WO2007120530A3 - Integrated liquid to air conduction module - Google Patents

Integrated liquid to air conduction module Download PDF

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Publication number
WO2007120530A3
WO2007120530A3 PCT/US2007/008190 US2007008190W WO2007120530A3 WO 2007120530 A3 WO2007120530 A3 WO 2007120530A3 US 2007008190 W US2007008190 W US 2007008190W WO 2007120530 A3 WO2007120530 A3 WO 2007120530A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
fluid
fluid path
air conduction
integrated liquid
Prior art date
Application number
PCT/US2007/008190
Other languages
French (fr)
Other versions
WO2007120530A2 (en
Inventor
James Hom
Girish Upadhya
Douglas E Werner
Mark Munch
Paul Tsao
Bruce Conway
Peng Zhou
Richard Brewer
Original Assignee
Cooligy Inc
James Hom
Girish Upadhya
Douglas E Werner
Mark Munch
Paul Tsao
Bruce Conway
Peng Zhou
Richard Brewer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, James Hom, Girish Upadhya, Douglas E Werner, Mark Munch, Paul Tsao, Bruce Conway, Peng Zhou, Richard Brewer filed Critical Cooligy Inc
Priority to JP2009503069A priority Critical patent/JP2009532868A/en
Priority to DE112007000768T priority patent/DE112007000768T5/en
Publication of WO2007120530A2 publication Critical patent/WO2007120530A2/en
Publication of WO2007120530A3 publication Critical patent/WO2007120530A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices.
PCT/US2007/008190 2006-03-30 2007-03-30 Integrated liquid to air conduction module WO2007120530A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009503069A JP2009532868A (en) 2006-03-30 2007-03-30 COOLING DEVICE AND COOLING DEVICE MANUFACTURING METHOD
DE112007000768T DE112007000768T5 (en) 2006-03-30 2007-03-30 Integrated module for the liquid-air line

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78854506P 2006-03-30 2006-03-30
US60/788,545 2006-03-30

Publications (2)

Publication Number Publication Date
WO2007120530A2 WO2007120530A2 (en) 2007-10-25
WO2007120530A3 true WO2007120530A3 (en) 2008-08-21

Family

ID=38610067

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/008190 WO2007120530A2 (en) 2006-03-30 2007-03-30 Integrated liquid to air conduction module

Country Status (5)

Country Link
US (1) US8157001B2 (en)
JP (1) JP2009532868A (en)
DE (1) DE112007000768T5 (en)
TW (3) TW200810676A (en)
WO (1) WO2007120530A2 (en)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
JP4994631B2 (en) 2005-10-12 2012-08-08 パナソニック株式会社 Nonaqueous electrolyte secondary battery and positive electrode active material thereof
JP4234722B2 (en) * 2006-02-28 2009-03-04 株式会社東芝 Cooling device and electronic equipment
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
KR20150036793A (en) * 2007-04-26 2015-04-07 세람테크 게엠베하 Cooling box for components or circuits
JP4785878B2 (en) * 2008-02-06 2011-10-05 本田技研工業株式会社 Cooling device and electric vehicle equipped with the cooling device
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US7808781B2 (en) * 2008-05-13 2010-10-05 International Business Machines Corporation Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
WO2010017321A1 (en) 2008-08-05 2010-02-11 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
SE533224C2 (en) * 2008-09-16 2010-07-27 Sapa Profiler Ab Fridge for circuit board components
BRPI1013063B1 (en) * 2009-05-18 2020-11-17 Huawei Technologies Co., Ltd. thermosyphon heat propagation device and method for making a thermosiphon heat propagation device
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
DK2259310T3 (en) * 2009-06-05 2020-06-22 Siemens Gamesa Renewable Energy As Integrated heat exchanger
FR2954971B1 (en) 2010-01-06 2012-02-10 Paul Benoit ELECTRICAL RADIATOR USING CALCULATING PROCESSORS AS HOT SOURCE.
US9596785B2 (en) * 2010-03-22 2017-03-14 Pratt & Whitney Canada Corp. Heat exchanger
US9027360B2 (en) 2011-05-06 2015-05-12 International Business Machines Corporation Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
US9307674B2 (en) * 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US8902591B2 (en) * 2011-05-11 2014-12-02 Microjet Technology Co., Ltd. Heat dissipation device
US8687364B2 (en) 2011-10-28 2014-04-01 International Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
CN103138536B (en) * 2011-11-29 2015-06-10 永济新时速电机电器有限责任公司 Converter cooling device
US9437903B2 (en) * 2012-01-31 2016-09-06 Johnson Controls Technology Company Method for cooling a lithium-ion battery pack
US20140048993A1 (en) * 2012-08-17 2014-02-20 Apple Inc. Selective placement of coolant to undercut areas
CN103855918A (en) * 2012-12-05 2014-06-11 永济新时速电机电器有限责任公司 Water distributor for converter and locomotive
KR101422098B1 (en) * 2012-12-12 2014-07-28 잘만테크 주식회사 Water cooling apperutus
US9526191B2 (en) * 2013-05-15 2016-12-20 Dy 4 Systems Inc. Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module
US9357675B2 (en) 2013-10-21 2016-05-31 International Business Machines Corporation Pump-enhanced, immersion-cooling of electronic component(s)
US20160029514A1 (en) * 2013-12-31 2016-01-28 Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi A liquid cooled device enclosure
CN104039117B (en) * 2014-06-03 2017-01-04 华为技术有限公司 A kind of heat abstractor, cooling control method and controller
US20170303431A1 (en) * 2014-11-22 2017-10-19 Gerald Ho Kim Silicon Cooling Plate With An Integrated PCB
US20160150678A1 (en) * 2014-11-22 2016-05-26 Gerald Ho Kim Silicon Cooling Plate With An Integrated PCB
WO2016201080A1 (en) * 2015-06-09 2016-12-15 Hamilton Sunstrand Corporation Modular heat exchanger design
US20160377356A1 (en) * 2015-06-25 2016-12-29 Asia Vital Components Co., Ltd. Flexible and transformable water-cooling device
US10512192B2 (en) * 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
US10492334B2 (en) * 2017-01-12 2019-11-26 Rensselaer Polytechnic Institute Methods, systems, and assemblies for cooling an electronic component
US10939587B2 (en) * 2017-02-16 2021-03-02 Dell Products, L.P. System and method for injecting cooling air into servers in a server rack
JP2019045777A (en) * 2017-09-06 2019-03-22 セイコーエプソン株式会社 Electro-optical device, electronic apparatus, and projector
CN107979955B (en) * 2017-11-24 2020-06-30 北京百度网讯科技有限公司 Modularized liquid cooling server case
WO2019119142A1 (en) * 2017-12-22 2019-06-27 Mcmaster University Controlling operational parameters of a cooling unit
US20190215987A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator structure
US20190214329A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Liquid heat dissipation system
CN110034082B (en) * 2018-01-12 2021-01-01 创意电子股份有限公司 Electronic device with active heat dissipation
US10225955B1 (en) 2018-02-23 2019-03-05 Microsoft Technology Licensing, Llc Enclosure thermal short
CN109002108A (en) * 2018-09-13 2018-12-14 景德镇陶瓷大学 Simulation paper descend slowly and lightly multi-panel stress orientable heat extraction computer host box
US10939592B2 (en) * 2019-06-14 2021-03-02 Intel Corporation Liquid cooling system with sub atmospheric pressure coolant
FR3097899B1 (en) * 2019-06-27 2021-06-04 Safran Aircraft Engines Cooling device
US11137175B2 (en) * 2019-07-16 2021-10-05 Asia Vital Components Co., Ltd. Composite water-cooling radiator structure
US11924995B2 (en) * 2021-04-23 2024-03-05 Forcecon Technology Co., Ltd. Water cooling head with sparse and dense fins
US11700709B2 (en) * 2021-07-23 2023-07-11 Baidu Usa Llc Redundant module and systems for high density servers
US20230180429A1 (en) * 2021-12-03 2023-06-08 Hewlett Packard Enterprise Development Lp Cooling module and a method of cooling an electronic circuit module using the cooling module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US20050231914A1 (en) * 2002-08-16 2005-10-20 Kazuyuki Mikubo Cooling device for electronic apparatus

Family Cites Families (466)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2273505A (en) 1942-02-17 Container
US596062A (en) 1897-12-28 Device for preventing bursting of freezing pipes
US2039593A (en) 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
NL6514626A (en) 1965-11-11 1967-05-12
US3361195A (en) 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3524497A (en) 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US3771219A (en) 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
US3654988A (en) 1970-02-24 1972-04-11 American Standard Inc Freeze protection for outdoor cooler
DE2102254B2 (en) 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
US3662821A (en) 1971-02-01 1972-05-16 Daniel I Saxon Heat transfer roll with separate temperature zones for processing materials
US3800510A (en) 1972-05-09 1974-04-02 Celanese Corp Separating assembly
FR2216537B1 (en) 1973-02-06 1975-03-07 Gaz De France
US3852806A (en) 1973-05-02 1974-12-03 Gen Electric Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US3823572A (en) 1973-08-15 1974-07-16 American Air Filter Co Freeze protection device in heat pump system
US3917375A (en) 1974-06-17 1975-11-04 Teradyne Inc Electrical connection apparatus
US3929154A (en) 1974-07-29 1975-12-30 Frank E Goodwin Freeze protection apparatus
US3923426A (en) 1974-08-15 1975-12-02 Alza Corp Electroosmotic pump and fluid dispenser including same
US3946276A (en) 1974-10-09 1976-03-23 Burroughs Corporation Island assembly employing cooling means for high density integrated circuit packaging
US4072188A (en) 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US3993123A (en) 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
DE2658720C3 (en) 1976-12-24 1982-01-28 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Latent heat storage for holding a heat-storing medium
US4312012A (en) 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4203488A (en) 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
US4194559A (en) 1978-11-01 1980-03-25 Thermacore, Inc. Freeze accommodating heat pipe
US4235285A (en) 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
US4296455A (en) 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4332291A (en) 1979-12-21 1982-06-01 D. Mulock-Bentley And Associates (Proprietary) Limited Heat exchanger with slotted fin strips
US4248295A (en) 1980-01-17 1981-02-03 Thermacore, Inc. Freezable heat pipe
US4345267A (en) 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4573067A (en) 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4450472A (en) 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4574876A (en) 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
JPS582276A (en) 1981-06-24 1983-01-07 株式会社日立製作所 Metal-ceramic joint body and manufacture
JPS58137285A (en) 1982-02-10 1983-08-15 株式会社日立製作所 Ceramic board with metal plate and method of producing same
CH658511A5 (en) 1982-04-21 1986-11-14 Ernst H Furrer Fa COOLING UNIT FOR A CLOSED DEVICE, IN PARTICULAR FOR A CONTROL CABINET.
US4485429A (en) 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4494171A (en) 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4516632A (en) 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4467861A (en) 1982-10-04 1984-08-28 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr Heat-transporting device
GB8323065D0 (en) 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
JPS6057956A (en) 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The Heat pipe type dissipator for semiconductor
US4567505A (en) 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
JPH0673364B2 (en) 1983-10-28 1994-09-14 株式会社日立製作所 Integrated circuit chip cooler
US4664181A (en) 1984-03-05 1987-05-12 Thermo Electron Corporation Protection of heat pipes from freeze damage
US4561040A (en) 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
US4612979A (en) 1984-08-31 1986-09-23 Siemens Aktiengesellschaft Apparatus for the cooling of electronic assemblies or components
US4893174A (en) 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
ES2024412B3 (en) 1985-12-13 1992-03-01 Hasler Ag Ascom PROCEDURE AND DEVICE FOR THE EVACUATION OF LOST HEAT FROM AT LEAST ONE GROUP OF CONSTRUCTION OF ELECTRICAL ELEMENTS
US4758926A (en) 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4716494A (en) 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
US4868712A (en) 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
GB2204181B (en) 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
US4903761A (en) 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US4791983A (en) 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
US5016138A (en) 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4894709A (en) 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4896719A (en) 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US4866570A (en) 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US5365400A (en) 1988-09-09 1994-11-15 Hitachi, Ltd. Heat sinks and semiconductor cooling device using the heat sinks
US4938280A (en) 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
CA2002213C (en) 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US5058627A (en) 1989-04-10 1991-10-22 Brannen Wiley W Freeze protection system for water pipes
US5145001A (en) 1989-07-24 1992-09-08 Creare Inc. High heat flux compact heat exchanger having a permeable heat transfer element
US5009760A (en) 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
DE3927755C2 (en) 1989-08-23 1997-09-11 Sel Alcatel Ag Heat dissipation device for electrical components
CH681168A5 (en) 1989-11-10 1993-01-29 Westonbridge Int Ltd Micro-pump for medicinal dosing
US4978638A (en) 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
US5016707A (en) * 1989-12-28 1991-05-21 Sundstrand Corporation Multi-pass crossflow jet impingement heat exchanger
US5083194A (en) 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
DE4006152A1 (en) 1990-02-27 1991-08-29 Fraunhofer Ges Forschung MICROMINIATURIZED PUMP
US5179500A (en) 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
US6176962B1 (en) 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US6054034A (en) 1990-02-28 2000-04-25 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5858188A (en) 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5070040A (en) 1990-03-09 1991-12-03 University Of Colorado Foundation, Inc. Method and apparatus for semiconductor circuit chip cooling
US4987996A (en) 1990-03-15 1991-01-29 Atco Rubber Products, Inc. Flexible duct and carton
US5016090A (en) 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5043797A (en) 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
US5265670A (en) 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
JPH07114250B2 (en) 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5161089A (en) 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5203401A (en) 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5285347A (en) 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5057908A (en) 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
CH680693A5 (en) 1990-08-07 1992-10-15 Sulzer Ag
US5420067A (en) 1990-09-28 1995-05-30 The United States Of America As Represented By The Secretary Of The Navy Method of fabricatring sub-half-micron trenches and holes
US5099910A (en) 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
JPH06342990A (en) 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
US5131233A (en) 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
US5232047A (en) 1991-04-02 1993-08-03 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5125451A (en) 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5263251A (en) 1991-04-02 1993-11-23 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5105430A (en) 1991-04-09 1992-04-14 The United States Of America As Represented By The United States Department Of Energy Thin planar package for cooling an array of edge-emitting laser diodes
US5199487A (en) 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
EP0520173A2 (en) 1991-06-21 1992-12-30 Tandon Corporation Computer housing
FR2679729B1 (en) 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
US5239200A (en) 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5228502A (en) 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
US5386143A (en) 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH05217121A (en) 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
DE69305667T2 (en) 1992-03-09 1997-05-28 Sumitomo Metal Ind Heat sink with good heat dissipating properties and manufacturing processes
US5218515A (en) 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5230564A (en) 1992-03-20 1993-07-27 Cray Research, Inc. Temperature monitoring system for air-cooled electric components
US5239443A (en) 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5317805A (en) 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5275237A (en) 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
DE4240082C1 (en) 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Heat pipe
US5520244A (en) 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
US5269372A (en) 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
US5397919A (en) 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5299635A (en) 1993-03-05 1994-04-05 Wynn's Climate Systems, Inc. Parallel flow condenser baffle
JPH06266474A (en) 1993-03-17 1994-09-22 Hitachi Ltd Electronic apparatus equipment and lap top electronic apparatus equipment
KR100327521B1 (en) 1993-03-19 2002-07-03 이.아이,듀우판드네모아앤드캄파니 Integrated chemical processing device and its manufacturing method
US5534328A (en) 1993-12-02 1996-07-09 E. I. Du Pont De Nemours And Company Integrated chemical processing apparatus and processes for the preparation thereof
JP3477781B2 (en) 1993-03-23 2003-12-10 セイコーエプソン株式会社 IC card
US5459352A (en) 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5436793A (en) 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
US5796580A (en) 1993-04-13 1998-08-18 Hitachi, Ltd. Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels
US5427174A (en) 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5380956A (en) 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5727618A (en) 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5704416A (en) 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
EP0720720B1 (en) 1993-09-27 1998-01-21 Eberhard Dipl.-Ing. Paul Channel heat exchanger
US5514906A (en) 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
KR100353020B1 (en) 1993-12-28 2003-01-10 쇼와 덴코 가부시키가이샤 Multilayer Heat Exchanger
CH689836A5 (en) 1994-01-14 1999-12-15 Westonbridge Int Ltd Micropump.
US5383340A (en) 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5424918A (en) 1994-03-31 1995-06-13 Hewlett-Packard Company Universal hybrid mounting system
US5647429A (en) 1994-06-16 1997-07-15 Oktay; Sevgin Coupled, flux transformer heat pipes
US5544696A (en) 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US6129973A (en) 1994-07-29 2000-10-10 Battelle Memorial Institute Microchannel laminated mass exchanger and method of making
US5611214A (en) 1994-07-29 1997-03-18 Battelle Memorial Institute Microcomponent sheet architecture
US5811062A (en) 1994-07-29 1998-09-22 Battelle Memorial Institute Microcomponent chemical process sheet architecture
US6126723A (en) 1994-07-29 2000-10-03 Battelle Memorial Institute Microcomponent assembly for efficient contacting of fluid
US5539153A (en) 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5641400A (en) 1994-10-19 1997-06-24 Hewlett-Packard Company Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems
US5508234A (en) 1994-10-31 1996-04-16 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
JP3355824B2 (en) 1994-11-04 2002-12-09 株式会社デンソー Corrugated fin heat exchanger
US5585069A (en) 1994-11-10 1996-12-17 David Sarnoff Research Center, Inc. Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
US5676198A (en) 1994-11-15 1997-10-14 Sundstrand Corporation Cooling apparatus for an electronic component
US5876655A (en) 1995-02-21 1999-03-02 E. I. Du Pont De Nemours And Company Method for eliminating flow wrinkles in compression molded panels
US6227809B1 (en) 1995-03-09 2001-05-08 University Of Washington Method for making micropumps
DE19514548C1 (en) 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
JP3113793B2 (en) 1995-05-02 2000-12-04 株式会社エヌ・ティ・ティ ファシリティーズ Air conditioning system
US5548605A (en) 1995-05-15 1996-08-20 The Regents Of The University Of California Monolithic microchannel heatsink
US5575929A (en) 1995-06-05 1996-11-19 The Regents Of The University Of California Method for making circular tubular channels with two silicon wafers
US6057149A (en) 1995-09-15 2000-05-02 The University Of Michigan Microscale devices and reactions in microscale devices
US5696405A (en) 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US5757070A (en) 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
JPH09129790A (en) 1995-11-07 1997-05-16 Toshiba Corp Heat sink device
US5705018A (en) 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
JP3029792B2 (en) 1995-12-28 2000-04-04 日本サーボ株式会社 Multi-phase permanent magnet type rotating electric machine
JP3090954B2 (en) 1996-01-04 2000-09-25 ダイムラークライスラー アクチエンゲゼルシャフト Cooling member with pins
US5918469A (en) 1996-01-11 1999-07-06 Silicon Thermal, Inc. Cooling system and method of cooling electronic devices
US6010316A (en) 1996-01-16 2000-01-04 The Board Of Trustees Of The Leland Stanford Junior University Acoustic micropump
US5579828A (en) 1996-01-16 1996-12-03 Hudson Products Corporation Flexible insert for heat pipe freeze protection
JP3763582B2 (en) 1996-02-13 2006-04-05 アセア ブラウン ボベリ アクチボラグ Equipment for casting in molds
US5768104A (en) 1996-02-22 1998-06-16 Cray Research, Inc. Cooling approach for high power integrated circuits mounted on printed circuit boards
US5675473A (en) 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5703536A (en) 1996-04-08 1997-12-30 Harris Corporation Liquid cooling system for high power solid state AM transmitter
US5885470A (en) 1997-04-14 1999-03-23 Caliper Technologies Corporation Controlled fluid transport in microfabricated polymeric substrates
US6016864A (en) 1996-04-19 2000-01-25 Heatcraft Inc. Heat exchanger with relatively flat fluid conduits
JP3329663B2 (en) 1996-06-21 2002-09-30 株式会社日立製作所 Cooling device for electronic devices
US5957194A (en) 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US5800690A (en) 1996-07-03 1998-09-01 Caliper Technologies Corporation Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces
US5740013A (en) 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
DE19628548A1 (en) 1996-07-16 1998-01-22 Abb Patent Gmbh Heat sink profile for air cooling device for semiconductor components
US5801442A (en) 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US5763951A (en) 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5692558A (en) 1996-07-22 1997-12-02 Northrop Grumman Corporation Microchannel cooling using aviation fuels for airborne electronics
US5731954A (en) 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
JPH1070219A (en) 1996-08-27 1998-03-10 Fujitsu Ltd Packaged module cooling device
DE29717480U1 (en) 1996-09-30 1998-02-05 Siemens Ag System for cooling speed-controlled drives
US5835345A (en) 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
US5830806A (en) 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
DE19643717A1 (en) 1996-10-23 1998-04-30 Asea Brown Boveri Liquid cooling device for a high-performance semiconductor module
US5963887A (en) 1996-11-12 1999-10-05 The United States Of America As Represented By The Secretary Of The Navy Apparatus for optimizing the rotational speed of cooling fans
JP3268734B2 (en) 1996-11-15 2002-03-25 古河電気工業株式会社 Method of manufacturing electronic device heat radiation unit using heat pipe
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
JPH10176768A (en) 1996-11-27 1998-06-30 Xerox Corp Microdevice supporting system and array of microdevice
US5870823A (en) 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5964092A (en) 1996-12-13 1999-10-12 Nippon Sigmax, Co., Ltd. Electronic cooling apparatus
US5927390A (en) 1996-12-13 1999-07-27 Caterpillar Inc. Radiator arrangement with offset modular cores
JPH10190071A (en) 1996-12-20 1998-07-21 Aisin Seiki Co Ltd Multistage electronic cooling device
US5898572A (en) 1996-12-24 1999-04-27 Decibel Instruments, Inc. Method and apparatus for the mitigation of noise generated by personal computers
US5896869A (en) 1997-01-13 1999-04-27 International Business Machines Corporation Semiconductor package having etched-back silver-copper braze
SE9700205D0 (en) 1997-01-24 1997-01-24 Peter Lindberg Integrated microfluidic element
JP3450148B2 (en) 1997-03-07 2003-09-22 三菱電機株式会社 Loop type heat pipe
DE19710783C2 (en) 1997-03-17 2003-08-21 Curamik Electronics Gmbh Coolers for use as a heat sink for electrical components or circuits
SE512111C2 (en) 1997-03-26 2000-01-24 Silvandersson Miljoe Ab Insect trap device
US6391622B1 (en) 1997-04-04 2002-05-21 Caliper Technologies Corp. Closed-loop biochemical analyzers
US5993750A (en) 1997-04-11 1999-11-30 Eastman Kodak Company Integrated ceramic micro-chemical plant
US5921087A (en) 1997-04-22 1999-07-13 Intel Corporation Method and apparatus for cooling integrated circuits using a thermoelectric module
WO1998049548A1 (en) 1997-04-25 1998-11-05 Caliper Technologies Corporation Microfluidic devices incorporating improved channel geometries
US6159353A (en) 1997-04-30 2000-12-12 Orion Research, Inc. Capillary electrophoretic separation system
US5880524A (en) 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
JP2002512737A (en) 1997-05-08 2002-04-23 ナノシステムズ，インコーポレイテッド Silicon etching method for manufacturing microchannel plate
US5923086A (en) 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die
US6090251A (en) 1997-06-06 2000-07-18 Caliper Technologies, Inc. Microfabricated structures for facilitating fluid introduction into microfluidic devices
US5869004A (en) 1997-06-09 1999-02-09 Caliper Technologies Corp. Methods and apparatus for in situ concentration and/or dilution of materials in microfluidic systems
US5942093A (en) 1997-06-18 1999-08-24 Sandia Corporation Electro-osmotically driven liquid delivery method and apparatus
US6277257B1 (en) 1997-06-25 2001-08-21 Sandia Corporation Electrokinetic high pressure hydraulic system
US6013164A (en) 1997-06-25 2000-01-11 Sandia Corporation Electokinetic high pressure hydraulic system
US6019882A (en) 1997-06-25 2000-02-01 Sandia Corporation Electrokinetic high pressure hydraulic system
US5847452A (en) 1997-06-30 1998-12-08 Sun Microsystems, Inc. Post mounted heat sink method and apparatus
US6001231A (en) 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6034872A (en) 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
JP4048579B2 (en) 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US6049040A (en) 1997-09-17 2000-04-11 Biles; Scott Douglas Universal cable guide
US6400012B1 (en) 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6012902A (en) 1997-09-25 2000-01-11 Caliper Technologies Corp. Micropump
US5842787A (en) 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US5836750A (en) 1997-10-09 1998-11-17 Honeywell Inc. Electrostatically actuated mesopump having a plurality of elementary cells
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US5829514A (en) 1997-10-29 1998-11-03 Eastman Kodak Company Bonded cast, pin-finned heat sink and method of manufacture
US6174675B1 (en) 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6140860A (en) 1997-12-31 2000-10-31 Intel Corporation Thermal sensing circuit
US6031751A (en) 1998-01-20 2000-02-29 Reliance Electric Industrial Company Small volume heat sink/electronic assembly
US6167910B1 (en) 1998-01-20 2001-01-02 Caliper Technologies Corp. Multi-layer microfluidic devices
US6100541A (en) 1998-02-24 2000-08-08 Caliper Technologies Corporation Microfluidic devices and systems incorporating integrated optical elements
US6084178A (en) 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6355505B1 (en) 1998-04-08 2002-03-12 Fuji Photo Film Co., Ltd. Heat sink and method of manufacturing heat sink
US6163073A (en) 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US6493221B2 (en) 1998-05-05 2002-12-10 Intel Corporation Computer peripheral bay cooling apparatus
US6019165A (en) 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
RU2194328C2 (en) 1998-05-19 2002-12-10 ООО "Высокие технологии" Cold-emission film cathode and its production process
US6227287B1 (en) 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
KR100266698B1 (en) 1998-06-12 2000-09-15 김영환 Semiconductor chip package and fabrication method thereof
US6196307B1 (en) 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US5940270A (en) 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
US5965813A (en) 1998-07-23 1999-10-12 Industry Technology Research Institute Integrated flow sensor
US6129260A (en) 1998-08-19 2000-10-10 Fravillig Technologies Company Solderable structures
US6119729A (en) 1998-09-14 2000-09-19 Arise Technologies Corporation Freeze protection apparatus for fluid transport passages
US6146103A (en) 1998-10-09 2000-11-14 The Regents Of The University Of California Micromachined magnetohydrodynamic actuators and sensors
US6021045A (en) 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6032689A (en) 1998-10-30 2000-03-07 Industrial Technology Research Institute Integrated flow controller module
US6086330A (en) 1998-12-21 2000-07-11 Motorola, Inc. Low-noise, high-performance fan
US6313992B1 (en) 1998-12-22 2001-11-06 James J. Hildebrandt Method and apparatus for increasing the power density of integrated circuit boards and their components
US6365962B1 (en) 2000-03-29 2002-04-02 Intel Corporation Flip-chip on flex for high performance packaging applications
US6416642B1 (en) 1999-01-21 2002-07-09 Caliper Technologies Corp. Method and apparatus for continuous liquid flow in microscale channels using pressure injection, wicking, and electrokinetic injection
EP1163052B1 (en) 1999-02-23 2010-06-02 Caliper Life Sciences, Inc. Manipulation of microparticles in microfluidic systems
US6553253B1 (en) 1999-03-12 2003-04-22 Biophoretic Therapeutic Systems, Llc Method and system for electrokinetic delivery of a substance
JP4493061B2 (en) 1999-04-22 2010-06-30 油研工業株式会社 Hydraulic pump with built-in electric motor
US6406605B1 (en) 1999-06-01 2002-06-18 Ysi Incorporated Electroosmotic flow controlled microfluidic devices
US6495015B1 (en) 1999-06-18 2002-12-17 Sandia National Corporation Electrokinetically pumped high pressure sprays
US6287440B1 (en) 1999-06-18 2001-09-11 Sandia Corporation Method for eliminating gas blocking in electrokinetic pumping systems
US6096656A (en) 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6234240B1 (en) 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6131650A (en) 1999-07-20 2000-10-17 Thermal Corp. Fluid cooled single phase heat sink
US6396706B1 (en) 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
US6457515B1 (en) 1999-08-06 2002-10-01 The Ohio State University Two-layered micro channel heat sink, devices and systems incorporating same
JP3518434B2 (en) 1999-08-11 2004-04-12 株式会社日立製作所 Multi-chip module cooling system
US6693320B1 (en) 1999-08-30 2004-02-17 Micron Technology, Inc. Capacitor structures with recessed hemispherical grain silicon
US6216343B1 (en) 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6293333B1 (en) 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
GB9922124D0 (en) 1999-09-17 1999-11-17 Pfizer Ltd Phosphodiesterase enzymes
US6210986B1 (en) 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
JP2001110956A (en) 1999-10-04 2001-04-20 Matsushita Electric Ind Co Ltd Cooling equipment for electronic component
US6544662B2 (en) 1999-10-25 2003-04-08 Alliedsignal Inc. Process for manufacturing of brazed multi-channeled structures
KR100338810B1 (en) 1999-11-08 2002-05-31 윤종용 cooling device
US6166907A (en) 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US7630198B2 (en) 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US6729383B1 (en) 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US6324075B1 (en) 1999-12-20 2001-11-27 Intel Corporation Partially covered motherboard with EMI partition gateway
JP2001185306A (en) 1999-12-28 2001-07-06 Jst Mfg Co Ltd Connector for module
US6154363A (en) 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement
US6570764B2 (en) 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6415860B1 (en) 2000-02-09 2002-07-09 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Crossflow micro heat exchanger
US6253835B1 (en) 2000-02-11 2001-07-03 International Business Machines Corporation Isothermal heat sink with converging, diverging channels
US6337794B1 (en) 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6301109B1 (en) 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
EP1123739B1 (en) 2000-02-11 2006-11-29 STMicroelectronics S.r.l. Integrated device for microfluid thermoregulation, and manufacturing process thereof
DE10008383A1 (en) 2000-02-23 2001-09-06 Loh Kg Rittal Werk Control cabinet or housing with an air conditioning device
US6417060B2 (en) 2000-02-25 2002-07-09 Borealis Technical Limited Method for making a diode device
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
WO2001072099A2 (en) 2000-03-21 2001-09-27 Liebert Corporation Method and apparatus for cooling electronic enclosures
US6257320B1 (en) 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
US6347036B1 (en) 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6366467B1 (en) 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
US6290909B1 (en) 2000-04-13 2001-09-18 Sandia Corporation Sample injector for high pressure liquid chromatography
DE60140837D1 (en) 2000-04-19 2010-02-04 Thermal Form & Function Inc Cooling plate with cooling fins with a vaporizing coolant
JP2001326311A (en) 2000-05-15 2001-11-22 Hitachi Ltd Cooling device for electronic equipment
FR2809281B1 (en) 2000-05-22 2002-07-12 Alstom ELECTRONIC POWER DEVICE
US6787052B1 (en) 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
TW449040U (en) 2000-06-20 2001-08-01 Advanced Thermal Technologies Improved structure of planar heat tube
US6366462B1 (en) 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6459582B1 (en) 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
US6362958B1 (en) 2000-08-11 2002-03-26 Ming-Chuan Yu Detachable cooling device for computer
US6915648B2 (en) 2000-09-14 2005-07-12 Xdx Inc. Vapor compression systems, expansion devices, flow-regulating members, and vehicles, and methods for using vapor compression systems
US6317326B1 (en) 2000-09-14 2001-11-13 Sun Microsystems, Inc. Integrated circuit device package and heat dissipation device
US6388317B1 (en) 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US6469893B1 (en) 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6324058B1 (en) 2000-10-25 2001-11-27 Chieh-Jen Hsiao Heat-dissipating apparatus for an integrated circuit device
US6537437B1 (en) 2000-11-13 2003-03-25 Sandia Corporation Surface-micromachined microfluidic devices
US6367544B1 (en) 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6578626B1 (en) 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6336497B1 (en) 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
US6437981B1 (en) 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
US6367543B1 (en) 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6459581B1 (en) 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
JP3607608B2 (en) 2000-12-19 2005-01-05 株式会社日立製作所 Liquid cooling system for notebook computers
JP2002188876A (en) 2000-12-20 2002-07-05 Hitachi Ltd Liquid cooling system and personal computer provided with the system
CA2329408C (en) 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US6698924B2 (en) 2000-12-21 2004-03-02 Tank, Inc. Cooling system comprising a circular venturi
US6431260B1 (en) 2000-12-21 2002-08-13 International Business Machines Corporation Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
US6639799B2 (en) 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US6466442B2 (en) 2001-01-29 2002-10-15 Ching-Bin Lin Guidably-recirculated heat dissipating means for cooling central processing unit
US6424531B1 (en) 2001-03-13 2002-07-23 Delphi Technologies, Inc. High performance heat sink for electronics cooling
US7556086B2 (en) 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
US6601643B2 (en) 2001-04-27 2003-08-05 Samsung Electronics Co., Ltd Flat evaporator
US6609560B2 (en) 2001-04-28 2003-08-26 Samsung Electronics Co., Ltd. Flat evaporator
US6600220B2 (en) 2001-05-14 2003-07-29 Hewlett-Packard Company Power distribution in multi-chip modules
JP2003035470A (en) 2001-05-15 2003-02-07 Samsung Electronics Co Ltd Evaporator of cpl cooling equipment having minute wick structure
US7177931B2 (en) * 2001-05-31 2007-02-13 Yahoo! Inc. Centralized feed manager
US7462852B2 (en) 2001-12-17 2008-12-09 Tecomet, Inc. Devices, methods, and systems involving cast collimators
US6449162B1 (en) 2001-06-07 2002-09-10 International Business Machines Corporation Removable land grid array cooling solution
AU2002306161A1 (en) 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system
US6519151B2 (en) 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
JP3690658B2 (en) 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション Heat sink, cooling member, semiconductor substrate cooling apparatus, computer, and heat dissipation method
US6385044B1 (en) 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
WO2003017365A2 (en) 2001-08-17 2003-02-27 Honeywell International Inc. Thermal transfer devices using heat pipes
DE10141525B4 (en) 2001-08-24 2009-12-31 ZAE Bayern Bayerisches Zentrum für angewandte Energieforschung eV Mass and heat exchange reactor
US6438984B1 (en) 2001-08-29 2002-08-27 Sun Microsystems, Inc. Refrigerant-cooled system and method for cooling electronic components
US6587343B2 (en) 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components
US6533029B1 (en) 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
JP3636118B2 (en) 2001-09-04 2005-04-06 株式会社日立製作所 Water cooling device for electronic equipment
US6652939B2 (en) 2001-09-13 2003-11-25 Dayco Products, Llc Low permeation nylon tube with aluminum barrier layer
US6981543B2 (en) 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6808011B2 (en) 2001-09-26 2004-10-26 Thermal.Corp. Heat pipe system for cooling flywheel energy storage systems
TW516810U (en) 2001-09-27 2003-01-01 Hoya Tech Co Ltd Fastening device for heat sink
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6449157B1 (en) 2001-10-03 2002-09-10 Ho Kang Chu IC package assembly with retention mechanism
US20030205363A1 (en) 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
FR2832336B1 (en) 2001-11-22 2004-02-20 Air Liquide BRAZED COPPER HEAT EXCHANGERS AND MANUFACTURING METHOD THEREOF
US6581388B2 (en) 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
DE20119352U1 (en) 2001-11-28 2002-03-14 Festo Ag & Co Connection piece, fluid line and fluid technology device
US6527835B1 (en) 2001-12-21 2003-03-04 Sandia Corporation Chemical preconcentrator with integral thermal flow sensor
US6477045B1 (en) 2001-12-28 2002-11-05 Tien-Lai Wang Heat dissipater for a central processing unit
IL147394A0 (en) 2001-12-30 2002-08-14 Active Cool Ltd Thermoelectric active cooling system for a computer processor with reduced audible noise and emi noise audio noise
US6700785B2 (en) 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6643132B2 (en) 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US6836407B2 (en) 2002-01-04 2004-12-28 Intel Corporation Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
JP3961843B2 (en) 2002-02-08 2007-08-22 株式会社日立製作所 A small computer with a liquid cooling system.
US6914779B2 (en) 2002-02-15 2005-07-05 Microsoft Corporation Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
EP1488182A4 (en) 2002-02-26 2007-09-05 Mikros Mfg Inc Capillary evaporator
US6591625B1 (en) 2002-04-17 2003-07-15 Agilent Technologies, Inc. Cooling of substrate-supported heat-generating components
TWI234063B (en) 2002-05-15 2005-06-11 Matsushita Electric Ind Co Ltd Cooling apparatus for electronic equipment
US7209355B2 (en) 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6827128B2 (en) 2002-05-20 2004-12-07 The Board Of Trustees Of The University Of Illinois Flexible microchannel heat exchanger
US6674642B1 (en) 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US20040008483A1 (en) 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
US6588498B1 (en) 2002-07-18 2003-07-08 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
US6724632B2 (en) 2002-07-18 2004-04-20 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly with adjustable clip
US20040020225A1 (en) 2002-08-02 2004-02-05 Patel Chandrakant D. Cooling system
JP3641258B2 (en) 2002-08-26 2005-04-20 株式会社東芝 Electronics
WO2004020888A2 (en) 2002-08-28 2004-03-11 Federal-Mogul Powertrain, Inc. Cable guide sleeving structure
TW578992U (en) 2002-09-09 2004-03-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
AU2003270600B2 (en) * 2002-09-12 2008-08-14 Radiant Medical, Inc. System and method for determining and controlling core body temperature
DE10243026B3 (en) 2002-09-13 2004-06-03 Oliver Laing Device for local cooling or heating of an object
US6894899B2 (en) 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US6834515B2 (en) 2002-09-13 2004-12-28 Air Products And Chemicals, Inc. Plate-fin exchangers with textured surfaces
AU2003270882A1 (en) 2002-09-23 2004-05-04 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6881039B2 (en) 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
JP2004139185A (en) 2002-10-15 2004-05-13 Toshiba Corp Electronic device
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US6988535B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US7000684B2 (en) 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
JP2006516068A (en) 2002-11-01 2006-06-15 クーリギー インコーポレイテッド Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat generating device
US7156159B2 (en) 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US6889515B2 (en) 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
US6775137B2 (en) 2002-11-25 2004-08-10 International Business Machines Corporation Method and apparatus for combined air and liquid cooling of stacked electronics components
US7210227B2 (en) 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
US6778393B2 (en) 2002-12-02 2004-08-17 International Business Machines Corporation Cooling device with multiple compliant elements
US20040107718A1 (en) 2002-12-06 2004-06-10 Michael Bowman Method, system and apparatus for cooling high power density devices
US6809928B2 (en) 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor
KR20040065626A (en) 2003-01-15 2004-07-23 엘지전자 주식회사 Heat exchanger
US7205675B2 (en) 2003-01-29 2007-04-17 Hewlett-Packard Development Company, L.P. Micro-fabricated device with thermoelectric device and method of making
US7044196B2 (en) 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7090001B2 (en) 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US6798660B2 (en) 2003-02-13 2004-09-28 Dell Products L.P. Liquid cooling module
JP4199018B2 (en) 2003-02-14 2008-12-17 株式会社日立製作所 Rack mount server system
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
JP2004302996A (en) 2003-03-31 2004-10-28 Toshiba Corp Information processor and fan control method
US6903929B2 (en) 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US6992891B2 (en) 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
US6798663B1 (en) 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location
DE10319367A1 (en) 2003-04-29 2004-11-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for creating a hydraulic network for optimized heat transfer and mass transfer
US7112131B2 (en) 2003-05-13 2006-09-26 American Power Conversion Corporation Rack enclosure
US6763880B1 (en) 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
CN100579348C (en) 2003-06-27 2010-01-06 日本电气株式会社 Cooler for electronic equipment
US6819563B1 (en) 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7021369B2 (en) 2003-07-23 2006-04-04 Cooligy, Inc. Hermetic closed loop fluid system
JP2005064186A (en) 2003-08-11 2005-03-10 Hitachi Ltd Electronic apparatus equipped with cooling system
US7310230B2 (en) 2003-08-21 2007-12-18 Delta Design, Inc. Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure
US20050061013A1 (en) 2003-09-10 2005-03-24 Bond Richard C. Method and apparatus for cooling devices that in use generate unwanted heat
US7508672B2 (en) 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
JP4157451B2 (en) 2003-09-30 2008-10-01 株式会社東芝 Gas-liquid separation mechanism, reserve tank, and electronic equipment
TWM248227U (en) 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Liquid cooling apparatus
EP1682995A2 (en) 2003-11-07 2006-07-26 Asetek A/S Cooling system for a computer system
US7273088B2 (en) 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
US7295444B1 (en) 2003-12-31 2007-11-13 Ncr Corporation Delivering chilled air to components in a hardware cabinet
US6896612B1 (en) 2004-01-26 2005-05-24 Sun Microsystems, Inc. Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation
US6980435B2 (en) 2004-01-28 2005-12-27 Hewlett-Packard Development Company, L.P. Modular electronic enclosure with cooling design
US7018169B2 (en) 2004-02-23 2006-03-28 General Electric Company Fluid flow control apparatus
JP2007529707A (en) 2004-02-24 2007-10-25 スペグ カンパニー リミテッド Micro heat exchanger for fuel cell and manufacturing method
US20050257532A1 (en) 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
US7359197B2 (en) 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US6955212B1 (en) 2004-04-20 2005-10-18 Adda Corporation Water-cooler radiator module
US7325588B2 (en) 2004-04-29 2008-02-05 Hewlett-Packard Development Company, L.P. High serviceability liquid cooling loop using flexible bellows
US7011143B2 (en) 2004-05-04 2006-03-14 International Business Machines Corporation Method and apparatus for cooling electronic components
US7248472B2 (en) 2004-05-21 2007-07-24 Hewlett-Packard Development Company, L.P. Air distribution system
US7382613B2 (en) 2004-05-21 2008-06-03 Hewlett-Packard Development Company, L.P. Computer system with external air mover
US7188662B2 (en) 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7301773B2 (en) 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7178512B1 (en) 2004-06-23 2007-02-20 Brunswick Corporation Fuel system for a marine vessel with a gaseous purge fuel container
JP4056504B2 (en) 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
DE102004042154B4 (en) 2004-08-31 2011-01-05 Asia Vital Components Co., Ltd. cooler
US7239516B2 (en) 2004-09-10 2007-07-03 International Business Machines Corporation Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
US7243704B2 (en) 2004-11-18 2007-07-17 Delta Design, Inc. Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
US6973801B1 (en) * 2004-12-09 2005-12-13 International Business Machines Corporation Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
US7327570B2 (en) 2004-12-22 2008-02-05 Hewlett-Packard Development Company, L.P. Fluid cooled integrated circuit module
CN100371854C (en) 2004-12-24 2008-02-27 富准精密工业(深圳)有限公司 Liquid cooling type heat sink
US7143820B2 (en) 2004-12-31 2006-12-05 Intel Corporation Systems for improved heat exchanger
US7124811B2 (en) 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate
US7117931B2 (en) 2004-12-31 2006-10-10 Intel Corporation Systems for low cost liquid cooling
US7280363B2 (en) 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
DE102005005296B3 (en) 2005-02-04 2006-05-18 Knürr AG Cooling unit for electronic modules used in server, comprises a supply of cool air, an air-liquid heat exchanger, and ventilators
US20060187639A1 (en) 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
US7385810B2 (en) 2005-04-18 2008-06-10 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
US7871578B2 (en) 2005-05-02 2011-01-18 United Technologies Corporation Micro heat exchanger with thermally conductive porous network
US7233494B2 (en) 2005-05-06 2007-06-19 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
US7342789B2 (en) 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
DE102005033150A1 (en) 2005-07-13 2007-01-25 Atotech Deutschland Gmbh Microstructured cooler and its use
CN2888141Y (en) 2005-07-22 2007-04-11 富准精密工业(深圳)有限公司 Fan employing pulse width modulation to control rotation speed
US7719837B2 (en) 2005-08-22 2010-05-18 Shan Ping Wu Method and apparatus for cooling a blade server
US7190583B1 (en) 2005-08-29 2007-03-13 Verigy Pte Ltd Self contained, liquid to air cooled, memory test engineering workstation
US7143816B1 (en) 2005-09-09 2006-12-05 Delphi Technologies, Inc. Heat sink for an electronic device
US7228888B2 (en) 2005-10-13 2007-06-12 International Business Machines Corporation Rotatable liquid reservoir for computer cooling
US7434412B1 (en) 2005-10-27 2008-10-14 Sun Microsystems, Inc. Computer equipment temperature control system and methods for operating the same
US7626815B2 (en) 2005-11-14 2009-12-01 Nvidia Corporation Drive bay heat exchanger
US7420806B1 (en) 2005-11-22 2008-09-02 Juniper Networks, Inc. Airflow distribution through an electronic device
US20070164088A1 (en) 2006-01-18 2007-07-19 Kam Dianatkhah Brazing process for stainless steel heat exchangers
EP1989935A4 (en) 2006-02-16 2012-07-04 Cooligy Inc Liquid cooling loops for server applications
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
US7355850B2 (en) 2006-03-31 2008-04-08 National Instruments Corporation Vented and ducted sub-rack support member
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US20070251938A1 (en) 2006-04-26 2007-11-01 Watlow Electric Manufacturing Company Ceramic heater and method of securing a thermocouple thereto
US20070266714A1 (en) 2006-05-19 2007-11-22 Andreas Fiedler Heat exchanger assembly
US20070297136A1 (en) 2006-06-23 2007-12-27 Sun Micosystems, Inc. Modular liquid cooling of electronic components while preserving data center integrity
US20080013283A1 (en) 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components
US7679909B2 (en) 2006-07-18 2010-03-16 Liebert Corporation Integral swivel hydraulic connectors, door hinges, and methods and systems for their use
US7743821B2 (en) 2006-07-26 2010-06-29 General Electric Company Air cooled heat exchanger with enhanced heat transfer coefficient fins
US8395896B2 (en) 2007-02-24 2013-03-12 Hewlett-Packard Development Company, L.P. Redundant cooling systems and methods
US7430118B1 (en) 2007-06-04 2008-09-30 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US20110073292A1 (en) 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US20050231914A1 (en) * 2002-08-16 2005-10-20 Kazuyuki Mikubo Cooling device for electronic apparatus

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