pads 862 that is configured to mate with the a 3x3 array of connection bumps 841 on the interferometric modulator array 800.
- a connection bump 840 on the interferometric modulator array 800 is configured to align with a connection pad 850 on the electronic device 860 in order to provide an electrical connection between the device 860 and the modulator 801b.
- the interferometric modulators 801a-c are enclosed by the encapsulation layer 802.
- the encapsulation layer 802 may provide a hermetic seal for the interferometric modulator in order to protect it from environmental agents such as moisture and oxygen.
- the seal also allows for pressure within the interferometric modulators 801 a-c to be maintained independent from external pressure of the ambient environment.
- the interferometric modulators 801 a-c may be fabricated to maintain environments that differ from the ambient environment.
- the encapsulation layer 802 can be manufactured with via 804 that provides a through hole from the ambient environment to the interferometric modulator 801b.
- the via 804 can then be filled by providing the first interconnect layer serves both to seal the encapsulation layer 802 and provides an electrical connection to the deformable layer 34b.
- the encapsulation layer seals all interferometric modulators in an array from the ambient environment, while in other embodiments only a portion of the interferometric modulators are sealed by the encapsulation layer.
- an array may comprise some interferometric modulators which are not addressed.
- Such interferometric modulators have a reflective layer manufactured at a known fixed position, and do not therefore need to have encapsulation layer comprising an electrical connection to them.
- interferometric modulator arrays are typically sealed from the ambient environment by sealing a backplate to protect the array from the outside environment. While this type of sealant may still be used, it may also be unnecessary because the encapsulation layer 802 can also serve to protect the interior cavities from being affected by the ambient environment.
- embodiments of the invention may also include the use of a desiccant to reduce the moisture levels within a cavity. However, the use of such desiccant may unnecessary in view of the fact that the cavities may be hermetically sealed by the encapsulation layer.
- the encapsulation layer 802 is spaced apart from the relaxed state position of the deformable layer 34b by the introduction of an intermediate layer.
- the introduction of such an intermediate layer may also improve reliability of the device.
- the deformable layer 34b may forcefully move from an actuated position close to the optical stack 816b to the relaxed position away from the optical stack 816b. Maintaining the cavity 808b above the deformable layer 34b allows for the deformable layer 34b to "overshoot" the final relaxed state because of the mechanical restorative force. Without the cavity, the deformable layer would collide with the encapsulating layer, potentially damaging the structure and shortening the life of the encapsulating layer and/or the mechanical interferometric modulator structure.
- the encapsulation layer 802 comprises the via 804 which makes an electrical connection between the deformable layer 34 and a first interconnect layer 810.
- the interconnect layer 810 can be routed to circuitry to be connected to the interferometric modulator.
- the circuitry may comprise passive and active elements, such as routing wires, resistors, capacitors, inductors, diodes, and transistors. These elements may also include variable elements, such as variable resistors and variable capacitors.
- the type of circuit elements is not limited and other types of circuit elements rows, columns, portions of rows and/or columns, and individual deformable layers.
- the circuitry may additionally or alternatively comprise sense circuitry, used to determine the state of individual deformable layers or groups (such as rows or columns) of deformable layers. ESD protection, EM shielding, and interconnect routing may also be included in the circuitry. In some embodiments the circuitry may also comprise digital signal processing (DSP) functions such as data filtering and control information decoding. In some embodiments the circuitry may comprise RF functions such as an antenna and a power amp, as well as data converters. The type and function of the circuitry is not limited and other types and functions may be implemented.
- DSP digital signal processing
- the interferometric modulators may also be connected to intermediate connectors configured to make connections to other circuits.
- Such connectors include bond-pads and bumps, such as those used in a ball grid array (BGA).
- BGA ball grid array
- the circuitry and/or connectors are outside the perimeter of the interferometric modulator array.
- the interferometric modulators may be connected to the connectors through the interconnect layers only, or through the circuitry, as in Figure 8, where the interferometric modulators are connected to the interconnect layer 810, which is connected to the inverter (the circuitry), which is connected to the connector 840.
- circuitry and/or connectors are within the perimeter of the interferometric modulator array.
- An advantageous aspect of this arrangement is that it allows for short routing connections.
- Such an embodiment is shown in Figure 9 as interferometric modulator 900. Similar to the embodiment described with reference to Figure 8, interferometric modulator 900 is formed on a substrate 20. Posts 18a are formed to define lateral boundaries, and an optical stack 16 is formed on the substrate 20 between the posts 18a. A movable reflective layer 34 is formed on the posts. This embodiment has circuitry between the deformable layer 34 and. a connection bump 940, wherein the circuitry consists only of interconnect 910, which comprises a via 912 sealing the encapsulation layer 902 from the ambient environment.
- the encapsulation layer is not present.
- the short interconnect 910 has lower parasitic parameters, such as resistance, capacitance, and inductance than it would if it were longer.
- a second connector such as a second bump, (not shown) can provide a short routing connection to an electrode in the optical stack 16.
- the second bump may connect to the electrode in the optical stack 16 through, for example, a embodiments other types of connectors may be used, such as a bond pad.
- Figures 1OA and 1OB are cross-sectional and top views, respectively, of another embodiment of an interferometric modulator 1000.
- One or more sacrificial layers are deposited during the fabrication of the interferometric modulator.
- the sacrificial layers at least provide a structural substrate for deposition of the layers which form the interferometric modulator.
- the sacrificial layers are removed, leaving only the interferometric modulator. In some cases the spaces previously occupied by the sacrificial layers then become cavities which allow for the mirror and the mechanical layer to move according to the operation of the interferometric modulator discussed above.
- the interferometric modulator 1000 may be formed according to the following process. Posts 18 are formed on the substrate 20, and optical stack 16 formed on the substrate 20 between the posts 18. A first sacrificial layer is deposited on the optical stack 16. A reflective layer 14 is then formed on the first sacrificial layer. Next, a second sacrificial layer is deposited on the reflective layer 14. The second sacrificial layer is etched so as to expose the reflective layer 14 in a region between the posts 18, and a mechanical layer 34 is then formed on the posts 18, the etched second sacrificial layer, and the portion of the reflective layer 14 exposed by etching the second sacrificial layer. In some embodiments, a third sacrificial layer is deposited above the mechanical layer.
- the third sacrificial layer may then be etched according to a desired contour for the encapsulation layer 1002, which is deposited on the third sacrificial layer. As seen from Figure 1OA, in this embodiment, the third sacrificial layer was etched so that the encapsulation layer contacts the mechanical layer in regions adjacent to the posts and is spaced apart from the mechanical layer in regions adjacent to the mirror.
- one or more orifices 1004 may be generated in the encapsulation layer by, for example, etching. After the orifices 1004 have been generated, the sacrificial layers may be removed. In some embodiments the orifices provide a path or the only path through which etching agents access the sacrificial layers and/or provide a path or the only path through which the etching agents and sacrificial layer materials are evacuated from the region between the encapsulation layer and the substrate.
- the orifices 1004 in the encapsulation layer 1002 may be closed to hermetically seal the interferometric cavity from the ambient within the interferometric cavity may be altered. For example, a vacuum may be induced, or an inert atmosphere may be generated between the encapsulation layer and the substrate. After the desired atmosphere is generated, the orifices may be closed while maintaining the desired atmosphere.
- the orifices may be closed with various materials including, but not limited to substantially non-conductive materials, and substantially conductive materials.
- At least some of the orifices may be closed using a conductive material.
- the conductive material may contact the mechanical layer and form a via 1006, as seen in Figure 1OA.
- the via 1006 provides an electrical connection to the mechanical layer 34 through the encapsulation layer 1002.
- the via 1006 may be used to electrically connect the mechanical layer 34 to other interconnect layers and to circuitry.
- the other interconnect layers and the circuitry may be fabricated adjacent to the interferometric modulator.
- passive circuitry including an inductor 1008, a capacitor 1010, and a resistor 1012 have been fabricated adjacent to the device, above the encapsulation layer 1002.
- an active circuit element, a diode 1014 has also been fabricated adjacent to the device.
- the active and passive circuit elements may be electrically connected either directly or indirectly to the interferometric device.
- connection bump 1040 is connected to some of the circuitry fabricated adjacent to the interferometric modulator.
- the connection bump 1040 is configured to electrically connect the interferometric modulator to another circuit.
- the connection bump 1040 may connect to the interferometric modulator indirectly, through other circuitry.
- the connection bump may directly connect to the device through the via 1006. Such an embodiment is shown in Figure 9.
- Figure 1 OB shows a top view of the structures of Figure 1 OA fabricated above the encapsulation layer 34, indicating their relative arrangement in the orientation depicted.
- the connection bump 1040, the diode 1014, the resistor 1012, the capacitor 1010, and the inductor 1008 are each shown as well as certain interconnect 1016 layers which electrically connect the structures.
Abstract
An iterferometric modulator array (800) is formed with connectors (840) and/or an encapsulation layer (802) with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.
Description
INTERCONNECT STRUCTURE FOR MEMS DEVICE Background
Field of the Invention
The field of the invention relates to microelectromechanical systems (MEMS). More specifically, the invention relates to a MEMS device having interconnect structure.
Description of the Related Technology Microelectromechanical systems (MEMS) include micro mechanical elements, actuators, and electronics. Micromechanical elements may be created using deposition, etching, and or other micromachining processes that etch away parts of substrates and/or deposited material layers or that add layers to form electrical and electromechanical devices. One type of MEMS device is called an interferometric modulator. As used herein, the term interferometric modulator or interferometric light modulator refers to a device that selectively absorbs and/or reflects light using the principles of optical interference. In certain embodiments, an interferometric modulator may have a pair of conductive plates, one or both of which may be transparent and/or reflective in whole or part and capable of relative motion upon application of an appropriate electrical signal. In this type of device, one plate may be a stationary layer deposited on a substrate and the other plate may be a metallic membrane separated from the stationary layer by an air gap. The position of one plate in relation to another can change the optical interference of light incident on the interferometric modulator. Such devices have a wide range of applications, and it would be beneficial in the art to utilize and/or modify the characteristics of these types of devices so that their features can be exploited in improving existing products and creating new products that have not yet been developed.
Summary of Certain Embodiments
The system, method, and devices of the invention each have several aspects, no single one of which is solely responsible for its desirable attributes. Without limiting the scope of this invention, its more prominent features will now be discussed briefly. After considering this discussion, and particularly after reading the section entitled "Detailed Description of Certain Embodiments" one will understand how the features of this invention provide advantages over other display devices.
interferometric light modulator formed on the substrate, wherein the modulator includes an upper layer, a lower layer, and a connector formed adjacent to the upper layer.
Another embodiment is an electronic device, including a substrate, and an interferometric modulator disposed on the substrate. The interferometric modulator includes a cavity defined by an upper layer and a lower layer, and an encapsulation layer formed adjacent to the interferometric modulator. The encapsulation layer has an electrical connection that connects the interferometric modulator to an electronic circuit, and the encapsulation layer hermetically seals the cavity from the ambient environment. Another embodiment is a method of manufacturing a light modulator device. This method includes forming an interferometric modulator having first and second layers defining a cavity and configured to interferometrϊcally modulate light, forming an encapsulation layer adjacent to the cavity, the layer including one or more orifices, inducing a vacuum or inert atmosphere in the cavity, and sealing the one or more holes where the sealing maintains the vacuum or inert atmosphere in the cavity.
Another embodiment is an electronic device, including means for transmitting light, means for interferometrically modulating the light transmitted by the transmitting means, and means for electrically connecting the light modulating means to a connector.
Brief Description of the Drawings Figure 1 is an isometric view depicting a portion of one embodiment of an interferometric modulator display in which a movable reflective layer of a first interferometric modulator is in a relaxed position and a movable reflective layer of a second interferometric modulator is in an actuated position.
Figure 2 is a system block diagram illustrating one embodiment of an electronic device incorporating a 3x3 interferometric modulator display.
Figure 3 is a diagram of movable mirror position versus applied voltage for one exemplary embodiment of an interferometric modulator of FIG. 1.
Figure 4 is an illustration of a set of row and column voltages that may be used to drive an interferometric modulator display. Figures 5 A and 5B illustrate one exemplary timing diagram for row and column signals that may be used to write a frame of display data to the 3x3 interferometric modulator display of Figure 2.
Figures 6A and 6B are system block diagrams illustrating an embodiment of a visual display device comprising a plurality of interferometric modulators.
Figure 7B is a cross section of an alternative embodiment of an interferometric modulator.
Figure 7C is a cross section of another alternative embodiment of an interferometric modulator.
Figure 7D is a cross section of yet another alternative embodiment of an interferometric modulator.
Figure 7E is a cross section of an additional alternative embodiment of an interferometric modulator. Figure 8 is a cross section of an embodiment of an interferometric modulator with additional features.
Figure 9 is another cross section of an embodiment of an interferometric modulator with additional features.
Figures 1 OA and 1OB are cross-sectional and top views, respectively, of another embodiment of an interferometric modulator with additional features.
Detailed Description of Certain Embodiments
The following detailed description is directed to certain specific embodiments of the invention. However, the invention can be embodied in a multitude of different ways. In this description, reference is made to the drawings wherein like parts are designated with like numerals throughout. As will be apparent from the following description, the embodiments may be implemented in any device that is configured to display an image, whether in motion (e.g., video) or stationary (e.g., still image), and whether textual or pictorial. More particularly, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP3 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and/or displays, display of camera views (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry). MEMS devices of similar structure to those described herein can also be used in non-display applications such as in electronic switching devices.
additional features. One additional feature is an encapsulation layer which hermetically seals the interferometric modulator, and which may have one or more electrical connections to the interferometric modulator. Another additional feature is a connection bump formed near the interferometric modulator and configured to make an electrical connection to an electronic circuit. In some embodiments electrical circuitry may be included between the interferometric modulators and the bumps, and the electrical circuitry may connect to either or both of the interferometric modulators and the bumps.
One interferometric modulator display embodiment comprising an interferometric MEMS display element is illustrated in Figure 1. In these devices, the pixels are in either a bright or dark state. In the bright ("on" or "open") state, the display element reflects a large portion of incident visible light to a user. When in the dark ("off or "closed") state, the display element reflects little incident visible light to the user. Depending on the embodiment, the light reflectance properties of the "on" and "off states may be reversed. MEMS pixels can be configured to reflect predominantly at selected colors, allowing for a color display in addition to black and white.
Figure 1 is an isometric view depicting two adjacent pixels in a series of pixels of a visual display, wherein each pixel comprises a MEMS interferometric modulator. In some embodiments, an interferometric modulator display comprises a row/column array of these interferometric modulators. Each interferometric modulator includes a pair of reflective layers positioned at a variable and controllable distance from each other to form a resonant optical cavity with at least one variable dimension. In one embodiment, one of the reflective layers may be moved between two positions. In the first position, referred to herein as the relaxed position, the movable reflective layer is positioned at a relatively large distance from a fixed partially reflective layer. In the second position, referred to herein as the actuated position, the movable reflective layer is positioned more closely adjacent to the partially reflective layer. Incident light that reflects from the two layers interferes constructively or destructively depending on the position of the movable reflective layer, producing either an overall reflective or non-reflective state for each pixel. The depicted portion of the pixel array in Figure 1 includes two adjacent interferometric modulators 12a and 12b. In the interferometric modulator 12a on the left, a movable reflective layer 14a is illustrated in a relaxed position at a predetermined distance from an optical stack 16a, which includes a partially reflective layer. In the interferometric
position adjacent to the optical stack 16b.
The optical stacks 16a and 16b (collectively referred to as optical stack 16), as referenced herein, typically comprise of several fused layers, which can include an electrode layer, such as indium tin oxide (ITO), a partially reflective layer, such as chromium, and a transparent dielectric. The optical stack 16 is thus electrically conductive, partially transparent and partially reflective, and may be fabricated, for example, by depositing one or more of the above layers onto a transparent substrate 20. The partially reflective layer can be formed from a variety of materials that are partially reflective such as various metals, semiconductors, and dielectrics. Some examples of suitable materials include oxides, nitrides, and fluorides. Other examples include germanium (Ge), nickel suicide (NiSi), molybdenum (Mo), titanium (Ti), tantalum (Ta), and platinum (Pt). The partially reflective layer can be formed of one or more layers of materials, and each of the layers can be formed of a single material or a combination of materials. In some embodiments, the layers of the optical stack are patterned into parallel strips, and may form row electrodes in a display device as described further below. The movable reflective layers 14a, 14b may be formed as a series of parallel strips of a deposited metal layer or layers (orthogonal to the row electrodes of 16a, 16b) deposited on top of posts 18 and an intervening sacrificial material deposited between the posts 18. When the sacrificial material is etched away, the movable reflective layers 14a, 14b are separated from the optical stacks 16a, 16b by a defined gap 19. A highly conductive and reflective material such as aluminum may be used for the reflective layers 14, and these strips may form column electrodes in a display device.
With no applied voltage, the cavity 19 remains between the movable reflective layer 14a and optical stack 16a, with the movable reflective layer 14a in a mechanically relaxed state, as illustrated by the pixel 12a in Figure 1. However, when a potential difference is applied to a selected row and column, the capacitor formed at the intersection of the row and column electrodes at the corresponding pixel becomes charged, and electrostatic forces pull the electrodes together. If the voltage is high enough, the movable reflective layer 14 is deformed and is forced against the optical stack 16. A dielectric layer (not illustrated in this Figure) within the optical stack 16 may prevent shorting and control the separation distance between layers 14 and 16, as illustrated by pixel 12b on the right in Figure 1. The behavior is the same regardless of the polarity of the applied potential difference. In this way, row/column actuation that can control the reflective vs. non-
other display technologies.
Figures 2 through 5 illustrate one exemplary process and system for using an array of interferometric modulators in a display application. Figure 2 is a system block diagram illustrating one embodiment of an electronic device that may incorporate aspects of the invention. In the exemplary embodiment, the electronic device includes a processor 21 which may be any general purpose single- or multi-chip microprocessor such as an ARM5 Pentium®, Pentium II®, Pentium III®, Pentium IV®, Pentium® Pro, an 8051, a MIPS®, a Power PC®, an ALPHA®, or any special purpose microprocessor such as a digital signal processor, microcontroller, or a programmable gate array. As is conventional in the art, the processor 21 may be configured to execute one or more software modules. In addition to executing an operating system, the processor may be configured to execute one or more software applications, including a web browser, a telephone application, an email program, or any other software application. In one embodiment, the processor 21 is also configured to communicate with an array driver 22. In one embodiment, the array driver 22 includes a row driver circuit 24 and a column driver circuit 26 that provide signals to a display array or panel 30. The cross section of the array illustrated in Figure 1 is shown by the lines 1-1 in Figure 2. For MEMS interferometric modulators, the row/column actuation protocol may take advantage of a hysteresis property of these devices illustrated in Figure 3. It may require, for example, a 10 volt potential difference to cause a movable layer to deform from the relaxed state to the actuated state. However, when the voltage is reduced from that value, the movable layer maintains its state as the voltage drops back below 10 volts. In the exemplary embodiment of Figure 3, the movable layer does not relax completely until the voltage drops below 2 volts. There is thus a range of voltage, about 3 to 7 V in the example illustrated in Figure 3, where .there exists a window of applied voltage within which the device is stable in either the relaxed or actuated state. This is referred to herein as the "hysteresis window" or "stability window." For a display array having the hysteresis characteristics of Figure 3, the row/column actuation protocol can be designed such that during row strobing, pixels in the strobed row that are to be actuated are exposed to a voltage difference of about 10 volts, and pixels that are to be relaxed are exposed to a voltage difference of close to zero volts. After the strobe, the pixels are exposed to a steady state voltage difference of about 5 volts such that they remain in whatever state the row strobe put them in. After being written, each pixel sees a potential difference within
illustrated in Figure 1 stable under the same applied voltage conditions in either an actuated or relaxed pre-existing state. Since each pixel of the interferometric modulator, whether in the actuated or relaxed state, is essentially a capacitor formed by the fixed and moving reflective layers, this stable state can be held at a voltage within the hysteresis window with almost no power dissipation. Essentially no current flows into the pixel if the applied potential is fixed.
In typical applications, a display frame may be created by asserting the set of column electrodes in accordance with the desired set of actuated pixels in the first row. A row pulse is then applied to the row 1 electrode, actuating the pixels corresponding to the asserted column lines. The asserted set of column electrodes is then changed to correspond to the desired set of actuated pixels in the second row. A pulse is then applied to the row 2 electrode, actuating the appropriate pixels in row 2 in accordance with the asserted column electrodes. The row 1 pixels are unaffected by the row 2 pulse, and remain in the state they were set to during the row 1 pulse. This may be repeated for the entire series of rows in a sequential fashion to produce the frame. Generally, the frames are refreshed and/or updated with new display data by continually repeating this process at some desired number of frames per second. A wide variety of protocols for driving row and column electrodes of pixel arrays to produce display frames are also well known and may be used in conjunction with the present invention.
Figures 4 and 5 illustrate one possible actuation protocol for creating a display frame on the 3x3 array of Figure 2. Figure 4 illustrates a possible set of column and row voltage levels that may be used for pixels exhibiting the hysteresis curves of Figure 3. In the Figure 4 embodiment, actuating a pixel involves setting the appropriate column to — Vbias, and the appropriate row to +ΔV, which may correspond to -5 volts and +5 volts respectively Relaxing the pixel is accomplished by setting the appropriate column to +Vbias, and the appropriate row to the same +ΔV, producing a zero volt potential difference across the pixel. In those rows where the row voltage is held at zero volts, the pixels are stable in whatever state they were originally in, regardless of whether the column is at +Vbias> or -Vbias- As is also illustrated in Figure 4, it will be appreciated that voltages of opposite polarity than those described above can be used, e.g., actuating a pixel can involve setting the appropriate column to +Vbias, and the appropriate row to -ΔV. In this embodiment, releasing the pixel is accomplished by setting the appropriate column to -
across the pixel.
Figure 5B is a timing diagram showing a series of row and column signals applied to the 3x3 array of Figure 2 which will result in the display arrangement illustrated in Figure 5A, where actuated pixels are non-reflective. Prior to writing the frame illustrated in Figure 5A5 the pixels can be in any state, and in this example, all the rows are at 0 volts, and all the columns are at +5 volts. With these applied voltages, all pixels are stable in their existing actuated or relaxed states.
In the Figure 5A frame, pixels (1,1), (1,2), (2,2), (3,2) and (3,3) are actuated. To accomplish this, during a "line time" for row 1, columns 1 and 2 are set to -5 volts, and column 3 is set to +5 volts. This does not change the state of any pixels, because all the pixels remain in the 3-7 volt stability window. Row 1 is then strobed with a pulse that goes from 0, up to 5 volts, and back to zero. This actuates the (1,1) and (1,2) pixels and relaxes the (1,3) pixel. No other pixels in the array are affected. To set row 2 as desired, column 2 is set to -5 volts, and columns 1 and 3 are set to +5 volts. The same strobe applied to row 2 will then actuate pixel (2,2) and relax pixels (2,1) and (2,3). Again, no other pixels of the array are affected. Row 3 is similarly set by setting columns 2 and 3 to -5 volts, and column 1 to +5 volts. The row 3 strobe sets the row 3 pixels as shown in Figure 5A. After writing the frame, the row potentials are zero, and the column potentials can remain at either +5 or -5 volts, and the display is then stable in the arrangement of Figure 5 A. It will be appreciated that the same procedure can be employed for arrays of dozens or hundreds of rows and columns. It will also be appreciated that the timing, sequence, and levels of voltages used to perform row and column actuation can be varied widely within the general principles outlined above, and the above example is exemplary only, and any actuation voltage method can be used with the systems and methods described herein.
Figures 6A and 6B are system block diagrams illustrating an embodiment of a display device 40. The display device 40 can be, for example, a cellular or mobile telephone. However, the same components of display device 40 or slight variations thereof are also illustrative of various types of display devices such as televisions and portable media players.
The display device 40 includes a housing 41, a display 30, an antenna 43, a speaker 44, an input device 48, and a microphone 46. The housing 41 is generally formed from any of a variety of manufacturing processes as are well known to those of skill in the art, including injection molding, and vacuum forming. In addition, the housing 41 may be
rubber, and ceramic, or a combination thereof. In one embodiment the housing 41 includes removable portions (not shown) that may be interchanged with other removable portions of different color, or containing different logos, pictures, or symbols. The display 30 of exemplary display device 40 may be any of a variety of displays, including a bi-stable display, as described herein. In other embodiments, the display 30 includes a flat-panel display, such as plasma, EL5 OLED, STN LCD, or TFT LCD as described above, or a non-flat-panel display, such as a CRT or other tube device, as is well known to those of skill in the art. However, for purposes of describing the present embodiment, the display 30 includes an interferometric modulator display, as described herein.
The components of one embodiment of exemplary display device 40 are schematically illustrated in Figure 6B. The illustrated exemplary display device 40 includes a housing 41 and can include additional components at least partially enclosed therein. For example, in one embodiment, the exemplary display device 40 includes a network interface 27 that includes an antenna 43 which is coupled to a transceiver 47. The transceiver 47 is connected to a processor 21, which is connected to conditioning hardware 52. The conditioning hardware 52 may be configured to condition a signal (e.g. filter a signal). The conditioning hardware 52 is connected to a speaker 45 and a microphone 46. The processor 21 is also connected to an input device 48 and a driver controller 29. The driver controller 29 is coupled to a frame buffer 28, and to an array driver 22, which in turn is coupled to a display array 30. A power supply 50 provides power to all components as required by the particular exemplary display device 40 design.
The network interface 27 includes the antenna 43 and the transceiver 47 so that the exemplary display device 40 can communicate with one ore more devices over a network. In one embodiment the network interface 27 may also have some processing capabilities to relieve requirements of the processor 21. The antenna 43 is any antenna known to those of skill in the art for transmitting and receiving signals. In one embodiment, the antenna transmits and receives RF signals according to the IEEE 802.11 standard, including IEEE 802.11 (a), (b), or (g). In another embodiment, the antenna transmits and receives RF signals according to the BLUETOOTH standard. In the case of a cellular telephone, the antenna is designed to receive CDMA, GSM, AMPS or other known signals that are used to communicate within a wireless cell phone network. The transceiver 47 pre-processes the signals received from the antenna 43 so that they may be received by and further
the processor 21 so that they may be transmitted from the exemplary display device 40 via the antenna 43.
In an alternative embodiment, the transceiver 47 can be replaced by a receiver. In yet another alternative embodiment, network interface 27 can be replaced by an image source, which can store or generate image data to be sent to the processor 21. For example, the image source can be a digital video disc (DVD) or a hard-disc drive that contains image data, or a software module that generates image data.
Processor 21 generally controls the overall operation of the exemplary display device 40. The processor 21 receives data, such as compressed image data from the network interface 27 or an image source, and processes the data into raw image data or into a format that is readily processed into raw image data. The processor 21 then sends the processed data to the driver controller 29 or to frame buffer 28 for storage. Raw data typically refers to the information that identifies the image characteristics at each location within an image. For example, such image characteristics can include color, saturation, and gray-scale level.
In one embodiment, the processor 21 includes a microcontroller, CPU, or logic unit to control operation of the exemplary display device 40. Conditioning hardware 52 generally includes amplifiers and filters for transmitting signals to the speaker 45, and for receiving signals from the microphone 46. Conditioning hardware 52 may be discrete components within the exemplary display device 40, or may be incorporated within the processor 21 or other components.
The driver controller 29 takes the raw image data generated by the processor 21 either directly from the processor 21 or from the frame buffer 28 and reformats the raw image data appropriately for high speed transmission to the array driver 22. Specifically, the driver controller 29 reformats the raw image data into a data flow having a raster-like format, such that it has a time order suitable for scanning across the display array 30. Then the driver controller 29 sends the formatted information to the array driver 22. Although a driver controller 29, such as a LCD controller, is often associated with the system processor 21 as a stand-alone Integrated Circuit (IC), such controllers may be implemented in many ways. They may be embedded in the processor 21 as hardware, embedded in the processor 21 as software, or fully integrated in hardware with the array driver 22.
Typically, the array driver 22 receives the formatted information from the driver controller 29 and reformats the video data into a parallel set of waveforms that are applied
display's x-y matrix of pixels.
In one embodiment, the driver controller 29, array driver 22, and display array 30 are appropriate for any of the types of displays described herein. For example, in one embodiment, driver controller 29 is a conventional display controller or a bi-stable display controller (e.g., an interferometric modulator controller). In another embodiment, array driver 22 is a conventional driver or a bi-stable display driver (e.g., an interferometric modulator display). In one embodiment, a driver controller 29 is integrated with the array driver 22. Such an embodiment is common in highly integrated systems such as cellular phones, watches, and other small area displays. In yet another embodiment, display array 30 is a typical display array or a bi-stable display array (e.g., a display including an array of interferometric modulators).
The input device 48 allows a user to control the operation of the exemplary display device 40. In one embodiment, input device 48 includes a keypad, such as a QWERTY keyboard or a telephone keypad, a button, a switch, a touch-sensitive screen, a pressure- or heat-sensitive membrane. In one embodiment, the microphone 46 is an input device for the exemplary display device 40. When the microphone 46 is used to input data to the device, voice commands may be provided by a user for controlling operations of the exemplary display device 40. Power supply 50 can include a variety of energy storage devices as are well known in the art. For example, in one embodiment, power supply 50 is a rechargeable battery, such as a nickel-cadmium battery or a lithium ion battery. In another embodiment, power supply 50 is a renewable energy source, a capacitor, or a solar cell, including a plastic solar cell, and solar-cell paint. In another embodiment, power supply 50 is configured to receive power from a wall outlet.
In some implementations control programmability resides, as described above, in a driver controller which can be located in several places in the electronic display system. In some cases control programmability resides in the array driver 22. Those of skill in the art will recognize that the above-described optimization may be implemented in any number of hardware and/or software components and in various configurations.
The details of the structure of interferometric modulators that operate in accordance with the principles set forth above may vary widely. For example, Figures 7A-7E illustrate five different embodiments of the movable reflective layer 14 and its supporting structures. Figure 7 A is a cross section of the embodiment of Figure 1, where a strip of metal material
reflective layer 14 is attached to supports at the corners only, on tethers 32. In Figure 7C, the moveable reflective layer 14 is suspended from a deformable layer 34, which may comprise a flexible metal. The deformable layer 34 connects, directly or indirectly, to the substrate 20 around the perimeter of the deformable layer 34. These connections are herein referred to as support posts. The embodiment illustrated in Figure 7D has support post plugs 42 upon which the deformable layer 34 rests. The movable reflective layer 14 remains suspended over the cavity, as in Figures 7A-7C, but the deformable layer 34 does not form the support posts by filling holes between the deformable layer 34 and the optical stack 16. Rather, the support posts are formed of a planarization material, which is used to form support post plugs 42. The embodiment illustrated in Figure 7E is based on the embodiment shown in Figure 7D, but may also be adapted to work with any of the embodiments illustrated in Figures 7A-7C as well as additional embodiments not shown. In the embodiment shown in Figure 7E, an extra layer of metal or other conductive material has been used to form a bus structure 44. This allows signal routing along the back of the interferometric modulators, eliminating a number of electrodes that may otherwise have had to be formed on the substrate 20.
In embodiments such as those shown in Figure 7, the interferometric modulators function as direct-view devices, in which images are viewed from the front side of the transparent substrate 20, the side opposite to that upon which the modulator is arranged. In these embodiments, the reflective layer 14 optically shields the portions of the interferometric modulator on the side of the reflective layer opposite the substrate 20, including the deformable layer 34. This allows the shielded areas to be configured and operated upon without negatively affecting the image quality. Such shielding allows the bus structure 44 in Figure 7E, which provides the ability to separate the optical properties of the modulator from the electromechanical properties of the modulator, such as addressing and the movements that result from that addressing. This separable modulator architecture allows the structural design and materials used for the electromechanical aspects and the optical aspects of the modulator to be selected and to function independently of each other. Moreover, the embodiments shown in Figures 7C-7E have additional benefits deriving from the decoupling of the optical properties of the reflective layer 14 from its mechanical properties, which are carried out by the deformable layer 34. This allows the structural design and materials used for the reflective layer 14 to be optimized with respect to the optical properties, and the structural design and materials
properties.
Figure 8 is an illustration of an exemplary embodiment of an interferometric modulator array 800 showing a cross-sectional view of interferometric modulators 801a, 801b, and 801c. As shown, interferometric modulators 801a, 801b, and 801c each have features similar to those previously discussed above. Also shown are additional features which have been formed above the structures previously discussed. In some embodiments the interferometric modulator array may be processed above these additional features. One skilled in the art will recognize that these features are combinable with interferometric modulators of any of the previously discussed embodiments, as well as other interferometric modulator embodiments not discussed.
Referring to Figure 8, as in the embodiments previously discussed the interferometric modulator structures are formed on a transparent substrate 820. Although in other embodiments an array may comprise various types of interferometric modulators, in this embodiment the interferometric modulators 801a, 801b, and 801c are identical, and the structure of these interferometric modulators will now be described with reference to interferometric modulator 801b only. Posts 18a are formed on the substrate 820, and define the boundaries for adjacent interferometric modulators. An optical stack 816b is formed on the substrate 820 between the posts 18a. The posts 18a support a deformable layer 34b from which a reflective layer 814b is suspended. The reflective layer 814b is suspended so as to be spaced apart from the optical stack 816b such that an interferometric cavity 806b is formed between the optical stack 816b and the reflective layer 814b. As discussed above, movement of the reflective layer 814b with respect to the optical stack 816b affects the dimensions, and therefore the interferometric properties, of the cavity 806b. Movement of the reflective layer 814b is controlled by a providing a voltage difference between the optical stack 816b and the deformable layer 34b. In this embodiment the additional features above the interferometric modulator provide an electrical connection to the deformable layer 34b.
As shown in Figure 8, posts 18a are extended vertically by addition of supports 18b. An encapsulation layer 802 is supported by the supports 18b, and has a via 804 adjacent to one of the supports 18b. The via 804 electrically connects the deformable layer 34b to a first interconnect layer 810, which is connected to additional circuitry. In this embodiment the circuitry comprises an inverter with PMOS transistor 822 and NMOS transistor 824. The input to the inverter 822 is connected to a connection bump 840 which is part of a 3x3
800. In some embodiments connection bumps 840 are not used. As can be envisioned, with this structure each deformable layer in the modulator array 800 can be directly connected to an external connector. For example, in the modulator array 800, the deformable layer 34b directly connects through interconnect layer 810 to the connection bump 840. All other, or substantially all other, deformable layers within the modulator array can similarly connect to individual connectors to that each deformable layer is capable of being individually addressed and controlled by the driver circuitry.
A separate electronic device 860 provides a 3x3 array of connection pads 862 that is configured to mate with the a 3x3 array of connection bumps 841 on the interferometric modulator array 800. As indicated in Figure 8, a connection bump 840 on the interferometric modulator array 800 is configured to align with a connection pad 850 on the electronic device 860 in order to provide an electrical connection between the device 860 and the modulator 801b. In the embodiment shown in Figure 8, the interferometric modulators 801a-c are enclosed by the encapsulation layer 802. The encapsulation layer 802 may provide a hermetic seal for the interferometric modulator in order to protect it from environmental agents such as moisture and oxygen. The seal also allows for pressure within the interferometric modulators 801 a-c to be maintained independent from external pressure of the ambient environment. Thus, the interferometric modulators 801 a-c may be fabricated to maintain environments that differ from the ambient environment. For example, during manufacturing, the encapsulation layer 802 can be manufactured with via 804 that provides a through hole from the ambient environment to the interferometric modulator 801b. The via 804 can then be filled by providing the first interconnect layer serves both to seal the encapsulation layer 802 and provides an electrical connection to the deformable layer 34b. In some embodiments the encapsulation layer seals all interferometric modulators in an array from the ambient environment, while in other embodiments only a portion of the interferometric modulators are sealed by the encapsulation layer. For example, an array may comprise some interferometric modulators which are not addressed. Such interferometric modulators have a reflective layer manufactured at a known fixed position, and do not therefore need to have encapsulation layer comprising an electrical connection to them.
When the reflective layer 814b, and the deformable layer 34b move between the actuated and relaxed states, orifices within the deformable layer 34b (not shown in the
deformable layer 34b and the cavity 808b above the deformable layer 34b. The viscosity of the gasses within the cavity may slow the movement between cavities. Sealing the interferometric modulator array at the time of manufacturing allows for deliberate customization of the cavity environment. Because of the permanent nature of the encapsulation, the environment within each cavity can persist throughout the lifetime of the array. For example, inducing a vacuum before sealing cavity 806b will substantially remove the gasses from the cavity portions 806b, and 808b, so that during use, the movement of the reflective layer 814b and the deformable layer 34b is not impeded by the cavity atmosphere. It should be realized that interferometric modulator arrays are typically sealed from the ambient environment by sealing a backplate to protect the array from the outside environment. While this type of sealant may still be used, it may also be unnecessary because the encapsulation layer 802 can also serve to protect the interior cavities from being affected by the ambient environment. Similarly, embodiments of the invention may also include the use of a desiccant to reduce the moisture levels within a cavity. However, the use of such desiccant may unnecessary in view of the fact that the cavities may be hermetically sealed by the encapsulation layer.
In some embodiments the encapsulation layer 802 is spaced apart from the relaxed state position of the deformable layer 34b by the introduction of an intermediate layer. The introduction of such an intermediate layer may also improve reliability of the device. During operation, the deformable layer 34b may forcefully move from an actuated position close to the optical stack 816b to the relaxed position away from the optical stack 816b. Maintaining the cavity 808b above the deformable layer 34b allows for the deformable layer 34b to "overshoot" the final relaxed state because of the mechanical restorative force. Without the cavity, the deformable layer would collide with the encapsulating layer, potentially damaging the structure and shortening the life of the encapsulating layer and/or the mechanical interferometric modulator structure.
As shown in Figure 8, in some embodiments the encapsulation layer 802 comprises the via 804 which makes an electrical connection between the deformable layer 34 and a first interconnect layer 810. The interconnect layer 810 can be routed to circuitry to be connected to the interferometric modulator. The circuitry may comprise passive and active elements, such as routing wires, resistors, capacitors, inductors, diodes, and transistors. These elements may also include variable elements, such as variable resistors and variable capacitors. The type of circuit elements is not limited and other types of circuit elements
rows, columns, portions of rows and/or columns, and individual deformable layers. The circuitry may additionally or alternatively comprise sense circuitry, used to determine the state of individual deformable layers or groups (such as rows or columns) of deformable layers. ESD protection, EM shielding, and interconnect routing may also be included in the circuitry. In some embodiments the circuitry may also comprise digital signal processing (DSP) functions such as data filtering and control information decoding. In some embodiments the circuitry may comprise RF functions such as an antenna and a power amp, as well as data converters. The type and function of the circuitry is not limited and other types and functions may be implemented.
The interferometric modulators may also be connected to intermediate connectors configured to make connections to other circuits. Such connectors include bond-pads and bumps, such as those used in a ball grid array (BGA). In some embodiments the circuitry and/or connectors are outside the perimeter of the interferometric modulator array. The interferometric modulators may be connected to the connectors through the interconnect layers only, or through the circuitry, as in Figure 8, where the interferometric modulators are connected to the interconnect layer 810, which is connected to the inverter (the circuitry), which is connected to the connector 840.
In some embodiments circuitry and/or connectors are within the perimeter of the interferometric modulator array. An advantageous aspect of this arrangement is that it allows for short routing connections. Such an embodiment is shown in Figure 9 as interferometric modulator 900. Similar to the embodiment described with reference to Figure 8, interferometric modulator 900 is formed on a substrate 20. Posts 18a are formed to define lateral boundaries, and an optical stack 16 is formed on the substrate 20 between the posts 18a. A movable reflective layer 34 is formed on the posts. This embodiment has circuitry between the deformable layer 34 and. a connection bump 940, wherein the circuitry consists only of interconnect 910, which comprises a via 912 sealing the encapsulation layer 902 from the ambient environment. In some embodiments the encapsulation layer is not present. The short interconnect 910 has lower parasitic parameters, such as resistance, capacitance, and inductance than it would if it were longer. Similarly, in some embodiments a second connector, such as a second bump, (not shown) can provide a short routing connection to an electrode in the optical stack 16. The second bump may connect to the electrode in the optical stack 16 through, for example, a
embodiments other types of connectors may be used, such as a bond pad.
Figures 1OA and 1OB are cross-sectional and top views, respectively, of another embodiment of an interferometric modulator 1000. One or more sacrificial layers are deposited during the fabrication of the interferometric modulator. The sacrificial layers at least provide a structural substrate for deposition of the layers which form the interferometric modulator. Once the layers forming the interferometric modulator are deposited, the sacrificial layers are removed, leaving only the interferometric modulator. In some cases the spaces previously occupied by the sacrificial layers then become cavities which allow for the mirror and the mechanical layer to move according to the operation of the interferometric modulator discussed above.
The interferometric modulator 1000 may be formed according to the following process. Posts 18 are formed on the substrate 20, and optical stack 16 formed on the substrate 20 between the posts 18. A first sacrificial layer is deposited on the optical stack 16. A reflective layer 14 is then formed on the first sacrificial layer. Next, a second sacrificial layer is deposited on the reflective layer 14. The second sacrificial layer is etched so as to expose the reflective layer 14 in a region between the posts 18, and a mechanical layer 34 is then formed on the posts 18, the etched second sacrificial layer, and the portion of the reflective layer 14 exposed by etching the second sacrificial layer. In some embodiments, a third sacrificial layer is deposited above the mechanical layer. The third sacrificial layer may then be etched according to a desired contour for the encapsulation layer 1002, which is deposited on the third sacrificial layer. As seen from Figure 1OA, in this embodiment, the third sacrificial layer was etched so that the encapsulation layer contacts the mechanical layer in regions adjacent to the posts and is spaced apart from the mechanical layer in regions adjacent to the mirror.
In some embodiments the after the encapsulation layer is deposited, one or more orifices 1004 may be generated in the encapsulation layer by, for example, etching. After the orifices 1004 have been generated, the sacrificial layers may be removed. In some embodiments the orifices provide a path or the only path through which etching agents access the sacrificial layers and/or provide a path or the only path through which the etching agents and sacrificial layer materials are evacuated from the region between the encapsulation layer and the substrate.
Once the sacrificial layers are removed, the orifices 1004 in the encapsulation layer 1002 may be closed to hermetically seal the interferometric cavity from the ambient
within the interferometric cavity may be altered. For example, a vacuum may be induced, or an inert atmosphere may be generated between the encapsulation layer and the substrate. After the desired atmosphere is generated, the orifices may be closed while maintaining the desired atmosphere. The orifices may be closed with various materials including, but not limited to substantially non-conductive materials, and substantially conductive materials.
In some embodiments at least some of the orifices may be closed using a conductive material. The conductive material may contact the mechanical layer and form a via 1006, as seen in Figure 1OA. As discussed above, the via 1006 provides an electrical connection to the mechanical layer 34 through the encapsulation layer 1002.
The via 1006 may be used to electrically connect the mechanical layer 34 to other interconnect layers and to circuitry. Using semiconductor fabrication techniques such as deposition of materials and sacrificial layers, and etching the materials and sacrificial layers, the other interconnect layers and the circuitry may be fabricated adjacent to the interferometric modulator. For example, as shown in Figure 1OA, passive circuitry including an inductor 1008, a capacitor 1010, and a resistor 1012 have been fabricated adjacent to the device, above the encapsulation layer 1002. In this embodiment, an active circuit element, a diode 1014, has also been fabricated adjacent to the device. The active and passive circuit elements may be electrically connected either directly or indirectly to the interferometric device.
Also shown in Figure 1OA is a connection bump 1040. In this embodiment the connection bump 1040 is connected to some of the circuitry fabricated adjacent to the interferometric modulator. The connection bump 1040 is configured to electrically connect the interferometric modulator to another circuit. As shown in Figure 1 OA, the connection bump 1040 may connect to the interferometric modulator indirectly, through other circuitry. In some embodiments the connection bump may directly connect to the device through the via 1006. Such an embodiment is shown in Figure 9.
Figure 1 OB shows a top view of the structures of Figure 1 OA fabricated above the encapsulation layer 34, indicating their relative arrangement in the orientation depicted. The connection bump 1040, the diode 1014, the resistor 1012, the capacitor 1010, and the inductor 1008 are each shown as well as certain interconnect 1016 layers which electrically connect the structures.
While the above detailed description has shown, described, and pointed out novel features as applied to various embodiments, it will be understood that various omissions,
be made by those skilled in the art without departing from the spirit of the invention. As will be recognized, the present invention may be embodied within a form that does not provide all of the features and benefits set forth herein, as some features may be used or practiced separately from others.
Claims
1. An electronic device, comprising: a substrate; an array of interferometric light modulators formed on said substrate; and a plurality of interconnects formed adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit.
2. The device of Claim 1, comprising at least one connector configured to connect said plurality of interconnects to said circuit.
3. The device of Claim 1, wherein said plurality of interferometric modulators comprises 90 percent of the interferometric modulators in said array.
4. The device of Claim 1, wherein said plurality of interconnects are formed on a layer adjacent to said plurality of interferometric light modulators. 5. The device of Claim 1, wherein the circuit comprises a display driver circuit.
6. The device of Claim 2, wherein said at least one connector comprises connector bumps.
7. The device of Claim 6, wherein the plurality of connector bumps are arranged with a pitch between about 40 microns and about 60 microns.
8. The device of Claim 1 , wherein said interconnects comprise at least one of active circuitry or passive circuitry.
9. The device of Claim 8, wherein said passive circuitry comprises at least one of a capacitor, an inductor, or a resistor. 10. The device of Claim 8, wherein said active circuitry comprises at least one of a diode, a transistor, a zener diode, or circuit protection devices.
1 1. The device of Claim 1, further comprising an encapsulation layer formed adjacent said plurality of interferometric modulators.
12. The device of Claim 1 1, wherein the encapsulation layer comprises one or more electrical connections that connect said at least one connector to said plurality of interferometric modulators.
13. The device of Claim 1, wherein the device is a cell phone.
14. The device of Claim 1 , further comprising: a processor that is in electrical communication with said interferometric modulator, the processor being configured to process image data; and
15. The device of Claim 14, further comprising a driver circuit configured to send at least one signal to the interferometric modulator.
16. The device of Claim 15, further comprising a controller configured to send at least a portion of the image data to the driver circuit.
17. The apparatus of Claim 14, further comprising an image source module configured to send the image data to the processor.
18. The device of Claim 17, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter. 19. The device of Claim 14, further comprising an input device configured to receive input data and to communicate the input data to the processor.
20. A method of manufacturing an electronic device, the method comprising: providing a substrate comprising an array of interferometric light modulators formed on said substrate; and forming a plurality of interconnects adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit.
21. The method of Claim 20, further comprising forming at least one connector configured to connect said plurality of interconnects to said circuit. 22. The method of Claim 20, wherein said plurality of interconnects are formed on a layer adjacent to said plurality of interferometric light modulators.
23. The method of Claim 20, wherein the circuit comprises a display driver circuit.
24. The method of Claim 20, wherein said at least one connector comprises connector bumps.
25. An electronic device made by the method of Claim 20.
26. An electronic device, comprising: a substrate; an interferometric modulator disposed on said substrate, wherein said interferometric modulator comprises a cavity defined by an upper layer and a lower layer; and an encapsulation layer formed adjacent to the interferometric modulator, said encapsulation layer comprising a sealed orifice, wherein said encapsulation layer hermetically seals said cavity from the ambient environment.
electrical connection that connects the interferometric modulator to an electronic circuit.
28. The device of Claim 26, wherein the sealed orifice comprises a via.
29. The device of Claim 26, wherein the cavity comprises a vacuum or inert atmosphere.
30. The device of Claim 26, further comprising one or more interconnect layers formed adjacent to the encapsulation layer and configured to connect said interferometric modulator to said electronic circuit.
31. The device of Claim 30, wherein said interconnect layers comprise one or more circuit elements.
32. The device of Claim 31, further comprising one or more connectors formed adjacent the encapsulation layer and configured to electrically connect said interferometric modulators to said electronic circuit.
33. A method of manufacturing a light modulator device, the method comprising: forming an interferometric modulator, wherein said modulator comprises first and second layers defining a cavity and configured to interferometrically modulate light; forming an encapsulation layer adjacent to the cavity, the layer comprising one or more orifices; inducing a vacuum or inert atmosphere in the cavity; and sealing the one or more orifices.
34. The method of Claim 33, further comprising: forming a sacrificial layer adjacent to the first layer; and removing the sacrificial layer through the one or more orifices in the encapsulation layer.
35. The method of Claim 33, further comprising: forming a sacrificial layer adjacent to the first layer; and removing the sacrificial layer, wherein the encapsulating layer remains spaced apart from the first layer.
36. The method of Claim 33, wherein sealing the one or more orifices comprises sealing the one or more orifices with a conductive material so as to provide an electrical connection to said first layer and wherein said sealing maintains the vacuum or inert atmosphere in the cavity.
interconnect layers adjacent to the encapsulating layer, wherein at least one of the interconnect layers is connected to the conductive material.
38. The method of Claim 36, further comprising forming one or more circuit elements adjacent to the encapsulating layer, wherein at least one of the circuit elements is connected to the conductive material.
39. The method of Claim 33, further comprising forming one or more connectors adjacent to the encapsulating layer, wherein the connectors are configured to connect to a circuit. 40. The method of Claim 39, further comprising forming one or more circuit elements adjacent to the first layer, wherein at least one of the circuit elements is connected to the conductive material and/or to one or more of the connectors.
41. An electronic device manufactured by the process of Claim 33.
42. An electronic device, comprising: means for transmitting light; an array of means for modulating light formed on said transmitting means; and a plurality of means for interconnecting formed adjacent a plurality of said light modulating means, wherein each of said interconnecting means is configured to connect a single light modulating means to a circuit.
43. The device of Claim 42, further comprising connecting means for connecting said plurality of interconnecting means to said circuit.
44. The device of Claim 42, wherein said transmitting means comprises a substrate. 45. The device of Claim 42, wherein said light modulating means comprises an interferometric light modulator.
46. The device of Claim 42, wherein said connecting means comprises a connection bump.
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Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8928967B2 (en) | 1998-04-08 | 2015-01-06 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
KR100703140B1 (en) | 1998-04-08 | 2007-04-05 | 이리다임 디스플레이 코포레이션 | Interferometric modulation and its manufacturing method |
US7372613B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | Method and device for multistate interferometric light modulation |
US7944599B2 (en) | 2004-09-27 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
US7916980B2 (en) * | 2006-01-13 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Interconnect structure for MEMS device |
US7643199B2 (en) * | 2007-06-19 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | High aperture-ratio top-reflective AM-iMod displays |
US7944604B2 (en) | 2008-03-07 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Interferometric modulator in transmission mode |
US8023167B2 (en) | 2008-06-25 | 2011-09-20 | Qualcomm Mems Technologies, Inc. | Backlight displays |
US7768690B2 (en) | 2008-06-25 | 2010-08-03 | Qualcomm Mems Technologies, Inc. | Backlight displays |
US7746539B2 (en) * | 2008-06-25 | 2010-06-29 | Qualcomm Mems Technologies, Inc. | Method for packing a display device and the device obtained thereof |
US7782522B2 (en) * | 2008-07-17 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Encapsulation methods for interferometric modulator and MEMS devices |
WO2011126953A1 (en) | 2010-04-09 | 2011-10-13 | Qualcomm Mems Technologies, Inc. | Mechanical layer of an electromechanical device and methods of forming the same |
US8963159B2 (en) | 2011-04-04 | 2015-02-24 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
US9134527B2 (en) | 2011-04-04 | 2015-09-15 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
US8853975B2 (en) * | 2011-09-28 | 2014-10-07 | DigitalOptics Corporation MEMS | Electrostatic actuator control |
US8786592B2 (en) | 2011-10-13 | 2014-07-22 | Qualcomm Mems Technologies, Inc. | Methods and systems for energy recovery in a display |
JP5987573B2 (en) * | 2012-09-12 | 2016-09-07 | セイコーエプソン株式会社 | Optical module, electronic device, and driving method |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
US10202278B2 (en) * | 2016-09-02 | 2019-02-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure with cavity spacing monitoring functions |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020126364A1 (en) * | 1994-05-05 | 2002-09-12 | Iridigm Display Corporation, A Delaware Corporation | Interferometric modulation of radiation |
US20040051929A1 (en) * | 1994-05-05 | 2004-03-18 | Sampsell Jeffrey Brian | Separable modulator |
WO2005066596A1 (en) * | 2003-12-31 | 2005-07-21 | Honeywell International Inc. | Tunable sensor |
Family Cites Families (1212)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2534846A (en) | 1946-06-20 | 1950-12-19 | Emi Ltd | Color filter |
US2590906A (en) | 1946-11-22 | 1952-04-01 | Farrand Optical Co Inc | Reflection interference filter |
US2588792A (en) | 1947-11-26 | 1952-03-11 | Libbey Owens Ford Glass Co | Adjustable mounting for automobile rearview mirrors |
US2518647A (en) | 1948-01-07 | 1950-08-15 | Celanese Corp | Interferometer means for thickness measurements |
US2677714A (en) | 1951-09-21 | 1954-05-04 | Alois Vogt Dr | Optical-electrical conversion device comprising a light-permeable metal electrode |
US3037189A (en) | 1958-04-23 | 1962-05-29 | Sylvania Electric Prod | Visual display system |
US3247392A (en) | 1961-05-17 | 1966-04-19 | Optical Coating Laboratory Inc | Optical coating and assembly used as a band pass interference filter reflecting in the ultraviolet and infrared |
US3210757A (en) | 1962-01-29 | 1965-10-05 | Carlyle W Jacob | Matrix controlled light valve display apparatus |
US3296530A (en) | 1962-09-28 | 1967-01-03 | Lockheed Aircraft Corp | Voltage controlled electroluminescent meter display |
US3184600A (en) | 1963-05-07 | 1965-05-18 | Potter Instrument Co Inc | Photosensitive apparatus for measuring coordinate distances |
DE1288651B (en) | 1963-06-28 | 1969-02-06 | Siemens Ag | Arrangement of electrical dipoles for wavelengths below 1 mm and method for producing such an arrangement |
US3371345A (en) | 1966-05-26 | 1968-02-27 | Radiation Inc | Radar augmentor |
US3410363A (en) | 1966-08-22 | 1968-11-12 | Devenco Inc | Method and apparatus for testing the wave-reflecting characteristics of a chamber |
US3448334A (en) | 1966-09-30 | 1969-06-03 | North American Rockwell | Multicolored e.l. displays using external colored light sources |
US3924929A (en) | 1966-11-14 | 1975-12-09 | Minnesota Mining & Mfg | Retro-reflective sheet material |
FR1603131A (en) | 1968-07-05 | 1971-03-22 | ||
US3661461A (en) | 1969-11-26 | 1972-05-09 | Du Pont | Co-irradiation system for producing positive images |
US3653741A (en) | 1970-02-16 | 1972-04-04 | Alvin M Marks | Electro-optical dipolar material |
US3813265A (en) | 1970-02-16 | 1974-05-28 | A Marks | Electro-optical dipolar material |
US3728030A (en) | 1970-06-22 | 1973-04-17 | Cary Instruments | Polarization interferometer |
US3725868A (en) | 1970-10-19 | 1973-04-03 | Burroughs Corp | Small reconfigurable processor for a variety of data processing applications |
US3679313A (en) | 1970-10-23 | 1972-07-25 | Bell Telephone Labor Inc | Dispersive element for optical pulse compression |
US3701586A (en) | 1971-04-21 | 1972-10-31 | George G Goetz | Light modulating deflectable membrane |
US3746785A (en) | 1971-11-26 | 1973-07-17 | Bendix Corp | Deflectable membrane optical modulator |
JPS4946974A (en) | 1972-09-11 | 1974-05-07 | ||
US3982239A (en) | 1973-02-07 | 1976-09-21 | North Hills Electronics, Inc. | Saturation drive arrangements for optically bistable displays |
DE2336930A1 (en) | 1973-07-20 | 1975-02-06 | Battelle Institut E V | INFRARED MODULATOR (II.) |
US3886310A (en) | 1973-08-22 | 1975-05-27 | Westinghouse Electric Corp | Electrostatically deflectable light valve with improved diffraction properties |
JPS5120721A (en) | 1974-08-13 | 1976-02-19 | Mitsubishi Metal Corp | HATSUKINKEI HAISHOKUBAI KARANO HATSUKINNO KAISHUHO |
US4125868A (en) | 1975-10-28 | 1978-11-14 | Automix Keyboards, Inc. | Typesetting terminal apparatus having searching and merging features |
US4087810A (en) | 1976-06-30 | 1978-05-02 | International Business Machines Corporation | Membrane deformographic display, and method of making |
US4099854A (en) | 1976-10-12 | 1978-07-11 | The Unites States Of America As Represented By The Secretary Of The Navy | Optical notch filter utilizing electric dipole resonance absorption |
US4196396A (en) | 1976-10-15 | 1980-04-01 | Bell Telephone Laboratories, Incorporated | Interferometer apparatus using electro-optic material with feedback |
DE2703688A1 (en) | 1977-01-29 | 1978-08-10 | Bosch Gmbh Robert | PROTECTIVE DEVICE FOR LIGHT-PERMEABLY LOCKED, ESPECIALLY GLAZED, ROOM OPENINGS, AS PROTECTION AGAINST EXCESSIVE HEAT TRANSMISSION |
US4154219A (en) | 1977-03-11 | 1979-05-15 | E-Systems, Inc. | Prismatic solar reflector apparatus and method of solar tracking |
US4389096A (en) | 1977-12-27 | 1983-06-21 | Matsushita Electric Industrial Co., Ltd. | Image display apparatus of liquid crystal valve projection type |
US4287449A (en) | 1978-02-03 | 1981-09-01 | Sharp Kabushiki Kaisha | Light-absorption film for rear electrodes of electroluminescent display panel |
US4445050A (en) | 1981-12-15 | 1984-04-24 | Marks Alvin M | Device for conversion of light power to electric power |
US4663083A (en) | 1978-05-26 | 1987-05-05 | Marks Alvin M | Electro-optical dipole suspension with reflective-absorptive-transmissive characteristics |
US4200472A (en) | 1978-06-05 | 1980-04-29 | The Regents Of The University Of California | Solar power system and high efficiency photovoltaic cells used therein |
GB2033125B (en) | 1978-08-18 | 1982-07-21 | Sharp Kk | Elastomer display |
US4190488A (en) | 1978-08-21 | 1980-02-26 | International Business Machines Corporation | Etching method using noble gas halides |
US4215244A (en) | 1978-12-18 | 1980-07-29 | The United States Of America As Represented By The Secretary Of The Army | Self-adaptive mobile subscriber access system employing time division multiple accessing |
US4347983A (en) | 1979-01-19 | 1982-09-07 | Sontek Industries, Inc. | Hyperbolic frequency modulation related to aero/hydrodynamic flow systems |
US4408181A (en) | 1979-04-10 | 1983-10-04 | Tokyo Shibaura Denki Kabushiki Kaisha | Document data filing/retrieval system |
DE2918212C2 (en) | 1979-05-05 | 1985-08-14 | Krupp Industrietechnik GmbH, 4048 Grevenbroich | Method and device for disrupting the cells of biomass and the like. |
US4228437A (en) | 1979-06-26 | 1980-10-14 | The United States Of America As Represented By The Secretary Of The Navy | Wideband polarization-transforming electromagnetic mirror |
JPS5610977A (en) | 1979-07-09 | 1981-02-03 | Agency Of Ind Science & Technol | Manufacture of photoelectric converter |
US4282862A (en) | 1979-11-09 | 1981-08-11 | Soleau Bertrand S | Thin-line collectors |
JPS5688111A (en) | 1979-12-19 | 1981-07-17 | Citizen Watch Co Ltd | Liquid crystal display device with solar battery |
NL8001281A (en) | 1980-03-04 | 1981-10-01 | Philips Nv | DISPLAY DEVICE. |
DE3012253A1 (en) | 1980-03-28 | 1981-10-15 | Hoechst Ag, 6000 Frankfurt | METHOD FOR VISIBLE MASKING OF CARGO IMAGES AND A DEVICE SUITABLE FOR THIS |
DE3109653A1 (en) | 1980-03-31 | 1982-01-28 | Jenoptik Jena Gmbh, Ddr 6900 Jena | "RESONANCE ABSORBER" |
US4421381A (en) | 1980-04-04 | 1983-12-20 | Yokogawa Hokushin Electric Corp. | Mechanical vibrating element |
US4484179A (en) | 1980-04-16 | 1984-11-20 | At&T Bell Laboratories | Touch position sensitive surface |
JPS56161676A (en) | 1980-05-16 | 1981-12-12 | Japan Electronic Ind Dev Assoc<Jeida> | Electrode structure for thin film transistor |
US4377324A (en) | 1980-08-04 | 1983-03-22 | Honeywell Inc. | Graded index Fabry-Perot optical filter device |
US4375312A (en) | 1980-08-07 | 1983-03-01 | Hughes Aircraft Company | Graded index waveguide structure and process for forming same |
US4441791A (en) | 1980-09-02 | 1984-04-10 | Texas Instruments Incorporated | Deformable mirror light modulator |
US4378567A (en) | 1981-01-29 | 1983-03-29 | Eastman Kodak Company | Electronic imaging apparatus having means for reducing inter-pixel transmission nonuniformity |
FR2506026A1 (en) | 1981-05-18 | 1982-11-19 | Radant Etudes | METHOD AND DEVICE FOR ANALYZING A HYPERFREQUENCY ELECTROMAGNETIC WAVE RADIATION BEAM |
US4400577A (en) | 1981-07-16 | 1983-08-23 | Spear Reginald G | Thin solar cells |
NL8103377A (en) | 1981-07-16 | 1983-02-16 | Philips Nv | DISPLAY DEVICE. |
US4863224A (en) | 1981-10-06 | 1989-09-05 | Afian Viktor V | Solar concentrator and manufacturing method therefor |
US4571603A (en) * | 1981-11-03 | 1986-02-18 | Texas Instruments Incorporated | Deformable mirror electrostatic printer |
NL8200354A (en) | 1982-02-01 | 1983-09-01 | Philips Nv | PASSIVE DISPLAY. |
US4518959A (en) | 1982-05-13 | 1985-05-21 | Mitsubishi Denki Kabushiki Kaisha | Electronic analog display device |
US4500171A (en) | 1982-06-02 | 1985-02-19 | Texas Instruments Incorporated | Process for plastic LCD fill hole sealing |
US4633031A (en) | 1982-09-24 | 1986-12-30 | Todorof William J | Multi-layer thin film, flexible silicon alloy photovoltaic cell |
EP0109160A3 (en) | 1982-10-14 | 1986-04-09 | The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and | Electronic displays |
DE8232497U1 (en) | 1982-11-19 | 1986-01-30 | Siemens AG, 1000 Berlin und 8000 München | Amorphous silicon solar cell |
US4497974A (en) | 1982-11-22 | 1985-02-05 | Exxon Research & Engineering Co. | Realization of a thin film solar cell with a detached reflector |
US4482213A (en) | 1982-11-23 | 1984-11-13 | Texas Instruments Incorporated | Perimeter seal reinforcement holes for plastic LCDs |
US4688068A (en) | 1983-07-08 | 1987-08-18 | The United States Of America As Represented By The Department Of Energy | Quantum well multijunction photovoltaic cell |
US4498953A (en) | 1983-07-27 | 1985-02-12 | At&T Bell Laboratories | Etching techniques |
DE3402746A1 (en) | 1984-01-27 | 1985-08-08 | Robert Bosch Gmbh, 7000 Stuttgart | Liquid crystal display |
JPS60159731A (en) | 1984-01-30 | 1985-08-21 | Sharp Corp | Liquid crystal display body |
US4832459A (en) | 1984-02-06 | 1989-05-23 | Rogers Corporation | Backlighting for electro-optical passive displays and transflective layer useful therewith |
US5633652A (en) | 1984-02-17 | 1997-05-27 | Canon Kabushiki Kaisha | Method for driving optical modulation device |
US4863245A (en) | 1984-02-28 | 1989-09-05 | Exxon Research And Engineering Company | Superlattice electrooptic devices |
JPS60147718U (en) | 1984-03-09 | 1985-10-01 | マツダ株式会社 | engine cooling system |
JPS60242408A (en) | 1984-05-17 | 1985-12-02 | Seiko Epson Corp | Optical system of light source for light guide |
US4566935A (en) | 1984-07-31 | 1986-01-28 | Texas Instruments Incorporated | Spatial light modulator and method |
US4710732A (en) | 1984-07-31 | 1987-12-01 | Texas Instruments Incorporated | Spatial light modulator and method |
US4709995A (en) | 1984-08-18 | 1987-12-01 | Canon Kabushiki Kaisha | Ferroelectric display panel and driving method therefor to achieve gray scale |
US5096279A (en) | 1984-08-31 | 1992-03-17 | Texas Instruments Incorporated | Spatial light modulator and method |
US5061049A (en) | 1984-08-31 | 1991-10-29 | Texas Instruments Incorporated | Spatial light modulator and method |
US4662746A (en) | 1985-10-30 | 1987-05-05 | Texas Instruments Incorporated | Spatial light modulator and method |
US4596992A (en) | 1984-08-31 | 1986-06-24 | Texas Instruments Incorporated | Linear spatial light modulator and printer |
US4560435A (en) | 1984-10-01 | 1985-12-24 | International Business Machines Corporation | Composite back-etch/lift-off stencil for proximity effect minimization |
US4615595A (en) | 1984-10-10 | 1986-10-07 | Texas Instruments Incorporated | Frame addressed spatial light modulator |
JPS6193678A (en) | 1984-10-15 | 1986-05-12 | Sharp Corp | Photoelectric conversion device |
US5345322A (en) | 1985-03-01 | 1994-09-06 | Manchester R&D Limited Partnership | Complementary color liquid crystal display |
US4655554A (en) | 1985-03-06 | 1987-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Spatial light modulator having a capacitively coupled photoconductor |
JPS61256321A (en) | 1985-05-10 | 1986-11-13 | Hitachi Ltd | Liquid crystal projection type display device |
JPS6247841A (en) | 1985-08-26 | 1987-03-02 | Matsushita Electric Ind Co Ltd | Storage carrier for optical information |
US4672254A (en) | 1985-10-11 | 1987-06-09 | Massachusetts Institute Of Technology | Surface acoustic wave devices and method of manufacture thereof |
EP0223414B1 (en) | 1985-10-16 | 1994-01-12 | BRITISH TELECOMMUNICATIONS public limited company | Mounting a component to a substrate |
US5172262A (en) | 1985-10-30 | 1992-12-15 | Texas Instruments Incorporated | Spatial light modulator and method |
JPS6282454U (en) | 1985-11-13 | 1987-05-26 | ||
JPS62119502A (en) | 1985-11-18 | 1987-05-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Spectrum-filter |
GB2186708B (en) | 1985-11-26 | 1990-07-11 | Sharp Kk | A variable interferometric device and a process for the production of the same |
US4705361A (en) | 1985-11-27 | 1987-11-10 | Texas Instruments Incorporated | Spatial light modulator |
FR2597621A1 (en) | 1986-04-22 | 1987-10-23 | Thomson Csf | NETWORK OF DIFFUSING ELEMENTS OF ELECTROMAGNETIC ENERGY WITH OPTICAL CONTROL |
US5835255A (en) | 1986-04-23 | 1998-11-10 | Etalon, Inc. | Visible spectrum modulator arrays |
GB8610129D0 (en) | 1986-04-25 | 1986-05-29 | Secr Defence | Electro-optical device |
US4963245A (en) | 1986-05-02 | 1990-10-16 | Ciba Corning Diagnostics Corp. | Unitary multiple electrode sensor |
US4850682A (en) | 1986-07-14 | 1989-07-25 | Advanced Environmental Research Group | Diffraction grating structures |
US4748366A (en) | 1986-09-02 | 1988-05-31 | Taylor George W | Novel uses of piezoelectric materials for creating optical effects |
GB8621438D0 (en) | 1986-09-05 | 1986-10-15 | Secr Defence | Electro-optic device |
GB8622711D0 (en) | 1986-09-20 | 1986-10-29 | Emi Plc Thorn | Display device |
GB8623240D0 (en) | 1986-09-26 | 1986-10-29 | Emi Plc Thorn | Display device |
FR2605444A1 (en) | 1986-10-17 | 1988-04-22 | Thomson Csf | METHOD FOR CONTROLLING AN ELECTROOPTIC MATRIX SCREEN AND CONTROL CIRCUIT USING THE SAME |
US4786128A (en) | 1986-12-02 | 1988-11-22 | Quantum Diagnostics, Ltd. | Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction |
GB8702302D0 (en) | 1987-02-02 | 1987-03-11 | Parks J R | Capturing information in drawing & writing |
JPS63194285A (en) | 1987-02-06 | 1988-08-11 | シャープ株式会社 | Color display device |
EP0278038A1 (en) | 1987-02-13 | 1988-08-17 | Battelle-Institut e.V. | Active flat type display panel |
US4822993A (en) | 1987-02-17 | 1989-04-18 | Optron Systems, Inc. | Low-cost, substantially cross-talk free high spatial resolution 2-D bistable light modulator |
US5114226A (en) | 1987-03-20 | 1992-05-19 | Digital Optronics Corporation | 3-Dimensional vision system utilizing coherent optical detection |
NL8701138A (en) | 1987-05-13 | 1988-12-01 | Philips Nv | ELECTROSCOPIC IMAGE DISPLAY. |
DE3716485C1 (en) | 1987-05-16 | 1988-11-24 | Heraeus Gmbh W C | Xenon short-arc discharge lamp |
JPS63298287A (en) | 1987-05-29 | 1988-12-06 | シャープ株式会社 | Liquid crystal display device |
US5091983A (en) | 1987-06-04 | 1992-02-25 | Walter Lukosz | Optical modulation apparatus and measurement method |
US5010328A (en) | 1987-07-21 | 1991-04-23 | Thorn Emi Plc | Display device |
JPH0745550B2 (en) | 1987-07-29 | 1995-05-17 | 三井東圧化学株式会社 | Polymerization method of propylene |
US4857978A (en) | 1987-08-11 | 1989-08-15 | North American Philips Corporation | Solid state light modulator incorporating metallized gel and method of metallization |
US4900136A (en) | 1987-08-11 | 1990-02-13 | North American Philips Corporation | Method of metallizing silica-containing gel and solid state light modulator incorporating the metallized gel |
US4879602A (en) | 1987-09-04 | 1989-11-07 | New York Institute Of Technology | Electrode patterns for solid state light modulator |
US20050259302A9 (en) | 1987-09-11 | 2005-11-24 | Metz Michael H | Holographic light panels and flat panel display systems and method and apparatus for making same |
GB2210540A (en) | 1987-09-30 | 1989-06-07 | Philips Electronic Associated | Method of and arrangement for modifying stored data,and method of and arrangement for generating two-dimensional images |
CA1319767C (en) | 1987-11-26 | 1993-06-29 | Canon Kabushiki Kaisha | Display apparatus |
US4977009A (en) | 1987-12-16 | 1990-12-11 | Ford Motor Company | Composite polymer/desiccant coatings for IC encapsulation |
JPH01108501U (en) | 1988-01-16 | 1989-07-21 | ||
US4956213A (en) | 1988-02-17 | 1990-09-11 | Fuji Photo Film Co., Ltd. | Information recording medium |
US4956619A (en) | 1988-02-19 | 1990-09-11 | Texas Instruments Incorporated | Spatial light modulator |
US4880493A (en) | 1988-06-16 | 1989-11-14 | The United States Of America As Represented By The United States Department Of Energy | Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication |
US4856863A (en) | 1988-06-22 | 1989-08-15 | Texas Instruments Incorporated | Optical fiber interconnection network including spatial light modulator |
US4980775A (en) | 1988-07-21 | 1990-12-25 | Magnascreen Corporation | Modular flat-screen television displays and modules and circuit drives therefor |
US5074840A (en) | 1990-07-24 | 1991-12-24 | Inbae Yoon | Packing device and method of packing for endoscopic procedures |
US5028939A (en) | 1988-08-23 | 1991-07-02 | Texas Instruments Incorporated | Spatial light modulator system |
US4925259A (en) | 1988-10-20 | 1990-05-15 | The United States Of America As Represented By The United States Department Of Energy | Multilayer optical dielectric coating |
US5206747A (en) | 1988-09-28 | 1993-04-27 | Taliq Corporation | Polymer dispersed liquid crystal display with birefringence of the liquid crystal at least 0.23 |
JP2700903B2 (en) | 1988-09-30 | 1998-01-21 | シャープ株式会社 | Liquid crystal display |
JPH02151079A (en) | 1988-12-01 | 1990-06-11 | Sharp Corp | Manufacture of solar cell |
JPH0791089B2 (en) | 1988-12-13 | 1995-10-04 | セントラル硝子株式会社 | Heat ray reflective glass |
US4982184A (en) | 1989-01-03 | 1991-01-01 | General Electric Company | Electrocrystallochromic display and element |
JPH0798326B2 (en) | 1989-01-11 | 1995-10-25 | 飯田工業株式会社 | Finger joint press machine |
US4973131A (en) | 1989-02-03 | 1990-11-27 | Mcdonnell Douglas Corporation | Modulator mirror |
US5446479A (en) | 1989-02-27 | 1995-08-29 | Texas Instruments Incorporated | Multi-dimensional array video processor system |
US5214420A (en) | 1989-02-27 | 1993-05-25 | Texas Instruments Incorporated | Spatial light modulator projection system with random polarity light |
US5162787A (en) | 1989-02-27 | 1992-11-10 | Texas Instruments Incorporated | Apparatus and method for digitized video system utilizing a moving display surface |
US5287096A (en) | 1989-02-27 | 1994-02-15 | Texas Instruments Incorporated | Variable luminosity display system |
KR100202246B1 (en) | 1989-02-27 | 1999-06-15 | 윌리엄 비. 켐플러 | Apparatus and method for digital video system |
US5170156A (en) | 1989-02-27 | 1992-12-08 | Texas Instruments Incorporated | Multi-frequency two dimensional display system |
US5079544A (en) | 1989-02-27 | 1992-01-07 | Texas Instruments Incorporated | Standard independent digitized video system |
US5192946A (en) | 1989-02-27 | 1993-03-09 | Texas Instruments Incorporated | Digitized color video display system |
US5206629A (en) | 1989-02-27 | 1993-04-27 | Texas Instruments Incorporated | Spatial light modulator and memory for digitized video display |
US5214419A (en) | 1989-02-27 | 1993-05-25 | Texas Instruments Incorporated | Planarized true three dimensional display |
US5272473A (en) | 1989-02-27 | 1993-12-21 | Texas Instruments Incorporated | Reduced-speckle display system |
US5218472A (en) | 1989-03-22 | 1993-06-08 | Alcan International Limited | Optical interference structures incorporating porous films |
US4900395A (en) | 1989-04-07 | 1990-02-13 | Fsi International, Inc. | HF gas etching of wafers in an acid processor |
US5198644A (en) | 1989-05-05 | 1993-03-30 | Diablo Research Corporation | System for display of prices and related method |
US4961617A (en) | 1989-07-19 | 1990-10-09 | Ferrydon Shahidi | Fibre optic waveguide illuminating elements |
US5022745A (en) | 1989-09-07 | 1991-06-11 | Massachusetts Institute Of Technology | Electrostatically deformable single crystal dielectrically coated mirror |
DE3930259A1 (en) | 1989-09-11 | 1991-03-21 | Thomson Brandt Gmbh | CONTROL CIRCUIT FOR A LIQUID CRYSTAL DISPLAY |
EP0417523B1 (en) | 1989-09-15 | 1996-05-29 | Texas Instruments Incorporated | Spatial light modulator and method |
GB8921722D0 (en) | 1989-09-26 | 1989-11-08 | British Telecomm | Micromechanical switch |
US4954789A (en) | 1989-09-28 | 1990-09-04 | Texas Instruments Incorporated | Spatial light modulator |
US5381253A (en) | 1991-11-14 | 1995-01-10 | Board Of Regents Of University Of Colorado | Chiral smectic liquid crystal optical modulators having variable retardation |
US5185660A (en) | 1989-11-01 | 1993-02-09 | Aura Systems, Inc. | Actuated mirror optical intensity modulation |
US5126836A (en) | 1989-11-01 | 1992-06-30 | Aura Systems, Inc. | Actuated mirror optical intensity modulation |
JPH03160494A (en) | 1989-11-10 | 1991-07-10 | Internatl Business Mach Corp <Ibm> | Datacprocessing device |
US5124834A (en) | 1989-11-16 | 1992-06-23 | General Electric Company | Transferrable, self-supporting pellicle for elastomer light valve displays and method for making the same |
US5037173A (en) | 1989-11-22 | 1991-08-06 | Texas Instruments Incorporated | Optical interconnection network |
JP2923656B2 (en) | 1989-12-11 | 1999-07-26 | 富士通株式会社 | Data driver for matrix display device |
JP2910114B2 (en) | 1990-01-20 | 1999-06-23 | ソニー株式会社 | Electronics |
US5123247A (en) | 1990-02-14 | 1992-06-23 | 116736 (Canada) Inc. | Solar roof collector |
US5500635A (en) | 1990-02-20 | 1996-03-19 | Mott; Jonathan C. | Products incorporating piezoelectric material |
US5279990A (en) | 1990-03-02 | 1994-01-18 | Motorola, Inc. | Method of making a small geometry contact using sidewall spacers |
US5227900A (en) | 1990-03-20 | 1993-07-13 | Canon Kabushiki Kaisha | Method of driving ferroelectric liquid crystal element |
CH682523A5 (en) | 1990-04-20 | 1993-09-30 | Suisse Electronique Microtech | A modulation matrix addressed light. |
GB9012099D0 (en) | 1990-05-31 | 1990-07-18 | Kodak Ltd | Optical article for multicolour imaging |
US5018256A (en) | 1990-06-29 | 1991-05-28 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5083857A (en) | 1990-06-29 | 1992-01-28 | Texas Instruments Incorporated | Multi-level deformable mirror device |
EP0467048B1 (en) | 1990-06-29 | 1995-09-20 | Texas Instruments Incorporated | Field-updated deformable mirror device |
US5142405A (en) | 1990-06-29 | 1992-08-25 | Texas Instruments Incorporated | Bistable dmd addressing circuit and method |
US5216537A (en) | 1990-06-29 | 1993-06-01 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5099353A (en) | 1990-06-29 | 1992-03-24 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5304419A (en) | 1990-07-06 | 1994-04-19 | Alpha Fry Ltd | Moisture and particle getter for enclosures |
US5153771A (en) | 1990-07-18 | 1992-10-06 | Northrop Corporation | Coherent light modulation and detector |
FR2665270B1 (en) | 1990-07-27 | 1994-05-13 | Etat Francais Cnet | LIGHT SPACE MODULATOR DEVICE AND HIGH DYNAMIC CONOSCOPIC HOLOGRAPHY SYSTEM COMPRISING SUCH A MODULATOR DEVICE. |
DE69114790T2 (en) | 1990-08-20 | 1996-04-18 | Sony Corp | Direct view picture display device. |
US5062689A (en) | 1990-08-21 | 1991-11-05 | Koehler Dale R | Electrostatically actuatable light modulating device |
JP2861340B2 (en) | 1990-09-07 | 1999-02-24 | ソニー株式会社 | Semiconductor device |
US5110370A (en) | 1990-09-20 | 1992-05-05 | United Solar Systems Corporation | Photovoltaic device with decreased gridline shading and method for its manufacture |
US5050946A (en) | 1990-09-27 | 1991-09-24 | Compaq Computer Corporation | Faceted light pipe |
US5148157A (en) | 1990-09-28 | 1992-09-15 | Texas Instruments Incorporated | Spatial light modulator with full complex light modulation capability |
US5034351A (en) | 1990-10-01 | 1991-07-23 | Motorola, Inc. | Process for forming a feature on a substrate without recessing the surface of the substrate |
US5526688A (en) | 1990-10-12 | 1996-06-18 | Texas Instruments Incorporated | Digital flexure beam accelerometer and method |
US5192395A (en) | 1990-10-12 | 1993-03-09 | Texas Instruments Incorporated | Method of making a digital flexure beam accelerometer |
US5044736A (en) | 1990-11-06 | 1991-09-03 | Motorola, Inc. | Configurable optical filter or display |
US5331454A (en) | 1990-11-13 | 1994-07-19 | Texas Instruments Incorporated | Low reset voltage process for DMD |
US5602671A (en) | 1990-11-13 | 1997-02-11 | Texas Instruments Incorporated | Low surface energy passivation layer for micromechanical devices |
JP2719230B2 (en) | 1990-11-22 | 1998-02-25 | キヤノン株式会社 | Photovoltaic element |
JPH04190323A (en) | 1990-11-26 | 1992-07-08 | Hitachi Ltd | Liquid crystal display with solar battery cell |
DE9016732U1 (en) | 1990-12-11 | 1992-04-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
US5742265A (en) | 1990-12-17 | 1998-04-21 | Photonics Systems Corporation | AC plasma gas discharge gray scale graphic, including color and video display drive system |
JPH04238321A (en) | 1991-01-23 | 1992-08-26 | Mitsubishi Electric Corp | Liquid crystal display device |
JPH04276721A (en) | 1991-03-04 | 1992-10-01 | Fuji Photo Film Co Ltd | Liquid crystal display element |
US5233459A (en) | 1991-03-06 | 1993-08-03 | Massachusetts Institute Of Technology | Electric display device |
US5136669A (en) | 1991-03-15 | 1992-08-04 | Sperry Marine Inc. | Variable ratio fiber optic coupler optical signal processing element |
US5358806A (en) | 1991-03-19 | 1994-10-25 | Hitachi, Ltd. | Phase shift mask, method of correcting the same and apparatus for carrying out the method |
DE4108966C2 (en) | 1991-03-19 | 1994-03-10 | Iot Entwicklungsgesellschaft F | Electro-optical interferometric light modulator |
CA2063744C (en) | 1991-04-01 | 2002-10-08 | Paul M. Urbanus | Digital micromirror device architecture and timing for use in a pulse-width modulated display system |
JPH04309925A (en) | 1991-04-08 | 1992-11-02 | Nec Corp | Active matrix color liquid crystal display element |
US5142414A (en) | 1991-04-22 | 1992-08-25 | Koehler Dale R | Electrically actuatable temporal tristimulus-color device |
US5226099A (en) | 1991-04-26 | 1993-07-06 | Texas Instruments Incorporated | Digital micromirror shutter device |
JPH0760844B2 (en) | 1991-05-15 | 1995-06-28 | 株式会社駒ヶ根電化 | How to recycle used probe cards |
EP0514786B1 (en) | 1991-05-23 | 1997-03-19 | Matsushita Electric Industrial Co., Ltd. | Hologram recording material, hologram recording device, method of manufacturing the same, and method of hologram recording |
US5555160A (en) | 1991-06-27 | 1996-09-10 | Nissen Chemitec Co., Ltd. | Light-guiding panel for surface lighting and a surface lighting body |
US5179274A (en) | 1991-07-12 | 1993-01-12 | Texas Instruments Incorporated | Method for controlling operation of optical systems and devices |
US5287215A (en) | 1991-07-17 | 1994-02-15 | Optron Systems, Inc. | Membrane light modulation systems |
US5170283A (en) | 1991-07-24 | 1992-12-08 | Northrop Corporation | Silicon spatial light modulator |
US5240818A (en) | 1991-07-31 | 1993-08-31 | Texas Instruments Incorporated | Method for manufacturing a color filter for deformable mirror device |
US5168406A (en) | 1991-07-31 | 1992-12-01 | Texas Instruments Incorporated | Color deformable mirror device and method for manufacture |
US5151585A (en) | 1991-08-12 | 1992-09-29 | Hughes Danbury Optical Systems, Inc. | Coherent radiation detector |
IL99420A (en) | 1991-09-05 | 2000-12-06 | Elbit Systems Ltd | Helmet mounted display |
US5254980A (en) | 1991-09-06 | 1993-10-19 | Texas Instruments Incorporated | DMD display system controller |
CH680534A5 (en) | 1991-09-16 | 1992-09-15 | Landis & Gyr Betriebs Ag | Fabry=perot sensor for optical parameter measurement - uses two opposing mirrors respectively attached to deflected measuring membrane and transparent plate |
US5358601A (en) | 1991-09-24 | 1994-10-25 | Micron Technology, Inc. | Process for isotropically etching semiconductor devices |
GB9121159D0 (en) | 1991-10-04 | 1991-11-13 | Marconi Gec Ltd | Colour display system |
US5315370A (en) | 1991-10-23 | 1994-05-24 | Bulow Jeffrey A | Interferometric modulator for optical signal processing |
EP0539099A3 (en) | 1991-10-25 | 1993-05-19 | Optical Coating Laboratory, Inc. | Repositionable optical cover for monitors |
US5361383A (en) | 1991-10-30 | 1994-11-01 | Hughes Aircraft Company | Optical fiber having internal partial mirrors and interferometer using same |
US5563398A (en) | 1991-10-31 | 1996-10-08 | Texas Instruments Incorporated | Spatial light modulator scanning system |
US5515184A (en) | 1991-11-12 | 1996-05-07 | The University Of Alabama In Huntsville | Waveguide hologram illuminators |
CA2081753C (en) | 1991-11-22 | 2002-08-06 | Jeffrey B. Sampsell | Dmd scanner |
US5233385A (en) | 1991-12-18 | 1993-08-03 | Texas Instruments Incorporated | White light enhanced color field sequential projection |
US5233456A (en) | 1991-12-20 | 1993-08-03 | Texas Instruments Incorporated | Resonant mirror and method of manufacture |
US5356488A (en) | 1991-12-27 | 1994-10-18 | Rudolf Hezel | Solar cell and method for its manufacture |
US5349503A (en) | 1991-12-31 | 1994-09-20 | At&T Bell Laboratories | Illuminated transparent display with microtextured back reflector |
US5244707A (en) | 1992-01-10 | 1993-09-14 | Shores A Andrew | Enclosure for electronic devices |
US5228013A (en) | 1992-01-10 | 1993-07-13 | Bik Russell J | Clock-painting device and method for indicating the time-of-day with a non-traditional, now analog artistic panel of digital electronic visual displays |
US6381022B1 (en) | 1992-01-22 | 2002-04-30 | Northeastern University | Light modulating device |
CA2087625C (en) | 1992-01-23 | 2006-12-12 | William E. Nelson | Non-systolic time delay and integration printing |
US5296950A (en) | 1992-01-31 | 1994-03-22 | Texas Instruments Incorporated | Optical signal free-space conversion board |
JPH05216617A (en) | 1992-01-31 | 1993-08-27 | Canon Inc | Display driving device and information processing system |
US5231532A (en) | 1992-02-05 | 1993-07-27 | Texas Instruments Incorporated | Switchable resonant filter for optical radiation |
US5212582A (en) | 1992-03-04 | 1993-05-18 | Texas Instruments Incorporated | Electrostatically controlled beam steering device and method |
US6002829A (en) | 1992-03-23 | 1999-12-14 | Minnesota Mining And Manufacturing Company | Luminaire device |
US5528720A (en) | 1992-03-23 | 1996-06-18 | Minnesota Mining And Manufacturing Co. | Tapered multilayer luminaire devices |
EP0562424B1 (en) | 1992-03-25 | 1997-05-28 | Texas Instruments Incorporated | Embedded optical calibration system |
JPH05281479A (en) | 1992-03-31 | 1993-10-29 | Nippon Steel Corp | Display device |
US5312513A (en) | 1992-04-03 | 1994-05-17 | Texas Instruments Incorporated | Methods of forming multiple phase light modulators |
JPH07508856A (en) | 1992-04-08 | 1995-09-28 | ジョージア テック リサーチ コーポレイション | Process for lifting off thin film materials from growth substrates |
US5261970A (en) | 1992-04-08 | 1993-11-16 | Sverdrup Technology, Inc. | Optoelectronic and photovoltaic devices with low-reflectance surfaces |
US5190637A (en) | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
US5311360A (en) | 1992-04-28 | 1994-05-10 | The Board Of Trustees Of The Leland Stanford, Junior University | Method and apparatus for modulating a light beam |
US5398170A (en) | 1992-05-18 | 1995-03-14 | Lee; Song S. | Optical-fiber display with intensive brightness |
TW245772B (en) | 1992-05-19 | 1995-04-21 | Akzo Nv | |
US5613103A (en) | 1992-05-19 | 1997-03-18 | Canon Kabushiki Kaisha | Display control system and method for controlling data based on supply of data |
JPH0651250A (en) | 1992-05-20 | 1994-02-25 | Texas Instr Inc <Ti> | Monolithic space optical modulator and memory package |
US5638084A (en) | 1992-05-22 | 1997-06-10 | Dielectric Systems International, Inc. | Lighting-independent color video display |
JPH06214169A (en) | 1992-06-08 | 1994-08-05 | Texas Instr Inc <Ti> | Controllable optical and periodic surface filter |
JPH08501900A (en) | 1992-06-17 | 1996-02-27 | ハリス・コーポレーション | Bonded wafer manufacturing method |
US5255093A (en) | 1992-06-19 | 1993-10-19 | Panasonic Technologies, Inc. | Apparatus and a method for limiting gain in a digital gamma corrector |
JPH0651721A (en) | 1992-07-29 | 1994-02-25 | Canon Inc | Display controller |
US5818095A (en) | 1992-08-11 | 1998-10-06 | Texas Instruments Incorporated | High-yield spatial light modulator with light blocking layer |
US5345328A (en) | 1992-08-12 | 1994-09-06 | Sandia Corporation | Tandem resonator reflectance modulator |
US5293272A (en) | 1992-08-24 | 1994-03-08 | Physical Optics Corporation | High finesse holographic fabry-perot etalon and method of fabricating |
US5737050A (en) | 1992-08-25 | 1998-04-07 | Matsushita Electric Industrial Co., Ltd. | Light valve having reduced reflected light, high brightness and high contrast |
US5327286A (en) | 1992-08-31 | 1994-07-05 | Texas Instruments Incorporated | Real time optical correlation system |
JPH0695112A (en) | 1992-09-16 | 1994-04-08 | Hitachi Ltd | Prism plate and information display device formed by using this plate |
GB9219671D0 (en) | 1992-09-17 | 1992-10-28 | Canterbury Park Limited | Ink |
US5325116A (en) | 1992-09-18 | 1994-06-28 | Texas Instruments Incorporated | Device for writing to and reading from optical storage media |
US5296775A (en) | 1992-09-24 | 1994-03-22 | International Business Machines Corporation | Cooling microfan arrangements and process |
US5488505A (en) | 1992-10-01 | 1996-01-30 | Engle; Craig D. | Enhanced electrostatic shutter mosaic modulator |
US5339179A (en) | 1992-10-01 | 1994-08-16 | International Business Machines Corp. | Edge-lit transflective non-emissive display with angled interface means on both sides of light conducting panel |
US5648860A (en) | 1992-10-09 | 1997-07-15 | Ag Technology Co., Ltd. | Projection type color liquid crystal optical apparatus |
US5285196A (en) | 1992-10-15 | 1994-02-08 | Texas Instruments Incorporated | Bistable DMD addressing method |
US5604607A (en) | 1992-10-19 | 1997-02-18 | Eastman Kodak Company | Light concentrator system |
US5312512A (en) | 1992-10-23 | 1994-05-17 | Ncr Corporation | Global planarization using SOG and CMP |
US5659374A (en) | 1992-10-23 | 1997-08-19 | Texas Instruments Incorporated | Method of repairing defective pixels |
US5353114A (en) | 1992-11-24 | 1994-10-04 | At&T Bell Laboratories | Opto-electronic interferometic logic |
US6166728A (en) | 1992-12-02 | 2000-12-26 | Scientific-Atlanta, Inc. | Display system with programmable display parameters |
US5285060A (en) | 1992-12-15 | 1994-02-08 | Donnelly Corporation | Display for automatic rearview mirror |
KR0168879B1 (en) | 1992-12-25 | 1999-04-15 | 기따지마 요시또시 | Renticular lens, surface light source and liquid crystal display apparatus |
US5374792A (en) | 1993-01-04 | 1994-12-20 | General Electric Company | Micromechanical moving structures including multiple contact switching system |
EP0608056B1 (en) | 1993-01-11 | 1998-07-29 | Canon Kabushiki Kaisha | Display line dispatcher apparatus |
EP0610665B1 (en) | 1993-01-11 | 1997-09-10 | Texas Instruments Incorporated | Pixel control circuitry for spatial light modulator |
FI96450C (en) | 1993-01-13 | 1996-06-25 | Vaisala Oy | Single-channel gas concentration measurement method and equipment |
US5671314A (en) | 1993-01-15 | 1997-09-23 | Sisters Of Prividence In Oregon | Illuminator devices for ultraviolet light delivery and methods of making same |
EP0609812B1 (en) | 1993-02-01 | 1998-01-07 | Matsushita Electric Industrial Co., Ltd. | Waveguide-type image transmission device and fingerprint identification device |
JP3240724B2 (en) | 1993-02-09 | 2001-12-25 | ソニー株式会社 | Wiring formation method |
US5670935A (en) | 1993-02-26 | 1997-09-23 | Donnelly Corporation | Rearview vision system for vehicle including panoramic view |
JP2823470B2 (en) | 1993-03-09 | 1998-11-11 | シャープ株式会社 | Optical scanning device, display device using the same, and image information input / output device |
US6674562B1 (en) | 1994-05-05 | 2004-01-06 | Iridigm Display Corporation | Interferometric modulation of radiation |
US7830587B2 (en) | 1993-03-17 | 2010-11-09 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light with semiconductor substrate |
US5446567A (en) | 1993-03-23 | 1995-08-29 | Honeywell Inc. | Liquid crystal display with first and second aperatures where one aperature has protuberances |
JPH06281956A (en) | 1993-03-29 | 1994-10-07 | Sharp Corp | Active matrix wiring board |
US5461411A (en) | 1993-03-29 | 1995-10-24 | Texas Instruments Incorporated | Process and architecture for digital micromirror printer |
US5337191A (en) | 1993-04-13 | 1994-08-09 | Photran Corporation | Broad band pass filter including metal layers and dielectric layers of alternating refractive index |
US5498863A (en) | 1993-04-30 | 1996-03-12 | At&T Corp. | Wavelength-sensitive detectors based on absorbers in standing waves |
GB2278222A (en) | 1993-05-20 | 1994-11-23 | Sharp Kk | Spatial light modulator |
US5559358A (en) | 1993-05-25 | 1996-09-24 | Honeywell Inc. | Opto-electro-mechanical device or filter, process for making, and sensors made therefrom |
JP3524122B2 (en) | 1993-05-25 | 2004-05-10 | キヤノン株式会社 | Display control device |
DE4317274A1 (en) | 1993-05-25 | 1994-12-01 | Bosch Gmbh Robert | Process for the production of surface-micromechanical structures |
US6199874B1 (en) | 1993-05-26 | 2001-03-13 | Cornell Research Foundation Inc. | Microelectromechanical accelerometer for automotive applications |
US6149190A (en) | 1993-05-26 | 2000-11-21 | Kionix, Inc. | Micromechanical accelerometer for automotive applications |
US5450205A (en) | 1993-05-28 | 1995-09-12 | Massachusetts Institute Of Technology | Apparatus and method for real-time measurement of thin film layer thickness and changes thereof |
US5324683A (en) | 1993-06-02 | 1994-06-28 | Motorola, Inc. | Method of forming a semiconductor structure having an air region |
JPH06350105A (en) | 1993-06-07 | 1994-12-22 | Nec Corp | Micromachine and its manufacture |
US5481385A (en) | 1993-07-01 | 1996-01-02 | Alliedsignal Inc. | Direct view display device with array of tapered waveguide on viewer side |
US5489952A (en) | 1993-07-14 | 1996-02-06 | Texas Instruments Incorporated | Method and device for multi-format television |
US5673139A (en) | 1993-07-19 | 1997-09-30 | Medcom, Inc. | Microelectromechanical television scanning device and method for making the same |
US5365283A (en) | 1993-07-19 | 1994-11-15 | Texas Instruments Incorporated | Color phase control for projection display using spatial light modulator |
US5510824A (en) | 1993-07-26 | 1996-04-23 | Texas Instruments, Inc. | Spatial light modulator array |
US5619061A (en) | 1993-07-27 | 1997-04-08 | Texas Instruments Incorporated | Micromechanical microwave switching |
CA2168107C (en) | 1993-07-27 | 2001-02-13 | Joel Petersen | Light source destructuring and shaping device |
US5526172A (en) | 1993-07-27 | 1996-06-11 | Texas Instruments Incorporated | Microminiature, monolithic, variable electrical signal processor and apparatus including same |
US5581272A (en) | 1993-08-25 | 1996-12-03 | Texas Instruments Incorporated | Signal generator for controlling a spatial light modulator |
US5552925A (en) | 1993-09-07 | 1996-09-03 | John M. Baker | Electro-micro-mechanical shutters on transparent substrates |
US5483260A (en) | 1993-09-10 | 1996-01-09 | Dell Usa, L.P. | Method and apparatus for simplified video monitor control |
FR2710161B1 (en) | 1993-09-13 | 1995-11-24 | Suisse Electronique Microtech | Miniature array of light shutters. |
EP0657760A1 (en) | 1993-09-15 | 1995-06-14 | Texas Instruments Incorporated | Image simulation and projection system |
US5457493A (en) | 1993-09-15 | 1995-10-10 | Texas Instruments Incorporated | Digital micro-mirror based image simulation system |
US5629790A (en) | 1993-10-18 | 1997-05-13 | Neukermans; Armand P. | Micromachined torsional scanner |
US5526051A (en) | 1993-10-27 | 1996-06-11 | Texas Instruments Incorporated | Digital television system |
US5497197A (en) | 1993-11-04 | 1996-03-05 | Texas Instruments Incorporated | System and method for packaging data into video processor |
US5459602A (en) | 1993-10-29 | 1995-10-17 | Texas Instruments | Micro-mechanical optical shutter |
US5452024A (en) | 1993-11-01 | 1995-09-19 | Texas Instruments Incorporated | DMD display system |
US5894686A (en) | 1993-11-04 | 1999-04-20 | Lumitex, Inc. | Light distribution/information display systems |
WO1995012897A1 (en) | 1993-11-05 | 1995-05-11 | Citizen Watch Co., Ltd. | Solar battery device and its manufacture |
US5398125A (en) | 1993-11-10 | 1995-03-14 | Minnesota Mining And Manufacturing Company | Liquid crystal projection panel having microlens arrays, on each side of the liquid crystal, with a focus beyond the liquid crystal |
ATE179528T1 (en) | 1993-11-15 | 1999-05-15 | Allied Signal Inc | OPTICAL ELEMENT FOR USE IN A MATRIX OF OPTICAL ELEMENTS IN A DISPLAY DEVICE |
JPH07152340A (en) | 1993-11-30 | 1995-06-16 | Rohm Co Ltd | Display device |
US5517347A (en) | 1993-12-01 | 1996-05-14 | Texas Instruments Incorporated | Direct view deformable mirror device |
NL9302091A (en) | 1993-12-02 | 1995-07-03 | R & S Renewable Energy Systems | Photovoltaic solar panel and method for its manufacture. |
CA2137059C (en) | 1993-12-03 | 2004-11-23 | Texas Instruments Incorporated | Dmd architecture to improve horizontal resolution |
US5583688A (en) | 1993-12-21 | 1996-12-10 | Texas Instruments Incorporated | Multi-level digital micromirror device |
US5659410A (en) | 1993-12-28 | 1997-08-19 | Enplas Corporation | Surface light source device and liquid crystal display |
US5598565A (en) | 1993-12-29 | 1997-01-28 | Intel Corporation | Method and apparatus for screen power saving |
US5448314A (en) | 1994-01-07 | 1995-09-05 | Texas Instruments | Method and apparatus for sequential color imaging |
US5500761A (en) | 1994-01-27 | 1996-03-19 | At&T Corp. | Micromechanical modulator |
IL108506A (en) | 1994-02-01 | 1997-06-10 | Yeda Res & Dev | Solar energy plant |
FI94804C (en) | 1994-02-17 | 1995-10-25 | Vaisala Oy | Electrically adjustable surface micromechanical Fabry-Perot interferometer for optical material analysis |
TW334523B (en) | 1994-03-02 | 1998-06-21 | Toso Kk | Back light |
DE4407067C2 (en) | 1994-03-03 | 2003-06-18 | Unaxis Balzers Ag | Dielectric interference filter system, LCD display and CCD arrangement as well as method for producing a dielectric interference filter system |
US5444566A (en) | 1994-03-07 | 1995-08-22 | Texas Instruments Incorporated | Optimized electronic operation of digital micromirror devices |
US5526327A (en) | 1994-03-15 | 1996-06-11 | Cordova, Jr.; David J. | Spatial displacement time display |
US5982540A (en) | 1994-03-16 | 1999-11-09 | Enplas Corporation | Surface light source device with polarization function |
US5796378A (en) | 1994-03-29 | 1998-08-18 | Casio Computer Co., Ltd. | Birifringence control type liquid crystal display device and apparatus and method of driving the same |
US5665997A (en) | 1994-03-31 | 1997-09-09 | Texas Instruments Incorporated | Grated landing area to eliminate sticking of micro-mechanical devices |
US5457900A (en) | 1994-03-31 | 1995-10-17 | Roy; Avery J. | Footwear display device |
GB9407116D0 (en) | 1994-04-11 | 1994-06-01 | Secr Defence | Ferroelectric liquid crystal display with greyscale |
JP3298301B2 (en) | 1994-04-18 | 2002-07-02 | カシオ計算機株式会社 | Liquid crystal drive |
US7826120B2 (en) | 1994-05-05 | 2010-11-02 | Qualcomm Mems Technologies, Inc. | Method and device for multi-color interferometric modulation |
US7808694B2 (en) | 1994-05-05 | 2010-10-05 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
US7738157B2 (en) | 1994-05-05 | 2010-06-15 | Qualcomm Mems Technologies, Inc. | System and method for a MEMS device |
US6040937A (en) | 1994-05-05 | 2000-03-21 | Etalon, Inc. | Interferometric modulation |
US7297471B1 (en) | 2003-04-15 | 2007-11-20 | Idc, Llc | Method for manufacturing an array of interferometric modulators |
US20010003487A1 (en) | 1996-11-05 | 2001-06-14 | Mark W. Miles | Visible spectrum modulator arrays |
US7839556B2 (en) | 1994-05-05 | 2010-11-23 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
US7123216B1 (en) | 1994-05-05 | 2006-10-17 | Idc, Llc | Photonic MEMS and structures |
US7138984B1 (en) | 2001-06-05 | 2006-11-21 | Idc, Llc | Directly laminated touch sensitive screen |
US7852545B2 (en) | 1994-05-05 | 2010-12-14 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
US7550794B2 (en) | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
US7619810B2 (en) | 1994-05-05 | 2009-11-17 | Idc, Llc | Systems and methods of testing micro-electromechanical devices |
US8014059B2 (en) | 1994-05-05 | 2011-09-06 | Qualcomm Mems Technologies, Inc. | System and method for charge control in a MEMS device |
US6710908B2 (en) | 1994-05-05 | 2004-03-23 | Iridigm Display Corporation | Controlling micro-electro-mechanical cavities |
US7776631B2 (en) | 1994-05-05 | 2010-08-17 | Qualcomm Mems Technologies, Inc. | MEMS device and method of forming a MEMS device |
US7800809B2 (en) | 1994-05-05 | 2010-09-21 | Qualcomm Mems Technologies, Inc. | System and method for a MEMS device |
US8081369B2 (en) | 1994-05-05 | 2011-12-20 | Qualcomm Mems Technologies, Inc. | System and method for a MEMS device |
KR950033432A (en) | 1994-05-12 | 1995-12-26 | 윌리엄 이. 힐러 | Spatial Light Modulator Display Pointing Device |
US5805117A (en) | 1994-05-12 | 1998-09-08 | Samsung Electronics Co., Ltd. | Large area tiled modular display system |
WO1995033227A1 (en) | 1994-05-26 | 1995-12-07 | Philips Electronics N.V. | Image projection device |
US5497172A (en) | 1994-06-13 | 1996-03-05 | Texas Instruments Incorporated | Pulse width modulation for spatial light modulator with split reset addressing |
US5671994A (en) | 1994-06-08 | 1997-09-30 | Clio Technologies, Inc. | Flat and transparent front-lighting system using microprisms |
US5673106A (en) | 1994-06-17 | 1997-09-30 | Texas Instruments Incorporated | Printing system with self-monitoring and adjustment |
US5454906A (en) | 1994-06-21 | 1995-10-03 | Texas Instruments Inc. | Method of providing sacrificial spacer for micro-mechanical devices |
US5920418A (en) | 1994-06-21 | 1999-07-06 | Matsushita Electric Industrial Co., Ltd. | Diffractive optical modulator and method for producing the same, infrared sensor including such a diffractive optical modulator and method for producing the same, and display device including such a diffractive optical modulator |
US5499062A (en) | 1994-06-23 | 1996-03-12 | Texas Instruments Incorporated | Multiplexed memory timing with block reset and secondary memory |
JPH0822024A (en) | 1994-07-05 | 1996-01-23 | Mitsubishi Electric Corp | Active matrix substrate and its production |
WO1996002862A1 (en) | 1994-07-15 | 1996-02-01 | Matsushita Electric Industrial Co., Ltd. | Head-up display apparatus, liquid crystal display panel and production method thereof |
US5656554A (en) | 1994-07-29 | 1997-08-12 | International Business Machines Corporation | Semiconductor chip reclamation technique involving multiple planarization processes |
US5636052A (en) | 1994-07-29 | 1997-06-03 | Lucent Technologies Inc. | Direct view display based on a micromechanical modulation |
US5485304A (en) | 1994-07-29 | 1996-01-16 | Texas Instruments, Inc. | Support posts for micro-mechanical devices |
CA2198105A1 (en) | 1994-09-02 | 1996-03-14 | Rad Hassan Dabbaj | Reflective light valve modulator |
US5544268A (en) | 1994-09-09 | 1996-08-06 | Deacon Research | Display panel with electrically-controlled waveguide-routing |
US5647036A (en) | 1994-09-09 | 1997-07-08 | Deacon Research | Projection display with electrically-controlled waveguide routing |
US5703710A (en) | 1994-09-09 | 1997-12-30 | Deacon Research | Method for manipulating optical energy using poled structure |
EP0784860A4 (en) | 1994-09-15 | 1998-11-18 | Panocorp Display Systems Inc | Electronic fluorescent display system with simplified multiple electrode structure and its processing |
JP3219943B2 (en) | 1994-09-16 | 2001-10-15 | 株式会社東芝 | Planar direct-view display device |
JPH0894992A (en) | 1994-09-22 | 1996-04-12 | Casio Comput Co Ltd | Liquid crystal display element |
US6053617A (en) | 1994-09-23 | 2000-04-25 | Texas Instruments Incorporated | Manufacture method for micromechanical devices |
US5619059A (en) | 1994-09-28 | 1997-04-08 | National Research Council Of Canada | Color deformable mirror device having optical thin film interference color coatings |
US5528707A (en) | 1994-09-30 | 1996-06-18 | Honeywell Inc. | Bidirectional optical modulator having lightwave signal conservation |
US5594660A (en) | 1994-09-30 | 1997-01-14 | Cirrus Logic, Inc. | Programmable audio-video synchronization method and apparatus for multimedia systems |
US5526951A (en) | 1994-09-30 | 1996-06-18 | Texas Instruments Incorporated | Fabrication method for digital micro-mirror devices using low temperature CVD |
JP3207686B2 (en) | 1994-10-07 | 2001-09-10 | フオスター電機株式会社 | Speaker damper |
US5795208A (en) | 1994-10-11 | 1998-08-18 | Yamaha Corporation | Manufacture of electron emitter by replica technique |
DE4437259C1 (en) | 1994-10-18 | 1995-10-19 | Siemens Ag | Micro-mechanical electrostatic relay with spiral contact spring bars |
US6560018B1 (en) | 1994-10-27 | 2003-05-06 | Massachusetts Institute Of Technology | Illumination system for transmissive light valve displays |
US5650881A (en) | 1994-11-02 | 1997-07-22 | Texas Instruments Incorporated | Support post architecture for micromechanical devices |
JPH08136910A (en) | 1994-11-07 | 1996-05-31 | Hitachi Ltd | Color liquid crystal display device and its production |
FR2726960B1 (en) | 1994-11-10 | 1996-12-13 | Thomson Csf | PROCESS FOR PRODUCING MAGNETORESISTIVE TRANSDUCERS |
US5552924A (en) | 1994-11-14 | 1996-09-03 | Texas Instruments Incorporated | Micromechanical device having an improved beam |
DE4441009C2 (en) | 1994-11-17 | 2001-03-29 | Karl Von Wedel | Grate plate arrangement |
US5815229A (en) | 1994-11-21 | 1998-09-29 | Proxima Corporation | Microlens imbedded liquid crystal projection panel including thermal insulation layer |
US5474865A (en) | 1994-11-21 | 1995-12-12 | Sematech, Inc. | Globally planarized binary optical mask using buried absorbers |
WO1996016348A1 (en) | 1994-11-24 | 1996-05-30 | Hitachi Ltd. | Liquid crystal display device |
JPH08153700A (en) | 1994-11-25 | 1996-06-11 | Semiconductor Energy Lab Co Ltd | Anisotropic etching of electrically conductive coating |
JP2916887B2 (en) | 1994-11-29 | 1999-07-05 | キヤノン株式会社 | Electron emitting element, electron source, and method of manufacturing image forming apparatus |
US5610624A (en) | 1994-11-30 | 1997-03-11 | Texas Instruments Incorporated | Spatial light modulator with reduced possibility of an on state defect |
TW373116B (en) | 1994-12-15 | 1999-11-01 | Sharp Kk | Lighting apparatus |
US6115014A (en) | 1994-12-26 | 2000-09-05 | Casio Computer Co., Ltd. | Liquid crystal display by means of time-division color mixing and voltage driving methods using birefringence |
US5550373A (en) | 1994-12-30 | 1996-08-27 | Honeywell Inc. | Fabry-Perot micro filter-detector |
US5612713A (en) | 1995-01-06 | 1997-03-18 | Texas Instruments Incorporated | Digital micro-mirror device with block data loading |
US5726480A (en) | 1995-01-27 | 1998-03-10 | The Regents Of The University Of California | Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same |
JPH08202318A (en) | 1995-01-31 | 1996-08-09 | Canon Inc | Display control method and its display system for display device having storability |
JP3251452B2 (en) | 1995-01-31 | 2002-01-28 | シャープ株式会社 | Backlight device for liquid crystal display device |
JP3429384B2 (en) | 1995-02-03 | 2003-07-22 | 株式会社エンプラス | Sidelight type surface light source device |
US5567334A (en) | 1995-02-27 | 1996-10-22 | Texas Instruments Incorporated | Method for creating a digital micromirror device using an aluminum hard mask |
US5610438A (en) | 1995-03-08 | 1997-03-11 | Texas Instruments Incorporated | Micro-mechanical device with non-evaporable getter |
US5636185A (en) | 1995-03-10 | 1997-06-03 | Boit Incorporated | Dynamically changing liquid crystal display timekeeping apparatus |
US5650865A (en) | 1995-03-21 | 1997-07-22 | Hughes Electronics | Holographic backlight for flat panel displays |
US5699074A (en) | 1995-03-24 | 1997-12-16 | Teletransaction, Inc. | Addressing device and method for rapid video response in a bistable liquid crystal display |
US5751388A (en) | 1995-04-07 | 1998-05-12 | Honeywell Inc. | High efficiency polarized display |
US5535047A (en) | 1995-04-18 | 1996-07-09 | Texas Instruments Incorporated | Active yoke hidden hinge digital micromirror device |
US5784190A (en) | 1995-04-27 | 1998-07-21 | John M. Baker | Electro-micro-mechanical shutters on transparent substrates |
US7898722B2 (en) | 1995-05-01 | 2011-03-01 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device with restoring electrode |
US5641391A (en) | 1995-05-15 | 1997-06-24 | Hunter; Ian W. | Three dimensional microfabrication by localized electrodeposition and etching |
US5886688A (en) | 1995-06-02 | 1999-03-23 | National Semiconductor Corporation | Integrated solar panel and liquid crystal display for portable computer or the like |
US5661592A (en) | 1995-06-07 | 1997-08-26 | Silicon Light Machines | Method of making and an apparatus for a flat diffraction grating light valve |
US6046840A (en) * | 1995-06-19 | 2000-04-04 | Reflectivity, Inc. | Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements |
US6849471B2 (en) | 2003-03-28 | 2005-02-01 | Reflectivity, Inc. | Barrier layers for microelectromechanical systems |
US5835256A (en) | 1995-06-19 | 1998-11-10 | Reflectivity, Inc. | Reflective spatial light modulator with encapsulated micro-mechanical elements |
AU6285396A (en) | 1995-06-20 | 1997-01-22 | Thomson Comsumer Electronics, Inc. | Back lit electronic viewfinder |
US5578976A (en) | 1995-06-22 | 1996-11-26 | Rockwell International Corporation | Micro electromechanical RF switch |
US6080467A (en) | 1995-06-26 | 2000-06-27 | 3M Innovative Properties Company | High efficiency optical devices |
US5686979A (en) | 1995-06-26 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Optical panel capable of switching between reflective and transmissive states |
US6712481B2 (en) | 1995-06-27 | 2004-03-30 | Solid State Opto Limited | Light emitting panel assemblies |
US5763785A (en) | 1995-06-29 | 1998-06-09 | Massachusetts Institute Of Technology | Integrated beam forming and focusing processing circuit for use in an ultrasound imaging system |
JP3540444B2 (en) | 1995-07-06 | 2004-07-07 | 三菱レイヨン株式会社 | Backlight and liquid crystal display device using the same |
JPH0936387A (en) | 1995-07-18 | 1997-02-07 | Denso Corp | Method for manufacturing semiconductor sensor for amount of dynamics |
US6124851A (en) | 1995-07-20 | 2000-09-26 | E Ink Corporation | Electronic book with multiple page displays |
US8139050B2 (en) | 1995-07-20 | 2012-03-20 | E Ink Corporation | Addressing schemes for electronic displays |
KR100213026B1 (en) | 1995-07-27 | 1999-08-02 | 윤종용 | Dmd and fabrication method for dmd |
US5569332A (en) | 1995-08-07 | 1996-10-29 | United Solar Systems Corporation | Optically enhanced photovoltaic back reflector |
US5877874A (en) | 1995-08-24 | 1999-03-02 | Terrasun L.L.C. | Device for concentrating optical radiation |
US5757536A (en) | 1995-08-30 | 1998-05-26 | Sandia Corporation | Electrically-programmable diffraction grating |
JP2728041B2 (en) | 1995-08-30 | 1998-03-18 | 日本電気株式会社 | LCD panel |
US5963788A (en) | 1995-09-06 | 1999-10-05 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
KR100365816B1 (en) | 1995-09-20 | 2003-02-20 | 가부시끼가이샤 히다치 세이사꾸쇼 | Image display device |
US5932309A (en) | 1995-09-28 | 1999-08-03 | Alliedsignal Inc. | Colored articles and compositions and methods for their fabrication |
US5661591A (en) | 1995-09-29 | 1997-08-26 | Texas Instruments Incorporated | Optical switch having an analog beam for steering light |
US5739945A (en) | 1995-09-29 | 1998-04-14 | Tayebati; Parviz | Electrically tunable optical filter utilizing a deformable multi-layer mirror |
US6324192B1 (en) | 1995-09-29 | 2001-11-27 | Coretek, Inc. | Electrically tunable fabry-perot structure utilizing a deformable multi-layer mirror and method of making the same |
GB9522135D0 (en) | 1995-10-30 | 1996-01-03 | John Mcgavigan Holdings Limite | Display panels |
JPH09127551A (en) | 1995-10-31 | 1997-05-16 | Sharp Corp | Semiconductor device and active matrix substrate |
JP3580826B2 (en) | 1995-11-01 | 2004-10-27 | 松下電器産業株式会社 | Emission efficiency control element, projection display device, infrared sensor, and non-contact thermometer |
WO1997017628A1 (en) | 1995-11-06 | 1997-05-15 | Etalon, Inc. | Interferometric modulation |
US7907319B2 (en) | 1995-11-06 | 2011-03-15 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light with optical compensation |
US5740150A (en) | 1995-11-24 | 1998-04-14 | Kabushiki Kaisha Toshiba | Galvanomirror and optical disk drive using the same |
US5999306A (en) | 1995-12-01 | 1999-12-07 | Seiko Epson Corporation | Method of manufacturing spatial light modulator and electronic device employing it |
US5889568A (en) | 1995-12-12 | 1999-03-30 | Rainbow Displays Inc. | Tiled flat panel displays |
US5933183A (en) | 1995-12-12 | 1999-08-03 | Fuji Photo Film Co., Ltd. | Color spatial light modulator and color printer using the same |
JPH09160032A (en) | 1995-12-12 | 1997-06-20 | Omron Corp | Illuminator, liquid crystal display device using the illuminator, portable terminal equipment, on board equipment and optical recognition device |
US5737115A (en) | 1995-12-15 | 1998-04-07 | Xerox Corporation | Additive color tristate light valve twisting ball display |
US5825528A (en) | 1995-12-26 | 1998-10-20 | Lucent Technologies Inc. | Phase-mismatched fabry-perot cavity micromechanical modulator |
JP3799092B2 (en) | 1995-12-29 | 2006-07-19 | アジレント・テクノロジーズ・インク | Light modulation device and display device |
US5771321A (en) | 1996-01-04 | 1998-06-23 | Massachusetts Institute Of Technology | Micromechanical optical switch and flat panel display |
US5638946A (en) | 1996-01-11 | 1997-06-17 | Northeastern University | Micromechanical switch with insulated switch contact |
GB2309609A (en) | 1996-01-26 | 1997-07-30 | Sharp Kk | Observer tracking autostereoscopic directional display |
EP0786911B1 (en) | 1996-01-26 | 2003-09-10 | Sharp Kabushiki Kaisha | Autostereoscopic display |
US5967163A (en) | 1996-01-30 | 1999-10-19 | Abbott Laboratories | Actuator and method |
US5751469A (en) | 1996-02-01 | 1998-05-12 | Lucent Technologies Inc. | Method and apparatus for an improved micromechanical modulator |
KR19990082166A (en) | 1996-02-01 | 1999-11-25 | 다구치 에이치 | Surface light source element and liquid crystal display device, display device and traffic sign device using same |
US5961198A (en) | 1996-02-02 | 1999-10-05 | Hitachi, Ltd. | Liquid crystal display device and method of manufacturing backlighting light guide panel therefor |
US6114862A (en) | 1996-02-14 | 2000-09-05 | Stmicroelectronics, Inc. | Capacitive distance sensor |
JP3597305B2 (en) | 1996-03-05 | 2004-12-08 | 株式会社半導体エネルギー研究所 | Liquid crystal display device and manufacturing method thereof |
JPH09260696A (en) | 1996-03-19 | 1997-10-03 | Daido Hoxan Inc | Solar cell |
US6624944B1 (en) | 1996-03-29 | 2003-09-23 | Texas Instruments Incorporated | Fluorinated coating for an optical element |
US5815141A (en) | 1996-04-12 | 1998-09-29 | Elo Touch Systems, Inc. | Resistive touchscreen having multiple selectable regions for pressure discrimination |
JP3869488B2 (en) | 1996-04-17 | 2007-01-17 | 大日本印刷株式会社 | Image display device using hologram color filter |
US5867301A (en) | 1996-04-22 | 1999-02-02 | Engle; Craig D. | Phase modulating device |
US5980054A (en) | 1996-05-09 | 1999-11-09 | Matsushita Electric Industrial Co., Ltd. | Panel-form illuminating system |
JP3506841B2 (en) | 1996-05-17 | 2004-03-15 | 松下電器産業株式会社 | Illumination device of reflective liquid crystal display device and reflective liquid crystal display device |
WO1997044707A2 (en) | 1996-05-24 | 1997-11-27 | Digital D.J. Incorporated | Liquid crystal display device with integrated solar power source and antenna |
JP2865618B2 (en) | 1996-05-31 | 1999-03-08 | 嶋田プレシジョン株式会社 | Light guide plate and light guide plate assembly |
DE19622748A1 (en) | 1996-06-05 | 1997-12-11 | Forschungszentrum Juelich Gmbh | Interference filter based on porous silicon |
US5782993A (en) | 1996-06-28 | 1998-07-21 | Ponewash; Jackie | Photovoltaic cells having micro-embossed optical enhancing structures |
US5907426A (en) | 1996-06-28 | 1999-05-25 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Stabilizing device for optical modulator |
JPH1020328A (en) | 1996-07-02 | 1998-01-23 | Fuji Xerox Co Ltd | Spatial light modulation element |
US5771124A (en) | 1996-07-02 | 1998-06-23 | Siliscape | Compact display system with two stage magnification and immersed beam splitter |
KR100213968B1 (en) | 1996-07-15 | 1999-08-02 | 구자홍 | Liquid crystal display device |
FR2751398B1 (en) | 1996-07-16 | 1998-08-28 | Thomson Csf | LIGHTING DEVICE AND APPLICATION TO THE LIGHTING OF A TRANSMISSION SCREEN |
US5720827A (en) | 1996-07-19 | 1998-02-24 | University Of Florida | Design for the fabrication of high efficiency solar cells |
US5710656A (en) | 1996-07-30 | 1998-01-20 | Lucent Technologies Inc. | Micromechanical optical modulator having a reduced-mass composite membrane |
DE69626972T2 (en) | 1996-07-31 | 2004-01-08 | Stmicroelectronics S.R.L., Agrate Brianza | Integrated capacitive semiconductor acceleration sensor and method for its production |
GB2315902A (en) | 1996-08-01 | 1998-02-11 | Sharp Kk | LIquid crystal device |
US5793504A (en) | 1996-08-07 | 1998-08-11 | Northrop Grumman Corporation | Hybrid angular/spatial holographic multiplexer |
US5838484A (en) | 1996-08-19 | 1998-11-17 | Lucent Technologies Inc. | Micromechanical optical modulator with linear operating characteristic |
US5828088A (en) | 1996-09-05 | 1998-10-27 | Astropower, Inc. | Semiconductor device structures incorporating "buried" mirrors and/or "buried" metal electrodes |
US5912758A (en) | 1996-09-11 | 1999-06-15 | Texas Instruments Incorporated | Bipolar reset for spatial light modulators |
GB9619781D0 (en) | 1996-09-23 | 1996-11-06 | Secr Defence | Multi layer interference coatings |
EP0878720B2 (en) | 1996-09-24 | 2011-06-22 | Seiko Epson Corporation | Illuminating device and display using the device |
JP3402138B2 (en) | 1996-09-27 | 2003-04-28 | 株式会社日立製作所 | Liquid crystal display |
US5975703A (en) | 1996-09-30 | 1999-11-02 | Digital Optics International | Image projection system |
FI108581B (en) | 1996-10-03 | 2002-02-15 | Valtion Teknillinen | Electrically adjustable optical filter |
US5854872A (en) | 1996-10-08 | 1998-12-29 | Clio Technologies, Inc. | Divergent angle rotator system and method for collimating light beams |
US5771116A (en) | 1996-10-21 | 1998-06-23 | Texas Instruments Incorporated | Multiple bias level reset waveform for enhanced DMD control |
JPH09189910A (en) | 1996-10-28 | 1997-07-22 | Seiko Epson Corp | Color display device |
WO1998019201A1 (en) | 1996-10-29 | 1998-05-07 | Xeotron Corporation | Optical device utilizing optical waveguides and mechanical light-switches |
US6486862B1 (en) | 1996-10-31 | 2002-11-26 | Kopin Corporation | Card reader display system |
US7929197B2 (en) | 1996-11-05 | 2011-04-19 | Qualcomm Mems Technologies, Inc. | System and method for a MEMS device |
DE19730715C1 (en) | 1996-11-12 | 1998-11-26 | Fraunhofer Ges Forschung | Method of manufacturing a micromechanical relay |
US5683649A (en) | 1996-11-14 | 1997-11-04 | Eastman Kodak Company | Method for the fabrication of micro-electromechanical ceramic parts |
FR2756105B1 (en) | 1996-11-19 | 1999-03-26 | Commissariat Energie Atomique | MULTISPECTRAL DETECTOR WITH RESONANT CAVITY |
US6094285A (en) | 1996-12-04 | 2000-07-25 | Trw Inc. | All optical RF signal channelizer |
JPH10161630A (en) | 1996-12-05 | 1998-06-19 | Toshiba Corp | Dynamic image data output device and method for betting its environment |
US5868480A (en) | 1996-12-17 | 1999-02-09 | Compaq Computer Corporation | Image projection apparatus for producing an image supplied by parallel transmitted colored light |
US7471444B2 (en) | 1996-12-19 | 2008-12-30 | Idc, Llc | Interferometric modulation of radiation |
US7830588B2 (en) | 1996-12-19 | 2010-11-09 | Qualcomm Mems Technologies, Inc. | Method of making a light modulating display device and associated transistor circuitry and structures thereof |
WO1998032047A1 (en) | 1997-01-16 | 1998-07-23 | Motorola Inc. | Ambient illuminated electro-optic display device |
KR100532801B1 (en) | 1997-01-21 | 2005-12-02 | 굿리치 코포레이션 | Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
GB2321532A (en) | 1997-01-22 | 1998-07-29 | Sharp Kk | Multi-colour reflector device and display |
US6028689A (en) | 1997-01-24 | 2000-02-22 | The United States Of America As Represented By The Secretary Of The Air Force | Multi-motion micromirror |
US5981112A (en) | 1997-01-24 | 1999-11-09 | Eastman Kodak Company | Method of making color filter arrays |
JPH10202948A (en) | 1997-01-29 | 1998-08-04 | Canon Inc | Image-forming apparatus and image formation method for image-forming apparatus |
US6266473B1 (en) | 1997-02-07 | 2001-07-24 | Alliedsignal Inc. | Reflective display |
US5939795A (en) | 1997-02-10 | 1999-08-17 | Yu; Wei Kong | Seat sensor operating safety system for a motor vehicle |
JPH10293212A (en) | 1997-02-18 | 1998-11-04 | Dainippon Printing Co Ltd | Backlight and liquid crystal display device |
US5783614A (en) | 1997-02-21 | 1998-07-21 | Copytele, Inc. | Polymeric-coated dielectric particles and formulation and method for preparing same |
US5913594A (en) | 1997-02-25 | 1999-06-22 | Iimura; Keiji | Flat panel light source device and passive display device utilizing the light source device |
US5881449A (en) | 1997-02-28 | 1999-03-16 | Eastman Kodak Company | Method of making a microceramic electromagnetic light shutter |
US5786927A (en) | 1997-03-12 | 1998-07-28 | Lucent Technologies Inc. | Gas-damped micromechanical structure |
JPH10260641A (en) | 1997-03-17 | 1998-09-29 | Nec Corp | Mount structure for driver ic for flat panel type display device |
US6123431A (en) | 1997-03-19 | 2000-09-26 | Sanyo Electric Co., Ltd | Backlight apparatus and light guide plate |
JP3666181B2 (en) | 1997-03-21 | 2005-06-29 | ソニー株式会社 | Reflective and transmissive display device |
US6034752A (en) | 1997-03-22 | 2000-03-07 | Kent Displays Incorporated | Display device reflecting visible and infrared radiation |
EP0867747A3 (en) | 1997-03-25 | 1999-03-03 | Sony Corporation | Reflective display device |
US6384952B1 (en) | 1997-03-27 | 2002-05-07 | Mems Optical Inc. | Vertical comb drive actuated deformable mirror device and method |
JP3231655B2 (en) | 1997-03-28 | 2001-11-26 | シャープ株式会社 | Forward illumination device and reflection type liquid crystal display device having the same |
US6879354B1 (en) | 1997-03-28 | 2005-04-12 | Sharp Kabushiki Kaisha | Front-illuminating device and a reflection-type liquid crystal display using such a device |
US5880921A (en) | 1997-04-28 | 1999-03-09 | Rockwell Science Center, Llc | Monolithically integrated switched capacitor bank using micro electro mechanical system (MEMS) technology |
EP0877272B1 (en) | 1997-05-08 | 2002-07-31 | Texas Instruments Incorporated | Improvements in or relating to spatial light modulators |
EP0879991A3 (en) | 1997-05-13 | 1999-04-21 | Matsushita Electric Industrial Co., Ltd. | Illuminating system |
GB9710062D0 (en) | 1997-05-16 | 1997-07-09 | British Tech Group | Optical devices and methods of fabrication thereof |
FI104658B (en) | 1997-05-26 | 2000-03-15 | Nokia Mobile Phones Ltd | Display arrangement and terminal with two displays |
WO1998054606A1 (en) | 1997-05-29 | 1998-12-03 | Kuraray Co., Ltd. | Lightguide |
US6142358A (en) | 1997-05-31 | 2000-11-07 | The Regents Of The University Of California | Wafer-to-wafer transfer of microstructures using break-away tethers |
US5822839A (en) | 1997-06-03 | 1998-10-20 | Eastman Kodak Company | Method for making a micromotor in a ceramic substrate |
US6147680A (en) | 1997-06-03 | 2000-11-14 | Koa T&T Corporation | Touchpad with interleaved traces |
US6480177B2 (en) | 1997-06-04 | 2002-11-12 | Texas Instruments Incorporated | Blocked stepped address voltage for micromechanical devices |
US5808780A (en) | 1997-06-09 | 1998-09-15 | Texas Instruments Incorporated | Non-contacting micromechanical optical switch |
US5959777A (en) | 1997-06-10 | 1999-09-28 | The University Of British Columbia | Passive high efficiency variable reflectivity image display device |
US5883684A (en) | 1997-06-19 | 1999-03-16 | Three-Five Systems, Inc. | Diffusively reflecting shield optically, coupled to backlit lightguide, containing LED's completely surrounded by the shield |
WO1998059382A1 (en) | 1997-06-23 | 1998-12-30 | Fed Corporation | Voltage controlled color organic light emitting device and method of producing the same |
US5914803A (en) | 1997-07-01 | 1999-06-22 | Daewoo Electronics Co., Ltd. | Thin film actuated mirror array in an optical projection system and method for manufacturing the same |
US6124581A (en) * | 1997-07-16 | 2000-09-26 | Illinois Tool Works Inc. | Method and apparatus for producing power for an induction heating source |
US6239777B1 (en) | 1997-07-22 | 2001-05-29 | Kabushiki Kaisha Toshiba | Display device |
US5870221A (en) | 1997-07-25 | 1999-02-09 | Lucent Technologies, Inc. | Micromechanical modulator having enhanced performance |
US6259082B1 (en) | 1997-07-31 | 2001-07-10 | Rohm Co., Ltd. | Image reading apparatus |
JPH1154773A (en) | 1997-08-01 | 1999-02-26 | Canon Inc | Photovoltaic element and its manufacture |
US5867302A (en) | 1997-08-07 | 1999-02-02 | Sandia Corporation | Bistable microelectromechanical actuator |
KR19990016714A (en) | 1997-08-19 | 1999-03-15 | 윤종용 | Multi-sided image display type rear projection project device |
US6008449A (en) | 1997-08-19 | 1999-12-28 | Cole; Eric D. | Reflective concentrating solar cell assembly |
US6031653A (en) | 1997-08-28 | 2000-02-29 | California Institute Of Technology | Low-cost thin-metal-film interference filters |
US5994174A (en) | 1997-09-29 | 1999-11-30 | The Regents Of The University Of California | Method of fabrication of display pixels driven by silicon thin film transistors |
US5966235A (en) | 1997-09-30 | 1999-10-12 | Lucent Technologies, Inc. | Micro-mechanical modulator having an improved membrane configuration |
FR2769382B1 (en) | 1997-10-03 | 2000-12-01 | Thomson Multimedia Sa | REAR LIGHTING SYSTEM FOR A TRANSMISSIBLE ELECTRO-OPTICAL MODULATOR USING THE LIGHT POLARIZATION EFFECT |
GB2330678A (en) | 1997-10-16 | 1999-04-28 | Sharp Kk | Addressing a ferroelectric liquid crystal display |
US6021007A (en) | 1997-10-18 | 2000-02-01 | Murtha; R. Michael | Side-collecting lightguide |
WO1999023832A1 (en) | 1997-10-31 | 1999-05-14 | Daewoo Electronics Co., Ltd. | Method for manufacturing thin film actuated mirror array in an optical projection system |
US6088102A (en) | 1997-10-31 | 2000-07-11 | Silicon Light Machines | Display apparatus including grating light-valve array and interferometric optical system |
US6273577B1 (en) | 1997-10-31 | 2001-08-14 | Sanyo Electric Co., Ltd. | Light guide plate, surface light source using the light guide plate, and liquid crystal display using the surface light source |
US6008123A (en) | 1997-11-04 | 1999-12-28 | Lucent Technologies Inc. | Method for using a hardmask to form an opening in a semiconductor substrate |
US6285424B1 (en) | 1997-11-07 | 2001-09-04 | Sumitomo Chemical Company, Limited | Black mask, color filter and liquid crystal display |
US6322901B1 (en) | 1997-11-13 | 2001-11-27 | Massachusetts Institute Of Technology | Highly luminescent color-selective nano-crystalline materials |
US5945980A (en) | 1997-11-14 | 1999-08-31 | Logitech, Inc. | Touchpad with active plane for pen detection |
US6750876B1 (en) | 1997-11-16 | 2004-06-15 | Ess Technology, Inc. | Programmable display controller |
EP0916981B1 (en) | 1997-11-17 | 2004-07-28 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Confocal spectroscopy system and method |
JP3808992B2 (en) | 1997-11-21 | 2006-08-16 | 三菱電機株式会社 | LCD panel module |
US6028690A (en) | 1997-11-26 | 2000-02-22 | Texas Instruments Incorporated | Reduced micromirror mirror gaps for improved contrast ratio |
JPH11174234A (en) | 1997-12-05 | 1999-07-02 | Victor Co Of Japan Ltd | Hologram color filter, manufacture of hologram color filter and spatial light modulation device using the same |
US6492065B2 (en) | 1997-12-05 | 2002-12-10 | Victor Company Of Japan, Limited | Hologram color filter, production method of the same hologram color filter and space light modulating apparatus using the same hologram color filter |
US5920421A (en) | 1997-12-10 | 1999-07-06 | Daewoo Electronics Co., Ltd. | Thin film actuated mirror array in an optical projection system and method for manufacturing the same |
US6180428B1 (en) | 1997-12-12 | 2001-01-30 | Xerox Corporation | Monolithic scanning light emitting devices using micromachining |
KR100253378B1 (en) | 1997-12-15 | 2000-04-15 | 김영환 | Apparatus for displaying output data in asic(application specific ic) |
US6381381B1 (en) | 1998-01-20 | 2002-04-30 | Seiko Epson Corporation | Optical switching device and image display device |
US6151089A (en) | 1998-01-20 | 2000-11-21 | Sony Corporation | Reflection type display with light waveguide with inclined and planar surface sections |
US5914804A (en) | 1998-01-28 | 1999-06-22 | Lucent Technologies Inc | Double-cavity micromechanical optical modulator with plural multilayer mirrors |
JPH11211999A (en) | 1998-01-28 | 1999-08-06 | Teijin Ltd | Optical modulating element and display device |
US6660656B2 (en) | 1998-02-11 | 2003-12-09 | Applied Materials Inc. | Plasma processes for depositing low dielectric constant films |
US6897855B1 (en) | 1998-02-17 | 2005-05-24 | Sarnoff Corporation | Tiled electronic display structure |
JP3496806B2 (en) | 1998-02-17 | 2004-02-16 | 株式会社エンプラス | Sidelight type surface light source device and liquid crystal display device |
US6100861A (en) | 1998-02-17 | 2000-08-08 | Rainbow Displays, Inc. | Tiled flat panel display with improved color gamut |
JPH11232919A (en) | 1998-02-17 | 1999-08-27 | Fuji Xerox Co Ltd | Front light lighting system and reflecting type display device |
GB9803441D0 (en) | 1998-02-18 | 1998-04-15 | Cambridge Display Tech Ltd | Electroluminescent devices |
JP3831510B2 (en) | 1998-02-27 | 2006-10-11 | 三洋電機株式会社 | Reflective liquid crystal display |
US6195196B1 (en) | 1998-03-13 | 2001-02-27 | Fuji Photo Film Co., Ltd. | Array-type exposing device and flat type display incorporating light modulator and driving method thereof |
US6172667B1 (en) | 1998-03-19 | 2001-01-09 | Michel Sayag | Optically-based touch screen input device |
US6262697B1 (en) | 1998-03-20 | 2001-07-17 | Eastman Kodak Company | Display having viewable and conductive images |
CN1142597C (en) | 1998-03-25 | 2004-03-17 | Tdk株式会社 | Solar cell module |
JP2986773B2 (en) | 1998-04-01 | 1999-12-06 | 嶋田プレシジョン株式会社 | Light guide plate for point light source |
US7532377B2 (en) | 1998-04-08 | 2009-05-12 | Idc, Llc | Movable micro-electromechanical device |
US8928967B2 (en) | 1998-04-08 | 2015-01-06 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
KR100703140B1 (en) | 1998-04-08 | 2007-04-05 | 이리다임 디스플레이 코포레이션 | Interferometric modulation and its manufacturing method |
JP4106735B2 (en) | 1998-04-13 | 2008-06-25 | 凸版印刷株式会社 | Reflective display with solar cells |
JP4066503B2 (en) | 1998-04-15 | 2008-03-26 | 凸版印刷株式会社 | Reflective display with solar cells |
US6967779B2 (en) | 1998-04-15 | 2005-11-22 | Bright View Technologies, Inc. | Micro-lens array with precisely aligned aperture mask and methods of producing same |
JP4520545B2 (en) | 1998-04-17 | 2010-08-04 | セイコーインスツル株式会社 | Reflective liquid crystal display device and manufacturing method thereof |
US6097145A (en) | 1998-04-27 | 2000-08-01 | Copytele, Inc. | Aerogel-based phase transition flat panel display |
US5943158A (en) | 1998-05-05 | 1999-08-24 | Lucent Technologies Inc. | Micro-mechanical, anti-reflection, switched optical modulator array and fabrication method |
US6160833A (en) | 1998-05-06 | 2000-12-12 | Xerox Corporation | Blue vertical cavity surface emitting laser |
JP3520494B2 (en) | 1998-05-11 | 2004-04-19 | 日東電工株式会社 | Reflective liquid crystal display |
WO1999059101A2 (en) | 1998-05-12 | 1999-11-18 | E-Ink Corporation | Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications |
US6282010B1 (en) | 1998-05-14 | 2001-08-28 | Texas Instruments Incorporated | Anti-reflective coatings for spatial light modulators |
US6339417B1 (en) | 1998-05-15 | 2002-01-15 | Inviso, Inc. | Display system having multiple memory elements per pixel |
US20010040538A1 (en) | 1999-05-13 | 2001-11-15 | William A. Quanrud | Display system with multiplexed pixels |
US6046659A (en) | 1998-05-15 | 2000-04-04 | Hughes Electronics Corporation | Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications |
TW386175B (en) | 1998-05-19 | 2000-04-01 | Dainippon Printing Co Ltd | Light reflective panel for reflective liquid crystal panel |
US6323982B1 (en) * | 1998-05-22 | 2001-11-27 | Texas Instruments Incorporated | Yield superstructure for digital micromirror device |
US5923955A (en) * | 1998-05-28 | 1999-07-13 | Xerox Corporation | Fine flip chip interconnection |
US6147790A (en) | 1998-06-02 | 2000-11-14 | Texas Instruments Incorporated | Spring-ring micromechanical device |
US6430332B1 (en) | 1998-06-05 | 2002-08-06 | Fiber, Llc | Optical switching apparatus |
WO1999064912A1 (en) | 1998-06-05 | 1999-12-16 | Seiko Epson Corporation | Light source and display device |
WO1999064950A1 (en) | 1998-06-08 | 1999-12-16 | Kaneka Corporation | Resistor film touch panel used for liquid crystal display and liquid crystal display with the same |
KR100357315B1 (en) | 1998-06-25 | 2002-10-19 | 시티즌 도케이 가부시키가이샤 | Reflective liquid crystal display |
US6496122B2 (en) | 1998-06-26 | 2002-12-17 | Sharp Laboratories Of America, Inc. | Image display and remote control system capable of displaying two distinct images |
US6077722A (en) | 1998-07-14 | 2000-06-20 | Bp Solarex | Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts |
US6304297B1 (en) | 1998-07-21 | 2001-10-16 | Ati Technologies, Inc. | Method and apparatus for manipulating display of update rate |
US5949571A (en) | 1998-07-30 | 1999-09-07 | Lucent Technologies | Mars optical modulators |
GB2341476A (en) | 1998-09-03 | 2000-03-15 | Sharp Kk | Variable resolution display device |
JP2000081848A (en) | 1998-09-03 | 2000-03-21 | Semiconductor Energy Lab Co Ltd | Electronic equipment mounting liquid crystal display device |
US6113239A (en) | 1998-09-04 | 2000-09-05 | Sharp Laboratories Of America, Inc. | Projection display system for reflective light valves |
US6242989B1 (en) | 1998-09-12 | 2001-06-05 | Agere Systems Guardian Corp. | Article comprising a multi-port variable capacitor |
JP4074714B2 (en) | 1998-09-25 | 2008-04-09 | 富士フイルム株式会社 | Array type light modulation element and flat display driving method |
DE69940291D1 (en) | 1998-09-28 | 2009-03-05 | Sharp Kk | Space solar cell |
US6972753B1 (en) | 1998-10-02 | 2005-12-06 | Semiconductor Energy Laboratory Co., Ltd. | Touch panel, display device provided with touch panel and electronic equipment provided with display device |
US6323834B1 (en) | 1998-10-08 | 2001-11-27 | International Business Machines Corporation | Micromechanical displays and fabrication method |
JP3919954B2 (en) | 1998-10-16 | 2007-05-30 | 富士フイルム株式会社 | Array type light modulation element and flat display driving method |
US6171945B1 (en) | 1998-10-22 | 2001-01-09 | Applied Materials, Inc. | CVD nanoporous silica low dielectric constant films |
US6288824B1 (en) | 1998-11-03 | 2001-09-11 | Alex Kastalsky | Display device based on grating electromechanical shutter |
JP2000147262A (en) | 1998-11-11 | 2000-05-26 | Nobuyuki Higuchi | Converging device and photovoltaic power generation system utilizing the device |
US6316289B1 (en) * | 1998-11-12 | 2001-11-13 | Amerasia International Technology Inc. | Method of forming fine-pitch interconnections employing a standoff mask |
US6391675B1 (en) | 1998-11-25 | 2002-05-21 | Raytheon Company | Method and apparatus for switching high frequency signals |
US6501107B1 (en) | 1998-12-02 | 2002-12-31 | Microsoft Corporation | Addressable fuse array for circuits and mechanical devices |
JP3332879B2 (en) | 1998-12-02 | 2002-10-07 | キヤノン株式会社 | Dichroic mirror |
US6335831B2 (en) | 1998-12-18 | 2002-01-01 | Eastman Kodak Company | Multilevel mechanical grating device |
GB9827945D0 (en) | 1998-12-19 | 1999-02-10 | Secr Defence | Method of driving a spatial light modulator |
JP3119255B2 (en) | 1998-12-22 | 2000-12-18 | 日本電気株式会社 | Micromachine switch and method of manufacturing the same |
US6358021B1 (en) | 1998-12-29 | 2002-03-19 | Honeywell International Inc. | Electrostatic actuators for active surfaces |
US6215221B1 (en) | 1998-12-29 | 2001-04-10 | Honeywell International Inc. | Electrostatic/pneumatic actuators for active surfaces |
US6590549B1 (en) | 1998-12-30 | 2003-07-08 | Texas Instruments Incorporated | Analog pulse width modulation of video data |
US6188519B1 (en) | 1999-01-05 | 2001-02-13 | Kenneth Carlisle Johnson | Bigrating light valve |
JP4511739B2 (en) | 1999-01-15 | 2010-07-28 | ザ リージェンツ オブ ザ ユニヴァーシティ オブ カリフォルニア | Polycrystalline silicon germanium films for forming microelectromechanical systems |
JP2000214804A (en) * | 1999-01-20 | 2000-08-04 | Fuji Photo Film Co Ltd | Light modulation element, aligner, and planar display |
US6242932B1 (en) | 1999-02-19 | 2001-06-05 | Micron Technology, Inc. | Interposer for semiconductor components having contact balls |
JP3864204B2 (en) | 1999-02-19 | 2006-12-27 | 株式会社日立プラズマパテントライセンシング | Plasma display panel |
US7683926B2 (en) | 1999-02-25 | 2010-03-23 | Visionsense Ltd. | Optical device |
US6606175B1 (en) | 1999-03-16 | 2003-08-12 | Sharp Laboratories Of America, Inc. | Multi-segment light-emitting diode |
US6446486B1 (en) | 1999-04-26 | 2002-09-10 | Sandia Corporation | Micromachine friction test apparatus |
US6782240B1 (en) | 2000-04-27 | 2004-08-24 | Joseph A Tabe | Megatel communication information system |
JP3657143B2 (en) | 1999-04-27 | 2005-06-08 | シャープ株式会社 | Solar cell and manufacturing method thereof |
US7012600B2 (en) | 1999-04-30 | 2006-03-14 | E Ink Corporation | Methods for driving bistable electro-optic displays, and apparatus for use therein |
TW477897B (en) | 1999-05-07 | 2002-03-01 | Sharp Kk | Liquid crystal display device, method and device to measure cell thickness of liquid crystal display device, and phase difference plate using the method thereof |
US6449084B1 (en) | 1999-05-10 | 2002-09-10 | Yanping Guo | Optical deflector |
US6323987B1 (en) | 1999-05-14 | 2001-11-27 | Agere Systems Optoelectronics Guardian Corp. | Controlled multi-wavelength etalon |
NL1015202C2 (en) | 1999-05-20 | 2002-03-26 | Nec Corp | Active matrix type liquid crystal display device includes adder provided by making scanning line and pixel electrode connected to gate electrode of TFT to overlap via insulating and semiconductor films |
TW523727B (en) | 1999-05-27 | 2003-03-11 | Koninkl Philips Electronics Nv | Display device |
FI107085B (en) | 1999-05-28 | 2001-05-31 | Ics Intelligent Control System | light Panel |
US6297811B1 (en) | 1999-06-02 | 2001-10-02 | Elo Touchsystems, Inc. | Projective capacitive touchscreen |
US6201633B1 (en) | 1999-06-07 | 2001-03-13 | Xerox Corporation | Micro-electromechanical based bistable color display sheets |
US6597419B1 (en) | 1999-07-02 | 2003-07-22 | Minolta Co., Ltd. | Liquid crystal display including filter means with 10-70% transmittance in the selective reflection wavelength range |
JP2001021883A (en) | 1999-07-06 | 2001-01-26 | Nec Corp | Reflective liquid crystal display device and electronic equipment |
GB2351866A (en) | 1999-07-07 | 2001-01-10 | Sharp Kk | Stereoscopic display |
TW473471B (en) | 1999-07-21 | 2002-01-21 | Ind Tech Res Inst | Process for preparing pentenoic ester |
US6862029B1 (en) | 1999-07-27 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Color display system |
US6331909B1 (en) | 1999-08-05 | 2001-12-18 | Microvision, Inc. | Frequency tunable resonant scanner |
US6525310B2 (en) | 1999-08-05 | 2003-02-25 | Microvision, Inc. | Frequency tunable resonant scanner |
US6674563B2 (en) | 2000-04-13 | 2004-01-06 | Lightconnect, Inc. | Method and apparatus for device linearization |
US6335235B1 (en) | 1999-08-17 | 2002-01-01 | Advanced Micro Devices, Inc. | Simplified method of patterning field dielectric regions in a semiconductor device |
US6507330B1 (en) | 1999-09-01 | 2003-01-14 | Displaytech, Inc. | DC-balanced and non-DC-balanced drive schemes for liquid crystal devices |
US6275326B1 (en) | 1999-09-21 | 2001-08-14 | Lucent Technologies Inc. | Control arrangement for microelectromechanical devices and systems |
GB2354899A (en) | 1999-10-02 | 2001-04-04 | Sharp Kk | Optical device for projection display |
WO2003007049A1 (en) | 1999-10-05 | 2003-01-23 | Iridigm Display Corporation | Photonic mems and structures |
US6351329B1 (en) | 1999-10-08 | 2002-02-26 | Lucent Technologies Inc. | Optical attenuator |
US6741383B2 (en) | 2000-08-11 | 2004-05-25 | Reflectivity, Inc. | Deflectable micromirrors with stopping mechanisms |
US6960305B2 (en) | 1999-10-26 | 2005-11-01 | Reflectivity, Inc | Methods for forming and releasing microelectromechanical structures |
US6549338B1 (en) | 1999-11-12 | 2003-04-15 | Texas Instruments Incorporated | Bandpass filter to reduce thermal impact of dichroic light shift |
US6552840B2 (en) | 1999-12-03 | 2003-04-22 | Texas Instruments Incorporated | Electrostatic efficiency of micromechanical devices |
US6674090B1 (en) | 1999-12-27 | 2004-01-06 | Xerox Corporation | Structure and method for planar lateral oxidation in active |
US6548908B2 (en) | 1999-12-27 | 2003-04-15 | Xerox Corporation | Structure and method for planar lateral oxidation in passive devices |
US6545335B1 (en) | 1999-12-27 | 2003-04-08 | Xerox Corporation | Structure and method for electrical isolation of optoelectronic integrated circuits |
JP2001249287A (en) | 1999-12-30 | 2001-09-14 | Texas Instr Inc <Ti> | Method for operating bistabl micro mirror array |
US6519073B1 (en) | 2000-01-10 | 2003-02-11 | Lucent Technologies Inc. | Micromechanical modulator and methods for fabricating the same |
PT1849621E (en) | 2000-01-21 | 2014-06-03 | Jds Uniphase Corp | Optically variable security devices |
US6307663B1 (en) | 2000-01-26 | 2001-10-23 | Eastman Kodak Company | Spatial light modulator with conformal grating device |
US6456301B1 (en) | 2000-01-28 | 2002-09-24 | Intel Corporation | Temporal light modulation technique and apparatus |
JP2002162652A (en) | 2000-01-31 | 2002-06-07 | Fujitsu Ltd | Sheet-like display device, resin spherical body and microcapsule |
WO2001057841A1 (en) | 2000-02-02 | 2001-08-09 | 3M Touch System, INC. | Touch screen with polarizer and method of making same |
US6407851B1 (en) | 2000-08-01 | 2002-06-18 | Mohammed N. Islam | Micromechanical optical switch |
AU2001232008A1 (en) | 2000-02-07 | 2001-08-14 | Quantumbeam Limited | Optical free space signalling system |
US7098884B2 (en) | 2000-02-08 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor display device and method of driving semiconductor display device |
JP2001221913A (en) | 2000-02-08 | 2001-08-17 | Yokogawa Electric Corp | Fabry-perot filter and ir gas analyzer |
GB2359636B (en) | 2000-02-22 | 2002-05-01 | Marconi Comm Ltd | Wavelength selective optical filter |
JP2003524215A (en) | 2000-02-24 | 2003-08-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Display device with optical waveguide |
WO2001063232A1 (en) | 2000-02-24 | 2001-08-30 | University Of Virginia Patent Foundation | High sensitivity infrared sensing apparatus and related method thereof |
US20030004272A1 (en) | 2000-03-01 | 2003-01-02 | Power Mark P J | Data transfer method and apparatus |
US6836366B1 (en) | 2000-03-03 | 2004-12-28 | Axsun Technologies, Inc. | Integrated tunable fabry-perot filter and method of making same |
JP4357071B2 (en) | 2000-03-09 | 2009-11-04 | 株式会社東芝 | Semiconductor device and semiconductor memory device |
ATE302429T1 (en) | 2000-03-14 | 2005-09-15 | Koninkl Philips Electronics Nv | LIQUID CRYSTAL DISPLAY DEVICE WITH MEANS FOR TEMPERATURE COMPENSATION OF THE OPERATING VOLTAGE |
US6747775B2 (en) | 2000-03-20 | 2004-06-08 | Np Photonics, Inc. | Detunable Fabry-Perot interferometer and an add/drop multiplexer using the same |
US6665109B2 (en) | 2000-03-20 | 2003-12-16 | Np Photonics, Inc. | Compliant mechanism and method of forming same |
EP1269619A2 (en) | 2000-03-22 | 2003-01-02 | Onix Microsystems Inc. | Two-dimensional gimbaled scanning actuator with vertical electrostatic comb-drive for actuation and/or sensing |
US20010051014A1 (en) | 2000-03-24 | 2001-12-13 | Behrang Behin | Optical switch employing biased rotatable combdrive devices and methods |
US6698295B1 (en) | 2000-03-31 | 2004-03-02 | Shipley Company, L.L.C. | Microstructures comprising silicon nitride layer and thin conductive polysilicon layer |
US6788520B1 (en) | 2000-04-10 | 2004-09-07 | Behrang Behin | Capacitive sensing scheme for digital control state detection in optical switches |
US6400738B1 (en) | 2000-04-14 | 2002-06-04 | Agilent Technologies, Inc. | Tunable Fabry-Perot filters and lasers |
KR100481590B1 (en) | 2000-04-21 | 2005-04-08 | 세이코 엡슨 가부시키가이샤 | Electrooptic device, projection type display and method for manufacturing electrooptic device |
US6850217B2 (en) | 2000-04-27 | 2005-02-01 | Manning Ventures, Inc. | Operating method for active matrix addressed bistable reflective cholesteric displays |
US6356085B1 (en) | 2000-05-09 | 2002-03-12 | Pacesetter, Inc. | Method and apparatus for converting capacitance to voltage |
US6864882B2 (en) | 2000-05-24 | 2005-03-08 | Next Holdings Limited | Protected touch panel display system |
US7008812B1 (en) | 2000-05-30 | 2006-03-07 | Ic Mechanics, Inc. | Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation |
JP2001343514A (en) | 2000-05-30 | 2001-12-14 | Victor Co Of Japan Ltd | Hologram color filter |
JP3843703B2 (en) | 2000-06-13 | 2006-11-08 | 富士ゼロックス株式会社 | Optical writable recording and display device |
JP2001356701A (en) | 2000-06-15 | 2001-12-26 | Fuji Photo Film Co Ltd | Optical element, light source unit and display device |
US6466190B1 (en) | 2000-06-19 | 2002-10-15 | Koninklijke Philips Electronics N.V. | Flexible color modulation tables of ratios for generating color modulation patterns |
US7583335B2 (en) | 2000-06-27 | 2009-09-01 | Citizen Holdings Co., Ltd. | Liquid crystal display device |
US6473274B1 (en) | 2000-06-28 | 2002-10-29 | Texas Instruments Incorporated | Symmetrical microactuator structure for use in mass data storage devices, or the like |
US6384953B1 (en) | 2000-06-29 | 2002-05-07 | The United States Of America As Represented By The Secretary Of The Navy | Micro-dynamic optical device |
FR2811139B1 (en) | 2000-06-29 | 2003-10-17 | Centre Nat Rech Scient | OPTOELECTRONIC DEVICE WITH INTEGRATED WAVELENGTH FILTERING |
TW535024B (en) | 2000-06-30 | 2003-06-01 | Minolta Co Ltd | Liquid display element and method of producing the same |
EP1802114B1 (en) | 2000-07-03 | 2011-11-23 | Sony Corporation | Optical multilayer structure, optical switching device, and image display |
GB0017008D0 (en) | 2000-07-12 | 2000-08-30 | Street Graham S B | Structured light source |
EP1172681A3 (en) | 2000-07-13 | 2004-06-09 | Creo IL. Ltd. | Blazed micro-mechanical light modulator and array thereof |
US6456420B1 (en) | 2000-07-27 | 2002-09-24 | Mcnc | Microelectromechanical elevating structures |
US6853129B1 (en) | 2000-07-28 | 2005-02-08 | Candescent Technologies Corporation | Protected substrate structure for a field emission display device |
KR20020010322A (en) | 2000-07-29 | 2002-02-04 | 구본준, 론 위라하디락사 | Display device using micro electro-mechanical system |
US6778155B2 (en) | 2000-07-31 | 2004-08-17 | Texas Instruments Incorporated | Display operation with inserted block clears |
US6795605B1 (en) | 2000-08-01 | 2004-09-21 | Cheetah Omni, Llc | Micromechanical optical switch |
US6867897B2 (en) | 2003-01-29 | 2005-03-15 | Reflectivity, Inc | Micromirrors and off-diagonal hinge structures for micromirror arrays in projection displays |
JP2002062490A (en) | 2000-08-14 | 2002-02-28 | Canon Inc | Interferrometric modulation device |
JP2002062505A (en) | 2000-08-14 | 2002-02-28 | Canon Inc | Projection type display deice and interference modulation element used therefor |
US6635919B1 (en) | 2000-08-17 | 2003-10-21 | Texas Instruments Incorporated | High Q-large tuning range micro-electro mechanical system (MEMS) varactor for broadband applications |
US6376787B1 (en) | 2000-08-24 | 2002-04-23 | Texas Instruments Incorporated | Microelectromechanical switch with fixed metal electrode/dielectric interface with a protective cap layer |
US6643069B2 (en) | 2000-08-31 | 2003-11-04 | Texas Instruments Incorporated | SLM-base color projection display having multiple SLM's and multiple projection lenses |
JP4304852B2 (en) | 2000-09-04 | 2009-07-29 | コニカミノルタホールディングス株式会社 | Non-flat liquid crystal display element and method for manufacturing the same |
JP2002075037A (en) | 2000-09-05 | 2002-03-15 | Minebea Co Ltd | Surface lighting equipment |
US6466354B1 (en) | 2000-09-19 | 2002-10-15 | Silicon Light Machines | Method and apparatus for interferometric modulation of light |
US6707594B2 (en) | 2000-09-20 | 2004-03-16 | General Nutronics, Inc. | Method and device for switching wavelength division multiplexed optical signals using two-dimensional micro-electromechanical mirrors |
GB2371119A (en) | 2000-09-25 | 2002-07-17 | Marconi Caswell Ltd | Micro electro-mechanical systems |
JP2004511824A (en) | 2000-10-12 | 2004-04-15 | レベオ, インコーポレイティッド | Digital light processing 3D projection system and method |
US7072086B2 (en) | 2001-10-19 | 2006-07-04 | Batchko Robert G | Digital focus lens system |
US6504118B2 (en) | 2000-10-27 | 2003-01-07 | Daniel J Hyman | Microfabricated double-throw relay with multimorph actuator and electrostatic latch mechanism |
US6714565B1 (en) | 2000-11-01 | 2004-03-30 | Agilent Technologies, Inc. | Optically tunable Fabry Perot microelectromechanical resonator |
JP3466148B2 (en) | 2000-11-02 | 2003-11-10 | 富士通株式会社 | Galvanometer mirror manufacturing method and galvanometer mirror |
US6556338B2 (en) | 2000-11-03 | 2003-04-29 | Intpax, Inc. | MEMS based variable optical attenuator (MBVOA) |
US6859218B1 (en) | 2000-11-07 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | Electronic display devices and methods |
US6593934B1 (en) | 2000-11-16 | 2003-07-15 | Industrial Technology Research Institute | Automatic gamma correction system for displays |
US6433917B1 (en) | 2000-11-22 | 2002-08-13 | Ball Semiconductor, Inc. | Light modulation device and system |
US6647171B1 (en) | 2000-12-01 | 2003-11-11 | Corning Incorporated | MEMS optical switch actuator |
US6504641B2 (en) | 2000-12-01 | 2003-01-07 | Agere Systems Inc. | Driver and method of operating a micro-electromechanical system device |
JP2002175053A (en) | 2000-12-07 | 2002-06-21 | Sony Corp | Active matrix display and mobile terminal which uses the same |
US6847752B2 (en) | 2000-12-07 | 2005-01-25 | Bluebird Optical Mems Ltd. | Integrated actuator for optical switch mirror array |
US7307775B2 (en) | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US6906847B2 (en) | 2000-12-07 | 2005-06-14 | Reflectivity, Inc | Spatial light modulators with light blocking/absorbing areas |
JP2002174780A (en) | 2000-12-08 | 2002-06-21 | Stanley Electric Co Ltd | Reflection type color display device |
AU2002222123A1 (en) | 2000-12-11 | 2002-06-24 | Rad H Dabbaj | Electrostatic device |
US6614576B2 (en) | 2000-12-15 | 2003-09-02 | Texas Instruments Incorporated | Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices |
US6756996B2 (en) | 2000-12-19 | 2004-06-29 | Intel Corporation | Obtaining a high refresh rate display using a low bandwidth digital interface |
JP4361206B2 (en) | 2000-12-21 | 2009-11-11 | 日東電工株式会社 | Optical film and liquid crystal display device |
DE10064616C2 (en) | 2000-12-22 | 2003-02-06 | Ovd Kinegram Ag Zug | Decorative film and method for labeling the decorative film |
US20020149834A1 (en) | 2000-12-22 | 2002-10-17 | Ball Semiconductor, Inc. | Light modulation device and system |
FR2818795B1 (en) | 2000-12-27 | 2003-12-05 | Commissariat Energie Atomique | MICRO-DEVICE WITH THERMAL ACTUATOR |
US6775174B2 (en) | 2000-12-28 | 2004-08-10 | Texas Instruments Incorporated | Memory architecture for micromirror cell |
US6625047B2 (en) | 2000-12-31 | 2003-09-23 | Texas Instruments Incorporated | Micromechanical memory element |
WO2002058089A1 (en) | 2001-01-19 | 2002-07-25 | Massachusetts Institute Of Technology | Bistable actuation techniques, mechanisms, and applications |
JP2002221678A (en) | 2001-01-25 | 2002-08-09 | Seiko Epson Corp | Optical switching device, method of manufacturing for the same and image display device |
WO2002061781A1 (en) | 2001-01-30 | 2002-08-08 | Advantest Corporation | Switch and integrated circuit device |
EP1461802A4 (en) | 2001-02-07 | 2008-10-01 | Visible Tech Knowledgy Llc | Smart electronic label employing electronic ink |
US6620712B2 (en) | 2001-02-14 | 2003-09-16 | Intpax, Inc. | Defined sacrifical region via ion implantation for micro-opto-electro-mechanical system (MOEMS) applications |
AU2002250271A1 (en) | 2001-03-02 | 2002-09-19 | Massachusetts Institute Of Technology | Methods and apparatus for diffractive optical processing using an actuatable structure |
WO2002080255A1 (en) | 2001-03-16 | 2002-10-10 | Corning Intellisense Corporation | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
US6912078B2 (en) | 2001-03-16 | 2005-06-28 | Corning Incorporated | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
JP2002277771A (en) | 2001-03-21 | 2002-09-25 | Ricoh Co Ltd | Optical modulator |
FR2822541B1 (en) | 2001-03-21 | 2003-10-03 | Commissariat Energie Atomique | METHODS AND DEVICES FOR MANUFACTURING RADIATION DETECTORS |
JP3888075B2 (en) | 2001-03-23 | 2007-02-28 | セイコーエプソン株式会社 | Optical switching element, optical switching device, and image display apparatus |
US6661561B2 (en) | 2001-03-26 | 2003-12-09 | Creo Inc. | High frequency deformable mirror device |
US6630786B2 (en) | 2001-03-30 | 2003-10-07 | Candescent Technologies Corporation | Light-emitting device having light-reflective layer formed with, or/and adjacent to, material that enhances device performance |
SE0101184D0 (en) | 2001-04-02 | 2001-04-02 | Ericsson Telefon Ab L M | Micro electromechanical switches |
GB0108309D0 (en) | 2001-04-03 | 2001-05-23 | Koninkl Philips Electronics Nv | Matrix array devices with flexible substrates |
US20020171610A1 (en) | 2001-04-04 | 2002-11-21 | Eastman Kodak Company | Organic electroluminescent display with integrated touch-screen |
JP2002313121A (en) | 2001-04-16 | 2002-10-25 | Nitto Denko Corp | Luminaire with touch panel and reflective liquid crystal display device |
US20020149850A1 (en) | 2001-04-17 | 2002-10-17 | E-Tek Dynamics, Inc. | Tunable optical filter |
US6600587B2 (en) | 2001-04-23 | 2003-07-29 | Memx, Inc. | Surface micromachined optical system with reinforced mirror microstructure |
US6657832B2 (en) | 2001-04-26 | 2003-12-02 | Texas Instruments Incorporated | Mechanically assisted restoring force support for micromachined membranes |
US6465355B1 (en) | 2001-04-27 | 2002-10-15 | Hewlett-Packard Company | Method of fabricating suspended microstructures |
GB2375184A (en) | 2001-05-02 | 2002-11-06 | Marconi Caswell Ltd | Wavelength selectable optical filter |
FR2824643B1 (en) | 2001-05-10 | 2003-10-31 | Jean Pierre Lazzari | LIGHT MODULATION DEVICE |
US6424094B1 (en) | 2001-05-15 | 2002-07-23 | Eastman Kodak Company | Organic electroluminescent display with integrated resistive touch screen |
US6800210B2 (en) | 2001-05-22 | 2004-10-05 | Reflectivity, Inc. | Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
US7106307B2 (en) | 2001-05-24 | 2006-09-12 | Eastman Kodak Company | Touch screen for use with an OLED display |
US6606247B2 (en) | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
US6598985B2 (en) | 2001-06-11 | 2003-07-29 | Nanogear | Optical mirror system with multi-axis rotational control |
US6822628B2 (en) | 2001-06-28 | 2004-11-23 | Candescent Intellectual Property Services, Inc. | Methods and systems for compensating row-to-row brightness variations of a field emission display |
JP4027313B2 (en) | 2001-07-05 | 2007-12-26 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Micro system switch |
JP3740444B2 (en) | 2001-07-11 | 2006-02-01 | キヤノン株式会社 | Optical deflector, optical equipment using the same, torsional oscillator |
JP4032216B2 (en) | 2001-07-12 | 2008-01-16 | ソニー株式会社 | OPTICAL MULTILAYER STRUCTURE, ITS MANUFACTURING METHOD, OPTICAL SWITCHING DEVICE, AND IMAGE DISPLAY DEVICE |
US6594059B2 (en) | 2001-07-16 | 2003-07-15 | Axsun Technologies, Inc. | Tilt mirror fabry-perot filter system, fabrication process therefor, and method of operation thereof |
KR100452112B1 (en) | 2001-07-18 | 2004-10-12 | 한국과학기술원 | Electrostatic Actuator |
JP3909812B2 (en) | 2001-07-19 | 2007-04-25 | 富士フイルム株式会社 | Display element and exposure element |
US6862022B2 (en) | 2001-07-20 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method and system for automatically selecting a vertical refresh rate for a video display monitor |
US6593834B2 (en) | 2001-07-30 | 2003-07-15 | Cindy Xing Qiu | Double-throw miniature electromagnetic microwave switches with latching mechanism |
US6589625B1 (en) | 2001-08-01 | 2003-07-08 | Iridigm Display Corporation | Hermetic seal and method to create the same |
US6600201B2 (en) | 2001-08-03 | 2003-07-29 | Hewlett-Packard Development Company, L.P. | Systems with high density packing of micromachines |
GB2378343B (en) | 2001-08-03 | 2004-05-19 | Sendo Int Ltd | Image refresh in a display |
US6632698B2 (en) | 2001-08-07 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS |
US6781208B2 (en) | 2001-08-17 | 2004-08-24 | Nec Corporation | Functional device, method of manufacturing therefor and driver circuit |
US6661562B2 (en) | 2001-08-17 | 2003-12-09 | Lucent Technologies Inc. | Optical modulator and method of manufacture thereof |
US7015457B2 (en) | 2002-03-18 | 2006-03-21 | Honeywell International Inc. | Spectrally tunable detector |
US6930364B2 (en) | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
US20030053078A1 (en) | 2001-09-17 | 2003-03-20 | Mark Missey | Microelectromechanical tunable fabry-perot wavelength monitor with thermal actuators |
WO2003028059A1 (en) | 2001-09-21 | 2003-04-03 | Hrl Laboratories, Llc | Mems switches and methods of making same |
US6866669B2 (en) | 2001-10-12 | 2005-03-15 | Cordis Corporation | Locking handle deployment mechanism for medical device and method |
US7064852B2 (en) | 2001-10-15 | 2006-06-20 | Kabushiki Kaisha Toshiba | Image forming apparatus for executing a plurality of jobs and method of controlling the apparatus |
US6787438B1 (en) | 2001-10-16 | 2004-09-07 | Teravieta Technologies, Inc. | Device having one or more contact structures interposed between a pair of electrodes |
US7004015B2 (en) | 2001-10-25 | 2006-02-28 | The Regents Of The University Of Michigan | Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein |
US6870581B2 (en) | 2001-10-30 | 2005-03-22 | Sharp Laboratories Of America, Inc. | Single panel color video projection display using reflective banded color falling-raster illumination |
WO2003040829A2 (en) | 2001-11-07 | 2003-05-15 | Applied Materials, Inc. | Maskless printer using photoelectric conversion of a light beam array |
WO2003041133A2 (en) | 2001-11-09 | 2003-05-15 | Wispry, Inc. | Electrothermal self-latching mems switch and method |
WO2003044765A2 (en) | 2001-11-20 | 2003-05-30 | E Ink Corporation | Methods for driving bistable electro-optic displays |
CN1255792C (en) | 2001-12-07 | 2006-05-10 | 松下电器产业株式会社 | Information recording medium and production thereof |
JP2003177336A (en) | 2001-12-11 | 2003-06-27 | Fuji Photo Film Co Ltd | Optical modulating element, optical modulating element array, and exposure device using the same |
JP2006504116A (en) | 2001-12-14 | 2006-02-02 | ディジタル・オプティクス・インターナショナル・コーポレイション | Uniform lighting system |
JP4190862B2 (en) | 2001-12-18 | 2008-12-03 | シャープ株式会社 | Display device and driving method thereof |
KR20040083476A (en) | 2001-12-19 | 2004-10-02 | 액츄앨리티 시스템즈, 인크. | Radiation conditioning system and method thereof |
JP3893421B2 (en) | 2001-12-27 | 2007-03-14 | 富士フイルム株式会社 | Light modulation element, light modulation element array, and exposure apparatus using the same |
US6959990B2 (en) | 2001-12-31 | 2005-11-01 | Texas Instruments Incorporated | Prism for high contrast projection |
US7012610B2 (en) | 2002-01-04 | 2006-03-14 | Ati Technologies, Inc. | Portable device for providing dual display and method thereof |
US6791735B2 (en) | 2002-01-09 | 2004-09-14 | The Regents Of The University Of California | Differentially-driven MEMS spatial light modulator |
EP1357571A1 (en) | 2002-04-24 | 2003-10-29 | Abb Research Ltd. | Microelectromechanical system and its method of manufacture |
US6750589B2 (en) | 2002-01-24 | 2004-06-15 | Honeywell International Inc. | Method and circuit for the control of large arrays of electrostatic actuators |
JP4162900B2 (en) | 2002-02-05 | 2008-10-08 | アルプス電気株式会社 | Illumination device and liquid crystal display device |
US6608268B1 (en) | 2002-02-05 | 2003-08-19 | Memtronics, A Division Of Cogent Solutions, Inc. | Proximity micro-electro-mechanical system |
US6794119B2 (en) | 2002-02-12 | 2004-09-21 | Iridigm Display Corporation | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
KR100639547B1 (en) | 2002-02-15 | 2006-10-30 | 가부시키가이샤 브리지스톤 | Image display unit |
US6643053B2 (en) | 2002-02-20 | 2003-11-04 | The Regents Of The University Of California | Piecewise linear spatial phase modulator using dual-mode micromirror arrays for temporal and diffractive fourier optics |
US6574033B1 (en) | 2002-02-27 | 2003-06-03 | Iridigm Display Corporation | Microelectromechanical systems device and method for fabricating same |
JP2003255338A (en) | 2002-02-28 | 2003-09-10 | Mitsubishi Electric Corp | Liquid crystal display |
US7283112B2 (en) | 2002-03-01 | 2007-10-16 | Microsoft Corporation | Reflective microelectrical mechanical structure (MEMS) optical modulator and optical display system |
EP1482770A4 (en) | 2002-03-01 | 2007-01-03 | Sharp Kk | Light emitting device and display unit using the light emitting device and reading device |
US6891658B2 (en) | 2002-03-04 | 2005-05-10 | The University Of British Columbia | Wide viewing angle reflective display |
EP1343190A3 (en) | 2002-03-08 | 2005-04-20 | Murata Manufacturing Co., Ltd. | Variable capacitance element |
EP1345197A1 (en) | 2002-03-11 | 2003-09-17 | Dialog Semiconductor GmbH | LCD module identification |
JP5060015B2 (en) | 2002-03-15 | 2012-10-31 | アドレア エルエルシー | Electrophoretic active matrix display device |
US6768555B2 (en) | 2002-03-21 | 2004-07-27 | Industrial Technology Research Institute | Fabry-Perot filter apparatus with enhanced optical discrimination |
US6965468B2 (en) | 2003-07-03 | 2005-11-15 | Reflectivity, Inc | Micromirror array having reduced gap between adjacent micromirrors of the micromirror array |
CN1315185C (en) | 2002-04-11 | 2007-05-09 | 皇家飞利浦电子股份有限公司 | Carrier, method of manufacturing a carrier and an electronic device |
EP1500077B1 (en) | 2002-04-19 | 2016-06-08 | TPO Hong Kong Holding Limited | Programmable drivers for display devices |
JP2003315732A (en) | 2002-04-25 | 2003-11-06 | Fuji Photo Film Co Ltd | Image display device |
US20030202264A1 (en) | 2002-04-30 | 2003-10-30 | Weber Timothy L. | Micro-mirror device |
US6954297B2 (en) | 2002-04-30 | 2005-10-11 | Hewlett-Packard Development Company, L.P. | Micro-mirror device including dielectrophoretic liquid |
US6972882B2 (en) | 2002-04-30 | 2005-12-06 | Hewlett-Packard Development Company, L.P. | Micro-mirror device with light angle amplification |
US20040212026A1 (en) | 2002-05-07 | 2004-10-28 | Hewlett-Packard Company | MEMS device having time-varying control |
US6791441B2 (en) | 2002-05-07 | 2004-09-14 | Raytheon Company | Micro-electro-mechanical switch, and methods of making and using it |
KR100433229B1 (en) | 2002-05-17 | 2004-05-28 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Display and Method of Fabricating the same |
JP2003340795A (en) | 2002-05-20 | 2003-12-02 | Sony Corp | Electrostatic drive type mems element and manufacturing method therefor, optical mems element, optical modulator, glv device and laser display |
JP3801099B2 (en) | 2002-06-04 | 2006-07-26 | 株式会社デンソー | Tunable filter, manufacturing method thereof, and optical switching device using the same |
JP2004021067A (en) | 2002-06-19 | 2004-01-22 | Sanyo Electric Co Ltd | Liquid crystal display and method for adjusting the same |
JP2004029571A (en) | 2002-06-27 | 2004-01-29 | Nokia Corp | Liquid crystal display device and device and method for adjusting vcom |
US6813059B2 (en) | 2002-06-28 | 2004-11-02 | Silicon Light Machines, Inc. | Reduced formation of asperities in contact micro-structures |
DE10228946B4 (en) | 2002-06-28 | 2004-08-26 | Universität Bremen | Optical modulator, display, use of an optical modulator and method for producing an optical modulator |
US6741377B2 (en) | 2002-07-02 | 2004-05-25 | Iridigm Display Corporation | Device having a light-absorbing mask and a method for fabricating same |
JP4001066B2 (en) | 2002-07-18 | 2007-10-31 | セイコーエプソン株式会社 | Electro-optical device, wiring board, and electronic equipment |
US6738194B1 (en) | 2002-07-22 | 2004-05-18 | The United States Of America As Represented By The Secretary Of The Navy | Resonance tunable optical filter |
US6822798B2 (en) | 2002-08-09 | 2004-11-23 | Optron Systems, Inc. | Tunable optical filter |
TWI266106B (en) | 2002-08-09 | 2006-11-11 | Sanyo Electric Co | Display device with a plurality of display panels |
US6674033B1 (en) * | 2002-08-21 | 2004-01-06 | Ming-Shan Wang | Press button type safety switch |
JP4006304B2 (en) | 2002-09-10 | 2007-11-14 | 株式会社 日立ディスプレイズ | Image display device |
TW544787B (en) | 2002-09-18 | 2003-08-01 | Promos Technologies Inc | Method of forming self-aligned contact structure with locally etched gate conductive layer |
KR100994945B1 (en) | 2002-09-19 | 2010-11-18 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | Switchable optical element |
JP4440523B2 (en) | 2002-09-19 | 2010-03-24 | 大日本印刷株式会社 | Organic EL display device by inkjet method, color filter manufacturing method, manufacturing device |
JP4057871B2 (en) | 2002-09-19 | 2008-03-05 | 東芝松下ディスプレイテクノロジー株式会社 | Liquid crystal display |
JP2004133430A (en) | 2002-09-20 | 2004-04-30 | Sony Corp | Display element, display device, and micro lens array |
US7781850B2 (en) | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
KR100512960B1 (en) | 2002-09-26 | 2005-09-07 | 삼성전자주식회사 | Flexible MEMS transducer and its manufacturing method, and flexible MEMS wireless microphone |
US7406245B2 (en) | 2004-07-27 | 2008-07-29 | Lumitex, Inc. | Flat optical fiber light emitters |
TW573170B (en) | 2002-10-11 | 2004-01-21 | Toppoly Optoelectronics Corp | Dual-sided display liquid crystal panel |
JP4347654B2 (en) | 2002-10-16 | 2009-10-21 | オリンパス株式会社 | Variable shape reflector and method of manufacturing the same |
US6986587B2 (en) | 2002-10-16 | 2006-01-17 | Olympus Corporation | Variable-shape reflection mirror and method of manufacturing the same |
US7085121B2 (en) | 2002-10-21 | 2006-08-01 | Hrl Laboratories, Llc | Variable capacitance membrane actuator for wide band tuning of microstrip resonators and filters |
FR2846318B1 (en) | 2002-10-24 | 2005-01-07 | Commissariat Energie Atomique | INTEGRATED ELECTROMECHANICAL MICROSTRUCTURE HAVING MEANS FOR ADJUSTING THE PRESSURE IN A SEALED CAVITY AND A METHOD OF ADJUSTING THE PRESSURE |
US6747785B2 (en) | 2002-10-24 | 2004-06-08 | Hewlett-Packard Development Company, L.P. | MEMS-actuated color light modulator and methods |
US6666561B1 (en) | 2002-10-28 | 2003-12-23 | Hewlett-Packard Development Company, L.P. | Continuously variable analog micro-mirror device |
US7370185B2 (en) | 2003-04-30 | 2008-05-06 | Hewlett-Packard Development Company, L.P. | Self-packaged optical interference display device having anti-stiction bumps, integral micro-lens, and reflection-absorbing layers |
US6909589B2 (en) | 2002-11-20 | 2005-06-21 | Corporation For National Research Initiatives | MEMS-based variable capacitor |
EP1563333A1 (en) | 2002-11-22 | 2005-08-17 | Advanced Nano Systems | Mems scanning mirror with tunable natural frequency |
US6844959B2 (en) | 2002-11-26 | 2005-01-18 | Reflectivity, Inc | Spatial light modulators with light absorbing areas |
US6958846B2 (en) | 2002-11-26 | 2005-10-25 | Reflectivity, Inc | Spatial light modulators with light absorbing areas |
US6741503B1 (en) | 2002-12-04 | 2004-05-25 | Texas Instruments Incorporated | SLM display data address mapping for four bank frame buffer |
US6813060B1 (en) | 2002-12-09 | 2004-11-02 | Sandia Corporation | Electrical latching of microelectromechanical devices |
WO2004054088A2 (en) | 2002-12-10 | 2004-06-24 | Koninklijke Philips Electronics N.V. | Driving of an array of micro-electro-mechanical-system (mems) elements |
TWI289708B (en) | 2002-12-25 | 2007-11-11 | Qualcomm Mems Technologies Inc | Optical interference type color display |
TW594155B (en) | 2002-12-27 | 2004-06-21 | Prime View Int Corp Ltd | Optical interference type color display and optical interference modulator |
JP2004212680A (en) | 2002-12-27 | 2004-07-29 | Fuji Photo Film Co Ltd | Optical modulator array and method of manufacturing same |
JP2004212638A (en) | 2002-12-27 | 2004-07-29 | Fuji Photo Film Co Ltd | Optical modulator and plane display element |
TW559686B (en) | 2002-12-27 | 2003-11-01 | Prime View Int Co Ltd | Optical interference type panel and the manufacturing method thereof |
JP2004212673A (en) | 2002-12-27 | 2004-07-29 | Fuji Photo Film Co Ltd | Planar display device and its driving method |
US6808953B2 (en) | 2002-12-31 | 2004-10-26 | Robert Bosch Gmbh | Gap tuning for surface micromachined structures in an epitaxial reactor |
US7002719B2 (en) | 2003-01-15 | 2006-02-21 | Lucent Technologies Inc. | Mirror for an integrated device |
JP2004219843A (en) | 2003-01-16 | 2004-08-05 | Seiko Epson Corp | Optical modulator, and display device and their manufacturing methods |
US6930816B2 (en) | 2003-01-17 | 2005-08-16 | Fuji Photo Film Co., Ltd. | Spatial light modulator, spatial light modulator array, image forming device and flat panel display |
US20040140557A1 (en) | 2003-01-21 | 2004-07-22 | United Test & Assembly Center Limited | Wl-bga for MEMS/MOEMS devices |
JP4397394B2 (en) | 2003-01-24 | 2010-01-13 | ディジタル・オプティクス・インターナショナル・コーポレイション | High density lighting system |
US20040147056A1 (en) | 2003-01-29 | 2004-07-29 | Mckinnell James C. | Micro-fabricated device and method of making |
TW557395B (en) | 2003-01-29 | 2003-10-11 | Yen Sun Technology Corp | Optical interference type reflection panel and the manufacturing method thereof |
TW200413810A (en) | 2003-01-29 | 2004-08-01 | Prime View Int Co Ltd | Light interference display panel and its manufacturing method |
US7205675B2 (en) | 2003-01-29 | 2007-04-17 | Hewlett-Packard Development Company, L.P. | Micro-fabricated device with thermoelectric device and method of making |
JP2004235465A (en) | 2003-01-30 | 2004-08-19 | Tokyo Electron Ltd | Bonding method, bonding device and sealant |
US7250930B2 (en) | 2003-02-07 | 2007-07-31 | Hewlett-Packard Development Company, L.P. | Transparent active-matrix display |
JP2004004553A (en) | 2003-02-10 | 2004-01-08 | Seiko Epson Corp | Liquid crystal display panel and driving circuit |
US7459402B2 (en) | 2003-02-12 | 2008-12-02 | Texas Instruments Incorporated | Protection layers in micromirror array devices |
US7436573B2 (en) | 2003-02-12 | 2008-10-14 | Texas Instruments Incorporated | Electrical connections in microelectromechanical devices |
US6903487B2 (en) | 2003-02-14 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Micro-mirror device with increased mirror tilt |
US7688509B2 (en) | 2003-02-21 | 2010-03-30 | Koninklijke Philips Electronics N.V. | Autostereoscopic display |
TW200417806A (en) | 2003-03-05 | 2004-09-16 | Prime View Int Corp Ltd | A structure of a light-incidence electrode of an optical interference display plate |
US6844953B2 (en) | 2003-03-12 | 2005-01-18 | Hewlett-Packard Development Company, L.P. | Micro-mirror device including dielectrophoretic liquid |
US7289404B2 (en) | 2003-03-13 | 2007-10-30 | Lg Electronics Inc. | Write-once recording medium and defective area management method and apparatus for write-once recording medium |
KR100925195B1 (en) | 2003-03-17 | 2009-11-06 | 엘지전자 주식회사 | Method and apparatus of processing image data in an interactive disk player |
JP2004286825A (en) | 2003-03-19 | 2004-10-14 | Fuji Photo Film Co Ltd | Flat panel display device |
US6913942B2 (en) | 2003-03-28 | 2005-07-05 | Reflectvity, Inc | Sacrificial layers for use in fabrications of microelectromechanical devices |
DE10314525A1 (en) | 2003-03-31 | 2004-11-04 | Osram Opto Semiconductors Gmbh | Method of manufacturing a lighting device and lighting device |
US7378655B2 (en) | 2003-04-11 | 2008-05-27 | California Institute Of Technology | Apparatus and method for sensing electromagnetic radiation using a tunable device |
TW567355B (en) | 2003-04-21 | 2003-12-21 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
TW594360B (en) | 2003-04-21 | 2004-06-21 | Prime View Int Corp Ltd | A method for fabricating an interference display cell |
TWI224235B (en) | 2003-04-21 | 2004-11-21 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
TWI226504B (en) | 2003-04-21 | 2005-01-11 | Prime View Int Co Ltd | A structure of an interference display cell |
US6741384B1 (en) | 2003-04-30 | 2004-05-25 | Hewlett-Packard Development Company, L.P. | Control of MEMS and light modulator arrays |
US7447891B2 (en) | 2003-04-30 | 2008-11-04 | Hewlett-Packard Development Company, L.P. | Light modulator with concentric control-electrode structure |
US7358966B2 (en) | 2003-04-30 | 2008-04-15 | Hewlett-Packard Development Company L.P. | Selective update of micro-electromechanical device |
US7072093B2 (en) | 2003-04-30 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Optical interference pixel display with charge control |
US7400489B2 (en) | 2003-04-30 | 2008-07-15 | Hewlett-Packard Development Company, L.P. | System and a method of driving a parallel-plate variable micro-electromechanical capacitor |
US6853476B2 (en) | 2003-04-30 | 2005-02-08 | Hewlett-Packard Development Company, L.P. | Charge control circuit for a micro-electromechanical device |
US6829132B2 (en) | 2003-04-30 | 2004-12-07 | Hewlett-Packard Development Company, L.P. | Charge control of micro-electromechanical device |
WO2004099629A2 (en) | 2003-05-01 | 2004-11-18 | University Of Florida | Vertical displacement device |
US6819469B1 (en) | 2003-05-05 | 2004-11-16 | Igor M. Koba | High-resolution spatial light modulator for 3-dimensional holographic display |
JP4075678B2 (en) | 2003-05-06 | 2008-04-16 | ソニー株式会社 | Solid-state image sensor |
US6865313B2 (en) | 2003-05-09 | 2005-03-08 | Opticnet, Inc. | Bistable latching actuator for optical switching applications |
US7218499B2 (en) | 2003-05-14 | 2007-05-15 | Hewlett-Packard Development Company, L.P. | Charge control circuit |
JP4338442B2 (en) | 2003-05-23 | 2009-10-07 | 富士フイルム株式会社 | Manufacturing method of transmissive light modulation element |
TW591716B (en) | 2003-05-26 | 2004-06-11 | Prime View Int Co Ltd | A structure of a structure release and manufacturing the same |
TW570896B (en) | 2003-05-26 | 2004-01-11 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
US6917459B2 (en) | 2003-06-03 | 2005-07-12 | Hewlett-Packard Development Company, L.P. | MEMS device and method of forming MEMS device |
TWI223855B (en) | 2003-06-09 | 2004-11-11 | Taiwan Semiconductor Mfg | Method for manufacturing reflective spatial light modulator mirror devices |
US6811267B1 (en) | 2003-06-09 | 2004-11-02 | Hewlett-Packard Development Company, L.P. | Display system with nonvisible data projection |
WO2005001900A2 (en) | 2003-06-12 | 2005-01-06 | Sirica Corporation | Steady-state-non-equilibrium distribution of free carriers and photon energy up-conversion using same |
JP2007027150A (en) | 2003-06-23 | 2007-02-01 | Hitachi Chem Co Ltd | Concentrating photovoltaic power generation system |
US6822780B1 (en) | 2003-06-23 | 2004-11-23 | Northrop Grumman Corporation | Vertically stacked spatial light modulator with multi-bit phase resolution |
US7221495B2 (en) | 2003-06-24 | 2007-05-22 | Idc Llc | Thin film precursor stack for MEMS manufacturing |
FR2857153B1 (en) | 2003-07-01 | 2005-08-26 | Commissariat Energie Atomique | BISTABLE MICRO-SWITCH WITH LOW CONSUMPTION. |
US7190337B2 (en) | 2003-07-02 | 2007-03-13 | Kent Displays Incorporated | Multi-configuration display driver |
US20070201234A1 (en) | 2003-07-21 | 2007-08-30 | Clemens Ottermann | Luminous element |
JP3722371B2 (en) | 2003-07-23 | 2005-11-30 | シャープ株式会社 | Shift register and display device |
US6862127B1 (en) | 2003-11-01 | 2005-03-01 | Fusao Ishii | High performance micromirror arrays and methods of manufacturing the same |
US6903860B2 (en) | 2003-11-01 | 2005-06-07 | Fusao Ishii | Vacuum packaged micromirror arrays and methods of manufacturing the same |
US7190380B2 (en) | 2003-09-26 | 2007-03-13 | Hewlett-Packard Development Company, L.P. | Generating and displaying spatially offset sub-frames |
JP3786106B2 (en) | 2003-08-11 | 2006-06-14 | セイコーエプソン株式会社 | Wavelength tunable optical filter and manufacturing method thereof |
US7173314B2 (en) | 2003-08-13 | 2007-02-06 | Hewlett-Packard Development Company, L.P. | Storage device having a probe and a storage cell with moveable parts |
TW200506479A (en) | 2003-08-15 | 2005-02-16 | Prime View Int Co Ltd | Color changeable pixel for an interference display |
TWI251712B (en) | 2003-08-15 | 2006-03-21 | Prime View Int Corp Ltd | Interference display plate |
TWI305599B (en) | 2003-08-15 | 2009-01-21 | Qualcomm Mems Technologies Inc | Interference display panel and method thereof |
TW593127B (en) | 2003-08-18 | 2004-06-21 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
TWI231865B (en) | 2003-08-26 | 2005-05-01 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
US20050057442A1 (en) | 2003-08-28 | 2005-03-17 | Olan Way | Adjacent display of sequential sub-images |
TWI230801B (en) | 2003-08-29 | 2005-04-11 | Prime View Int Co Ltd | Reflective display unit using interferometric modulation and manufacturing method thereof |
JP3979982B2 (en) | 2003-08-29 | 2007-09-19 | シャープ株式会社 | Interferometric modulator and display device |
TWI232333B (en) | 2003-09-03 | 2005-05-11 | Prime View Int Co Ltd | Display unit using interferometric modulation and manufacturing method thereof |
US7027204B2 (en) | 2003-09-26 | 2006-04-11 | Silicon Light Machines Corporation | High-density spatial light modulator |
US6982820B2 (en) | 2003-09-26 | 2006-01-03 | Prime View International Co., Ltd. | Color changeable pixel |
TW593126B (en) | 2003-09-30 | 2004-06-21 | Prime View Int Co Ltd | A structure of a micro electro mechanical system and manufacturing the same |
US20050068583A1 (en) | 2003-09-30 | 2005-03-31 | Gutkowski Lawrence J. | Organizing a digital image |
US6894824B2 (en) | 2003-10-02 | 2005-05-17 | Hewlett-Packard Development Company, L.P. | Micro mirror device with spring and method for the same |
US6861277B1 (en) | 2003-10-02 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method of forming MEMS device |
US20050116924A1 (en) | 2003-10-07 | 2005-06-02 | Rolltronics Corporation | Micro-electromechanical switching backplane |
JP2005121906A (en) | 2003-10-16 | 2005-05-12 | Fuji Photo Film Co Ltd | Reflection type optical modulation array element and exposure device |
US20050122306A1 (en) | 2003-10-29 | 2005-06-09 | E Ink Corporation | Electro-optic displays with single edge addressing and removable driver circuitry |
US7198873B2 (en) | 2003-11-18 | 2007-04-03 | Asml Netherlands B.V. | Lithographic processing optimization based on hypersampled correlations |
KR100791165B1 (en) | 2003-11-19 | 2008-01-03 | 히다치 가세고교 가부시끼가이샤 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
TW200524236A (en) | 2003-12-01 | 2005-07-16 | Nl Nanosemiconductor Gmbh | Optoelectronic device incorporating an interference filter |
US7142346B2 (en) | 2003-12-09 | 2006-11-28 | Idc, Llc | System and method for addressing a MEMS display |
US7161728B2 (en) | 2003-12-09 | 2007-01-09 | Idc, Llc | Area array modulation and lead reduction in interferometric modulators |
EP1544657B1 (en) | 2003-12-19 | 2012-04-04 | Barco N.V. | Broadband full white reflective display structure |
US7323217B2 (en) | 2004-01-08 | 2008-01-29 | Qualcomm Mems Technologies, Inc. | Method for making an optical interference type reflective panel |
WO2005089098A2 (en) | 2004-01-14 | 2005-09-29 | The Regents Of The University Of California | Ultra broadband mirror using subwavelength grating |
TWI235345B (en) | 2004-01-20 | 2005-07-01 | Prime View Int Co Ltd | A structure of an optical interference display unit |
US7342705B2 (en) | 2004-02-03 | 2008-03-11 | Idc, Llc | Spatial light modulator with integrated optical compensation structure |
US7532194B2 (en) * | 2004-02-03 | 2009-05-12 | Idc, Llc | Driver voltage adjuster |
JP2005235403A (en) | 2004-02-17 | 2005-09-02 | Hitachi Displays Ltd | Organic el display device |
TWI256941B (en) | 2004-02-18 | 2006-06-21 | Qualcomm Mems Technologies Inc | A micro electro mechanical system display cell and method for fabricating thereof |
US7061681B2 (en) | 2004-03-02 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | Fabry-Perot interferometer |
US7119945B2 (en) | 2004-03-03 | 2006-10-10 | Idc, Llc | Altering temporal response of microelectromechanical elements |
US7706050B2 (en) | 2004-03-05 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | Integrated modulator illumination |
TW200530669A (en) | 2004-03-05 | 2005-09-16 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
US7855824B2 (en) | 2004-03-06 | 2010-12-21 | Qualcomm Mems Technologies, Inc. | Method and system for color optimization in a display |
TWI261683B (en) | 2004-03-10 | 2006-09-11 | Qualcomm Mems Technologies Inc | Interference reflective element and repairing method thereof |
JP4581453B2 (en) | 2004-03-29 | 2010-11-17 | ソニー株式会社 | MEMS element, optical MEMS element, diffractive optical MEMS element, and laser display |
US7095545B2 (en) | 2004-04-02 | 2006-08-22 | Hewlett-Packard Development Company, L.P. | Microelectromechanical device with reset electrode |
JP2005308871A (en) | 2004-04-19 | 2005-11-04 | Aterio Design Kk | Interference color filter |
US7400041B2 (en) | 2004-04-26 | 2008-07-15 | Sriram Muthukumar | Compliant multi-composition interconnects |
US7245285B2 (en) | 2004-04-28 | 2007-07-17 | Hewlett-Packard Development Company, L.P. | Pixel device |
US7476327B2 (en) | 2004-05-04 | 2009-01-13 | Idc, Llc | Method of manufacture for microelectromechanical devices |
US7164520B2 (en) | 2004-05-12 | 2007-01-16 | Idc, Llc | Packaging for an interferometric modulator |
US7612759B2 (en) | 2004-05-12 | 2009-11-03 | Shimano Inc. | Cycle computer display apparatus |
US6970031B1 (en) | 2004-05-28 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Method and apparatus for reducing charge injection in control of MEMS electrostatic actuator array |
EP1759376A1 (en) | 2004-06-10 | 2007-03-07 | Koninklijke Philips Electronics N.V. | Light valve |
US7787170B2 (en) | 2004-06-15 | 2010-08-31 | Texas Instruments Incorporated | Micromirror array assembly with in-array pillars |
US7075700B2 (en) | 2004-06-25 | 2006-07-11 | The Boeing Company | Mirror actuator position sensor systems and methods |
US7213958B2 (en) | 2004-06-30 | 2007-05-08 | 3M Innovative Properties Company | Phosphor based illumination system having light guide and an interference reflector |
US7256922B2 (en) | 2004-07-02 | 2007-08-14 | Idc, Llc | Interferometric modulators with thin film transistors |
CA2572952C (en) | 2004-07-09 | 2012-12-04 | The University Of Cincinnati | Display capable electrowetting light valve |
TWI233916B (en) | 2004-07-09 | 2005-06-11 | Prime View Int Co Ltd | A structure of a micro electro mechanical system |
GB0415773D0 (en) | 2004-07-15 | 2004-08-18 | Koninkl Philips Electronics Nv | A flexible display device |
TWI270722B (en) | 2004-07-23 | 2007-01-11 | Au Optronics Corp | Dual-side display panel |
KR101255691B1 (en) | 2004-07-29 | 2013-04-17 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | System and method for micro-electromechanical operating of an interferometric modulator |
US7436389B2 (en) | 2004-07-29 | 2008-10-14 | Eugene J Mar | Method and system for controlling the output of a diffractive light device |
US7126741B2 (en) | 2004-08-12 | 2006-10-24 | Hewlett-Packard Development Company, L.P. | Light modulator assembly |
US7372348B2 (en) | 2004-08-20 | 2008-05-13 | Palo Alto Research Center Incorporated | Stressed material and shape memory material MEMS devices and methods for manufacturing |
US7515147B2 (en) | 2004-08-27 | 2009-04-07 | Idc, Llc | Staggered column drive circuit systems and methods |
US7889163B2 (en) | 2004-08-27 | 2011-02-15 | Qualcomm Mems Technologies, Inc. | Drive method for MEMS devices |
US7499208B2 (en) | 2004-08-27 | 2009-03-03 | Udc, Llc | Current mode display driver circuit realization feature |
US7551159B2 (en) | 2004-08-27 | 2009-06-23 | Idc, Llc | System and method of sensing actuation and release voltages of an interferometric modulator |
US7560299B2 (en) | 2004-08-27 | 2009-07-14 | Idc, Llc | Systems and methods of actuating MEMS display elements |
EP1632804B1 (en) | 2004-09-01 | 2008-06-04 | Barco, naamloze vennootschap. | Prism assembly |
US7602375B2 (en) | 2004-09-27 | 2009-10-13 | Idc, Llc | Method and system for writing data to MEMS display elements |
US7327510B2 (en) | 2004-09-27 | 2008-02-05 | Idc, Llc | Process for modifying offset voltage characteristics of an interferometric modulator |
US7586484B2 (en) | 2004-09-27 | 2009-09-08 | Idc, Llc | Controller and driver features for bi-stable display |
US7289259B2 (en) | 2004-09-27 | 2007-10-30 | Idc, Llc | Conductive bus structure for interferometric modulator array |
US20060066557A1 (en) | 2004-09-27 | 2006-03-30 | Floyd Philip D | Method and device for reflective display with time sequential color illumination |
US7612932B2 (en) | 2004-09-27 | 2009-11-03 | Idc, Llc | Microelectromechanical device with optical function separated from mechanical and electrical function |
US7355780B2 (en) | 2004-09-27 | 2008-04-08 | Idc, Llc | System and method of illuminating interferometric modulators using backlighting |
US7893919B2 (en) | 2004-09-27 | 2011-02-22 | Qualcomm Mems Technologies, Inc. | Display region architectures |
US7898521B2 (en) | 2004-09-27 | 2011-03-01 | Qualcomm Mems Technologies, Inc. | Device and method for wavelength filtering |
US20060066586A1 (en) | 2004-09-27 | 2006-03-30 | Gally Brian J | Touchscreens for displays |
US8124434B2 (en) | 2004-09-27 | 2012-02-28 | Qualcomm Mems Technologies, Inc. | Method and system for packaging a display |
US7310179B2 (en) | 2004-09-27 | 2007-12-18 | Idc, Llc | Method and device for selective adjustment of hysteresis window |
US8102407B2 (en) | 2004-09-27 | 2012-01-24 | Qualcomm Mems Technologies, Inc. | Method and device for manipulating color in a display |
US20060132383A1 (en) | 2004-09-27 | 2006-06-22 | Idc, Llc | System and method for illuminating interferometric modulator display |
US7345805B2 (en) | 2004-09-27 | 2008-03-18 | Idc, Llc | Interferometric modulator array with integrated MEMS electrical switches |
US8310441B2 (en) | 2004-09-27 | 2012-11-13 | Qualcomm Mems Technologies, Inc. | Method and system for writing data to MEMS display elements |
US7807488B2 (en) | 2004-09-27 | 2010-10-05 | Qualcomm Mems Technologies, Inc. | Display element having filter material diffused in a substrate of the display element |
US7843410B2 (en) | 2004-09-27 | 2010-11-30 | Qualcomm Mems Technologies, Inc. | Method and device for electrically programmable display |
US7710636B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Systems and methods using interferometric optical modulators and diffusers |
US7545550B2 (en) | 2004-09-27 | 2009-06-09 | Idc, Llc | Systems and methods of actuating MEMS display elements |
US7653371B2 (en) | 2004-09-27 | 2010-01-26 | Qualcomm Mems Technologies, Inc. | Selectable capacitance circuit |
US7719500B2 (en) | 2004-09-27 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | Reflective display pixels arranged in non-rectangular arrays |
US7630119B2 (en) | 2004-09-27 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Apparatus and method for reducing slippage between structures in an interferometric modulator |
US8362987B2 (en) | 2004-09-27 | 2013-01-29 | Qualcomm Mems Technologies, Inc. | Method and device for manipulating color in a display |
US7911428B2 (en) | 2004-09-27 | 2011-03-22 | Qualcomm Mems Technologies, Inc. | Method and device for manipulating color in a display |
US7561323B2 (en) | 2004-09-27 | 2009-07-14 | Idc, Llc | Optical films for directing light towards active areas of displays |
US7349141B2 (en) | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and post structures for interferometric modulation |
US7626581B2 (en) | 2004-09-27 | 2009-12-01 | Idc, Llc | Device and method for display memory using manipulation of mechanical response |
US7675669B2 (en) | 2004-09-27 | 2010-03-09 | Qualcomm Mems Technologies, Inc. | Method and system for driving interferometric modulators |
WO2006035565A1 (en) | 2004-09-27 | 2006-04-06 | Asahi Glass Company, Limited | Method for manufacturing electrode and/or black stripe for plasma display substrate |
US7532195B2 (en) | 2004-09-27 | 2009-05-12 | Idc, Llc | Method and system for reducing power consumption in a display |
US8031133B2 (en) | 2004-09-27 | 2011-10-04 | Qualcomm Mems Technologies, Inc. | Method and device for manipulating color in a display |
US7420725B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Device having a conductive light absorbing mask and method for fabricating same |
US20060176241A1 (en) | 2004-09-27 | 2006-08-10 | Sampsell Jeffrey B | System and method of transmitting video data |
US20060066594A1 (en) | 2004-09-27 | 2006-03-30 | Karen Tyger | Systems and methods for driving a bi-stable display element |
EP1800167A1 (en) | 2004-09-27 | 2007-06-27 | Idc, Llc | Reduced capacitance display element |
US7321456B2 (en) | 2004-09-27 | 2008-01-22 | Idc, Llc | Method and device for corner interferometric modulation |
US8008736B2 (en) | 2004-09-27 | 2011-08-30 | Qualcomm Mems Technologies, Inc. | Analog interferometric modulator device |
AU2005289445A1 (en) | 2004-09-27 | 2006-04-06 | Idc, Llc | Method and device for multistate interferometric light modulation |
US7564612B2 (en) | 2004-09-27 | 2009-07-21 | Idc, Llc | Photonic MEMS and structures |
US7724993B2 (en) | 2004-09-27 | 2010-05-25 | Qualcomm Mems Technologies, Inc. | MEMS switches with deforming membranes |
US7446927B2 (en) | 2004-09-27 | 2008-11-04 | Idc, Llc | MEMS switch with set and latch electrodes |
US7136213B2 (en) | 2004-09-27 | 2006-11-14 | Idc, Llc | Interferometric modulators having charge persistence |
US7184202B2 (en) | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
US7554714B2 (en) | 2004-09-27 | 2009-06-30 | Idc, Llc | Device and method for manipulation of thermal response in a modulator |
US7679627B2 (en) | 2004-09-27 | 2010-03-16 | Qualcomm Mems Technologies, Inc. | Controller and driver features for bi-stable display |
US7813026B2 (en) | 2004-09-27 | 2010-10-12 | Qualcomm Mems Technologies, Inc. | System and method of reducing color shift in a display |
US7920135B2 (en) | 2004-09-27 | 2011-04-05 | Qualcomm Mems Technologies, Inc. | Method and system for driving a bi-stable display |
US20060066596A1 (en) | 2004-09-27 | 2006-03-30 | Sampsell Jeffrey B | System and method of transmitting video data |
US7369296B2 (en) * | 2004-09-27 | 2008-05-06 | Idc, Llc | Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator |
US7369294B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | Ornamental display device |
US7928928B2 (en) | 2004-09-27 | 2011-04-19 | Qualcomm Mems Technologies, Inc. | Apparatus and method for reducing perceived color shift |
US7302157B2 (en) | 2004-09-27 | 2007-11-27 | Idc, Llc | System and method for multi-level brightness in interferometric modulation |
US7936497B2 (en) | 2004-09-27 | 2011-05-03 | Qualcomm Mems Technologies, Inc. | MEMS device having deformable membrane characterized by mechanical persistence |
US7417735B2 (en) | 2004-09-27 | 2008-08-26 | Idc, Llc | Systems and methods for measuring color and contrast in specular reflective devices |
US7508571B2 (en) | 2004-09-27 | 2009-03-24 | Idc, Llc | Optical films for controlling angular characteristics of displays |
US7304784B2 (en) | 2004-09-27 | 2007-12-04 | Idc, Llc | Reflective display device having viewable display on both sides |
US7750886B2 (en) | 2004-09-27 | 2010-07-06 | Qualcomm Mems Technologies, Inc. | Methods and devices for lighting displays |
US7372613B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | Method and device for multistate interferometric light modulation |
US7944599B2 (en) | 2004-09-27 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
US7710632B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Display device having an array of spatial light modulators with integrated color filters |
US7527995B2 (en) | 2004-09-27 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of making prestructure for MEMS systems |
US20060077126A1 (en) | 2004-09-27 | 2006-04-13 | Manish Kothari | Apparatus and method for arranging devices into an interconnected array |
US8004504B2 (en) | 2004-09-27 | 2011-08-23 | Qualcomm Mems Technologies, Inc. | Reduced capacitance display element |
US7535466B2 (en) | 2004-09-27 | 2009-05-19 | Idc, Llc | System with server based control of client device display features |
US8878825B2 (en) | 2004-09-27 | 2014-11-04 | Qualcomm Mems Technologies, Inc. | System and method for providing a variable refresh rate of an interferometric modulator display |
US7130104B2 (en) | 2004-09-27 | 2006-10-31 | Idc, Llc | Methods and devices for inhibiting tilting of a mirror in an interferometric modulator |
US7161730B2 (en) | 2004-09-27 | 2007-01-09 | Idc, Llc | System and method for providing thermal compensation for an interferometric modulator display |
JP4155361B2 (en) | 2004-09-27 | 2008-09-24 | 株式会社デュエラ | Sheet concentrator and solar cell sheet using the same |
US7630123B2 (en) | 2004-09-27 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Method and device for compensating for color shift as a function of angle of view |
JP4384005B2 (en) | 2004-10-15 | 2009-12-16 | 株式会社東芝 | Display device |
US7170697B2 (en) | 2004-10-20 | 2007-01-30 | Hewlett-Packard Development Company, L.P. | Programmable waveform for lamp ballast |
JP4688131B2 (en) | 2004-10-21 | 2011-05-25 | 株式会社リコー | Optical deflection apparatus, optical deflection array, optical system, and image projection display apparatus |
US7139112B2 (en) | 2004-10-27 | 2006-11-21 | United Microdisplay Optronics Corp. | Spatial light modulator and method for color management |
US8203402B2 (en) | 2004-10-27 | 2012-06-19 | Epcos Ag | Electronic device |
US20080068697A1 (en) | 2004-10-29 | 2008-03-20 | Haluzak Charles C | Micro-Displays and Their Manufacture |
US20060132927A1 (en) | 2004-11-30 | 2006-06-22 | Yoon Frank C | Electrowetting chromatophore |
TW200628877A (en) | 2005-02-04 | 2006-08-16 | Prime View Int Co Ltd | Method of manufacturing optical interference type color display |
US7521666B2 (en) | 2005-02-17 | 2009-04-21 | Capella Microsystems Inc. | Multi-cavity Fabry-Perot ambient light filter apparatus |
US8310442B2 (en) | 2005-02-23 | 2012-11-13 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US7405852B2 (en) | 2005-02-23 | 2008-07-29 | Pixtronix, Inc. | Display apparatus and methods for manufacture thereof |
US7675665B2 (en) | 2005-02-23 | 2010-03-09 | Pixtronix, Incorporated | Methods and apparatus for actuating displays |
US7375465B2 (en) | 2005-05-19 | 2008-05-20 | Chunghwa Picture Tubes, Ltd. | Plasma display panel with single sided driving circuit |
US7884989B2 (en) | 2005-05-27 | 2011-02-08 | Qualcomm Mems Technologies, Inc. | White interferometric modulators and methods for forming the same |
TW200641422A (en) | 2005-05-30 | 2006-12-01 | Polarlite Corp | Transparent type light guiding module |
US7460292B2 (en) | 2005-06-03 | 2008-12-02 | Qualcomm Mems Technologies, Inc. | Interferometric modulator with internal polarization and drive method |
US7349188B2 (en) | 2005-06-06 | 2008-03-25 | Eaton Corporation | Arc fault detector responsive to patterns in interval to interval change in integrated sensed current values |
US7184195B2 (en) | 2005-06-15 | 2007-02-27 | Miradia Inc. | Method and structure reducing parasitic influences of deflection devices in an integrated spatial light modulator |
EP1910216A1 (en) | 2005-07-22 | 2008-04-16 | QUALCOMM Incorporated | Support structure for mems device and methods therefor |
EP2495212A3 (en) | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
KR20080040715A (en) | 2005-07-22 | 2008-05-08 | 콸콤 인코포레이티드 | Support structure for mems device and methods therefor |
KR101423321B1 (en) | 2005-07-22 | 2014-07-30 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | Electomechanical devices having support structures and methods of fabricating the same |
DE102005046156B3 (en) | 2005-09-27 | 2007-05-31 | Siemens Ag | Device with functional element and method for manufacturing the device |
JP4641478B2 (en) * | 2005-09-27 | 2011-03-02 | キヤノン株式会社 | Optical scanning device and image forming apparatus using the same |
US8574823B2 (en) | 2005-10-05 | 2013-11-05 | Hewlett-Packard Development Company, L.P. | Multi-level layer |
US7513327B1 (en) | 2005-10-13 | 2009-04-07 | Kent Peterson | System for converting a recreational vehicle |
GB0521251D0 (en) | 2005-10-19 | 2005-11-30 | Qinetiq Ltd | Optical modulation |
US7760197B2 (en) | 2005-10-31 | 2010-07-20 | Hewlett-Packard Development Company, L.P. | Fabry-perot interferometric MEMS electromagnetic wave modulator with zero-electric field |
KR101146527B1 (en) | 2005-11-30 | 2012-05-25 | 엘지디스플레이 주식회사 | Gate in panel structure liquid crystal display device and method of fabricating the same |
JP2007167998A (en) | 2005-12-20 | 2007-07-05 | Toshiba Corp | Device having beam structure and semiconductor device |
US7417746B2 (en) | 2005-12-29 | 2008-08-26 | Xerox Corporation | Fabry-perot tunable filter systems and methods |
US7916980B2 (en) | 2006-01-13 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Interconnect structure for MEMS device |
US7382515B2 (en) | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
US7652814B2 (en) | 2006-01-27 | 2010-01-26 | Qualcomm Mems Technologies, Inc. | MEMS device with integrated optical element |
US7603001B2 (en) | 2006-02-17 | 2009-10-13 | Qualcomm Mems Technologies, Inc. | Method and apparatus for providing back-lighting in an interferometric modulator display device |
US7550810B2 (en) | 2006-02-23 | 2009-06-23 | Qualcomm Mems Technologies, Inc. | MEMS device having a layer movable at asymmetric rates |
US7450295B2 (en) | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
JP5051123B2 (en) | 2006-03-28 | 2012-10-17 | 富士通株式会社 | Movable element |
US7477440B1 (en) | 2006-04-06 | 2009-01-13 | Miradia Inc. | Reflective spatial light modulator having dual layer electrodes and method of fabricating same |
US7643203B2 (en) | 2006-04-10 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | Interferometric optical display system with broadband characteristics |
US7623287B2 (en) | 2006-04-19 | 2009-11-24 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
US7417784B2 (en) | 2006-04-19 | 2008-08-26 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing a porous surface |
US7711239B2 (en) | 2006-04-19 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing nanoparticles |
US7527996B2 (en) | 2006-04-19 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
US20070249078A1 (en) | 2006-04-19 | 2007-10-25 | Ming-Hau Tung | Non-planar surface structures and process for microelectromechanical systems |
US8004743B2 (en) | 2006-04-21 | 2011-08-23 | Qualcomm Mems Technologies, Inc. | Method and apparatus for providing brightness control in an interferometric modulator (IMOD) display |
JP4876697B2 (en) | 2006-04-28 | 2012-02-15 | ブラザー工業株式会社 | Image processing apparatus and image processing program |
US7369292B2 (en) | 2006-05-03 | 2008-05-06 | Qualcomm Mems Technologies, Inc. | Electrode and interconnect materials for MEMS devices |
US7649671B2 (en) | 2006-06-01 | 2010-01-19 | Qualcomm Mems Technologies, Inc. | Analog interferometric modulator device with electrostatic actuation and release |
US7405863B2 (en) | 2006-06-01 | 2008-07-29 | Qualcomm Mems Technologies, Inc. | Patterning of mechanical layer in MEMS to reduce stresses at supports |
US7321457B2 (en) | 2006-06-01 | 2008-01-22 | Qualcomm Incorporated | Process and structure for fabrication of MEMS device having isolated edge posts |
US7766498B2 (en) | 2006-06-21 | 2010-08-03 | Qualcomm Mems Technologies, Inc. | Linear solid state illuminator |
US7527998B2 (en) | 2006-06-30 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of manufacturing MEMS devices providing air gap control |
US7566664B2 (en) | 2006-08-02 | 2009-07-28 | Qualcomm Mems Technologies, Inc. | Selective etching of MEMS using gaseous halides and reactive co-etchants |
US7845841B2 (en) | 2006-08-28 | 2010-12-07 | Qualcomm Mems Technologies, Inc. | Angle sweeping holographic illuminator |
KR20090094241A (en) | 2006-10-06 | 2009-09-04 | 퀄컴 엠이엠스 테크놀로지스, 인크. | Thin light bar and method of manufacturing |
US8872085B2 (en) | 2006-10-06 | 2014-10-28 | Qualcomm Mems Technologies, Inc. | Display device having front illuminator with turning features |
US8107155B2 (en) | 2006-10-06 | 2012-01-31 | Qualcomm Mems Technologies, Inc. | System and method for reducing visual artifacts in displays |
EP2069840A1 (en) | 2006-10-06 | 2009-06-17 | Qualcomm Mems Technologies, Inc. | Apparatus and method for reducing back reflection from an illumination device |
EP2366945A1 (en) | 2006-10-06 | 2011-09-21 | Qualcomm Mems Technologies, Inc. | Optical loss layer integrated in an illumination apparatus of a display |
EP2069838A2 (en) | 2006-10-06 | 2009-06-17 | Qualcomm Mems Technologies, Inc. | Illumination device with built-in light coupler |
US7855827B2 (en) | 2006-10-06 | 2010-12-21 | Qualcomm Mems Technologies, Inc. | Internal optical isolation structure for integrated front or back lighting |
EP2069839A2 (en) | 2006-10-06 | 2009-06-17 | Qualcomm Mems Technologies, Inc. | Light bar with reflector |
WO2008045463A2 (en) | 2006-10-10 | 2008-04-17 | Qualcomm Mems Technologies, Inc. | Display device with diffractive optics |
US7864395B2 (en) | 2006-10-27 | 2011-01-04 | Qualcomm Mems Technologies, Inc. | Light guide including optical scattering elements and a method of manufacture |
US7535621B2 (en) | 2006-12-27 | 2009-05-19 | Qualcomm Mems Technologies, Inc. | Aluminum fluoride films for microelectromechanical system applications |
US20080158648A1 (en) | 2006-12-29 | 2008-07-03 | Cummings William J | Peripheral switches for MEMS display test |
US7403180B1 (en) | 2007-01-29 | 2008-07-22 | Qualcomm Mems Technologies, Inc. | Hybrid color synthesis for multistate reflective modulator displays |
US7777954B2 (en) | 2007-01-30 | 2010-08-17 | Qualcomm Mems Technologies, Inc. | Systems and methods of providing a light guiding layer |
US20080192029A1 (en) | 2007-02-08 | 2008-08-14 | Michael Hugh Anderson | Passive circuits for de-multiplexing display inputs |
US7916378B2 (en) | 2007-03-08 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Method and apparatus for providing a light absorbing mask in an interferometric modulator display |
US7733552B2 (en) | 2007-03-21 | 2010-06-08 | Qualcomm Mems Technologies, Inc | MEMS cavity-coating layers and methods |
US7733439B2 (en) | 2007-04-30 | 2010-06-08 | Qualcomm Mems Technologies, Inc. | Dual film light guide for illuminating displays |
US7580175B2 (en) | 2007-06-21 | 2009-08-25 | Alcatel-Lucent Usa Inc. | Detector of infrared radiation having a bi-material transducer |
US7569488B2 (en) | 2007-06-22 | 2009-08-04 | Qualcomm Mems Technologies, Inc. | Methods of making a MEMS device by monitoring a process parameter |
WO2009006163A2 (en) | 2007-06-29 | 2009-01-08 | Itt Manufacturing Enterprises, Inc. | Thermally conductive structural composite material and method |
US7630121B2 (en) | 2007-07-02 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
US7595926B2 (en) | 2007-07-05 | 2009-09-29 | Qualcomm Mems Technologies, Inc. | Integrated IMODS and solar cells on a substrate |
CA2694044C (en) | 2007-07-25 | 2017-02-28 | Qualcomm Mems Technologies, Inc. | Mems display devices and methods of fabricating the same |
EP2183623A1 (en) | 2007-07-31 | 2010-05-12 | Qualcomm Mems Technologies, Inc. | Devices for enhancing colour shift of interferometric modulators |
US8072402B2 (en) | 2007-08-29 | 2011-12-06 | Qualcomm Mems Technologies, Inc. | Interferometric optical modulator with broadband reflection characteristics |
US20090078316A1 (en) | 2007-09-24 | 2009-03-26 | Qualcomm Incorporated | Interferometric photovoltaic cell |
JP5209727B2 (en) | 2007-10-19 | 2013-06-12 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Display with integrated photovoltaic device |
US8058549B2 (en) | 2007-10-19 | 2011-11-15 | Qualcomm Mems Technologies, Inc. | Photovoltaic devices with integrated color interferometric film stacks |
US20090293955A1 (en) | 2007-11-07 | 2009-12-03 | Qualcomm Incorporated | Photovoltaics with interferometric masks |
US20090126792A1 (en) | 2007-11-16 | 2009-05-21 | Qualcomm Incorporated | Thin film solar concentrator/collector |
US8068710B2 (en) | 2007-12-07 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | Decoupled holographic film and diffuser |
US7949213B2 (en) | 2007-12-07 | 2011-05-24 | Qualcomm Mems Technologies, Inc. | Light illumination of displays with front light guide and coupling elements |
WO2009079279A2 (en) | 2007-12-17 | 2009-06-25 | Qualcomm Mems Technologies, Inc. | Photovoltaics with interferometric back side masks |
CA2710198A1 (en) | 2007-12-21 | 2009-07-09 | Qualcomm Mems Technologies, Inc. | Multijunction photovoltaic cells |
US20090168459A1 (en) | 2007-12-27 | 2009-07-02 | Qualcomm Incorporated | Light guide including conjugate film |
US7643305B2 (en) | 2008-03-07 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | System and method of preventing damage to metal traces of flexible printed circuits |
US7898723B2 (en) | 2008-04-02 | 2011-03-01 | Qualcomm Mems Technologies, Inc. | Microelectromechanical systems display element with photovoltaic structure |
US7768690B2 (en) | 2008-06-25 | 2010-08-03 | Qualcomm Mems Technologies, Inc. | Backlight displays |
US8023167B2 (en) | 2008-06-25 | 2011-09-20 | Qualcomm Mems Technologies, Inc. | Backlight displays |
US7782522B2 (en) | 2008-07-17 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Encapsulation methods for interferometric modulator and MEMS devices |
US7719754B2 (en) | 2008-09-30 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | Multi-thickness layers for MEMS and mask-saving sequence for same |
WO2010044901A1 (en) | 2008-10-16 | 2010-04-22 | Qualcomm Mems Technologies, Inc. | Monolithic imod color enhanced photovoltaic cell |
US20100096011A1 (en) | 2008-10-16 | 2010-04-22 | Qualcomm Mems Technologies, Inc. | High efficiency interferometric color filters for photovoltaic modules |
WO2010111306A1 (en) | 2009-03-25 | 2010-09-30 | Qualcomm Mems Technologies, Inc. | Em shielding for display devices |
WO2011133706A1 (en) | 2010-04-22 | 2011-10-27 | Qualcomm Mems Technologies, Inc. | Active matrix content manipulation systems and methods |
US20120105385A1 (en) | 2010-11-02 | 2012-05-03 | Qualcomm Mems Technologies, Inc. | Electromechanical systems apparatuses and methods for providing rough surfaces |
US20120134008A1 (en) | 2010-11-30 | 2012-05-31 | Ion Bita | Electromechanical interferometric modulator device |
US20120162232A1 (en) | 2010-12-22 | 2012-06-28 | Qualcomm Mems Technologies, Inc. | Method of fabrication and resultant encapsulated electromechanical device |
US20120188215A1 (en) | 2011-01-24 | 2012-07-26 | Qualcomm Mems Technologies, Inc. | Electromechanical devices with variable mechanical layers |
US20120194897A1 (en) | 2011-01-27 | 2012-08-02 | Qualcomm Mems Technologies, Inc. | Backside patterning to form support posts in an electromechanical device |
-
2006
- 2006-01-13 US US11/331,705 patent/US7916980B2/en not_active Expired - Fee Related
- 2006-12-19 WO PCT/US2006/048318 patent/WO2007087047A2/en active Application Filing
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2011
- 2011-03-28 US US13/073,922 patent/US8971675B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020126364A1 (en) * | 1994-05-05 | 2002-09-12 | Iridigm Display Corporation, A Delaware Corporation | Interferometric modulation of radiation |
US20040051929A1 (en) * | 1994-05-05 | 2004-03-18 | Sampsell Jeffrey Brian | Separable modulator |
WO2005066596A1 (en) * | 2003-12-31 | 2005-07-21 | Honeywell International Inc. | Tunable sensor |
Also Published As
Publication number | Publication date |
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US7916980B2 (en) | 2011-03-29 |
US20070189654A1 (en) | 2007-08-16 |
WO2007087047A3 (en) | 2007-10-04 |
US8971675B2 (en) | 2015-03-03 |
US20110177745A1 (en) | 2011-07-21 |
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