WO2007133226A1 - Selectable frequency emr emitter - Google Patents
Selectable frequency emr emitter Download PDFInfo
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- WO2007133226A1 WO2007133226A1 PCT/US2006/022787 US2006022787W WO2007133226A1 WO 2007133226 A1 WO2007133226 A1 WO 2007133226A1 US 2006022787 W US2006022787 W US 2006022787W WO 2007133226 A1 WO2007133226 A1 WO 2007133226A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J25/00—Transit-time tubes, e.g. klystrons, travelling-wave tubes, magnetrons
Definitions
- the present invention is related to the following co-pending U.S. Patent applications: (1) U.S. Patent Application No. 11/238,991, [atty. docket 2549-0003], entitled “Ultra-Small Resonating Charged Particle Beam Modulator,” and filed September 30, 2005, (2) U.S. Patent Application No. 10/917,511, filed on August 13, 2004, entitled “Patterning Thin Metal Film by Dry Reactive Ion Etching,” and to U.S. Application No. 11/203,407, filed on August 15, 2005, entitled “Method Of Patterning Ultra-Small Structures," (3) U.S. Application No. 11/243,476 [Atty.
- the present invention is directed to an optical transmitter and a method of manufacturing the same, and, in one embodiment, to an optical switch utilizing plural resonant structures emitting electromagnetic radiation resonant (EMR) where the resonant structures are excited by a charged particle source such as an electron beam.
- EMR electromagnetic radiation resonant
- Optical transmission systems utilize fiber optic cables to transmit pulses of light between two communicating end-points.
- Various optical transmission systems are currently used in short-, medium- and long-haul networks to carry data at very high transmission rates.
- some transmission systems utilize wavelength division multiplexing and require plural light sources to send multiple frequencies down the fiber optic cable.
- Figure 1 is a generalized block diagram of a generalized resonant structure and its charged particle source
- Figure 2A is a top view of a non-limiting exemplary resonant structure for use with the present invention.
- Figure 2B is a top view of the exemplary resonant structure of Figure 2 A with the addition of a backbone;
- Figures 2C-2H are top views of other exemplary resonant structures for use with the present invention.
- Figure 3 is a top view of a single wavelength element having a first period and a first "finger" length according to one embodiment of the present invention
- Figure 4 is a top view of a single wavelength element having a second period and a second "finger" length according to one embodiment of the present invention
- Figure 5 is a top view of a single wavelength element having a third period and a third
- finger length according to one embodiment of the present invention.
- Figure 6 A is a top view of a multi- wavelength element utilizing two deflectors according to one embodiment of the present invention.
- Figure 6B is a top view of a multi- wavelength element utilizing a single, integrated deflector according to one embodiment of the present invention.
- Figure 6C is a top view of a multi- wavelength element utilizing a single, integrated deflector and focusing charged particle optical elements according to one embodiment of the present invention
- Figure 6D is a top view of a multi- wavelength element utilizing plural deflectors along various points in the path of the beam according to one embodiment of the present invention
- Figure 7 is a top view of a multi- wavelength element utilizing two serial deflectors according to one embodiment of the present invention.
- Figure 8 is a perspective view of a single wavelength element having a first period and a first resonant frequency or "finger" length according to one embodiment of the present invention
- Figure 9 is a perspective view of a single wavelength element having a second period and a second "finger" length according to one embodiment of the present invention
- Figure 10 is a perspective view of a single wavelength element having a third period and a third "finger" length according to one embodiment of the present invention.
- Figure 11 is a perspective view of a portion of a multi-wavelength element having wavelength elements with different periods and "finger" lengths;
- Figure 12 is a top view of a multi- wavelength element according to one embodiment of the present invention.
- Figure 13 is a top view of a multi-wavelength element according to another embodiment of the present invention.
- Figure 14 is a top view of a multi- wavelength element utilizing two deflectors with variable amounts of deflection according to one embodiment of the present invention.
- Figure 15 is a top view of a multi- wavelength element utilizing two deflectors according to another embodiment of the present invention.
- Figure 16 is a top view of a multi-intensity element utilizing two deflectors according to another embodiment of the present invention.
- Figure 17 A is a top view of a multi-intensity element using plural inline deflectors
- Figure 17B is a top view of a multi-intensity element using plural attractive deflectors above the path of the beam;
- Figure 17C is a view of a first deflectable beam for turning the resonant structures on and off without needing a separate data input on the source of charged particles and without having to turn off the source of charged particles;
- Figure 17D is a view of a second deflectable beam for turning the resonant structures on and off without needing a separate data input on the source of charged particles and without having to turn off the source of charged particles;
- Figure 18A is a top view of a multi-intensity element using finger of varying heights
- Figure 18B is a top view of a multi-intensity element using finger of varying heights
- Figure 19A is a top view of a fan-shaped resonant element that enables varying intensity based on the amount of deflection of the beam;
- Figure 19B is a top view of another fan-shaped resonant element that enables varying intensity based on the amount of deflection of the beam;
- Figure 20 is a microscopic photograph of a series of resonant segments;
- Figure 21 is an illustration of a set of resonant structures that emit electromagnetic radiation that is transferable along a communications medium
- Figure 22 A is an illustration of a two-channel optical switch using a set of two resonant structures
- Figure 22B is an illustration of an n-channel optical switch using a set of n resonant structures
- Figure 23 is an illustration of a parallel 2-channel optical switch using a set of three resonant structures
- Figure 24 is an illustration of a single channel optical switch with synchronization using a set of three resonant structures.
- Figure 25 is an illustration of a single channel optical switch with a valid signal.
- a wavelength element 100 on a substrate 105 can be produced from at least one resonant structure 110 that emits light (such as infrared light, visible light or ultraviolet light or any other electromagnetic radiation (EMR) 150 at a wide range of frequencies, and often at a frequency higher than that of microwave).
- the EMR 150 is emitted when the resonant structure 110 is exposed to a beam 130 of charged particles ejected from or emitted by a source of charged particles 140.
- the source 140 is controlled by applying a signal on data input 145.
- the source 140 can be any desired source of charged particles such as an electron gun, a cathode, an ion source, an electron source from a scanning electron microscope, etc.
- a resonant structure 110 may comprise a series of fingers 115 which are separated by a spacing 120 measured as the beginning of one finger 115 to the beginning of an adjacent finger 115.
- the finger 115 has a thickness that takes up a portion of the spacing between fingers 115.
- the fingers also have a length 125 and a height (not shown).
- the fingers of Figure 2A are perpendicular to the beam 130.
- Resonant structures 110 are fabricated from resonating material (e.g., from a conductor such as metal (e.g., silver, gold, aluminum and platinum or from an alloy) or from any other P C Il / U !b material that resonates in the presence of a charged particle beam).
- resonating material e.g., from a conductor such as metal (e.g., silver, gold, aluminum and platinum or from an alloy) or from any other P C Il / U !b material that resonates in the presence of a charged particle beam.
- Other exemplary resonating materials include carbon nanotubes and high temperature superconductors. .
- the various resonant structures can be constructed in multiple layers of resonating materials but are preferably constructed in a single layer of resonating material (as described above).
- all the resonant structures 110 of a resonant element 100 are etched or otherwise shaped in the same processing step.
- the resonant structures 110 of each resonant frequency are etched or otherwise shaped in the same processing step.
- all resonant structures having segments of the same height are etched or otherwise shaped in the same processing step.
- all of the resonant elements 100 on a substrate 105 are etched or otherwise shaped in the same processing step.
- the material need not even be a contiguous layer, but can be a series of resonant elements individually present on a substrate.
- the materials making up the resonant elements can be produced by a variety of methods, such as by pulsed-plating, depositing, sputtering or etching. Preferred methods for doing so are described in co-pending U.S. Application No. 10/917,571, filed on August 13, 2004, entitled "Patterning Thin Metal Film by Dry Reactive Ion Etching," and in U.S. Application No.
- the fingers of the resonant structure 110 can be supplemented with a backbone.
- the backbone 112 connects the various fingers 115 of the resonant structure 110 forming a comb-like shape on its side.
- the. backbone 112 would be made of the same material as the rest of the resonant structure 110, but alternate materials may be used.
- the backbone 112 may be formed in the same layer or a different layer than the fingers 110.
- the backbone 112 may also be formed in the same processing step or in a different .
- the shape of the fingers 115R may also be shapes other than rectangles, such as simple shapes (e.g., circles, ovals, arcs and squares), complex shapes (e.g., such as semicircles, angled fingers, serpentine structures and embedded structures (i.e., structures with a smaller geometry within a larger geometry, thereby creating more complex resonances)) and those including waveguides or complex cavities.
- simple shapes e.g., circles, ovals, arcs and squares
- complex shapes e.g., such as semicircles, angled fingers, serpentine structures and embedded structures (i.e., structures with a smaller geometry within a larger geometry, thereby creating more complex resonances)
- embedded structures i.e., structures with a smaller geometry within a larger geometry, thereby creating more complex resonances
- a wavelength element IOOR for producing electromagnetic radiation with a first frequency is shown as having been constructed on a substrate 105.
- the illustrated embodiments of Figures 3, 4 and 5 are described as producing red, green and blue light in the visible spectrum, respectively.
- the spacings and lengths of the fingers 115R, 115G and 115B of the resonant structures 11OR, HOG and HOB, respectively, are for illustrative purposes only and not intended to represent any actual relationship between the period 120 of the fingers, the lengths of the fingers 115 and the frequency of the emitted electromagnetic radiation.)
- the dimensions of exemplary resonant structures are provided in the table below.
- the intensity of the radiation may change as well.
- harmonics e.g., second and third harmonics
- intensity appears oscillatory in that finding the optimal peak of each mode created the highest output.
- FC T/ i y SO 6 / E! B 787 the geometric modes of the fingers are used to increase the output intensity.
- Optimal overall output comes when there is constructive modal alignment in as many axes as possible.
- a sweep of the duty cycle of the cavity space width and the post thickness indicates that the cavity space width and period (i.e., the sum of the width of one cavity space width and one post) have relevance to the center frequency of the resultant radiation. That is, the center frequency of resonance is generally determined by the post/space period.
- a series of posts can be constructed that output substantial EMR in the infrared, visible and ultraviolet portions of the spectrum and which can be optimized based on alterations of the geometry, electron velocity and density, and metal/layer type. It should also be possible to generate EMR of longer wavelengths as well. Unlike a Smith-Purcell device, the resultant radiation from such a structure is intense enough to be visible to the human eye with only 30 nanoamperes of current. [0053] Using the above-described sweeps, one can also find the point of maximum intensity for given posts. Additional options also exist to widen the bandwidth or even have multiple frequency points on a single device. Such options include irregularly shaped posts and spacing, series arrays of non-uniform periods, asymmetrical post orientation, multiple beam configurations, etc.
- a beam 130 of charged particles (e.g., electrons, or positively or negatively charged ions) is emitted from a source 140 of charged particles under the control of a data input 145.
- the beam 130 passes close enough to the resonant structure 11OR to excite a response from the fingers and their associated cavities (or spaces).
- the source 140 is turned on when an input signal is received that indicates that the resonant structure 11OR is to be excited. When the input signal indicates that the resonant structure 11OR is not to be excited, the source 140 is turned off.
- the illustrated EMR 150 is intended to denote that, in response to the data input 145 turning on the source 140, a red wavelength is emitted from the resonant structure 11OR.
- the beam 130 passes next to the resonant structure HOR which is shaped like a series of rectangular fingers 115R or posts.
- the resonant structure 11OR is fabricated utilizing any one of a variety of techniques
- electromagnetic radiation 150 is emitted there from which can be directed to an exterior of the element 110.
- a green element IOOG includes a second source 140 providing a second beam 130 in close proximity to a resonant structure HOG having a set of fingers 115G with a spacing 120G, a finger length 125G and a finger height 155G (see Figure 9) which may be different than the spacing 120R, finger length 125 G and finger height 155R of the resonant structure 11OR.
- the finger length 125, finger spacing 120 and finger height 155 may be varied during design time to determine optimal finger lengths 125, finger spacings 120 and finger heights 155to be used in the desired application.
- a blue element IOOB includes a third source 140 providing a third beam 130 in close proximity to a resonant structure 11OB having a set of fingers 115B having a spacing 120B, a finger length 125B and a finger height 155B (see Figure 10) which may be different than the spacing 120R, length 125R and height 155R of the resonant structure 11OR and which may be different than the spacing 120G, length 125G and height 155G of the resonant structure HOG.
- the cathode sources of electron beams are usually best constructed off of the chip or board onto which the conducting structures are constructed.
- a deflector, diffractor, or switch to direct one or more electron beams to one or more selected rows of the resonant structures.
- EMR electrospray magnetic resonance
- an element is produced such that plural wavelengths can be produced from a single beam 130.
- two P C T./ IJ S O IB /H H 7 S '? deflectors 160 are provided which can direct the beam towards a desired resonant structure
- 11OG, 11OB or 11OR by providing a deflection control voltage on a deflection control terminal 165.
- One of the two deflectors 160 is charged to make the beam bend in a first direction toward a first resonant structure, and the other of the two deflectors can be charged to make the beam bend in a second direction towards a second resonant structure.
- Energizing neither of the two deflectors 160 allows the beam 130 to be directed to yet a third of the resonant structures.
- Deflector plates are known in the art and include, but are not limited to, charged plates to which a voltage differential can be applied and deflectors as are used in cathode-ray tube (CRT) displays.
- CTR cathode-ray tube
- Figure 6 A illustrates a single beam 130 interacting with three resonant structures
- a larger or smaller number of resonant structures can be utilized in the multi- wavelength element 10OM.
- utilizing only two resonant structures HOG and HOB ensures that the beam does not pass over or through a resonant structure as it would when bending toward 11OR if the beam 130 were left on.
- the beam 130 is turned off while the deflector(s) is/are charged to provide the desired deflection and then the beam 130 is turned back on again.
- the multi-wavelength structure IOOM of Figure 6 A is modified to utilize a single deflector 160 with sides that can be individually energized such that the beam 130 can be deflected toward the appropriate resonant structure.
- the multi- wavelength element IOOM of Figure 6C also includes (as can any embodiment described herein) a series of focusing charged particle optical elements 600 in front of the resonant structures 11OR, HOG and HOB.
- the multi-wavelength structure IOOM of Figure 6 A is modified to utilize additional deflectors 160 at various points along the path of the beam 130. Additionally, the structure of Figure 6D has been altered to utilize a beam that passes over, rather than next to, the resonant structures 11OR, HOG and 11OB.
- a set of at least two deflectors 160a,b may be utilized in series. Each of the deflectors includes a deflection control terminal 165 for controlling whether it should aid in the deflection of the beam 130.
- the beam 130 is not deflected, and the resonant structure HOB is excited.
- the beam 130 is deflected towards and excites resonant structure 11OG.
- both of the deflectors 160a,b are energized, then the beam 130 is deflected towards and excites resonant structure HOR.
- the number of resonant structures could be increased by providing greater amounts of beam deflection, either by adding additional deflectors 160 or by providing variable amounts of deflection under the control of the deflection control terminal 165.
- directors other than the deflectors 160 can be used to direct/deflect the electron beam 130 emitted from the source 140 toward any one of the resonant structures 110 discussed herein.
- Directors 160 can include any one or a combination of a deflector 160, a diffractor, and an optical structure (e.g., switch) that generates the necessary fields.
- an optical structure e.g., switch
- Figures 8, 9 and 10 illustrate a variety of finger lengths, spacings and heights to illustrate that a variety of EMR 150 frequencies can be selectively produced according to this embodiment as well.
- the resonant structures of Figures 8-10 can be modified to utilize a single source 190 which includes a deflector therein.
- the deflectors 160 can be separate from the charged particle source 140 as well without departing from the present invention.
- fingers of different spacings and potentially different lengths and heights are provided in close proximity to each other.
- the beam 130 is allowed to pass out of the source 190 undeflected.
- the beam 130 is deflected after being generated in the source 190. (The third resonant structure for the third wavelength element has been omitted for clarity.)
- wavelength elements 200RG that include plural resonant structures in series (e.g., with multiple finger spacings and one or more finger lengths and finger heights per element). In such a configuration, one may obtain a mix of wavelengths if this is desired.
- At least two resonant structures in series can either be the same type of resonant structure (e.g., all of the type shown in Figure 2A) or may be of different types (e.g., in an exemplary embodiment PMu Il / U Ib Z ! ! with three resonant structures, at least one of Figure 2 A, at least one of Figure 2C, at least one of
- a single charged particle beam 130 may excite two resonant structures HOR and 11OG in parallel.
- the wavelengths need not correspond to red and green but may instead be any wavelength pairing utilizing the structure of Figure 13.
- the charged particle density making up the beam 130 can be varied to increase or decrease intensity, as needed.
- the speed that the charged particles pass next to or over the resonant structures can be varied to alter intensity as well.
- the beam 130 can be positioned at three different distances away from the resonant structures 110.
- at least three different intensities are possible for the green resonant structure, and similar intensities would be available for the red and green resonant structures.
- a much larger number of positions (and corresponding intensities) would be used. For example, by specifying an 8-bit color component, one of 256 different positions would be selected for the position of the beam 130 when in proximity to the resonant structure of that color.
- the deflectors are preferably controlled by a translation table or circuit that converts the desired intensity to a deflection voltage (either linearly or non- linearly).
- the structure of Figure 13 may be supplemented with at least one deflector 160 which temporarily positions the beam 130 closer to one of the two structures HOR and 11OG as desired.
- the path of the beam 130 to become closer ,
- the intensity of the emitted electromagnetic radiation from resonant structure 11OR is increased and the intensity of the emitted electromagnetic radiation from resonant structure 11OG is decreased.
- a multi-intensity pixel can be produced by providing plural resonant structures, each emitting the same dominant frequency, but with different intensities (e.g., based on different numbers of fingers per structure). As illustrated, the color component is capable of providing five different intensities ⁇ off, 25%, 50%, 75% and 100%). Such a structure could be incorporated into a device having multiple multi-intensity elements 100 per color or wavelength.
- the illustrated order of the resonant structures is not required and may be altered.
- the most frequently used intensities may be placed such that they require lower amounts of deflection, thereby enabling the system to utilize, on average, less power for the deflection.
- the intensity can also be controlled using deflectors 160 that are inline with the fingers 115 and which repel the beam 130.
- the beam 130 will reduce its interactions with later fingers 115 (i.e., fingers to the right in the figure).
- the beam can produce six different intensities ⁇ off, 20%, 40%, 60%, 80% and 100% ⁇ by turning the beam on and off and only using four deflectors, but in practice the number of deflectors can be significantly higher.
- a number of deflectors 160 can be used to attract the beam away from its undeflected path in order to change intensity as well.
- at least one additional repulsive deflector 16Or or at least one additional attractive deflector 160a can be used to direct the beam 130 away from a resonant structure 110, as shown in Figures 17C and 17D, respectively.
- the source 140 need not include a separate data input 145. Instead, the data input is simply integrated into the deflection control terminal 165 which controls the amount of deflection that the beam is to undergo, and the beam 130 is left on.
- Figures 17C and 17D illustrate that the beam 130 can be deflected by one deflector 160a,r before reaching the resonant structure 1.10, it should be understood that multiple deflectors may be used, either serially or in parallel.
- deflector plates may be provided on both sides of the path of the charged particle beam 130 such that the beam 130 is cooperatively repelled and attracted simultaneously to turn off the resonant structure 110, or the deflector plates are turned off so that the beam 130 can, at least initially, be directed undeflected toward the resonant structure 110.
- the resonant structure 110 can be either a vertical structure such that the beam 130 passes over the resonant structure 110 or a horizontal structure such that the beam 130 passes next to the resonant structure 110.
- the "off" state can be achieved by deflecting the beam 130 above the resonant structure 110 but at a height higher than can excite the resonant structure.
- the "off" state can be achieved by deflecting the beam 130 next to the resonant structure 110 but at a distance greater than can excite the resonant structure.
- both the vertical and horizontal resonant structures can be turned "off by deflecting the beam away from resonant structures in a direction other than the undeflected direction.
- the resonant structure in the vertical configuration, can be turned off by deflecting the beam left or right so that it no longer passes over top of the resonant structure.
- the off-state may be selected to be any one of: a deflection between HOB and 11OG, a deflection between HOB and 110R, a deflection to the right of 11 OB, and a deflection to the left of 11 OR.
- a horizontal resonant structure may be turned off by passing the beam next to the structure but higher than the height of the fingers such that the resonant structure is not excited.
- the deflectors may utilize a combination of horizontal and vertical deflections such that the intensity is controlled by deflecting the beam in a first direction but the on/off state is controlled by deflecting the beam in a second direction.
- P ⁇ [0084]
- Figure 18 A illustrates yet another possible embodiment of a varying intensity resonant structure. (The change in heights of the fingers have been over exaggerated for illustrative purposes). As shown in Figure 18A, a beam 130 is not deflected and interacts with a few fingers to produce a first low intensity output.
- At least one deflector (not shown) internal to or above the source 190 increases the amount of deflection that the beam undergoes, the beam interacts with an increasing number of fingers and results in a higher intensity output.
- a number of deflectors can be placed along a path of the beam 130 to push the beam down towards as many additional segments as needed for the specified intensity.
- deflectors 160 have been illustrated in Figures 17A-18B as being above the resonant structures when the beam 130 passes over the structures, it should be understood that in embodiments where the beam 130 passes next to the structures, the deflectors can instead be next to the resonant structures.
- Figure 19A illustrates an additional possible embodiment of a varying intensity resonant structure according to the present invention.
- segments shaped as arcs are provided with varying lengths but with a fixed spacing between arcs such that a desired frequency is emitted.
- the number of segments has been greatly reduced. In practice, the number of segments would be significantly greater, e.g., utilizing hundreds of segments.
- the intensity changes with the angle of deflection as well. For example, a deflection angle of zero excites 100% of the segments. However, at half the maximum angle 50% of the segments are excited. At the maximum angle, the minimum number of segments are excited.
- Figure 19B provides an alternate structure to the structure of Figure 19A but where a deflection angle of zero excites the minimum number of segments and at the maximum angle, the maximum number of segments are excited.
- the present invention is not so limited.
- the resonant structures may be utilized to produce a desired wavelength by selecting the appropriate parameters (e.g., beam velocity, finger length, finger period, finger height, duty cycle of finger period, etc.).
- the above was . ,..” ! discussed with respect to three- wavelengths per element, any number (n) of wavelengths can be utilized per element.
- the emissions produced by the resonant structures 110 can additionally be directed in a desired direction or otherwise altered using any one or a combination of: mirrors, lenses and filters.
- the resonant structures are processed onto a substrate 105 ( Figure 3) (such as a semiconductor substrate or a circuit board) and can provide a large number of rows in a real estate area commensurate in size with an electrical pad (e.g., a copper pad).
- a substrate 105 Figure 3
- the resonant structures discussed above may be used for actual visible light production at variable frequencies. Such applications include any light producing application where incandescent, fluorescent, halogen, semiconductor, or other light-producing device is employed.
- By putting a number of resonant structures of varying geometries onto the same substrate 105 light of virtually any frequency can be realized by aiming an electron beam at selected ones of the rows.
- Figure 20 shows a series of resonant posts that have been fabricated to act as segments in a test structure. As can be seen, segments can be fabricated having various dimensions.
- each resonant structure emits electromagnetic radiation having a single frequency.
- the resonant structures each emit EMR at a dominant frequency and at least one "noise" or undesired frequency.
- a communications medium e.g., a fiber optic cable 2100
- a communications medium can be provided in close proximity to the resonant structures such that light emitted from the resonant structures is directed in the direction of a receiver, as is illustrated in Figure 21.
- structures such as those of Figures 6A-6D can be used to implement an optical switch when used in conjunction with optics (e.g., the fiber optic cable 2100 of Figure 21) which carries the emitted EMR to a receiver.
- a deflection control terminal is controlled by a transmission controller 2200.
- the transmission controller 2200 receives an indication of which channel of plural channels is to be selected and the data that is to be transmitted on the selected channel at that time.
- the data can be sent out as either (a) (OOOORRRROGOGOG) (where all the bits of an 8-bit word of a channel are sent serially in their entirety before sending the bits of the 8-bit word of the other channel), (b) (000G000GR0RGR0RG) (where each bit of an 8-bit word of the first (e.g., red) channel is interleaved with a bit of an 8-bit word of the second (e.g., green) channel), or (c) any other amount of interleaving desired, where "R” indicates that the red resonant structure 11OR is resonating, "G” indicates that the green resonant structure 11OG
- This transmission is controlled by the transmission controller 2200 which converts the channel number and data value into an amount of deflection, hi the illustrated embodiment, there is no deflection (and therefore no resonance) when the data value is "zero", independent of which channel is selected; there is deflection in a first direction when the first channel is selected and the data is "one”; and there is deflection in the second direction when the second channel is selected and the data is "one.”
- the transmission controller 2200 may include buffering circuitry and parallel-to-serial conversion circuitry if the transmission controller 2200 is to perform the interleaving, or the data and channel signal lines may be controlled by other circuitry that provides the data in the desired serial or interleaved format.
- Figure 22A illustrates two channels each corresponding to a predominant frequency emitted by a respective resonant structure
- the present invention is not limited to any particular number of channels.
- the transmission controller 2200 can cause the deflector 160 to select between either (1) no resonant structure being excited or (2) any one of the n resonant structures being excited.
- the 2-channel switch of Figure 22 A has been modified to include an additional resonant structure that transmits at the both of the frequencies of the other resonant structures.
- the third resonant structure transmits at both the red and green frequencies.
- the first and second channels can transmit simultaneously, and the transmission controller selects which of the 2 n ⁇ 2 -l resonant structures to excite, if any.
- no resonant structure need be excited, and, in fact, no structure is excited when both the first and second channels are transmitting "zero" simultaneously.
- the technique behind the 2-channel switch can be extended for an n-channel switch as well.
- 2 ⁇ 3 -l resonant structures can be used which emit at least one of the three predominant frequencies representing each of the three channels.
- the transmission on the three channels can be represented by:
- three resonant structures have only one predominant frequency (R 5 G 5 or B) each, three resonant structures have two predominant frequencies each, and one resonant structures has three predominant frequencies. Which of the seven resonant structures is excited is based on the amount of deflection selected by the transmission controller 2200 based on the data to be encoded. Alternatively, the transmission controller 2200 may not excite any of the resonant structures if (0,0,0) is to be encoded.
- channel 1 is represented by a first frequency (or wavelength) transmission (e.g., a red transmission).
- a first state transmitted e.g., a 1 bit
- a resonant structure is selected which transmits the first frequency.
- the second state e.g., a 0-bit
- no structure that transmits the first frequency is selected.
- the clock signal is then represented by a second frequency (or wavelength) and is illustrated as corresponding to a green transmission.
- the receiver can stay synchronized with the transmitter without having to have perfectly accurate and synchronized clocks at both ends of the communication.
- the transmission controller 2200 would select the resonant structures such that the following illustrative colors (in .. .. ⁇ " :::i ⁇ i ⁇ ::: pairs) would be transmitted: ((0O) 3 (OG) 5 (OO) 5 (RG) 5 (RO) 5 (RG)).
- the period and the duty cycle of the clock signal also can be other than as illustrated.
- the clock signal could be sent with every fourth bit for one cycle or two cycles as well.
- the clock signal could be sent as alternating frequencies (e.g., green one cycle and blue the next).
- a second frequency to identify when a transmission is valid.
- the transmitter/receiver pair could also be arranged to identify the valid data transmissions by the lack of the second frequency.
- the "x" represents that when there is no valid data to be transmitted, no matter what the signal is on the channel input, no resonant structure is excited. This is controlled by not asserting the "valid" signal at the controller 2200.
- a second frequency (illustrated as green) is transmitted to the receiver. If the channel is to transmit a first state (e.g., a 0 bit), then only the second frequency is transmitted by a resonant structure. If the channel is to transmit a second state (e.g., a 1 bit), then a resonant structure which transmits both a first frequency (illustrated as red) and a second frequency is excited.
- a first state e.g., a 0 bit
- a second frequency e.g., a 1 bit
- a second frequency can be used as a start and/or stop bit to signal the beginning and/or end of the transmissions. The system would then be able to resynchronize at the occurrence of each start and/or stop bit.
- the structures of the present invention may include a multi-pin structure.
- two pins are used where the voltage between them is indicative of what frequency band, if any, should be emitted, but at a common intensity.
- the frequency is selected on one pair of pins and the intensity is selected on another pair of pins (potentially sharing a common ground pin with the first pair).
- commands may be sent to the device (1) to turn the transmission of EMR on and off, (2) to set the frequency to be emitted and/or (3) to set the intensity of the EMR to be emitted.
- a controller receives the corresponding voltage(s) or commands on the pins and controls the director to select the appropriate resonant structure and optionally to produce the requested intensity. ..' ⁇ i .
Abstract
An optical transmitter produces electromagnetic radiation (e.g., light) of at least one frequency (e.g., at a particular color frequency) by utilizing a resonant structure that is excited by the presence a beam of charged particles (e.g., a beam of electrons) where the electromagnetic radiation is transmitted along a communications medium (e.g., a fiber optic cable). In at least one embodiment, the frequency of the electromagnetic radiation is higher than that of the microwave spectrum.
Description
SELECTABLE FREQUENCY EMR EMITTER
CROSS-REFERENCE TO CO-PENDING APPLICATIONS
[0001] The present invention is related to the following co-pending U.S. Patent applications: (1) U.S. Patent Application No. 11/238,991, [atty. docket 2549-0003], entitled "Ultra-Small Resonating Charged Particle Beam Modulator," and filed September 30, 2005, (2) U.S. Patent Application No. 10/917,511, filed on August 13, 2004, entitled "Patterning Thin Metal Film by Dry Reactive Ion Etching," and to U.S. Application No. 11/203,407, filed on August 15, 2005, entitled "Method Of Patterning Ultra-Small Structures," (3) U.S. Application No. 11/243,476 [Atty. Docket 2549-0058], entitled "Structures And Methods For Coupling Energy From An Electromagnetic Wave," filed on October 5, 2005, (4) U.S. Application No. 11/243,477 [Atty. Docket 2549-0059], entitled "Electron beam induced resonancy," filed on October 5, 2005, and (5) U.S. Application No. 11/325,432 [Atty. Docket 2549-0021], entitled "Resonant Structure- Based Display," filed on January 5, 2006, which are all commonly owned with the present application, the entire contents of which are incorporated herein by reference.
FIELD OF INVENTION
[0002] The present invention is directed to an optical transmitter and a method of manufacturing the same, and, in one embodiment, to an optical switch utilizing plural resonant structures emitting electromagnetic radiation resonant (EMR) where the resonant structures are excited by a charged particle source such as an electron beam.
INTRODUCTION
[0003] Optical transmission systems utilize fiber optic cables to transmit pulses of light between two communicating end-points. Various optical transmission systems are currently used in short-, medium- and long-haul networks to carry data at very high transmission rates. Moreover, some transmission systems utilize wavelength division multiplexing and require plural light sources to send multiple frequencies down the fiber optic cable.
P C l / UtiQB/E!iE!787
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] The following description, given with respect to the attached drawings, may be better understood with reference to the non-limiting examples of the drawings, wherein:
[0005] Figure 1 is a generalized block diagram of a generalized resonant structure and its charged particle source;
[0006] Figure 2A is a top view of a non-limiting exemplary resonant structure for use with the present invention;
[0007] Figure 2B is a top view of the exemplary resonant structure of Figure 2 A with the addition of a backbone;
[0008] Figures 2C-2H are top views of other exemplary resonant structures for use with the present invention;
[0009] Figure 3 is a top view of a single wavelength element having a first period and a first "finger" length according to one embodiment of the present invention;
[0010] Figure 4 is a top view of a single wavelength element having a second period and a second "finger" length according to one embodiment of the present invention;
[0011] Figure 5 is a top view of a single wavelength element having a third period and a third
"finger" length according to one embodiment of the present invention;
[0012] Figure 6 A is a top view of a multi- wavelength element utilizing two deflectors according to one embodiment of the present invention;
[0013] Figure 6B is a top view of a multi- wavelength element utilizing a single, integrated deflector according to one embodiment of the present invention;
[0014] Figure 6C is a top view of a multi- wavelength element utilizing a single, integrated deflector and focusing charged particle optical elements according to one embodiment of the present invention;
[0015] Figure 6D is a top view of a multi- wavelength element utilizing plural deflectors along various points in the path of the beam according to one embodiment of the present invention;
[0016] Figure 7 is a top view of a multi- wavelength element utilizing two serial deflectors according to one embodiment of the present invention;
[0017] Figure 8 is a perspective view of a single wavelength element having a first period and a first resonant frequency or "finger" length according to one embodiment of the present invention;
[0018] Figure 9 is a perspective view of a single wavelength element having a second period and a second "finger" length according to one embodiment of the present invention;
[0019] Figure 10 is a perspective view of a single wavelength element having a third period and a third "finger" length according to one embodiment of the present invention;
[0020] Figure 11 is a perspective view of a portion of a multi-wavelength element having wavelength elements with different periods and "finger" lengths;
[0021] Figure 12 is a top view of a multi- wavelength element according to one embodiment of the present invention;
[0022] Figure 13 is a top view of a multi-wavelength element according to another embodiment of the present invention;
[0023] Figure 14 is a top view of a multi- wavelength element utilizing two deflectors with variable amounts of deflection according to one embodiment of the present invention;
[0024] Figure 15 is a top view of a multi- wavelength element utilizing two deflectors according to another embodiment of the present invention;
[0025] Figure 16 is a top view of a multi-intensity element utilizing two deflectors according to another embodiment of the present invention;
[0026] Figure 17 A is a top view of a multi-intensity element using plural inline deflectors;
[0027] Figure 17B is a top view of a multi-intensity element using plural attractive deflectors above the path of the beam;
[0028] Figure 17C is a view of a first deflectable beam for turning the resonant structures on and off without needing a separate data input on the source of charged particles and without having to turn off the source of charged particles;
[0029] Figure 17D is a view of a second deflectable beam for turning the resonant structures on and off without needing a separate data input on the source of charged particles and without having to turn off the source of charged particles;
[0030] Figure 18A is a top view of a multi-intensity element using finger of varying heights;
[0031] Figure 18B is a top view of a multi-intensity element using finger of varying heights;
[0032] Figure 19A is a top view of a fan-shaped resonant element that enables varying intensity based on the amount of deflection of the beam;
[0033] Figure 19B is a top view of another fan-shaped resonant element that enables varying intensity based on the amount of deflection of the beam;
[0034] Figure 20 is a microscopic photograph of a series of resonant segments;
[0035] Figure 21 is an illustration of a set of resonant structures that emit electromagnetic radiation that is transferable along a communications medium;
[0036] Figure 22 A is an illustration of a two-channel optical switch using a set of two resonant structures;
[0037] Figure 22B is an illustration of an n-channel optical switch using a set of n resonant structures;
[0038] Figure 23 is an illustration of a parallel 2-channel optical switch using a set of three resonant structures;
[0039] Figure 24 is an illustration of a single channel optical switch with synchronization using a set of three resonant structures; and
[0040] Figure 25 is an illustration of a single channel optical switch with a valid signal.
DISCUSSION OF THE PREFERRED EMBODIMENTS
[0041] Turning to Figure 1, according to the present invention, a wavelength element 100 on a substrate 105 (such as a semiconductor substrate or a circuit board) can be produced from at least one resonant structure 110 that emits light (such as infrared light, visible light or ultraviolet light or any other electromagnetic radiation (EMR) 150 at a wide range of frequencies, and often at a frequency higher than that of microwave). The EMR 150 is emitted when the resonant structure 110 is exposed to a beam 130 of charged particles ejected from or emitted by a source of charged particles 140. The source 140 is controlled by applying a signal on data input 145. The source 140 can be any desired source of charged particles such as an electron gun, a cathode, an ion source, an electron source from a scanning electron microscope, etc.
[0042] Exemplary resonant structures are illustrated in Figures 2A-2H. As shown in Figure 2A, a resonant structure 110 may comprise a series of fingers 115 which are separated by a spacing 120 measured as the beginning of one finger 115 to the beginning of an adjacent finger 115. The finger 115 has a thickness that takes up a portion of the spacing between fingers 115. The fingers also have a length 125 and a height (not shown). As illustrated, the fingers of Figure 2A are perpendicular to the beam 130.
[0043] Resonant structures 110 are fabricated from resonating material (e.g., from a conductor such as metal (e.g., silver, gold, aluminum and platinum or from an alloy) or from any other
P C Il / U !b material that resonates in the presence of a charged particle beam). Other exemplary resonating materials include carbon nanotubes and high temperature superconductors. . [0044] . When creating any of the elements 100 according to the present invention, the various resonant structures can be constructed in multiple layers of resonating materials but are preferably constructed in a single layer of resonating material (as described above). [0045] In one single layer embodiment, all the resonant structures 110 of a resonant element 100 are etched or otherwise shaped in the same processing step. In one multi-layer embodiment, the resonant structures 110 of each resonant frequency are etched or otherwise shaped in the same processing step. In yet another multi-layer embodiment, all resonant structures having segments of the same height are etched or otherwise shaped in the same processing step. In yet another embodiment, all of the resonant elements 100 on a substrate 105 are etched or otherwise shaped in the same processing step.
[0046] The material need not even be a contiguous layer, but can be a series of resonant elements individually present on a substrate. The materials making up the resonant elements can be produced by a variety of methods, such as by pulsed-plating, depositing, sputtering or etching. Preferred methods for doing so are described in co-pending U.S. Application No. 10/917,571, filed on August 13, 2004, entitled "Patterning Thin Metal Film by Dry Reactive Ion Etching," and in U.S. Application No. 11/203,407, filed on August 15, 2005, entitled "Method Of Patterning Ultra-Small Structures," both of which are commonly owned at the time of filing, and the entire contents of each of which are incorporated herein by reference. [0047] At least in the case of silver, etching does not need to remove the material between segments or posts all the way down to the substrate level, nor does the plating have to place the posts directly on the substrate. Silver posts can be on a silver layer on top of the substrate. In fact, we discovered that, due to various coupling effects, better results are obtained when the silver posts are set on a silver layer, which itself is on the substrate.
[0048] As shown in Figure 2B, the fingers of the resonant structure 110 can be supplemented with a backbone. The backbone 112 connects the various fingers 115 of the resonant structure 110 forming a comb-like shape on its side. Typically, the. backbone 112 would be made of the same material as the rest of the resonant structure 110, but alternate materials may be used. In addition, the backbone 112 may be formed in the same layer or a different layer than the fingers 110. The backbone 112 may also be formed in the same processing step or in a different
.
P I:;;: ii / u a ι / ..." . '■-;■ processing step than the fingers 110. While the remaining figures do not show the use of a backbone 112, it should be appreciated that all other resonant structures described herein can be fabricated with a backbone also.
[0049] The shape of the fingers 115R (or posts) may also be shapes other than rectangles, such as simple shapes (e.g., circles, ovals, arcs and squares), complex shapes (e.g., such as semicircles, angled fingers, serpentine structures and embedded structures (i.e., structures with a smaller geometry within a larger geometry, thereby creating more complex resonances)) and those including waveguides or complex cavities. The finger structures of all the various shapes will be collectively referred to herein as "segments." Other exemplary shapes are shown in Figures 2C-2H, again with respect to a path of a beam 130. As can be seen at least from Figure 2C, the axis of symmetry of the segments need not be perpendicular to the path of the beam 130. [0050] Turning now to specific exemplary resonant elements, in Figure 3, a wavelength element IOOR for producing electromagnetic radiation with a first frequency is shown as having been constructed on a substrate 105. (The illustrated embodiments of Figures 3, 4 and 5 are described as producing red, green and blue light in the visible spectrum, respectively. However, the spacings and lengths of the fingers 115R, 115G and 115B of the resonant structures 11OR, HOG and HOB, respectively, are for illustrative purposes only and not intended to represent any actual relationship between the period 120 of the fingers, the lengths of the fingers 115 and the frequency of the emitted electromagnetic radiation.) However, the dimensions of exemplary resonant structures are provided in the table below.
[0051] As dimensions (e.g., height and/or length) change the intensity of the radiation may change as well. Moreover, depending on the dimensions, harmonics (e.g., second and third harmonics) may occur. For post height, length, and width, intensity appears oscillatory in that finding the optimal peak of each mode created the highest output. When operating in the velocity dependent mode (where the finger period depicts the dominant output radiation) the alignment of
FC T/i y SO 6 / E! B 787 the geometric modes of the fingers are used to increase the output intensity. However, it is seen that there are also radiation components due to geometric mode excitation during this time, but they do not appear to dominate the output. Optimal overall output comes when there is constructive modal alignment in as many axes as possible.
[0052] Other dimensions of the posts and cavities can also be swept to improve the intensity. A sweep of the duty cycle of the cavity space width and the post thickness indicates that the cavity space width and period (i.e., the sum of the width of one cavity space width and one post) have relevance to the center frequency of the resultant radiation. That is, the center frequency of resonance is generally determined by the post/space period. By sweeping the geometries, at given electron velocity v and current density, while evaluating the characteristic harmonics during each sweep, one can ascertain a predictable design model and equation set for a particular metal layer type and construction. Each of the dimensions mentioned about can be any value in the nanostructure range, i.e., 1 nm to 1 μm. Within such parameters, a series of posts can be constructed that output substantial EMR in the infrared, visible and ultraviolet portions of the spectrum and which can be optimized based on alterations of the geometry, electron velocity and density, and metal/layer type. It should also be possible to generate EMR of longer wavelengths as well. Unlike a Smith-Purcell device, the resultant radiation from such a structure is intense enough to be visible to the human eye with only 30 nanoamperes of current. [0053] Using the above-described sweeps, one can also find the point of maximum intensity for given posts. Additional options also exist to widen the bandwidth or even have multiple frequency points on a single device. Such options include irregularly shaped posts and spacing, series arrays of non-uniform periods, asymmetrical post orientation, multiple beam configurations, etc.
[0054] As shown in Figure 3, a beam 130 of charged particles (e.g., electrons, or positively or negatively charged ions) is emitted from a source 140 of charged particles under the control of a data input 145. The beam 130 passes close enough to the resonant structure 11OR to excite a response from the fingers and their associated cavities (or spaces). The source 140 is turned on when an input signal is received that indicates that the resonant structure 11OR is to be excited. When the input signal indicates that the resonant structure 11OR is not to be excited, the source 140 is turned off.
P / S /1 EKB 7 B 7 ;■• [0055] The illustrated EMR 150 is intended to denote that, in response to the data input 145 turning on the source 140, a red wavelength is emitted from the resonant structure 11OR. In the illustrated embodiment, the beam 130 passes next to the resonant structure HOR which is shaped like a series of rectangular fingers 115R or posts.
[0056] The resonant structure 11OR is fabricated utilizing any one of a variety of techniques
(e.g., semiconductor processing-style techniques such as reactive ion etching, wet etching and pulsed plating) that produce small shaped features.
[0057] In response to the beam 130, electromagnetic radiation 150 is emitted there from which can be directed to an exterior of the element 110.
[0058] As shown in Figure 4, a green element IOOG includes a second source 140 providing a second beam 130 in close proximity to a resonant structure HOG having a set of fingers 115G with a spacing 120G, a finger length 125G and a finger height 155G (see Figure 9) which may be different than the spacing 120R, finger length 125 G and finger height 155R of the resonant structure 11OR. The finger length 125, finger spacing 120 and finger height 155 may be varied during design time to determine optimal finger lengths 125, finger spacings 120 and finger heights 155to be used in the desired application.
[0059] As shown in Figure 5, a blue element IOOB includes a third source 140 providing a third beam 130 in close proximity to a resonant structure 11OB having a set of fingers 115B having a spacing 120B, a finger length 125B and a finger height 155B (see Figure 10) which may be different than the spacing 120R, length 125R and height 155R of the resonant structure 11OR and which may be different than the spacing 120G, length 125G and height 155G of the resonant structure HOG.
[0060] The cathode sources of electron beams, as one example of the charged particle beam, are usually best constructed off of the chip or board onto which the conducting structures are constructed. In such a case, we incorporate an off-site cathode with a deflector, diffractor, or switch to direct one or more electron beams to one or more selected rows of the resonant structures. The result is that the same conductive layer can produce multiple light (or other
EMR) frequencies by selectively inducing resonance in one of plural resonant structures that exist on the same substrate 105.
[0061] In an embodiment shown in Figure 6 A, an element is produced such that plural wavelengths can be produced from a single beam 130. hi the embodiment of Figure 6 A, two
P C T./ IJ S O IB /H H 7 S '? deflectors 160 are provided which can direct the beam towards a desired resonant structure
11OG, 11OB or 11OR by providing a deflection control voltage on a deflection control terminal 165. One of the two deflectors 160 is charged to make the beam bend in a first direction toward a first resonant structure, and the other of the two deflectors can be charged to make the beam bend in a second direction towards a second resonant structure. Energizing neither of the two deflectors 160 allows the beam 130 to be directed to yet a third of the resonant structures. Deflector plates are known in the art and include, but are not limited to, charged plates to which a voltage differential can be applied and deflectors as are used in cathode-ray tube (CRT) displays.
[0062] While Figure 6 A illustrates a single beam 130 interacting with three resonant structures, in alternate embodiments a larger or smaller number of resonant structures can be utilized in the multi- wavelength element 10OM. For example, utilizing only two resonant structures HOG and HOB ensures that the beam does not pass over or through a resonant structure as it would when bending toward 11OR if the beam 130 were left on. However, in one embodiment, the beam 130 is turned off while the deflector(s) is/are charged to provide the desired deflection and then the beam 130 is turned back on again.
[0063] In yet another embodiment illustrated in Figure 6B, the multi-wavelength structure IOOM of Figure 6 A is modified to utilize a single deflector 160 with sides that can be individually energized such that the beam 130 can be deflected toward the appropriate resonant structure. The multi- wavelength element IOOM of Figure 6C also includes (as can any embodiment described herein) a series of focusing charged particle optical elements 600 in front of the resonant structures 11OR, HOG and HOB.
[0064] In yet another embodiment illustrated in Figure 6D, the multi-wavelength structure IOOM of Figure 6 A is modified to utilize additional deflectors 160 at various points along the path of the beam 130. Additionally, the structure of Figure 6D has been altered to utilize a beam that passes over, rather than next to, the resonant structures 11OR, HOG and 11OB. [0065] Alternatively, as shown in Figure 7, rather than utilize parallel deflectors (e.g., as in Figure 6A), a set of at least two deflectors 160a,b may be utilized in series. Each of the deflectors includes a deflection control terminal 165 for controlling whether it should aid in the deflection of the beam 130. For example, with neither of deflectors 160a,b energized, the beam 130 is not deflected, and the resonant structure HOB is excited. When one of the deflectors
, : 160a,b is energized but not the other, then the beam 130 is deflected towards and excites resonant structure 11OG. When both of the deflectors 160a,b are energized, then the beam 130 is deflected towards and excites resonant structure HOR. The number of resonant structures could be increased by providing greater amounts of beam deflection, either by adding additional deflectors 160 or by providing variable amounts of deflection under the control of the deflection control terminal 165.
[0066] Alternatively, "directors" other than the deflectors 160 can be used to direct/deflect the electron beam 130 emitted from the source 140 toward any one of the resonant structures 110 discussed herein. Directors 160 can include any one or a combination of a deflector 160, a diffractor, and an optical structure (e.g., switch) that generates the necessary fields. [0067] While many of the above embodiments have been discussed with respect to resonant structures having beams 130 passing next to them, such a configuration is not required. Instead, the beam 130 from the source 140 may be passed over top of the resonant structures. Figures 8, 9 and 10 illustrate a variety of finger lengths, spacings and heights to illustrate that a variety of EMR 150 frequencies can be selectively produced according to this embodiment as well. [0068] Furthermore, as shown in Figure 11, the resonant structures of Figures 8-10 can be modified to utilize a single source 190 which includes a deflector therein. However, as with the embodiments of Figures 6 A-I, the deflectors 160 can be separate from the charged particle source 140 as well without departing from the present invention. As shown in Figure 11, fingers of different spacings and potentially different lengths and heights are provided in close proximity to each other. To activate the resonant structure 11OR, the beam 130 is allowed to pass out of the source 190 undeflected. To activate the resonant structure HOB, the beam 130 is deflected after being generated in the source 190. (The third resonant structure for the third wavelength element has been omitted for clarity.)
[0069] While the above elements have been described with reference to resonant structures 110 that have a single resonant structure along any beam trajectory, as shown in Figure 12, it is possible to utilize wavelength elements 200RG that include plural resonant structures in series (e.g., with multiple finger spacings and one or more finger lengths and finger heights per element). In such a configuration, one may obtain a mix of wavelengths if this is desired. At least two resonant structures in series can either be the same type of resonant structure (e.g., all of the type shown in Figure 2A) or may be of different types (e.g., in an exemplary embodiment
PMu Il / U Ib Z ! ! with three resonant structures, at least one of Figure 2 A, at least one of Figure 2C, at least one of
Figure 2H, but none of the others).
[0070] Alternatively, as shown in Figure 13, a single charged particle beam 130 (e.g., electron beam) may excite two resonant structures HOR and 11OG in parallel. As would be appreciated by one of ordinary skill from this disclosure, the wavelengths need not correspond to red and green but may instead be any wavelength pairing utilizing the structure of Figure 13. [0071] It is possible to alter the intensity of emissions from resonant structures using a variety of techniques. For example, the charged particle density making up the beam 130 can be varied to increase or decrease intensity, as needed. Moreover, the speed that the charged particles pass next to or over the resonant structures can be varied to alter intensity as well. [0072] Alternatively, by decreasing the distance between the beam 130 and a resonant structure (without hitting the resonant structure), the intensity of the emission from the resonant structure is increased. In the embodiments of Figures 3-7, this would be achieved by bringing the beam 130 closer to the side of the resonant structure. For Figures 8-10, this would be achieved by lowering the beam 130. Conversely, by increasing the distance between the beam 130 and a resonant structure, the intensity of the emission from the resonant structure is decreased. [0073] Turning to the structure of Figure 14, it is possible to utilize at least one deflector 160 to vary the amount of coupling between the beam 130 and the resonant structures 110. As illustrated, the beam 130 can be positioned at three different distances away from the resonant structures 110. Thus, as illustrated at least three different intensities are possible for the green resonant structure, and similar intensities would be available for the red and green resonant structures. However, in practice a much larger number of positions (and corresponding intensities) would be used. For example, by specifying an 8-bit color component, one of 256 different positions would be selected for the position of the beam 130 when in proximity to the resonant structure of that color. Since the resonant structures for different may have different responses to the proximity of the beam, the deflectors are preferably controlled by a translation table or circuit that converts the desired intensity to a deflection voltage (either linearly or non- linearly).
[0074] Moreover, as shown in Figure 15, the structure of Figure 13 may be supplemented with at least one deflector 160 which temporarily positions the beam 130 closer to one of the two structures HOR and 11OG as desired. By modifying the path of the beam 130 to become closer
, „ „,„ „ μ iL Ii •■■■■ U ib O b / fcϋ idl / ϋ / to the resonant structures HOR and farther away from the resonant structure HOG, the intensity of the emitted electromagnetic radiation from resonant structure 11OR is increased and the intensity of the emitted electromagnetic radiation from resonant structure 11OG is decreased. Likewise, the intensity of the emitted electromagnetic radiation from resonant structure 11OR can be decreased and the intensity of the emitted electromagnetic radiation from resonant structure HOG can be increased by modifying the path of the beam 130 to become closer to the resonant structures HOG and farther away from the resonant structure 11OR. In this way, a multi- resonant structure utilizing beam deflection can act as a color channel mixer. [0075] As shown in Figure 16, a multi-intensity pixel can be produced by providing plural resonant structures, each emitting the same dominant frequency, but with different intensities (e.g., based on different numbers of fingers per structure). As illustrated, the color component is capable of providing five different intensities {off, 25%, 50%, 75% and 100%). Such a structure could be incorporated into a device having multiple multi-intensity elements 100 per color or wavelength.
[0076] The illustrated order of the resonant structures is not required and may be altered. For example, the most frequently used intensities may be placed such that they require lower amounts of deflection, thereby enabling the system to utilize, on average, less power for the deflection.
[0077] As shown in Figure 17A, the intensity can also be controlled using deflectors 160 that are inline with the fingers 115 and which repel the beam 130. By turning on the deflectors at the various locations, the beam 130 will reduce its interactions with later fingers 115 (i.e., fingers to the right in the figure). Thus, as illustrated, the beam can produce six different intensities {off, 20%, 40%, 60%, 80% and 100%} by turning the beam on and off and only using four deflectors, but in practice the number of deflectors can be significantly higher.
[0078] Alternatively, as shown in Figure 17B, a number of deflectors 160 can be used to attract the beam away from its undeflected path in order to change intensity as well. [0079] In addition to the repulsive and attractive deflectors 160 of Figures 17A and 17B which are used to control intensity of multi-intensity resonators, at least one additional repulsive deflector 16Or or at least one additional attractive deflector 160a, can be used to direct the beam 130 away from a resonant structure 110, as shown in Figures 17C and 17D, respectively. By directing the beam 130 before the resonant structure 110 is excited at all, the resonant structure
! 110 can be turned on and off, not just controlled in intensity, without having to turn off the source 140. Using this technique, the source 140 need not include a separate data input 145. Instead, the data input is simply integrated into the deflection control terminal 165 which controls the amount of deflection that the beam is to undergo, and the beam 130 is left on. [0080] Furthermore, while Figures 17C and 17D illustrate that the beam 130 can be deflected by one deflector 160a,r before reaching the resonant structure 1.10, it should be understood that multiple deflectors may be used, either serially or in parallel. For example, deflector plates may be provided on both sides of the path of the charged particle beam 130 such that the beam 130 is cooperatively repelled and attracted simultaneously to turn off the resonant structure 110, or the deflector plates are turned off so that the beam 130 can, at least initially, be directed undeflected toward the resonant structure 110.
[0081] The configuration of Figures 17A-D is also intended to be general enough that the resonant structure 110 can be either a vertical structure such that the beam 130 passes over the resonant structure 110 or a horizontal structure such that the beam 130 passes next to the resonant structure 110. In the vertical configuration, the "off" state can be achieved by deflecting the beam 130 above the resonant structure 110 but at a height higher than can excite the resonant structure. In the horizontal configuration, the "off" state can be achieved by deflecting the beam 130 next to the resonant structure 110 but at a distance greater than can excite the resonant structure.
[0082] Alternatively, both the vertical and horizontal resonant structures can be turned "off by deflecting the beam away from resonant structures in a direction other than the undeflected direction. For example, in the vertical configuration, the resonant structure can be turned off by deflecting the beam left or right so that it no longer passes over top of the resonant structure. Looking at the exemplary structure of Figure 7, the off-state may be selected to be any one of: a deflection between HOB and 11OG, a deflection between HOB and 110R, a deflection to the right of 11 OB, and a deflection to the left of 11 OR. Similarly, a horizontal resonant structure may be turned off by passing the beam next to the structure but higher than the height of the fingers such that the resonant structure is not excited.
[0083] In yet another embodiment, the deflectors may utilize a combination of horizontal and vertical deflections such that the intensity is controlled by deflecting the beam in a first direction but the on/off state is controlled by deflecting the beam in a second direction.
P \ [0084] Figure 18 A illustrates yet another possible embodiment of a varying intensity resonant structure. (The change in heights of the fingers have been over exaggerated for illustrative purposes). As shown in Figure 18A, a beam 130 is not deflected and interacts with a few fingers to produce a first low intensity output. However, as at least one deflector (not shown) internal to or above the source 190 increases the amount of deflection that the beam undergoes, the beam interacts with an increasing number of fingers and results in a higher intensity output. [0085] Alternatively, as shown in Figure 18B, a number of deflectors can be placed along a path of the beam 130 to push the beam down towards as many additional segments as needed for the specified intensity.
[0086] While deflectors 160 have been illustrated in Figures 17A-18B as being above the resonant structures when the beam 130 passes over the structures, it should be understood that in embodiments where the beam 130 passes next to the structures, the deflectors can instead be next to the resonant structures.
[0087] Figure 19A illustrates an additional possible embodiment of a varying intensity resonant structure according to the present invention. According to the illustrated embodiment, segments shaped as arcs are provided with varying lengths but with a fixed spacing between arcs such that a desired frequency is emitted. (For illustrative purposes, the number of segments has been greatly reduced. In practice, the number of segments would be significantly greater, e.g., utilizing hundreds of segments.) By varying the lengths, the number of segments that are excited by the deflected beam changes with the angle of deflection. Thus, the intensity changes with the angle of deflection as well. For example, a deflection angle of zero excites 100% of the segments. However, at half the maximum angle 50% of the segments are excited. At the maximum angle, the minimum number of segments are excited. Figure 19B provides an alternate structure to the structure of Figure 19A but where a deflection angle of zero excites the minimum number of segments and at the maximum angle, the maximum number of segments are excited
[0088] While the above has been discussed in terms of elements emitting red, green and blue light, the present invention is not so limited. The resonant structures may be utilized to produce a desired wavelength by selecting the appropriate parameters (e.g., beam velocity, finger length, finger period, finger height, duty cycle of finger period, etc.). Moreover, while the above was
. ,.." ! discussed with respect to three- wavelengths per element, any number (n) of wavelengths can be utilized per element.
[0089] As should be appreciated by those of ordinary skill in the art, the emissions produced by the resonant structures 110 can additionally be directed in a desired direction or otherwise altered using any one or a combination of: mirrors, lenses and filters.
[0090] The resonant structures (e.g., HOR5 11OG and HOB) are processed onto a substrate 105 (Figure 3) (such as a semiconductor substrate or a circuit board) and can provide a large number of rows in a real estate area commensurate in size with an electrical pad (e.g., a copper pad). [0091] The resonant structures discussed above may be used for actual visible light production at variable frequencies. Such applications include any light producing application where incandescent, fluorescent, halogen, semiconductor, or other light-producing device is employed. By putting a number of resonant structures of varying geometries onto the same substrate 105, light of virtually any frequency can be realized by aiming an electron beam at selected ones of the rows.
[0092] Figure 20 shows a series of resonant posts that have been fabricated to act as segments in a test structure. As can be seen, segments can be fabricated having various dimensions. [0093] The above discussion has been provided assuming an idealized set of conditions - i.e., that each resonant structure emits electromagnetic radiation having a single frequency. However, in practice the resonant structures each emit EMR at a dominant frequency and at least one "noise" or undesired frequency. By selecting dimensions of the segments (e.g., by selecting proper spacing between resonant structures and lengths of the structures) such that the intensities of the noise frequencies are kept sufficiently low, an element 100 can be created that is applicable to the desired application or field of use. However, in some applications, it is also possible to factor in the estimate intensity of the noise from the various resonant structures and correct for it when selecting the number of resonant structures of each color to turn on and at what intensity. For example, if red, green and blue resonant structures 11OR, HOG and 10OB, respectively, were known to emit (1) 10% green and 10% blue, (2) 10% red and 10% blue and (3) 10% red and 10% green, respectively, then a grey output at a selected level (levels) could be achieved by requesting each resonant structure output levels /(1+0.1+0.1) or levels/1.2.
PC 11 / U a y ! [0094] Additional details about the manufacture and use of such resonant structures are provided in the above-referenced co-pending applications, the contents of which are incorporated herein by reference.
[0095] In some embodiments herein, a communications medium (e.g., a fiber optic cable 2100) can be provided in close proximity to the resonant structures such that light emitted from the resonant structures is directed in the direction of a receiver, as is illustrated in Figure 21. [0096] As shown in Figure 22A, structures such as those of Figures 6A-6D can be used to implement an optical switch when used in conjunction with optics (e.g., the fiber optic cable 2100 of Figure 21) which carries the emitted EMR to a receiver. In the illustrated embodiment, a deflection control terminal is controlled by a transmission controller 2200. The transmission controller 2200 receives an indication of which channel of plural channels is to be selected and the data that is to be transmitted on the selected channel at that time. [0097] For example, if 8-bit data is to be transmitted on the channels, and the values (00001111) and (01010101) are to be transmitted on the first and second channels, respectively, then the data can be sent out as either (a) (OOOORRRROGOGOGOG) (where all the bits of an 8-bit word of a channel are sent serially in their entirety before sending the bits of the 8-bit word of the other channel), (b) (000G000GR0RGR0RG) (where each bit of an 8-bit word of the first (e.g., red) channel is interleaved with a bit of an 8-bit word of the second (e.g., green) channel), or (c) any other amount of interleaving desired, where "R" indicates that the red resonant structure 11OR is resonating, "G" indicates that the green resonant structure 11OG is resonating, and "0" indicates that neither the red nor the green resonant structure is resonating. This transmission is controlled by the transmission controller 2200 which converts the channel number and data value into an amount of deflection, hi the illustrated embodiment, there is no deflection (and therefore no resonance) when the data value is "zero", independent of which channel is selected; there is deflection in a first direction when the first channel is selected and the data is "one"; and there is deflection in the second direction when the second channel is selected and the data is "one." This is illustrated in Figure 22A in the form of (channel, data) pairs where: (0,0) represents the first channel transmitting "zero", (0,1) represents the first channel transmitting "one", (1,0) represents the second channel transmitting "zero", and (1,1) represents the second channel transmitting "one".
, . i . ιι:. [0098] The transmission controller 2200 may include buffering circuitry and parallel-to-serial conversion circuitry if the transmission controller 2200 is to perform the interleaving, or the data and channel signal lines may be controlled by other circuitry that provides the data in the desired serial or interleaved format.
[0099] While Figure 22A illustrates two channels each corresponding to a predominant frequency emitted by a respective resonant structure, the present invention is not limited to any particular number of channels. As shown in Figure 22B, in an n-channel switch, the transmission controller 2200 can cause the deflector 160 to select between either (1) no resonant structure being excited or (2) any one of the n resonant structures being excited. [0100] In an alternate embodiment shown in Figure 23, the 2-channel switch of Figure 22 A has been modified to include an additional resonant structure that transmits at the both of the frequencies of the other resonant structures. (In the example from Figure 22 A, a first channel transmitted at a predominantly red frequency while a second channel transmitted at a predominantly green frequency.) In Figure 23, the third resonant structure transmits at both the red and green frequencies. Thus, the first and second channels can transmit simultaneously, and the transmission controller selects which of the 2n~2-l resonant structures to excite, if any. (As in Figure 22B, no resonant structure need be excited, and, in fact, no structure is excited when both the first and second channels are transmitting "zero" simultaneously.)
[0101] The technique behind the 2-channel switch can be extended for an n-channel switch as well. For example, in a 3 -channel switch, 2π~3-l resonant structures can be used which emit at least one of the three predominant frequencies representing each of the three channels. Assuming that the three channels are transmitted using (R,G,B), for channels 1-3, respectively, then the transmission on the three channels can be represented by:
where three resonant structures have only one predominant frequency (R5 G5 or B) each, three resonant structures have two predominant frequencies each, and one resonant structures has three predominant frequencies. Which of the seven resonant structures is excited is based on the amount of deflection selected by the transmission controller 2200 based on the data to be encoded. Alternatively, the transmission controller 2200 may not excite any of the resonant structures if (0,0,0) is to be encoded.
[0102] As shown in Figure 24, it is also possible to use three resonant structures for a single channel transmitter with a transmitted clock signal. In the illustrated embodiment, channel 1 is represented by a first frequency (or wavelength) transmission (e.g., a red transmission). When channel 1 is to have a first state transmitted (e.g., a 1 bit), then a resonant structure is selected which transmits the first frequency. However, when the second state (e.g., a 0-bit) is to be transmitted, no structure that transmits the first frequency is selected. [0103] The clock signal is then represented by a second frequency (or wavelength) and is illustrated as corresponding to a green transmission. By sending the clock signal with a fixed periodicity (illustrated as every other bit and therefore modulo 2), then the receiver can stay synchronized with the transmitter without having to have perfectly accurate and synchronized clocks at both ends of the communication. As an example, assuming that the transmitter wants to send the signal {000111}, then according to the illustrated embodiment, the transmission controller 2200 would select the resonant structures such that the following illustrative colors (in
.. ..■" :::iι i ιι::: pairs) would be transmitted: ((0O)3(OG)5(OO)5(RG)5(RO)5(RG)). The period and the duty cycle of the clock signal also can be other than as illustrated. For example, the clock signal could be sent with every fourth bit for one cycle or two cycles as well. Likewise, the clock signal could be sent as alternating frequencies (e.g., green one cycle and blue the next). [0104] As shown in Figure 25, in a communication system in which the transmitter is not constantly transmitting, it is also possible to utilize a second frequency to identify when a transmission is valid. (The transmitter/receiver pair could also be arranged to identify the valid data transmissions by the lack of the second frequency.) In the illustrated embodiment, the "x" represents that when there is no valid data to be transmitted, no matter what the signal is on the channel input, no resonant structure is excited. This is controlled by not asserting the "valid" signal at the controller 2200. However, during valid transmission times, a second frequency (illustrated as green) is transmitted to the receiver. If the channel is to transmit a first state (e.g., a 0 bit), then only the second frequency is transmitted by a resonant structure. If the channel is to transmit a second state (e.g., a 1 bit), then a resonant structure which transmits both a first frequency (illustrated as red) and a second frequency is excited.
[0105] As would be appreciated by those of ordinary skill in the art, various other transmission techniques can be used to control the transmission controller 2200 to synchronize a transmitter and a receiver. For example, a second frequency can be used as a start and/or stop bit to signal the beginning and/or end of the transmissions. The system would then be able to resynchronize at the occurrence of each start and/or stop bit.
[0106] The structures of the present invention may include a multi-pin structure. In one embodiment, two pins are used where the voltage between them is indicative of what frequency band, if any, should be emitted, but at a common intensity. In another embodiment, the frequency is selected on one pair of pins and the intensity is selected on another pair of pins (potentially sharing a common ground pin with the first pair). In a more digital configuration, commands may be sent to the device (1) to turn the transmission of EMR on and off, (2) to set the frequency to be emitted and/or (3) to set the intensity of the EMR to be emitted. A controller (not shown) receives the corresponding voltage(s) or commands on the pins and controls the director to select the appropriate resonant structure and optionally to produce the requested intensity.
..'■■ i . [0107] While certain configurations of structures have been illustrated for the purposes of presenting the basic structures of the present invention, one of ordinary skill in the art will appreciate that other variations are possible which would still fall within the scope of the appended claims.
Claims
1. An optical transmitter comprising: a source of charged particles; a data input for receiving data to be transmitted; a first resonant structure configured to be excited by particles emitted from the source of charged particles and configured to emit electromagnetic radiation at a first predominant frequency representing the data to be transmitted; and a communications medium for carrying the emitted electromagnetic radiation at the first predominant frequency, wherein the first predominant frequency has a frequency higher than that of a microwave frequency.
2. The optical transmitter as claimed in claim 1, wherein the particles emitted from the source of charged particles comprise electrons.
3. The optical transmitter as claimed in claim 1, further comprising: a second resonant structure configured to be excited by particles emitted from the source of charged particles and configured to emit electromagnetic radiation at a second predominant frequency; and at least one deflector having a deflection control terminal for selectively exciting the first and second resonant structures by the particles emitted from the source of charged particles, wherein the communications medium is also configured to carry the emitted electromagnetic radiation at the second predominant frequency, and wherein the second predominant frequency has a frequency higher than that of a microwave frequency.
4. The optical transmitter as claimed in claim 3, further comprising: a third resonant structure configured to be excited by particles emitted from the source of charged particles and configured to emit electromagnetic radiation at the first and second predominant frequencies, wherein the at least one deflector is configured to selectively excite any one of the first through third resonant structures.
5. The optical transmitter as claimed in claim 3, further comprising: a third resonant structure configured to be excited by particles emitted from the source of charged particles and configured to emit electromagnetic radiation at a third frequency, wherein a iι::: ::: the Communications medium is also configured to carry the emitted electromagnetic radiation at the third predominant frequency, and wherein the third predominant frequency has a frequency higher than that of a microwave frequency.
6. The optical transmitter as claimed in claim 5, wherein the at least one deflector comprises at least two deflectors, wherein the first deflector deflects the particles emitted from the source of charged particles in a first direction and the second deflector deflects the particles emitted from the source of charged particles in a second direction.
7. The optical transmitter as claimed in claim 5, wherein the at least one deflector comprises at least two deflectors, wherein the first deflector deflects the particles emitted from the source of charged particles in a first direction and the second deflector deflects the particles emitted from the source of charged particles in the first direction, wherein the particles emitted from the source of charged particles are deflected a greater amount in the first direction when plural of the at least two deflectors are energized than when only one of the at least two deflectors are energized.
8. The optical transmitter as claimed in claim 1, wherein the communications medium comprises a fiber optic cable.
9. The optical transmitter as claimed in claim 4, wherein emission, above a first threshold, of electromagnetic radiation of the first predominant frequency and emission, below a second threshold, of electromagnetic radiation of the second predominant frequency represents a first multi-bit value, wherein emission, below the first threshold, of electromagnetic radiation of the first predominant frequency and emission, above the second threshold, of electromagnetic radiation of the second predominant frequency represents a second multi-bit value, wherein emission, above the first threshold, of electromagnetic radiation of the first predominant frequency and emission, above the second threshold, of electromagnetic radiation of the second predominant frequency represents a third multi-bit value, and wherein emission, below the first threshold, of electromagnetic radiation of the first predominant frequency and emission, below the second threshold, of electromagnetic radiation of the second predominant frequency represents a fourth multi-bit value. |..." Ii Ii ./• ILJi 3ι Ii ,/■ n::: i
10. The optical transmitter as claimed in claim 3, wherein the deflection control signal applied to the deflection control terminal of the at least one deflector is alternated such that the received data is transmitted on plural channels.
Priority Applications (1)
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EP06784774A EP2011256A1 (en) | 2006-04-26 | 2006-06-12 | Selectable frequency emr emitter |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/410,924 | 2006-04-26 | ||
US11/410,924 US7646991B2 (en) | 2006-04-26 | 2006-04-26 | Selectable frequency EMR emitter |
Publications (1)
Publication Number | Publication Date |
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WO2007133226A1 true WO2007133226A1 (en) | 2007-11-22 |
Family
ID=38685266
Family Applications (1)
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PCT/US2006/022787 WO2007133226A1 (en) | 2006-04-26 | 2006-06-12 | Selectable frequency emr emitter |
Country Status (4)
Country | Link |
---|---|
US (1) | US7646991B2 (en) |
EP (1) | EP2011256A1 (en) |
TW (1) | TW200741791A (en) |
WO (1) | WO2007133226A1 (en) |
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Also Published As
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TW200741791A (en) | 2007-11-01 |
US7646991B2 (en) | 2010-01-12 |
EP2011256A1 (en) | 2009-01-07 |
US20070264030A1 (en) | 2007-11-15 |
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