WO2007109652A3 - Aluminum bump bonding for fine aluminum wire - Google Patents

Aluminum bump bonding for fine aluminum wire Download PDF

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Publication number
WO2007109652A3
WO2007109652A3 PCT/US2007/064373 US2007064373W WO2007109652A3 WO 2007109652 A3 WO2007109652 A3 WO 2007109652A3 US 2007064373 W US2007064373 W US 2007064373W WO 2007109652 A3 WO2007109652 A3 WO 2007109652A3
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WO
WIPO (PCT)
Prior art keywords
aluminum
wire
bump
fine
bump bonding
Prior art date
Application number
PCT/US2007/064373
Other languages
French (fr)
Other versions
WO2007109652A2 (en
Inventor
Adams Zhu
Xingquan Fang
Fred Ren
Yongsuk Kwon
Original Assignee
Fairchild Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Semiconductor filed Critical Fairchild Semiconductor
Priority to DE200711000671 priority Critical patent/DE112007000671T8/en
Priority to JP2009501692A priority patent/JP2009530872A/en
Priority to CN2007800094755A priority patent/CN101405860B/en
Priority to KR1020087022387A priority patent/KR101355987B1/en
Publication of WO2007109652A2 publication Critical patent/WO2007109652A2/en
Publication of WO2007109652A3 publication Critical patent/WO2007109652A3/en

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    • H01L23/495—Lead-frames or other flat leads
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    • H01L2924/2076—Diameter ranges equal to or larger than 100 microns

Abstract

The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a lϵadframc having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.
PCT/US2007/064373 2006-03-20 2007-03-20 Aluminum bump bonding for fine aluminum wire WO2007109652A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE200711000671 DE112007000671T8 (en) 2006-03-20 2007-03-20 Aluminum elevation bonding for fine aluminum wire
JP2009501692A JP2009530872A (en) 2006-03-20 2007-03-20 Aluminum bump bonding for thin aluminum wires
CN2007800094755A CN101405860B (en) 2006-03-20 2007-03-20 Aluminum bump bonding for fine aluminum wire
KR1020087022387A KR101355987B1 (en) 2006-03-20 2007-03-20 Aluminum bump bonding for fine aluminum wire

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/385,022 US20070216026A1 (en) 2006-03-20 2006-03-20 Aluminum bump bonding for fine aluminum wire
US11/385,022 2006-03-20

Publications (2)

Publication Number Publication Date
WO2007109652A2 WO2007109652A2 (en) 2007-09-27
WO2007109652A3 true WO2007109652A3 (en) 2008-01-17

Family

ID=38516959

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/064373 WO2007109652A2 (en) 2006-03-20 2007-03-20 Aluminum bump bonding for fine aluminum wire

Country Status (8)

Country Link
US (2) US20070216026A1 (en)
JP (1) JP2009530872A (en)
KR (1) KR101355987B1 (en)
CN (1) CN101405860B (en)
DE (1) DE112007000671T8 (en)
MY (1) MY147586A (en)
TW (1) TW200742017A (en)
WO (1) WO2007109652A2 (en)

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Also Published As

Publication number Publication date
KR20080103072A (en) 2008-11-26
KR101355987B1 (en) 2014-01-28
CN101405860B (en) 2011-06-08
DE112007000671T8 (en) 2009-05-14
US20100035385A1 (en) 2010-02-11
US20070216026A1 (en) 2007-09-20
JP2009530872A (en) 2009-08-27
US8138081B2 (en) 2012-03-20
TW200742017A (en) 2007-11-01
DE112007000671T5 (en) 2009-01-29
MY147586A (en) 2012-12-31
WO2007109652A2 (en) 2007-09-27
CN101405860A (en) 2009-04-08

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