WO2007092592A3 - Automated probe card planarization and alignment methods and tools - Google Patents

Automated probe card planarization and alignment methods and tools Download PDF

Info

Publication number
WO2007092592A3
WO2007092592A3 PCT/US2007/003474 US2007003474W WO2007092592A3 WO 2007092592 A3 WO2007092592 A3 WO 2007092592A3 US 2007003474 W US2007003474 W US 2007003474W WO 2007092592 A3 WO2007092592 A3 WO 2007092592A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
vertical position
horizontal
probe card
tools
Prior art date
Application number
PCT/US2007/003474
Other languages
French (fr)
Other versions
WO2007092592A2 (en
Inventor
Bahadir Tunaboylu
Guy Frick
Edward L Malantonio
Horst Claugerg
John Mcglory
Original Assignee
Sv Probe Pte Ltd
Bahadir Tunaboylu
Guy Frick
Edward L Malantonio
Horst Claugerg
John Mcglory
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/703,891 external-priority patent/US7583098B2/en
Application filed by Sv Probe Pte Ltd, Bahadir Tunaboylu, Guy Frick, Edward L Malantonio, Horst Claugerg, John Mcglory filed Critical Sv Probe Pte Ltd
Publication of WO2007092592A2 publication Critical patent/WO2007092592A2/en
Publication of WO2007092592A3 publication Critical patent/WO2007092592A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location (500) for a probe is compared with the actual horizontal position (502) for the probe to determine (504) a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects (506) the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes (512, 514) the actual vertical position of the probe to the desired vertical position.
PCT/US2007/003474 2006-02-08 2007-02-08 Automated probe card planarization and alignment methods and tools WO2007092592A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US77155406P 2006-02-08 2006-02-08
US60/771,554 2006-02-08
US11/703,891 2007-02-07
US11/703,891 US7583098B2 (en) 2006-02-08 2007-02-07 Automated probe card planarization and alignment methods and tools

Publications (2)

Publication Number Publication Date
WO2007092592A2 WO2007092592A2 (en) 2007-08-16
WO2007092592A3 true WO2007092592A3 (en) 2007-12-21

Family

ID=38345819

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/003474 WO2007092592A2 (en) 2006-02-08 2007-02-08 Automated probe card planarization and alignment methods and tools

Country Status (1)

Country Link
WO (1) WO2007092592A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT514025A1 (en) * 2013-03-07 2014-09-15 Alicona Imaging Gmbh Device for processing a workpiece

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892122A (en) * 1988-12-19 1990-01-09 Micron Technology Inc. Probe pin alignment tool
US20030006755A1 (en) * 2001-07-06 2003-01-09 Taylor James E. Micro-tools
US20040032272A1 (en) * 2002-08-14 2004-02-19 Fujitsu Limited Contactor having contact electrodes formed by laser processing
US6727579B1 (en) * 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892122A (en) * 1988-12-19 1990-01-09 Micron Technology Inc. Probe pin alignment tool
US6727579B1 (en) * 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US20030006755A1 (en) * 2001-07-06 2003-01-09 Taylor James E. Micro-tools
US20040032272A1 (en) * 2002-08-14 2004-02-19 Fujitsu Limited Contactor having contact electrodes formed by laser processing

Also Published As

Publication number Publication date
WO2007092592A2 (en) 2007-08-16

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