WO2007097664A1 - Light-emitting diode device - Google Patents
Light-emitting diode device Download PDFInfo
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- WO2007097664A1 WO2007097664A1 PCT/RU2007/000088 RU2007000088W WO2007097664A1 WO 2007097664 A1 WO2007097664 A1 WO 2007097664A1 RU 2007000088 W RU2007000088 W RU 2007000088W WO 2007097664 A1 WO2007097664 A1 WO 2007097664A1
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- light
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- cavity
- emitting diode
- light guide
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Definitions
- the invention relates to electronic equipment, in particular to semiconductor devices, and can be used in the manufacture of lighting and signaling devices.
- LED devices are widely used in industry.
- CDS are used for signaling the operating mode of various equipment, for backlighting screens, for information sources such as information boards, running lines, are also used in traffic lights, household lighting devices, etc.
- SDU RF Patent N ° 2114492
- a light-emitting crystal mounted on a holder connected to one of the electrical terminals, and placed in a plastic housing, which is a hemispherical lens that collects radiation.
- CDS Code Division Multiple Access
- the closest in technical essence to the proposed LED device is the CDS (RF Patent JMk 2133068), selected as a prototype, containing a metal or metallized base with connecting leads, the base contains a recess with a reflecting radiation side surface and a flat bottom on which two or more light-emitting are mounted a crystal, a lid containing a concentrating lens, and the inner surface of the lid has a cavity, the lid cavity and a recess in the base are filled with a light guide box medium in the form of a light-conducting polymer sealing compound.
- the disadvantages of the known device are the narrow range of control of the viewing angle, when, when switching from one variant of devices of the same nomenclature, it is necessary to rebuild the entire instrumentation in production, and low light output, especially from the side surfaces of light-emitting crystals, as well as low SDE parameters for light output and their large spread from sample to sample due to the uneven distribution of the casting mass and the content of air bubbles in it.
- the technical result of the proposed invention is to improve the manufacturability of the CDS assembly, increase light output and uniform radiation diagram of an SDE in a given wavelength range.
- the technical result is achieved in that in an LED device including at least one semiconductor LED with electrical contacts mounted on the base and a cover of transparent material made with a cavity on the surface connected to the base, which covers the LED with electrical contacts and contains a light-conducting medium, the specified cavity communicates with the environment through at least one through hole made in the base to fill the cavity with a light guide medium .
- the light guide medium may further comprise phosphor particles and particles of light scattering substance.
- the illustration shows the proposed LED device in the context.
- the LED device contains a semiconductor LED 1 with electrical contacts 2 mounted on a base 3 made of a material with high thermal conductivity and made with through mounting holes 4, the LED 1 can also be glued using electrically conductive glue to the metal layer 5 covering the base on which the wiring topology is formed LED pins.
- the device also contains a cover 6 in the form of a concentrating or other lens made of a transparent material, made with a cavity 7 on the surface connected to the base 3, and quotation pins 8, coinciding with the through installation holes 4 in the base 3, while the LED 7 covers the cavity 7 of the surface of the cover its electrical contacts 2 and contains a light guide medium 9 containing particles of light scattering substance.
- the cavity 7 communicates with the environment through one or more additional through holes 10 in the base 3.
- the central part of the cover 6 connected to the base can be made in the form of a truncated body of revolution, while the plane of the section coincides with the surface of the base.
- the cavity of the surface of the cover is also made in the form of a truncated figure of rotation, for example, a cone, on the truncated part of the cover so that the optical axis of the cavity coincides with the optical axis of the concentrating lens of the cover, and its base also coincides with the surface of the base 3 of the device.
- the plane of the section of the cavity is parallel to the surface of the LED, and the surface of the part of the cover connected to the base is formed so that the radiation of the side surfaces of the LED passing through the light guide medium in the cavity experiences total internal reflection at the interface between the surface of the cover and the environment.
- One or more additional through holes in the base, connecting the cavity with the environment, are made for a complete and uniform filling of the cavity with a light guide medium.
- a part of its boundary on the base surface connected to the cover preferably coincides with the boundary of the cavity in a plane coinciding with the plane in which the base surface connected to the cover lies, or is located close to this border.
- the composition of the light guide medium in order to evenly distribute radiation at the output of the device, can include light scattering particles, for example, finely dispersed particles of SiO 2 . These particles can also be included in the lid material for the same purpose.
- phosphor particles for example, based on garnet, can be introduced into the light guide medium.
- the surfaces of the alignment pins and mounting holes can be coated with a metal layer.
- the specified metallization of the alignment pins can also be used to connect to a power source with their corresponding location relative to the topology of the wiring of the contacts of the LED.
- the assembly of the proposed device is carried out in the following sequence.
- one or more semiconductor LEDs 1 are fixed. Then, in accordance with the topology of the pinout, solder one or more contacts 2 to the surface of the LED 1 and the metallizing layer 5. Places of soldering for hardening are torn with a layer of conductive glue or sealant.
- the fabricated matrix with LEDs and wiring is covered molded cover 6, combining the LEDs 1 with the cavity 7 of the cover 6.
- the combined cover 6 and the base are fixed with quotation pins 8 by tensioning them into the mounting holes 4 of the base 3. The product is positioned so that the cover is facing down and the plane of the base is fixed strictly horizontally.
- a prepared light guide medium is supplied into the cavity 7 until the cavity is completely filled, which is fixed when the light guide medium appears from the second additional hole. If one additional hole is made, the product is positioned so that the base plane is fixed strictly vertically, and the additional hole 10 is located in its highest position. A prepared light guide medium is supplied into the cavity 7 through the tube introduced through the additional hole 10 until the cavity is completely filled, which is fixed when the light guide medium appears from the additional hole.
- the mode of supply of the light guide medium is selected in accordance with the viscosity of the light guide medium and the wettability of the surfaces of the LED, base, metallization layer, cavity and electrical conductors.
- the light guide medium After filling, the light guide medium is polymerized and ensures uniform distribution throughout the filled volume of light scattering particles and phosphor particles.
- the device operates as follows.
Abstract
The inventive light-emitting diode device comprises a semiconductor light-emitting diode (1) provided with electric contacts (2) and fixed to a base (3) which is made of a high-thermal conductive material and provided with through locating holes (4), wherein said light-emitting diode (1) can be also glued with the aid of an electrically conductive glue to a metal layer (5) which covers the base and on which a pin assignment topology of the light-emitting diodes is formed. The device also comprises a lid (6) in the form of a focusing or another lens which is made of a transparent material and provided with a cavity (7) arranged on a surface connected to the base (3) and with pins (8) coinciding with the through locating holes (4) embodied in the base (3), wherein the cavity (7) of the lid covers the light-emitting diode with the electric contacts thereof and comprises a light-diffusing medium (9) containing particles of a light-conducting material and a luminiphore. The cavity (7) communicates with the environment via one or several through holes (10) embodied in the base (3) for filling the cavity with the light-conducting medium. Said invention makes it possible to improve the assembling processabilty of the light-emitting diode device, to increase the light efficiency and a radiation uniform distribution at the device output.
Description
СВЕТОДИОДНОЕ УСТРОЙСТВО LED DEVICE
Изобретение относится к электронной технике, в частности к полупроводниковым приборам, и может быть использовано при производстве осветительных и сигнальных устройств.The invention relates to electronic equipment, in particular to semiconductor devices, and can be used in the manufacture of lighting and signaling devices.
Светодиодные устройства (СДУ) широко используются в промышленности. СДУ применяются для сигнализации о режиме работы различной аппаратуры, для подсветки экранов, для источников информации типа информационного табло, бегущих строк, используются также в светофорах, устройствах бытового освещения и т.д. Высокие эксплуатационные параметры СДУ - оптическая мощность излучения, коэффициент преобразования электрической энергии в световую, высокая надежность и низкая себестоимость делают эти источники света весьма перспективными. Во многих случаях требуются СДУ с широкой гаммой цветов и оттенков светового потока, включая белый и полноцветный.LED devices (LEDs) are widely used in industry. CDS are used for signaling the operating mode of various equipment, for backlighting screens, for information sources such as information boards, running lines, are also used in traffic lights, household lighting devices, etc. High operational parameters of the CDS - optical radiation power, the conversion factor of electrical energy into light, high reliability and low cost make these light sources very promising. In many cases, CDS with a wide range of colors and shades of light output, including white and full color, are required.
Известно СДУ (Патент РФ N° 2114492), содержащее светоизлучающий кристалл, укрепленный на держателе, соединенном с одним из электрических выводов, и размещенный в пластмассовом корпусе, представляющем собой полусферическую линзу, собирающую излучение.It is known SDU (RF Patent N ° 2114492), containing a light-emitting crystal mounted on a holder connected to one of the electrical terminals, and placed in a plastic housing, which is a hemispherical lens that collects radiation.
Недостатком этого СДУ является невысокая технологичность изготовления, необходимость коренной переделки всего инструментария при выпуске вариантов изделий того же класса, но отличающихся номенклатурой.The disadvantage of this CDS is the low manufacturability, the need for a radical alteration of all tools when releasing variants of products of the same class, but differing in nomenclature.
Известно СДУ (Патент РФ N° 2251761), содержащее светодиодные кристаллы на общем основании, окруженные рефлекторами и залитые светопроводящей массой с распределенными в ней частицами люминофора.
Недостатком этого технического решения является невысокие . параметры СДУ по светоотдаче и большой разброс их от образца к образцу за счет неравномерного распределения светопроводящей массы и содержания в ней пузырьков воздуха.It is known SDU (RF Patent N ° 2251761) containing LED crystals on a common base, surrounded by reflectors and filled with a light-conducting mass with phosphor particles distributed in it. The disadvantage of this technical solution is low. SDE parameters for light output and their large scatter from sample to sample due to the uneven distribution of the light guide mass and the content of air bubbles in it.
Наиболее близким по технической сущности к предлагаемому светодиодному устройству является СДУ (Патент РФ JMk 2133068), избранное в качестве прототипа, содержащее металлическое или металлизированное основание с присоединительными выводами, основание содержит углубление с отражающей излучение боковой поверхностью и плоским дном на котором укреплены два или более светоизлучающих кристалла, крышку, содержащую концентрирующую линзу, а внутренняя поверхность крышки имеет полость, полость крышки и углубление в основании заполнены светопроводящей средой в виде светопроводящего полимерного герметизирующего компаунда.The closest in technical essence to the proposed LED device is the CDS (RF Patent JMk 2133068), selected as a prototype, containing a metal or metallized base with connecting leads, the base contains a recess with a reflecting radiation side surface and a flat bottom on which two or more light-emitting are mounted a crystal, a lid containing a concentrating lens, and the inner surface of the lid has a cavity, the lid cavity and a recess in the base are filled with a light guide box medium in the form of a light-conducting polymer sealing compound.
Недостатками известного устройства являются, узкий диапазон управления углом обзора, когда при переходе от одного варианта устройств той же номенклатуры необходимо перестраивать весь инструментарий в производстве, и низкая светоотдача, особенно от боковых поверхностей светоизлучающих кристаллов, а также невысокие параметры СДУ по светоотдаче и большой разброс их от образца к образцу за счет неравномерного распределения заливочной массы и содержания в ней пузырьков воздуха.The disadvantages of the known device are the narrow range of control of the viewing angle, when, when switching from one variant of devices of the same nomenclature, it is necessary to rebuild the entire instrumentation in production, and low light output, especially from the side surfaces of light-emitting crystals, as well as low SDE parameters for light output and their large spread from sample to sample due to the uneven distribution of the casting mass and the content of air bubbles in it.
Сущность изобретения.SUMMARY OF THE INVENTION
Техническим результатом предложенного изобретения является повышение технологичности сборки СДУ, повышение светоотдачи и
равномерная диаграмма излучения СДУ в заданном диапазоне длин волн.The technical result of the proposed invention is to improve the manufacturability of the CDS assembly, increase light output and uniform radiation diagram of an SDE in a given wavelength range.
Технических результат достигается тем, что в светодиодном устройстве, включающем не менее одного полупроводникового светодиода с электрическими контактами, установленного на основании, и крышку из прозрачного материала, выполненную с полостью на поверхности соединенной с основанием, которая покрывает светодиод с электрическими контактами и содержит светопроводяшую среду, указанная полость сообщается с окружающей средой не менее чем через одно сквозное отверстие выполненное в основании для заполнения полости светопроводящей средой. При этом светопроводящая среда может дополнительно содержать частицы люминофора и частицы светорассеивающего вещества.The technical result is achieved in that in an LED device including at least one semiconductor LED with electrical contacts mounted on the base and a cover of transparent material made with a cavity on the surface connected to the base, which covers the LED with electrical contacts and contains a light-conducting medium, the specified cavity communicates with the environment through at least one through hole made in the base to fill the cavity with a light guide medium . In this case, the light guide medium may further comprise phosphor particles and particles of light scattering substance.
На иллюстрации представлено предлагаемое светодиодное устройство в разрезе.The illustration shows the proposed LED device in the context.
Светодиодное устройство содержит полупроводниковый светодиод 1 с электрическими контактами 2 закрепленный на основании 3 изготовленном из материала с высокой теплопроводностью и выполненной со сквозными установочными отверстиями 4, светодиод 1 может быть также приклеен с помощью электропроводящего клея к слою металла 5 покрывающему основание, на котором сформирована топология разводки контактов светодиодов. Устройство также содержит крышку 6 в виде концентрирующей или иной линзы из прозрачного материала, выполненную с полостью 7 на поверхности соединенной с основанием 3, и котировочными штырями 8, совпадающими со сквозными установочными отверстиями 4 в основании 3, при этом полость 7 поверхности крышки покрывает светодиод с его электрическими контактами 2 и содержит
светопроводящую среду 9 содержащую частицы светорассеивающего вещества. Полость 7 сообщается с окружающей средой через одно или несколько дополнительных сквозных отверстия 10 в основании 3.The LED device contains a semiconductor LED 1 with electrical contacts 2 mounted on a base 3 made of a material with high thermal conductivity and made with through mounting holes 4, the LED 1 can also be glued using electrically conductive glue to the metal layer 5 covering the base on which the wiring topology is formed LED pins. The device also contains a cover 6 in the form of a concentrating or other lens made of a transparent material, made with a cavity 7 on the surface connected to the base 3, and quotation pins 8, coinciding with the through installation holes 4 in the base 3, while the LED 7 covers the cavity 7 of the surface of the cover its electrical contacts 2 and contains a light guide medium 9 containing particles of light scattering substance. The cavity 7 communicates with the environment through one or more additional through holes 10 in the base 3.
С целью более эффективного использования излучения боковых поверхностей светодиода 1 центральная часть крышки 6 соединенная с основанием может быть выполнена в виде усеченного тела вращения, при этом плоскость сечения совпадает с поверхностью основания. Полость поверхности крышки выполняется также в виде усеченной фигуры вращения, например, конуса, на усеченной части крышки таким образом, чтобы оптическая ось полости совпадала с оптической осью концентрирующей линзы крышки, а её основание также совпадало с поверхностью основания 3 устройства. Плоскость сечения полости располагается параллельно поверхности светодиода, а поверхность части крышки, соединенной с основанием, формируется таким образом, чтобы излучение боковых поверхностей светодиода, прошедшее через светопроводящую среду в полости, испытывало на границе соприкосновения поверхности крышки с окружающей средой полное внутреннее отражение.In order to more effectively use the radiation of the side surfaces of the LED 1, the central part of the cover 6 connected to the base can be made in the form of a truncated body of revolution, while the plane of the section coincides with the surface of the base. The cavity of the surface of the cover is also made in the form of a truncated figure of rotation, for example, a cone, on the truncated part of the cover so that the optical axis of the cavity coincides with the optical axis of the concentrating lens of the cover, and its base also coincides with the surface of the base 3 of the device. The plane of the section of the cavity is parallel to the surface of the LED, and the surface of the part of the cover connected to the base is formed so that the radiation of the side surfaces of the LED passing through the light guide medium in the cavity experiences total internal reflection at the interface between the surface of the cover and the environment.
Одно или несколько дополнительных сквозных отверстия в основании, соединяющих полость с окружающей средой, выполнены для полного и равномерного заполнения полости светопроводящей средой. В случае выполнения одного дополнительного отверстия часть его границы на поверхности основания соединенной с крышкой предпочтительно совпадает с границей полости в плоскости, совпадающей с плоскостью, в которой лежит поверхность основания соединенная с крышкой, или располагается вблизи этой границы. Неравномерность распределения светопроводящей среды вокруг светодиода, также наличие в ней пузырьков газа, является одним из существенных факторов нарушающих равномерное
распределение излучения на выходе аналогичных устройств.One or more additional through holes in the base, connecting the cavity with the environment, are made for a complete and uniform filling of the cavity with a light guide medium. In the case of making one additional hole, a part of its boundary on the base surface connected to the cover preferably coincides with the boundary of the cavity in a plane coinciding with the plane in which the base surface connected to the cover lies, or is located close to this border. The uneven distribution of the light guide medium around the LED, as well as the presence of gas bubbles in it, is one of the significant factors that violate the uniform radiation distribution at the output of similar devices.
В состав светопроводящей среды, с целью равномерного распределения излучения на выходе устройства, могут включаться светорассеивающие частицы, например, мелкодисперсные частицы SiO2. Указанные частицы с той же целью могут также включаться в материал крышки.The composition of the light guide medium, in order to evenly distribute radiation at the output of the device, can include light scattering particles, for example, finely dispersed particles of SiO 2 . These particles can also be included in the lid material for the same purpose.
Для формирования спектра в необходимом диапазоне в светопроводящую среду могут быть введены частицы люминофора, например, на основе граната.To form the spectrum in the required range, phosphor particles, for example, based on garnet, can be introduced into the light guide medium.
С целью увеличения отвода тепла от светодиода поверхности юстировочных штырей и установочных отверстий могут быть покрыты слоем металла. Указанная металлизация юстировочных штырей может быть также использована для соединения с источником электропитания при соответствующем их расположении относительно топологии разводки контактов светодиода.In order to increase the heat dissipation from the LED, the surfaces of the alignment pins and mounting holes can be coated with a metal layer. The specified metallization of the alignment pins can also be used to connect to a power source with their corresponding location relative to the topology of the wiring of the contacts of the LED.
Реализация изобретения.The implementation of the invention.
Сборка предложенного устройства осуществляется в следующей последовательности.The assembly of the proposed device is carried out in the following sequence.
На основании 3 или, в зависимости от применяемой топологии разводки контактов, на металлизирующем слое 5, например, с помощью токопроводящего клея, закрепляются один или несколько полупроводниковых светодиодов 1. Затем, в соответствии с применяемой топологией разводки, производят пайку одного или нескольких контактов 2 к поверхности светодиода 1 и металлизирующему слою 5. Места пайки для упрочения порывают слоем токопроводящего клея или герметика. Изготовленную матрицу с светодиодами и разводкой накрывают
сформованной крышкой 6, совмещая светодиоды 1 с полостью 7 крышки 6. Совмещенные крышку 6 и основание фиксируют котировочными штырями 8 вводя их с натяжением в установочные отверстия 4 основания 3. Изделие располагают таким образом, чтобы крышка была обращена вниз, а плоскость основании была зафиксирована строго горизонтально. Затем через одно из дополнительных отверстий 10 в основании 3 в полость 7 подают подготовленную светопроводящую среду до полного заполнения полости, которое фиксируется при появлении светопроводящей среды из второго дополнительного отверстия. В случае выполнения одного дополнительного отверстия изделие располагают таким образом, чтобы плоскость основания была зафиксирована строго вертикально, а дополнительное отверстие 10 располагалось в крайнем верхнем положении. В полость 7 через введенную через дополнительное отверстие 10 трубку подают подготовленную светопроводящую среду до полного заполнения полости, которое фиксируется при появлении светопроводящей среды из дополнительного отверстия.On the basis of 3 or, depending on the topology of the pinout, on the metallizing layer 5, for example, using conductive glue, one or more semiconductor LEDs 1 are fixed. Then, in accordance with the topology of the pinout, solder one or more contacts 2 to the surface of the LED 1 and the metallizing layer 5. Places of soldering for hardening are torn with a layer of conductive glue or sealant. The fabricated matrix with LEDs and wiring is covered molded cover 6, combining the LEDs 1 with the cavity 7 of the cover 6. The combined cover 6 and the base are fixed with quotation pins 8 by tensioning them into the mounting holes 4 of the base 3. The product is positioned so that the cover is facing down and the plane of the base is fixed strictly horizontally. Then, through one of the additional holes 10 in the base 3, a prepared light guide medium is supplied into the cavity 7 until the cavity is completely filled, which is fixed when the light guide medium appears from the second additional hole. If one additional hole is made, the product is positioned so that the base plane is fixed strictly vertically, and the additional hole 10 is located in its highest position. A prepared light guide medium is supplied into the cavity 7 through the tube introduced through the additional hole 10 until the cavity is completely filled, which is fixed when the light guide medium appears from the additional hole.
Режим подачи светопроводящей среды подбирают в соответствии с вязкостью светопроводящей среды и смачиваемостью поверхностей светодиода, основания, слоя металлизации, полости и электрических проводников.The mode of supply of the light guide medium is selected in accordance with the viscosity of the light guide medium and the wettability of the surfaces of the LED, base, metallization layer, cavity and electrical conductors.
После заполнения светопроводящая среда полимеризуется и обеспечивает равномерное распределение по всему заполненному объему светорассеивающих частиц и частиц люминофора.After filling, the light guide medium is polymerized and ensures uniform distribution throughout the filled volume of light scattering particles and phosphor particles.
Устройство работает следующим образом.The device operates as follows.
При пропускании прямого тока через диод в нем инжектируются неравновновесные носители, которые рекомбинируют с выделением фотонов видимого спектра излучения. Излучение боковых поверхностей
собирается за счет полного внутреннего отражения в заданный угол.When a direct current is passed through a diode, nonequilibrium carriers are injected into it, which recombine with the release of photons of the visible radiation spectrum. Radiation of the side surfaces collected due to total internal reflection at a given angle.
Наличие рассеивающих излучение частиц в светопроводящей среде (SiO2 или SiO2 + люминофор) позволяет формировать равномерную диаграмму излучения в заданном диапазоне длин волн.
The presence of particles scattering radiation in the light guide medium (SiO 2 or SiO 2 + phosphor) allows you to create a uniform radiation pattern in a given wavelength range.
Claims
1. Светодиодное устройство, включающее не менее одного полупроводникового светодиода с электрическими контактами, установленного на основании, и крышку из прозрачного материала, выполненную с полостью на поверхности соединенной с основанием, которая покрывает светодиод с электрическими контактами и содержит светопроводяшую среду, отличающееся тем, что полость сообщается с окружающей средой не менее чем через одно сквозное отверстие выполненное в основании для заполнения полости светопроводящей средой.1. An LED device comprising at least one semiconductor LED with electrical contacts mounted on the base and a cover of transparent material made with a cavity on the surface connected to the base, which covers the LED with electrical contacts and contains a light guide medium, characterized in that the cavity communicates with the environment through at least one through hole made in the base to fill the cavity with a light guide medium.
2. Светодиодное устройство по п.l, отличающееся тем, что светопроводящая среда содержит частицы люминофора.2. The LED device according to claim 1, characterized in that the light guide medium contains phosphor particles.
3. Светодиодное устройство по п.1,2 отличающееся тем, что светопроводящая среда содержит мелкодисперсные светорассеивающие частицы. 3. The LED device according to claim 1, 2, characterized in that the light guide medium contains finely dispersed light scattering particles.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2006105730/28A RU2302687C1 (en) | 2006-02-26 | 2006-02-26 | Light-emitting diode device |
| RU2006105730 | 2006-02-26 |
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| Publication Number | Publication Date |
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| WO2007097664A1 true WO2007097664A1 (en) | 2007-08-30 |
| WO2007097664A9 WO2007097664A9 (en) | 2007-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/RU2007/000088 WO2007097664A1 (en) | 2006-02-26 | 2007-02-22 | Light-emitting diode device |
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| Country | Link |
|---|---|
| RU (1) | RU2302687C1 (en) |
| WO (1) | WO2007097664A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014141011A1 (en) * | 2013-03-13 | 2014-09-18 | Koninklijke Philips N.V. | Encapsulating led lens with bottom reflectors |
| US9899579B2 (en) | 2013-11-07 | 2018-02-20 | Koninklijke Philips N.V. | Substrate for LED with total-internal reflection layer surrounding LED |
| WO2024003045A1 (en) * | 2022-06-27 | 2024-01-04 | Schreder S.A. | Light assembly comprising a side emitting light element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102171844A (en) * | 2008-10-01 | 2011-08-31 | 皇家飞利浦电子股份有限公司 | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
| RU2613529C2 (en) * | 2015-07-08 | 2017-03-16 | Гиа Маргович Гвичия | Device for controlling light-emitting crystals in led |
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| RU2133068C1 (en) * | 1997-07-30 | 1999-07-10 | Абрамов Владимир Семенович | Light-emitting diode unit |
| RU2134000C1 (en) * | 1997-12-31 | 1999-07-27 | Абрамов Владимир Семенович | Light-emitting diode unit |
| US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
| RU2200358C1 (en) * | 2001-06-05 | 2003-03-10 | Хан Владимир Александрович | Semiconductor light-emitting diode |
| RU2212734C1 (en) * | 2002-07-10 | 2003-09-20 | Закрытое Акционерное Общество "Светлана - Оптоэлектроника" | Semiconductor light source |
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- 2006-02-26 RU RU2006105730/28A patent/RU2302687C1/en not_active IP Right Cessation
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| RU2133068C1 (en) * | 1997-07-30 | 1999-07-10 | Абрамов Владимир Семенович | Light-emitting diode unit |
| RU2134000C1 (en) * | 1997-12-31 | 1999-07-27 | Абрамов Владимир Семенович | Light-emitting diode unit |
| RU2200358C1 (en) * | 2001-06-05 | 2003-03-10 | Хан Владимир Александрович | Semiconductor light-emitting diode |
| US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014141011A1 (en) * | 2013-03-13 | 2014-09-18 | Koninklijke Philips N.V. | Encapsulating led lens with bottom reflectors |
| US10355182B2 (en) | 2013-03-13 | 2019-07-16 | Lumileds Llc | Encapsulated LED lens with bottom reflectors |
| US9899579B2 (en) | 2013-11-07 | 2018-02-20 | Koninklijke Philips N.V. | Substrate for LED with total-internal reflection layer surrounding LED |
| TWI621287B (en) * | 2013-11-07 | 2018-04-11 | 皇家飛利浦有限公司 | Light emitting device and method for forming the same |
| TWI648880B (en) * | 2013-11-07 | 2019-01-21 | 荷蘭商皇家飛利浦有限公司 | Method of forming a light emitting device |
| WO2024003045A1 (en) * | 2022-06-27 | 2024-01-04 | Schreder S.A. | Light assembly comprising a side emitting light element |
| NL2032294B1 (en) * | 2022-06-27 | 2024-01-12 | Schreder Sa | Light assembly comprising a side emitting light element |
Also Published As
| Publication number | Publication date |
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| RU2302687C1 (en) | 2007-07-10 |
| WO2007097664A9 (en) | 2007-10-25 |
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