WO2007133701A3 - Reduced capacity carrier, transport, load port, buffer system - Google Patents
Reduced capacity carrier, transport, load port, buffer system Download PDFInfo
- Publication number
- WO2007133701A3 WO2007133701A3 PCT/US2007/011443 US2007011443W WO2007133701A3 WO 2007133701 A3 WO2007133701 A3 WO 2007133701A3 US 2007011443 W US2007011443 W US 2007011443W WO 2007133701 A3 WO2007133701 A3 WO 2007133701A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transport
- buffer system
- load port
- reduced capacity
- capacity carrier
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009509884A JP2009537075A (en) | 2006-05-11 | 2007-05-11 | Reduced capacity carrier, transport machine, loading port, shock absorber system |
CN2007800262360A CN101490833B (en) | 2006-05-11 | 2007-05-11 | Reduced capacity carrier, transport, load port, buffer system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79990806P | 2006-05-11 | 2006-05-11 | |
US60/799,908 | 2006-05-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2007133701A2 WO2007133701A2 (en) | 2007-11-22 |
WO2007133701A9 WO2007133701A9 (en) | 2008-01-17 |
WO2007133701A3 true WO2007133701A3 (en) | 2008-12-04 |
Family
ID=38694507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/011443 WO2007133701A2 (en) | 2006-05-11 | 2007-05-11 | Reduced capacity carrier, transport, load port, buffer system |
Country Status (4)
Country | Link |
---|---|
JP (4) | JP2009537075A (en) |
CN (1) | CN101490833B (en) |
TW (1) | TWI405290B (en) |
WO (1) | WO2007133701A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8297319B2 (en) | 2006-09-14 | 2012-10-30 | Brooks Automation, Inc. | Carrier gas system and coupling substrate carrier to a loadport |
TWI475627B (en) | 2007-05-17 | 2015-03-01 | Brooks Automation Inc | Substrate carrier, substrate processing apparatus and system, for reducing particle contamination of substrate during processing and method of interfacing a carrier with a processing tool |
JP2010144199A (en) * | 2008-12-17 | 2010-07-01 | Canon Anelva Corp | Vacuum vessel, vacuum treatment apparatus having vacuum vessel, and method for manufacturing vacuum vessel |
CN101712130B (en) * | 2009-12-22 | 2012-11-14 | 中国电子科技集团公司第四十五研究所 | Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer |
JP6599094B2 (en) * | 2014-11-13 | 2019-10-30 | 株式会社ミツトヨ | Optical device |
JP6456177B2 (en) * | 2015-02-12 | 2019-01-23 | 株式会社ディスコ | Wafer processing system |
US9601360B2 (en) * | 2015-03-16 | 2017-03-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer transport method |
CN105543807B (en) * | 2015-12-15 | 2018-06-26 | 华中科技大学 | A kind of alternating temperature thin film deposition system |
CN109937184B (en) * | 2016-11-14 | 2021-09-28 | 村田机械株式会社 | Aerial conveying system, transfer conveying device used therein and conveying method |
US11031266B2 (en) * | 2018-07-16 | 2021-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer handling equipment and method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411358A (en) * | 1992-08-04 | 1995-05-02 | International Business Machines Corporation | Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers |
US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
US6026561A (en) * | 1994-01-14 | 2000-02-22 | International Business Machines Corporation | Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0221740U (en) * | 1988-07-28 | 1990-02-14 | ||
JPH04171841A (en) * | 1990-11-05 | 1992-06-19 | Matsushita Electron Corp | Self-traveling transfer truck |
US5204739A (en) * | 1992-02-07 | 1993-04-20 | Karl Suss America, Inc. | Proximity mask alignment using a stored video image |
JP4056141B2 (en) * | 1998-08-07 | 2008-03-05 | 松下電器産業株式会社 | Substrate transfer device |
KR100303321B1 (en) * | 1999-05-20 | 2001-09-26 | 박종섭 | Appratus for controlling abnormal lot in automization system to produce semiconductor and control method using the same |
JP2005294280A (en) * | 2002-04-12 | 2005-10-20 | Hirata Corp | Sealed container transfer system |
WO2004010476A2 (en) * | 2002-07-22 | 2004-01-29 | Brooks Automation, Inc. | Substrate processing apparatus |
JP2004227060A (en) * | 2003-01-20 | 2004-08-12 | Murata Mach Ltd | Automated guided vehicle system |
US7221993B2 (en) * | 2003-01-27 | 2007-05-22 | Applied Materials, Inc. | Systems and methods for transferring small lot size substrate carriers between processing tools |
JP4487302B2 (en) * | 2003-05-20 | 2010-06-23 | 株式会社安川電機 | Load port |
JP4470576B2 (en) * | 2003-05-20 | 2010-06-02 | ムラテックオートメーション株式会社 | Transport system |
JP4259968B2 (en) * | 2003-09-22 | 2009-04-30 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
US20050095087A1 (en) * | 2003-10-30 | 2005-05-05 | Sullivan Robert P. | Automated material handling system |
JP2005243729A (en) * | 2004-02-24 | 2005-09-08 | Asyst Shinko Inc | Conveyer system |
JP2006051886A (en) * | 2004-08-12 | 2006-02-23 | Murata Mach Ltd | Ceiling traveling vehicle system |
US7806643B2 (en) * | 2004-08-23 | 2010-10-05 | Brooks Automation, Inc. | Elevator-based tool loading and buffering system |
-
2007
- 2007-05-11 CN CN2007800262360A patent/CN101490833B/en active Active
- 2007-05-11 WO PCT/US2007/011443 patent/WO2007133701A2/en active Search and Examination
- 2007-05-11 TW TW096116737A patent/TWI405290B/en active
- 2007-05-11 JP JP2009509884A patent/JP2009537075A/en active Pending
-
2014
- 2014-03-26 JP JP2014064109A patent/JP6073262B2/en active Active
-
2017
- 2017-01-04 JP JP2017000254A patent/JP6630296B2/en active Active
-
2019
- 2019-07-26 JP JP2019138208A patent/JP6896027B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411358A (en) * | 1992-08-04 | 1995-05-02 | International Business Machines Corporation | Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers |
US6026561A (en) * | 1994-01-14 | 2000-02-22 | International Business Machines Corporation | Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers |
US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
Also Published As
Publication number | Publication date |
---|---|
JP2009537075A (en) | 2009-10-22 |
JP2017069583A (en) | 2017-04-06 |
JP2019192942A (en) | 2019-10-31 |
JP6896027B2 (en) | 2021-06-30 |
WO2007133701A2 (en) | 2007-11-22 |
WO2007133701A9 (en) | 2008-01-17 |
JP6630296B2 (en) | 2020-01-15 |
CN101490833A (en) | 2009-07-22 |
JP6073262B2 (en) | 2017-02-01 |
TWI405290B (en) | 2013-08-11 |
JP2014146825A (en) | 2014-08-14 |
TW200816351A (en) | 2008-04-01 |
CN101490833B (en) | 2013-08-14 |
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