WO2007131194A3 - Apparatus and methods for processing, testing, and packaging of semiconductor ics and image sensors - Google Patents

Apparatus and methods for processing, testing, and packaging of semiconductor ics and image sensors Download PDF

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Publication number
WO2007131194A3
WO2007131194A3 PCT/US2007/068285 US2007068285W WO2007131194A3 WO 2007131194 A3 WO2007131194 A3 WO 2007131194A3 US 2007068285 W US2007068285 W US 2007068285W WO 2007131194 A3 WO2007131194 A3 WO 2007131194A3
Authority
WO
WIPO (PCT)
Prior art keywords
packaging
testing
image sensors
processing
enhanced
Prior art date
Application number
PCT/US2007/068285
Other languages
French (fr)
Other versions
WO2007131194A2 (en
WO2007131194A4 (en
Inventor
W R Bottoms
Fu Chiung Chong
Roman Milter
Thomas Edward Dinan
Erh-Kong Chieh
David Thanh Doan
Pierre H Giauque
Douglas N Modlin
Original Assignee
Nanonexus Inc
W R Bottoms
Fu Chiung Chong
Roman Milter
Thomas Edward Dinan
Erh-Kong Chieh
David Thanh Doan
Pierre H Giauque
Douglas N Modlin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanonexus Inc, W R Bottoms, Fu Chiung Chong, Roman Milter, Thomas Edward Dinan, Erh-Kong Chieh, David Thanh Doan, Pierre H Giauque, Douglas N Modlin filed Critical Nanonexus Inc
Publication of WO2007131194A2 publication Critical patent/WO2007131194A2/en
Publication of WO2007131194A3 publication Critical patent/WO2007131194A3/en
Publication of WO2007131194A4 publication Critical patent/WO2007131194A4/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

Enhanced optical probe structures and associated methods comprise improvements to spring structures, wherein optical signals can be transmitted through the resultant substrate by fabricating openings of sufficient size through the substrate through which the optical signals can be transmitted. The holes may be unfilled or filled with optically conducting materials including but not limited to polymers, glasses, air, vacuum, etc. Lenses, diffraction gratings and other optical elements, e.g. refractive or diffractive, can be integrated to improve the coupling efficiency or provide frequency discrimination as desired. Enhanced spring structures and associated methods are also used in conjunction with the enhanced optical probe architectures, such as for processing, testing, and/or packaging of semiconductor ICs and image sensors.
PCT/US2007/068285 2006-05-05 2007-05-04 Apparatus and methods for processing, testing, and packaging of semiconductor ics and image sensors WO2007131194A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US79788606P 2006-05-05 2006-05-05
US60/797,886 2006-05-05
US89119207P 2007-02-22 2007-02-22
US60/891,192 2007-02-22

Publications (3)

Publication Number Publication Date
WO2007131194A2 WO2007131194A2 (en) 2007-11-15
WO2007131194A3 true WO2007131194A3 (en) 2008-04-17
WO2007131194A4 WO2007131194A4 (en) 2010-10-21

Family

ID=38668600

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/068285 WO2007131194A2 (en) 2006-05-05 2007-05-04 Apparatus and methods for processing, testing, and packaging of semiconductor ics and image sensors

Country Status (2)

Country Link
TW (1) TW200804829A (en)
WO (1) WO2007131194A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10670656B2 (en) * 2016-05-09 2020-06-02 International Business Machines Corporation Integrated electro-optical module assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5555422A (en) * 1993-03-10 1996-09-10 Co-Operative Facility For Aging Tester Development Prober for semiconductor integrated circuit element wafer
US5631571A (en) * 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US6245444B1 (en) * 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US20050270055A1 (en) * 2004-06-02 2005-12-08 Salman Akram Systems and methods for testing microelectronic imagers and microfeature devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5555422A (en) * 1993-03-10 1996-09-10 Co-Operative Facility For Aging Tester Development Prober for semiconductor integrated circuit element wafer
US5631571A (en) * 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US6245444B1 (en) * 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US20050270055A1 (en) * 2004-06-02 2005-12-08 Salman Akram Systems and methods for testing microelectronic imagers and microfeature devices

Also Published As

Publication number Publication date
WO2007131194A2 (en) 2007-11-15
TW200804829A (en) 2008-01-16
WO2007131194A4 (en) 2010-10-21

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