WO2007126534A3 - Electrical connector with segmented housing - Google Patents
Electrical connector with segmented housing Download PDFInfo
- Publication number
- WO2007126534A3 WO2007126534A3 PCT/US2007/005500 US2007005500W WO2007126534A3 WO 2007126534 A3 WO2007126534 A3 WO 2007126534A3 US 2007005500 W US2007005500 W US 2007005500W WO 2007126534 A3 WO2007126534 A3 WO 2007126534A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical connector
- segmented housing
- lead portion
- contacts
- housing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Preferred embodiments of electrical connectors include a plurality of electrically-conductive contacts each having a lead portion, a plurality of solder balls each attached to the lead portion of a respective one of the contacts, and a housing having plurality of pedestals that each receive the lead portion of a respective one of the contacts.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800196142A CN101455128B (en) | 2006-03-29 | 2007-03-02 | Electrical connector with segmented housing |
MX2008012308A MX2008012308A (en) | 2006-03-29 | 2007-03-02 | Electrical connector with segmented housing. |
EP07752215A EP2008503A4 (en) | 2006-03-29 | 2007-03-02 | Electrical connector with segmented housing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/393,051 | 2006-03-29 | ||
US11/393,051 US7226298B1 (en) | 2006-03-29 | 2006-03-29 | Electrical connector with segmented housing |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2007126534A2 WO2007126534A2 (en) | 2007-11-08 |
WO2007126534A3 true WO2007126534A3 (en) | 2008-06-19 |
WO2007126534A8 WO2007126534A8 (en) | 2008-12-31 |
Family
ID=38090093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/005500 WO2007126534A2 (en) | 2006-03-29 | 2007-03-02 | Electrical connector with segmented housing |
Country Status (5)
Country | Link |
---|---|
US (1) | US7226298B1 (en) |
EP (1) | EP2008503A4 (en) |
CN (1) | CN101455128B (en) |
MX (1) | MX2008012308A (en) |
WO (1) | WO2007126534A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2917031Y (en) * | 2006-07-11 | 2007-06-27 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
CN200986990Y (en) * | 2006-11-24 | 2007-12-05 | 富士康(昆山)电脑接插件有限公司 | Electric connector terminal |
US7553170B2 (en) * | 2006-12-19 | 2009-06-30 | Fci Americas Technology, Inc. | Surface mount connectors |
US7699628B2 (en) * | 2008-06-06 | 2010-04-20 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having reinforcement member attached to housing |
US8425237B2 (en) | 2010-09-11 | 2013-04-23 | International Business Machines Corporation | Socket having heat-dissipating vents |
US8657616B2 (en) | 2011-05-24 | 2014-02-25 | Fci Americas Technology Llc | Electrical contact normal force increase |
CN104283043B (en) * | 2014-09-30 | 2016-08-24 | 实盈电子(东莞)有限公司 | Spherical BGA socket adapter and the spherical BGA pin connector with its adaptation |
US10389051B2 (en) * | 2017-10-20 | 2019-08-20 | Arris Enterprises Llc | Connector structure with standoff region for improved soldering and method of making the same |
US10470313B1 (en) * | 2018-07-02 | 2019-11-05 | Te Connectivity Corporation | Solder ball module for contact assembly of an electrical connector |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6293455B1 (en) * | 1998-06-25 | 2001-09-25 | International Business Machines Corporation | Method for producing a reliable BGA solder joint interconnection |
US20050161806A1 (en) * | 2004-01-22 | 2005-07-28 | Divakar Mysore P. | Area array packages with overmolded pin-fin heat sinks |
US20060055010A1 (en) * | 2004-04-15 | 2006-03-16 | Kheng Lee T | Semiconductor packages |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574532A (en) * | 1990-01-18 | 1993-03-26 | Kel Corp | Electric connector |
US5255839A (en) | 1992-01-02 | 1993-10-26 | Motorola, Inc. | Method for solder application and reflow |
US5399104A (en) * | 1992-09-28 | 1995-03-21 | Mckenzie Socket Technology, Inc. | Socket for multi-lead integrated circuit packages |
JP3355353B2 (en) * | 1993-08-20 | 2002-12-09 | ケル株式会社 | Electrical connector |
US5562462A (en) * | 1994-07-19 | 1996-10-08 | Matsuba; Stanley | Reduced crosstalk and shielded adapter for mounting an integrated chip package on a circuit board like member |
US5519580A (en) | 1994-09-09 | 1996-05-21 | Intel Corporation | Method of controlling solder ball size of BGA IC components |
US5702255A (en) | 1995-11-03 | 1997-12-30 | Advanced Interconnections Corporation | Ball grid array socket assembly |
US5746608A (en) | 1995-11-30 | 1998-05-05 | Taylor; Attalee S. | Surface mount socket for an electronic package, and contact for use therewith |
US6007348A (en) * | 1996-05-07 | 1999-12-28 | Advanced Intercommunications Corporation | Solder ball terminal |
TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
US6426564B1 (en) | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
JP2000323215A (en) * | 1999-04-28 | 2000-11-24 | Berg Technol Inc | Electrical connector |
US6217348B1 (en) * | 1999-08-09 | 2001-04-17 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
TW484251B (en) * | 1999-10-19 | 2002-04-21 | Berg Tech Inc | Electrical connector with strain relief |
US6830462B1 (en) * | 1999-12-13 | 2004-12-14 | Fci Americas Technology, Inc. | Electrical connector housing |
US20040048504A1 (en) * | 2001-05-23 | 2004-03-11 | Hynes John K. | Electrical connector having a solder-array interface surface |
US6572397B2 (en) * | 2001-10-09 | 2003-06-03 | Lotes Co., Ltd. | Structure of a ball grid array IC socket connection with solder ball |
US6530788B1 (en) * | 2001-10-09 | 2003-03-11 | Lotes Co., Ltd. | Structure of a ball grid array IC socket connection with solder ball |
US6666693B2 (en) | 2001-11-20 | 2003-12-23 | Fci Americas Technology, Inc. | Surface-mounted right-angle electrical connector |
US6638082B2 (en) | 2001-11-20 | 2003-10-28 | Fci Americas Technology, Inc. | Pin-grid-array electrical connector |
US20050009385A1 (en) * | 2003-06-23 | 2005-01-13 | Korsunsky Iosif R. | Electrical connector having improved contacts |
US6971885B2 (en) | 2004-02-18 | 2005-12-06 | Teledyne Technologies Incorporated | Interconnect device with opposingly oriented contacts |
US20060016071A1 (en) | 2004-07-26 | 2006-01-26 | Huang-Chou Huang | Method for attaching an IC socket connector to a circuit board |
US7786591B2 (en) * | 2004-09-29 | 2010-08-31 | Broadcom Corporation | Die down ball grid array package |
-
2006
- 2006-03-29 US US11/393,051 patent/US7226298B1/en not_active Expired - Fee Related
-
2007
- 2007-03-02 CN CN2007800196142A patent/CN101455128B/en active Active
- 2007-03-02 EP EP07752215A patent/EP2008503A4/en not_active Withdrawn
- 2007-03-02 MX MX2008012308A patent/MX2008012308A/en active IP Right Grant
- 2007-03-02 WO PCT/US2007/005500 patent/WO2007126534A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6293455B1 (en) * | 1998-06-25 | 2001-09-25 | International Business Machines Corporation | Method for producing a reliable BGA solder joint interconnection |
US20050161806A1 (en) * | 2004-01-22 | 2005-07-28 | Divakar Mysore P. | Area array packages with overmolded pin-fin heat sinks |
US20060055010A1 (en) * | 2004-04-15 | 2006-03-16 | Kheng Lee T | Semiconductor packages |
Non-Patent Citations (2)
Title |
---|
PAVEL VALENTA: "Thermal Modeling of Ball Grid Arrays", ALCATEL SEL AG STUTTGART, GERMANY, Retrieved from the Internet <URL:http://www.flomerics.com/flotherm/technical_papers/t169/t169.jsp> * |
See also references of EP2008503A4 * |
Also Published As
Publication number | Publication date |
---|---|
MX2008012308A (en) | 2008-10-10 |
CN101455128B (en) | 2011-02-23 |
EP2008503A2 (en) | 2008-12-31 |
WO2007126534A8 (en) | 2008-12-31 |
CN101455128A (en) | 2009-06-10 |
US7226298B1 (en) | 2007-06-05 |
EP2008503A4 (en) | 2012-10-31 |
WO2007126534A2 (en) | 2007-11-08 |
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