WO2007137605A1

WO2007137605A1 - Fin-socket bridging electronic tapping interface

Info

Publication number: WO2007137605A1
Application number: PCT/EP2006/005123
Authority: WO
Inventors: Tilmann Wendel
Original assignee: Agilent Technologies, Inc.
Priority date: 2006-05-30
Filing date: 2006-05-30
Publication date: 2007-12-06

Abstract

An electronic interface or probing device for electrically coupling a socket-shaped electrical component to a fin-shaped electrical component, the electronic interface device comprising an electrically insulating substrate, an electrically conductive element coupled to the electrically insulating substrate, and a tapping element for tapping an electrical signal traveling through the electrically conductive element and for supplying the electrical signal to an analyzing apparatus connectable to the electronic interface device, wherein the electronic interface device is adapted to provide an electrical coupling between the socket-shaped electrical component and the fin-shaped electrical component when the electronic interface device is inserted between the socket-shaped electrical component and the fin-shaped electrical component in a state in which the fin-shaped electrical component is inserted into the socket-shaped electrical component.

Description

DESCRIPTION

FIN-SOCKET BRIDGING ELECTRONIC TAPPING INTERFACE

BACKGROUND ART

[0001] The present invention relates to the electrical coupling of two electronic components with the opportunity to analyze electronic signals traveling between the two components.

[0002] The Agilent E2960 test series is a product that provides an array of test equipment for high speed serial protocol testing, one example would be the PCI Express standard. The series comprises a serial protocol test platform for PCI Express, providing a protocol analyzer and protocol exerciser, as well as a separate protocol test card. It offers a complete test environment for debug and bring-up of PCI Express based designs, as well as server and chipset validation. Other protocols are offered as well.

[0003] For instance, an electronic card like a WLAN card for a server or personal computer can be tested with such a test apparatus. For this purpose, a separate probing test card may be inserted in the computer at a slot which is actually foreseen for the WLAN card. The WLAN card, in turn, may then be connected to the test card.

Furthermore, the probing test card may be connected to the test apparatus. When electric signals are exchanged between the computer and the WLAN card across the test card, it is possible, using the probing test card, to tap such signals and to transmit the tapped signals for further analysis in the test apparatus.

[0004] Alternatively, a pin may be clamped onto such a system for analyzing the function of the WLAN card with regard to the PC (see, for instance, a Midbus Probe from Agilent Technologies).

[0005] However, such conventional test systems are large in size and may be relatively expensive. DISCLOSURE

[0006] It is an object of the invention to provide an efficient electrical interface between electronic components. The object is solved by the independent claims. Further embodiments are shown by the dependent claims.

[0007] According to an exemplary embodiment of the present invention, an electronic interface device (which may also be denoted as a probing device or a "Flexboard Probe" or a connector element) for electrically coupling a socket-shaped electrical component ( i.e. an electrical component having a substantially two- dimensional recess), for instance a socket-shaped connector, to a fin-shaped electrical component (i.e. a component having a substantially two-dimensional insertion element for insertion into the socket), for instance a fin shaped connector, is provided, the electronic interface device comprising an electrically insulating substrate, an electrically conductive element coupled to the electrically insulating substrate, and a tapping element for tapping an electrical signal traveling through the electrically conductive element and for supplying the electrical signal to an analyzing apparatus connectable to the electronic interface device, wherein the electronic interface device is adapted to provide an electrical coupling between the socket-shaped electrical component and the fin-shaped electrical component when the electronic interface device is inserted between the socket-shaped electrical component and the fin-shaped electrical component in a state in which the fin-shaped electrical component is inserted into the socket-shaped electrical component.

[0008] According to another exemplary embodiment of the present invention, a test system for testing a function of a fin-shaped electrical component inserted into a socket-shaped electrical component is provided, the test system comprising an electronic interface device having the above-mentioned features for electrically coupling the socket-shaped electrical component to the fin-shaped electrical component, and an analyzing apparatus connectable to the electronic interface device for receiving the tapped electrical signal traveling through the electrically conductive element.

[0009] According to still another exemplary embodiment of the present invention, a method of electrically coupling a socket-shaped electrical component to a fin-shaped electrical component via an electronic interface device is provided, the method comprising inserting the electronic interface device between the socket-shaped electrical component and the fin-shaped electrical component to provide an electrical coupling between the socket-shaped electrical component and the fin-shaped electrical component via an electrically conductive element of the electronic interface device in a state in which the fin-shaped electrical component is inserted into the socket-shaped electrical component, tapping an electrical signal traveling through the electrically conductive element using the electronic interface device, and supplying the tapped electrical signal to an analyzing apparatus connected to the electronic interface device.

[0010] Embodiments of the invention can be partly or entirely embodied or supported by one or more suitable software programs, which can be stored on or otherwise provided by any kind of data carrier, and which might be executed in or by any suitable data processing unit. Software programs or routines can be preferably applied in the context of analyzing electronic signals. The electronic coupling scheme according to an embodiment of the invention can be performed or assisted by a computer program, i.e. by software, or by using one or more special electronic optimization circuits, i.e. in hardware, or in hybrid form, i.e. by means of software components and hardware components.

[0011] According to an exemplary embodiment of the invention, a bridge device may be provided which may be a small-size and light-weight probing device. Such an electronic interface device may comprise an insulating substrate having an electric circuit mounted thereon. Such an electronic interface device, which may be a mechanically flexible element, may simply be squeezed between a socket of a system under test (SUT, for instance a computer) and a fin of a device under test (DUT, for instance a WLAN card) so as to serve as some kind of electronic bridge for conveying signals between the DUT and the SUT. Such an electronic interface device may have a size which is not significantly larger than that of a stamp and may snugly fit between the socket and the corresponding fin. Such a socket-fin connection usually has some mechanical clearance, which may be obtained using spring contacts in the socket which may abut, under the biasing spring force, against contacts of the fin. Since such spring elements are mechanically flexible, it is possible to place the flexible electronic interface device, being thin enough, between the fin and the socket so as to mechanically bypass fin contacts and socket contacts.

[0012] Thus, a probing technology may be provided which is easy in use, small in size and cheap in manufacture. The electronic interface device may be manufactured as a simple molded plastic member which may be adapted to the dimensions and/or the shape of groove and fin so as to be able to fulfil its function. A clearance between the two elements to be connected to one another may be used by providing the electronic interface device with flexible mechanical properties and/or by providing the electronic interface device with a corresponding shape.

[0013] In an operation state in which the fin is inserted into the socket, the electronic interface device may be clamped in between these two elements. Additionally, a unit for conducting or leading away an electrical signal to be transmitted from the fin to the socket, or vice versa, may be provided. Such electronic signals of interest may therefore be tapped and may be transmitted to an analyzing device, for instance a protocol analyzer similar to the E2960 of Agilent Technologies, for analysis of the function of DUT and SUT based on an analysis of the tapped signal(s).

[0014] Exemplary embodiments may be used for any bus or connector, independent of the used bus protocol. Important is only the mechanical connection which may be, for instance, a fin-socket connection.

[0015] Thus, a measuring adaptor may simply be sandwiched between DUT and SUT for providing an electric and a mechanical bridge so as to generate a further board-groove connection.

[0016] Exemplary embodiments of the invention may have the advantage that the electronic interface device may be manufactured with a small size (especially very thin) and does not require a lot of space. Further, it may be dispensible to use relatively large probing cards. Beyond this, the signal paths may be shortened, which may prevent the signals from being distorted by disturbing influences. Signal-to-noise ratios may therefore be improved. Therefore, the electric interface unit may allow to convey even high-speed signals of 2.5 GHz (5 GBit), and more. [0017] According to an exemplary embodiment, a foil or a film for a plug connection may be provided.

[0018] It is possible to tap a differential signal, wherein the evaluation of a differential signal may increase the accuracy of the analysis.

[0019] The electronic interface device may nestle or nuzzle between the two components to be connected, thereby allowing to intermediate between two essentially planar electric contacts.

[0020] Thus, a direct electrical and mechanical coupling element with a T-piece function between a SUT and a DUT without the need of a separate test card may be provided. By taking this measure, the number of cards to be connected may be reduced, the size of the conduct lines may be reduced, and the mechanical construction may be simplified. This may essentially have significant advantages when further increasing the operating frequencies, for instance for a next generation PCI Express. Particularly when moving from a 2.5 GHz application to a 5 GHz application, such advantages may become important.

[0021] Next, further exemplary embodiments of the electronic interface device will be explained. However, these embodiments also apply for the test system and for the method of electrically coupling a socket-shaped electrical component to a fin-shaped electrical component.

[0022] The electrically insulating substrate may comprise a flexible material. The flexibility of such a material may be such that the electronic interface device may be brought in essentially any geometrical shape using moderate muscle forces. For instance, one end portion of the electrically insulating substrate of such a flexibility may be brought in contact with another end portion of the electrically insulating substrate by bending. Such a degree of flexibility may allow the electrically insulating substrate to be brought in essentially any desired position when being squeezed between the fin and the socket.

[0023] Alternatively, the electrically insulating substrate may comprise a relatively rigid material being pre-shaped in a manner to enable the electronic interface device to be inserted between the socket-shaped electrical component and the fin-shaped electrical component in a state in which the fin-shaped electrical component is inserted into the socket-shaped electrical component. According to such an embodiment, the fit or geometrical adjustment of the electronic interface device between the socket and the fin may be obtained by shaping the electrically insulating substrate accordingly. In other words, the shape of the electrically insulating substrate may be adapted to a specific fin-socket-system, and the dimensions may be adjusted so that the electrically insulating substrate with a rigid character may fit between the fin and the socket.

[0024] Embodiments of the invention can be applied particularly advantageously to socket-fin systems which, when inserting the fin in the socket, may have an electrical contact even in the absence of the electronic interface device. However, the socket fin system should have such a mechanical tolerance or clearance that an insertion of the fin into the socket is also possible when the socket has been lined with the electrically interface device.

[0025] The electrically insulating substrate may comprise polyimide, polypropylene, polyethylene, polytetrafluorethylene, polyesterimide, polyetherimide, or polyamideimide. Particularly polyimide is a proper selection which provides a high degree of flexibility and robustness, so that the electronic interface device may be implemented even under harsh conditions, at relatively high temperatures, and for a long time.

[0026] The electrically insulating substrate may be a thin layer substrate. The term "thin layer substrate" may particularly denote that the electrically insulating substrate being a thin coil or film with a thickness which is significantly smaller than the other two dimensions of the electrically insulating substrate. For instance, the thickness may be a factor of 10 or 100 smaller than the dimensions in the other two directions.

[0027] Particularly, the electrically insulating substrate may have a thickness of less than one millimeter, particularly less than five hundred micrometers, and more particularly less than one hundred micrometers. For instance, the electrically insulating substrate may be a polyimide film with a thickness of 75μm having the electrically conductive elements provided thereon and/or therein. [0028] The electrically conductive element may be formed as a structure deposited on the electrically insulating substrate. It is possible that the electrically conductive element is formed as some kind of conductive dot, as a conductive line or as an essentially two-dimensional planar conductive area. For instance, essentially a whole main surface of the electrically insulating substrate may be covered with electrically conductive material so as to allow to conduct the electrical signals in an efficient and low-ohmic manner to a desired destination.

[0029] The electrically conductive element may be formed on both main surfaces of the electrically insulating substrate. When arranging the conducting lines so as to provide a continuous electrical connection from one main surface to the other surface, the provision of through holes in the electrically conductive substrate for electrically connecting the two main surfaces may be avoided. This may allow for a simple construction of the electronic interface device.

[0030] Additionally or alternatively, the electrically conductive element may be formed within the electrically insulating substrate. Thus, vias or other through holes may be formed in the electrically insulating substrate to penetrate the latter by procedures like milling, blanking, laser treatment, or etching. Also lithography can be applied for generating the holes which may be subsequently filled with electrically conductive material.

[0031] The tapping element of the electronic interface device may comprise an ohmic resistor unit for reducing the electric energy of the tapped electrical signal compared to the original electrical signal. When tapping the electrical signal for analyzing the signal, it shall be ensured that the function between SUT and DUT, or in other words between fin and socket, shall be influenced as weak as possible. If only a small portion of the electrical signal is tapped for further analysis, this requirement may be fulfilled. For this purpose, an ohmic resistor network may be provided so as to adjust the amplitude values of the current and/or of the voltage.

[0032] The tapping element may further comprise an amplification unit for amplifying the tapped electrical signal. After having tapped this small electrical signal, the amplitude may be artificially increased again so as to improve or increase the intensity of the signal for further analysis. This may still be performed on the electronic interface device.

[0033] The electrically insulating substrate may further comprise an oblong hole or recess for simplifying attachment of the electronic interface device between the socket- shaped electrical component and the fin-shaped electrical component. For instance, such an oblong hole may give the entire electronic interface an annular shape and may serve for centering the electronic interface device when being provided between the socket and the fin. Such a slit may also be used for fastening the electronic interface device between two grooves of the socket and/or of the fin.

[0034] The electrically insulating substrate may comprise two edge portions and a central portion located between the two edge portions, wherein a thickness of the central portion may be smaller than a thickness of the two edge portions to simplify folding of the two edge portions with respect to the central portion, or which may simplify bending of the central portion. The central portion of the electrically insulating substrate is usually subject of relatively strong mechanical forces, since it is positioned at a bottom portion of the fin. Therefore, a relatively high flexibility is necessary in this part of the electronic interface device, which may be achieved by a smaller thickness as compared to other portions. The edge portions, in contrast thereto, may have a very high degree of mechanical stability, since they pass essentially parallel along the side surfaces of the fin and the side surfaces of the socket and are usually not subject of strong folding.

[0035] The described structure may be obtained, for instance, by realizing the two edge portions from a plastics layer which is covered with a varnish, wherein the central portion only consists of the plastics layer but does not contain any varnish provided thereon. The varnish may then provide a mechanical reinforcement and an electrical isolation, which may not be necessary or desired in the central portion.

[0036] In an operation state in which the electronic interface device is squeezed between socket and fin, the cross-section of the electronic interface device may have essentially a U-shape. In this condition, the two vertical lines of the U are formed by the two edge portions, wherein the bottom portion of the U with a high degree of curvature may be formed by the central portion. [0037] The electronic interface device may further comprise a connection element coupled to or to be coupled to the tapping element and adapted to be connected, permanently or temporarily, to the analyzing apparatus. The electronic interface device alone does usually not have the capability of analyzing the signals. Therefore, for further and deeper analysis, the tapped signals may be transmitted to an analyzing apparatus. The analyzing apparatus may be connected to the electronic interface device via the connection element. The connection element may be, for instance, a solder connection, a click connection or a plug connection. This is simple in manufacture, robust and easy in handling.

[0038] The electronic interface device may further be adapted to provide an electrical coupling for a plug connection of the group consisting of a high-speed plug connection (for instance with signals in the 5 GHz domain), a computer card connection (for instance for a WLAN card), a car battery connection, a communication network connection, a hub connection, a switch box connection, an extruder card connection, and a printed circuit board (PCB) connection. More generally speaking, exemplary embodiments may be implemented when two components are electrically coupled with a sufficient degree of clearance or tolerance to allow to arrange or locate the electronic interface device as an adaptor therebetween. In such a scenario, the electronic interface device may not only serve as an interface bridging the components for transmitting signals, but may also branch off a portion of the signal for further analysis. Examples are all fin-groove plugs having a sufficient tolerance which may be used for inserting the electronic interface device in between.

[0039] Next, exemplary embodiments of the test system will be explained. However, these embodiments also apply for the electronic interface device and for the method.

[0040] The test device may comprise a device for testing a device under test or a substance, a sensor device, a device for chemical, biological and/or pharmaceutical analysis, a fluid separation system adapted for separating compounds of a fluid, a capillary electrophoresis device, a liquid chromatography device, a gas chromatography device, an electronic measurement device, and a mass spectroscopy device. The test system is not restricted to these examples, but may be applied in any field where electrical signals shall undergo a processing, manipulation or analysis. BRIEF DESCRIPTION OF DRAWINGS

[0041] Other objects and many of the attendant advantages of embodiments of the present invention will be readily appreciated and become better understood by reference to the following more detailed description of embodiments in connection with the accompanied drawings. Features that are substantially or functionally equal or similar will be referred to by the same reference signs.

[0042] Fig. 1 shows a test system comprising an electronic interface device, illustrated in a cross-sectional view, according to an exemplary embodiment of the invention.

[0043] Fig. 2 shows a test system according to an exemplary embodiment.

[0044] Fig. 3 shows a cross-section of an electronic interface device according to an exemplary embodiment.

[0045] Fig.4 shows a circuit diagram of an electronic interface device according to an exemplary embodiment.

[0046] Fig. 5 shows a plan view of a layout of an electronic interface device according to an exemplary embodiment.

[0047] Fig. 6 shows a plan view of a layout of an electronic interface device according to an exemplary embodiment.

[0048] The illustration in the drawing is schematically.

[0049] In the following, referring to Fig. 1, a test system 100 according to an exemplary embodiment will be explained.

[0050] The test system 100 is adapted for testing a function of a fin-shaped card 101 (a cross-section thereof is shown in Fig. 1), for instance a WLAN card, which is removably inserted into a socket 102, having a U-shaped groove, of a computer (not shown).

[0051] In conventional use, when a user has inserted the card 101 , for instance a

WLAN card, into the socket 102 of the PC, the biasing spring force of electrical spring contacts 103 of the socket 102 are brought automatically in electrically contact with contacts 104 of the card 101. Therefore, even when an electronic interface device 110 which will be explained below in more detail, is not present and is not inserted between the card 101 and the socket 102, a direct electrical connection between the card 101 and the socket 102 is enabled.

[0052] However, the test system 100 further comprises the electronic interface device 110 for electrically coupling the socket-shaped electrical component 102 to the fin-shaped electrical component 101. An analyzing apparatus 120, for instance a protocol analyzer E2960 of Agilent Technologies, is connected by an electrically conductive wire 121 to a contact 111 of the electronic interface device 110.

[0053] In the following, the electronic interface device 110 will be explained in more detail.

[0054] The electronic interface device 110 is adapted for electrically coupling the socket-shaped electrical component 102 to the fin-shaped electrical component 101. For this purpose, the electronic interface device 110 comprises an electrically insulating substrate 112 in the shape of a flexible film. In and on the electrically insulating substrate 112, electrically conductive elements 113 are provided. Furthermore, also not shown in Fig. 1, a tapping element as some kind of wire is provided on and/or in the electrically insulating substrate 112 and is adapted for tapping an electrical signal traveling from the spring contact 103 through the electrically conductive element 113 to the contact 104, or in the opposite direction, and for supplying this electrical signal via the contact 111 and the wiring 121 to the analyzing apparatus 120 connected to the electrical interface 110.

[0055] The electronic interface device 100 is shaped, dimensioned and made of such a material to provide an electrical coupling between the socket-shaped electrical component 102 and the fin-shaped electrical component 101 when the electrical probe( or interface)- as shown in Fig. 1 - is inserted between the socket-shaped electrical component 102 and the fin-shaped electrical component 101 in a state - as shown in Fig. 1 - in which the fin-shaped electrical component 101 is inserted into the socket-shaped electrical component 102. [0056] In more detail, the operation of the fin component 101 and of the socket component 102 is such that electrical signals can be transmitted between the components 101. 102. directly or via the electronic interface device 110. For monitoring or analyzing the proper function of the interaction between the fin component 101 and the socket component 102, the signal is tapped via the wiring 121 and sent to the analyzer apparatus 120.

[0057] However, for maintaining the electrical connection between the components 101 and 102, the contacts 113 of the electronic interface device 110 are used as some kind of bridge to transport the largest part of the electric signal from the fin component 101 to the socket component 102.

[0058] In the scenario of Fig. 1 , the electrically insulating substrate 112 is made of a flexible material, namely of a polyimide layer with a thickness of, for instance, 75μmor 50μm. The electrically conductive element 113 is a copper contact provided on and/or in the electrically conductive film 112.

[0059] Fig. 2 shows another schematic illustration of the test system 100 of Fig. 1.

[0060] A tapping element 200 for tapping an electric signal propagating between DUT 101 and SUT 102 and for guiding the tapped signal to the analysis apparatus 120 is also shown in Fig. 2.

[0061] The socket 102 may also be denoted as the SUT (system under test), whereas the fin element 101 may be denoted as the device under test (DUT).

[0062] Fig. 3 shows a cross-sectional of the electronic interface device 110.

[0063] As can be taken from Fig. 3, a 75μm or 50μm thick and flexible layer of the polyimide film 112 comprises through holes which are filled with copper material 300. The copper structures 300 may be hollow cylinders or solid cylinders which may allow to conduct the signals with low losses and with low signal distortions. Furthermore, copper contacts 301 are provided on both main surfaces of the electronic interface device 110 and are electrically coupled to the copper material 300. A varnish layer 302 covers both surfaces of the electronic interface device 110. The copper contacts 301 may have a thickness of 18μm. Furthermore, Fig. 3 shows copper lines 303 extending along a surface of the polyimide film 112 below the varnish layer 302. The varnish layer 302 is removed at surface portions above the copper contacts 301 to allow for an ohmic contact.

[0064] Although not shown in Fig. 3, both surfaces of the varnish 302 may be covered by a glue layer (for instance with a thickness of 50μm) which, in turn, may be covered with a further polyimide layer having a thickness of, for instance, 25μm.

[0065] Fig. 4 shows an electric circuitry of the electronic interface device 110.

[0066] This electric circuitry is shown in the form of a block diagram 400. The DUT 101 is connected or connectable at an upper end portion of connection lines 401 , and the SUT 102 is connected or connectable at a lower end thereof. In other words, signals are traveling along lines 401 between the DUT 101 and the SUT 102 through the contacts 103, 113, 104 which may form or which may be part of the connection lines 401.

[0067] Furthermore, the tapping element 200 is shown in more detail in Fig.4. The electrical signals are tapped at certain positions 405, 406 of the wiring 401 and are transmitted to ohmic resistors 402. The ohmic resistors 402 form an ohmic resistor network for reducing the electric energy of the tapped electrical signal compared to the original electrical signal travelling between the DUT 101 and the SUT 102. The value of the ohmic resistors 402 may be, for instance, 300 Ω which may be reasonable for PCI Express.

[0068] Moreover, coupling capacitors 403 are foreseen. Providing coupling capacitors 403 may be reasonable for PCI Express, since this may include transmitting DC free signals and filter out DC contributions. The differential signals having passed the resistors 402 and the capacitors 403 are passed through a differential amplifier 404 before being further transmitted to the analyzer 120. The differential amplifier 404 may be reasonable when differential signals are transmitted. For PCI bus applications, a differential amplifier 404 may be substituted by a linear amplifier.

[0069] In the following, referring to Fig. 5, a layout of an electronic interface device 500 according to an exemplary embodiment of the invention will be explained. [0070] As can be taken from Fig. 5, the electrically insulating substrate 112 comprises an oblong hole 504 in a slit-like shape for attaching the electronic interface device 500 between the socket 102 and the fin 101. This oblong hole 504 may allow the attachment of the electronic interface device 500 between the two electronic components 101 and 102. The oblong hole 504 may promote correct placement of the Flexboard Probe in the plug and may automatically align the contacts in a correct manner, when the plug has a protrusion corresponding to the oblong hole 504. A plurality of protrusions/oblong holes are possible.

[0071] As can further be taken from Fig. 5, the electrically insulating substrate 112 comprises a first edge portion 501 and a second edge potion 503 as well as a central portion 502 located between the two edge portions 501 and 503. Also not shown in the plan view of Fig. 5, a thickness of the central portion 502 may be smaller than a thickness of the two edge portions 501 , 503 to simplify folding of the two edge portions 501 , 503 with respect to the central portion 502.

[0072] Particularly, the central portion 502 consists of the polyimide layer 112, whereas a varnish 302 layer is provided on the two edge portions 501 , 503, but not on the central portion 502. Therefore, the central portion 502 is relatively flexible, whereas the edge portions 501 , 503 may be denoted as semi-rigid. The semi-rigid configuration (or a rigid configuration) may provide a proper mechanical support for sensitive electric components, like ceramic capacitors.

[0073] Furthermore, Fig. 5 shows a plurality of bore holes 505 (which may be filled or lined with an electrically conductive material like copper), a ground connection 506, a resistor network 507, a clock connection 508, and a 3.25 Gigabit amplifier 509. Furthermore, measurement contacts 510 are shown at which measurement wires from the analyzer device 120 may be connected, for instance by soldering.

[0074] One main surface (particularly the bottom surface) of the electronic interface device 500 may be essentially continuously covered with electrically conductive material.

[0075] Fig. 6 shows an electronic interface device 600 according to another exemplary embodiment of the invention. [0076] The embodiment of Fig. 5 is adapted for low-speed applications, whereas the embodiment of Fig. 6 is adapted for high-speed applications. For instance, a 10 Gigabit amplifier 601 is provided in Fig. 6. An amplifier for the clock is denoted with reference numeral 602.

[0077] It should be noted that the term "comprising" does not exclude other elements or features and the "a" or "an" does not exclude a plurality. Also elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

Claims

1. An electronic interface device for electrically coupling a socket-shaped electrical component to a fin-shaped electrical component, the electronic interface device comprising

an electrically insulating substrate;

an electrically conductive element coupled to the electrically insulating substrate;

a tapping element for tapping an electrical signal traveling through the electrically conductive element and for supplying the tapped electrical signal to an analyzing apparatus connectable to the electronic interface device;

wherein the electronic interface device is adapted to provide an electrical coupling between the socket-shaped electrical component and the fin-shaped electrical component when the electronic interface device is inserted between the socket-shaped electrical component and the fin-shaped electrical component in a state in which the fin-shaped electrical component is inserted into the socket- shaped electrical component.

2. The electronic interface device of claim 1 ,

wherein the electrically insulating substrate comprises a flexible material.

3. The electronic interface device of claim 1 ,

wherein the electrically insulating substrate comprises a rigid material being shaped in a manner to enable the electronic interface device to be inserted between the socket-shaped electrical component and the fin-shaped electrical component in a state in which the fin-shaped electrical component is inserted into the socket-shaped electrical component.

4. The electronic interface device of claim 1 or any one of the above claims,

wherein the electrically insulating substrate comprises at least one material of the group consisting of polyimide, polypropylene, polyethylene, polytetrafluorethylene, polyesterimide, polyetherimide, and polyamideimide.

5. The electronic interface device of claim 1 or any one of the above claims,

wherein the electrically insulating substrate is a thin layer substrate.

6. The electronic interface device of claim 1 or any one of the above claims,

wherein the electrically insulating substrate has a thickness of less than a millimeter, particularly less than five hundred micrometer, more particularly less than one hundred micrometer.

7. The electronic interface device of claim 1 or any one of the above claims,

wherein at least a part of the electrically conductive element is formed on a surface of the electrically insulating substrate.

8. The electronic interface device of claim 1 or any one of the above claims,

wherein at least a part of the electrically conductive element is formed on both main surfaces of the electrically insulating substrate.

9. The electronic interface device of claim 1 or any one of the above claims,

wherein at least a part of the electrically conductive element is formed in the electrically insulating substrate.

10. The electronic interface device of claim 1 or any one of the above claims,

wherein the tapping element comprises an ohmic resistor unit for reducing the amplitude of the tapped electrical signal compared to the amplitude of the original electrical signal.

11. The electronic interface device of claim 10,

wherein the tapping element comprises an amplification unit for amplifying the tapped electrical signal.

12. The electronic interface device of claim 1 or any one of the above claims,

wherein the electrically insulating substrate comprises an oblong through hole for attaching the electronic interface device between the socket-shaped electrical component and the fin-shaped electrical component.

13. The electronic interface device of claim 1 or any one of the above claims,

wherein the electrically insulating substrate comprises two edge portions and a central portion located between the two edge portions, wherein a thickness of the central portion is smaller than a thickness of the two edge portions to simplify folding or bending of the central portion.

14. The electronic interface device of claim 13,

wherein the two edge portions comprise a plastics layer covered with a varnish, and the central portion comprises the plastics layer and is free of varnish.

15. The electronic interface device of claim 1 or any one of the above claims,

comprising a connection element coupled to the tapping element and adapted to be connected, detachably or permanently, to the analyzing apparatus.

16. The electronic interface device of claim 15,

wherein the connection element is adapted to be connected to the analyzing apparatus using at least one connection type of the group consisting of a solder connection and a plug connection.

17. The electronic interface device of claim 1 or any one of the above claims,

adapted to provide an electrical coupling for a plug connection of the group consisting of a high speed plug connection, a computer card connection, a car battery connection, a communication network connection, a hub connection, a switch box connection, an extruder card connection, and a printed circuit board connection.

18. A test system for testing a function of a fin-shaped electrical component inserted into a socket-shaped electrical component, the test system comprising

an electronic interface device of claim 1 or any one of the above claims for electrically coupling the socket-shaped electrical component to the fin-shaped electrical component;

an analyzing apparatus connectable to the electronic interface device for receiving the tapped electrical signal traveling through the electrically conductive element.

19. The test system of claim 18,

comprising at least one of a test device for testing a device under test or a substance, a sensor device, a device for chemical, biological and/or pharmaceutical analysis, a fluid separation system adapted for separating compounds of a fluid, a capillary electrophoresis device, a liquid chromatography device, a gas chromatography device, an electronic measurement device, and a mass spectroscopy device.

20. A method of electrically coupling a socket-shaped electrical component to a fin- shaped electrical component via an electronic interface device, the method comprising

inserting the electronic interface device between the socket-shaped electrical component and the fin-shaped electrical component to provide an electrical coupling between the socket-shaped electrical component and the fin-shaped electrical component via an electrically conductive element of the electronic interface device in a state in which the fin-shaped electrical component is inserted into the socket-shaped electrical component;

tapping an electrical signal traveling through the electrically conductive element using the electronic interface device; and

supplying the tapped electrical signal to an analyzing apparatus connected to the electronic interface device.