WO2007098078A3 - Liquid cooling loops for server applications - Google Patents

Liquid cooling loops for server applications Download PDF

Info

Publication number
WO2007098078A3
WO2007098078A3 PCT/US2007/004237 US2007004237W WO2007098078A3 WO 2007098078 A3 WO2007098078 A3 WO 2007098078A3 US 2007004237 W US2007004237 W US 2007004237W WO 2007098078 A3 WO2007098078 A3 WO 2007098078A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronics server
rack
server
force
heat exchangers
Prior art date
Application number
PCT/US2007/004237
Other languages
French (fr)
Other versions
WO2007098078A2 (en
Inventor
Norman Chow
Paul Tsao
Douglas E Werner
Mark Mcmaster
Girish Upadhya
Frederic Landry
Ian Spearing
Tim Schrader
Original Assignee
Cooligy Inc
Norman Chow
Paul Tsao
Douglas E Werner
Mark Mcmaster
Girish Upadhya
Frederic Landry
Ian Spearing
Tim Schrader
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, Norman Chow, Paul Tsao, Douglas E Werner, Mark Mcmaster, Girish Upadhya, Frederic Landry, Ian Spearing, Tim Schrader filed Critical Cooligy Inc
Priority to JP2008555400A priority Critical patent/JP5208769B2/en
Priority to CN200780013580.6A priority patent/CN101438638B/en
Priority to EP07751027.9A priority patent/EP1987309B1/en
Publication of WO2007098078A2 publication Critical patent/WO2007098078A2/en
Publication of WO2007098078A3 publication Critical patent/WO2007098078A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
PCT/US2007/004237 2006-02-16 2007-02-16 Liquid cooling loops for server applications WO2007098078A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008555400A JP5208769B2 (en) 2006-02-16 2007-02-16 Mounting device
CN200780013580.6A CN101438638B (en) 2006-02-16 2007-02-16 Liquid cooling loops for server applications
EP07751027.9A EP1987309B1 (en) 2006-02-16 2007-02-16 Liquid cooling loops for server applications

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77476406P 2006-02-16 2006-02-16
US60/774,764 2006-02-16

Publications (2)

Publication Number Publication Date
WO2007098078A2 WO2007098078A2 (en) 2007-08-30
WO2007098078A3 true WO2007098078A3 (en) 2008-10-16

Family

ID=38437909

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2007/004236 WO2007098077A2 (en) 2006-02-16 2007-02-16 Liquid cooling loops for server applications
PCT/US2007/004237 WO2007098078A2 (en) 2006-02-16 2007-02-16 Liquid cooling loops for server applications

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2007/004236 WO2007098077A2 (en) 2006-02-16 2007-02-16 Liquid cooling loops for server applications

Country Status (6)

Country Link
US (2) US7539020B2 (en)
EP (2) EP1987309B1 (en)
JP (2) JP2009527897A (en)
CN (2) CN101438638B (en)
TW (2) TW200805042A (en)
WO (2) WO2007098077A2 (en)

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* Cited by examiner, † Cited by third party
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TW200805041A (en) 2008-01-16
EP1989935A2 (en) 2008-11-12
EP1987309A4 (en) 2012-07-04
WO2007098077A2 (en) 2007-08-30
WO2007098078A2 (en) 2007-08-30
CN101438638A (en) 2009-05-20
CN101438638B (en) 2015-01-14
CN101438637B (en) 2013-01-02
US20070201210A1 (en) 2007-08-30
US20070201204A1 (en) 2007-08-30
JP5208769B2 (en) 2013-06-12
JP2009527897A (en) 2009-07-30
TWI371684B (en) 2012-09-01
EP1987309A2 (en) 2008-11-05
US7539020B2 (en) 2009-05-26
US7599184B2 (en) 2009-10-06
CN101438637A (en) 2009-05-20
TW200805042A (en) 2008-01-16
JP2009536754A (en) 2009-10-15
EP1987309B1 (en) 2014-04-16
EP1989935A4 (en) 2012-07-04
WO2007098077A3 (en) 2008-09-18

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