WO2007124050A3 - Probe structures with electronic components - Google Patents

Probe structures with electronic components Download PDF

Info

Publication number
WO2007124050A3
WO2007124050A3 PCT/US2007/009660 US2007009660W WO2007124050A3 WO 2007124050 A3 WO2007124050 A3 WO 2007124050A3 US 2007009660 W US2007009660 W US 2007009660W WO 2007124050 A3 WO2007124050 A3 WO 2007124050A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
probe structures
contact structure
substrate
electronic component
Prior art date
Application number
PCT/US2007/009660
Other languages
French (fr)
Other versions
WO2007124050A2 (en
Inventor
Igor K Khandros
John K Gritters
Original Assignee
Formfactor Inc
Igor K Khandros
John K Gritters
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Igor K Khandros, John K Gritters filed Critical Formfactor Inc
Priority to EP07755797A priority Critical patent/EP2013632A4/en
Priority to JP2009506602A priority patent/JP2009534660A/en
Publication of WO2007124050A2 publication Critical patent/WO2007124050A2/en
Publication of WO2007124050A3 publication Critical patent/WO2007124050A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

A probe apparatus can include a substrate, a contact structure attached to the substrate, and an electronic component electrically connected to the contact structure. The electronic component can be attached to the contact structure.
PCT/US2007/009660 2006-04-21 2007-04-19 Probe structures with electronic components WO2007124050A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07755797A EP2013632A4 (en) 2006-04-21 2007-04-19 Probe structures with electronic components
JP2009506602A JP2009534660A (en) 2006-04-21 2007-04-19 Probe structure with electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/379,760 US7579856B2 (en) 2006-04-21 2006-04-21 Probe structures with physically suspended electronic components
US11/379,760 2006-04-21

Publications (2)

Publication Number Publication Date
WO2007124050A2 WO2007124050A2 (en) 2007-11-01
WO2007124050A3 true WO2007124050A3 (en) 2008-03-27

Family

ID=38618907

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/009660 WO2007124050A2 (en) 2006-04-21 2007-04-19 Probe structures with electronic components

Country Status (7)

Country Link
US (1) US7579856B2 (en)
EP (1) EP2013632A4 (en)
JP (1) JP2009534660A (en)
KR (1) KR20090012242A (en)
CN (1) CN101454679A (en)
TW (1) TW200745568A (en)
WO (1) WO2007124050A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7557592B2 (en) * 2006-06-06 2009-07-07 Formfactor, Inc. Method of expanding tester drive and measurement capability
JP4916893B2 (en) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス Probe manufacturing method
US8058887B2 (en) * 2008-01-23 2011-11-15 Sv Probe Pte. Ltd. Probe card assembly with interposer probes
US8441272B2 (en) * 2008-12-30 2013-05-14 Stmicroelectronics S.R.L. MEMS probe for probe cards for integrated circuits
TW201111798A (en) * 2009-09-29 2011-04-01 Hermes Testing Solutions Inc Structure for test probe card of integrated circuits
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
TW201239365A (en) * 2011-03-22 2012-10-01 Mpi Corp High frequency coupling signal adjustment manner and test device thereof
JP2013127408A (en) * 2011-12-19 2013-06-27 Micronics Japan Co Ltd Wiring of probe structure unit and manufacturing method
TWI453423B (en) * 2012-04-25 2014-09-21 Probe impedance matching method
TWI454709B (en) * 2012-09-07 2014-10-01 Mpi Corp The method of leveling the probe card structure
US9086433B2 (en) * 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
US9252138B2 (en) * 2014-05-27 2016-02-02 General Electric Company Interconnect devices for electronic packaging assemblies
KR102442100B1 (en) * 2015-03-31 2022-09-08 테크노프로브 에스.피.에이. Probe card for test equipment of electronic devices with improved filtering characteristics
US10101367B2 (en) * 2015-04-10 2018-10-16 Intel Corporation Microelectronic test device including a probe card having an interposer
TWI617811B (en) * 2016-04-22 2018-03-11 新特系統股份有限公司 Probe card
CN106226614B (en) * 2016-07-04 2019-03-26 京东方科技集团股份有限公司 A kind of test macro and its test method
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
KR102551965B1 (en) * 2022-12-02 2023-07-06 주식회사 피엠티 Probe Sheet With Contact Tip On Stacked Multi-Layer And Method Of Manufacturing The Same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5491426A (en) * 1994-06-30 1996-02-13 Vlsi Technology, Inc. Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card

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US4747784A (en) * 1986-05-16 1988-05-31 Daymarc Corporation Contactor for integrated circuits
US4894612A (en) * 1987-08-13 1990-01-16 Hypres, Incorporated Soft probe for providing high speed on-wafer connections to a circuit
JPH0653277A (en) * 1992-06-04 1994-02-25 Lsi Logic Corp Semiconductor device assembly and its assembly method
US5347226A (en) * 1992-11-16 1994-09-13 National Semiconductor Corporation Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction
US5748002A (en) * 1996-01-26 1998-05-05 Phase Dynamics Inc. RF probe for montoring composition of substances
JP3565893B2 (en) * 1994-02-04 2004-09-15 アジレント・テクノロジーズ・インク Probe device and electric circuit element measuring device
US5565788A (en) * 1994-07-20 1996-10-15 Cascade Microtech, Inc. Coaxial wafer probe with tip shielding
JPH08226934A (en) * 1995-02-22 1996-09-03 Nippon Telegr & Teleph Corp <Ntt> Probe
JP3576677B2 (en) * 1996-01-19 2004-10-13 キヤノン株式会社 Electrostatic actuator, probe using the actuator, scanning probe microscope, processing device, recording / reproducing device
US5734176A (en) * 1996-02-26 1998-03-31 Wiltron Company Impedance controlled test fixture for multi-lead surface mounted integrated circuits
US6046599A (en) * 1996-05-20 2000-04-04 Microconnect, Inc. Method and device for making connection
US5841982A (en) * 1996-06-17 1998-11-24 Brouwer; Derek J. Method and system for testing the operation of an electronic mail switch
US6477132B1 (en) * 1998-08-19 2002-11-05 Canon Kabushiki Kaisha Probe and information recording/reproduction apparatus using the same
US6491968B1 (en) * 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
JP2001244308A (en) * 2000-02-25 2001-09-07 Mitsubishi Electric Corp Probe for high frequency signal
US6811406B2 (en) * 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member
KR100418881B1 (en) * 2001-05-23 2004-02-19 엘지전자 주식회사 cantilever for high sensitivity piezoresistive of Atomic Force Microscope type
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7265562B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
JP2007517231A (en) * 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド Active wafer probe
US20060038576A1 (en) * 2004-08-19 2006-02-23 Pooya Tadayon Sort interface unit having probe capacitors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5491426A (en) * 1994-06-30 1996-02-13 Vlsi Technology, Inc. Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card

Also Published As

Publication number Publication date
TW200745568A (en) 2007-12-16
EP2013632A4 (en) 2012-06-06
KR20090012242A (en) 2009-02-02
US20070247175A1 (en) 2007-10-25
JP2009534660A (en) 2009-09-24
US7579856B2 (en) 2009-08-25
EP2013632A2 (en) 2009-01-14
WO2007124050A2 (en) 2007-11-01
CN101454679A (en) 2009-06-10

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