WO2008001970A1 - Apparatus and method for conditioning polishing pad for chemical mechanical polishing apparatus - Google Patents

Apparatus and method for conditioning polishing pad for chemical mechanical polishing apparatus Download PDF

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Publication number
WO2008001970A1
WO2008001970A1 PCT/KR2006/002895 KR2006002895W WO2008001970A1 WO 2008001970 A1 WO2008001970 A1 WO 2008001970A1 KR 2006002895 W KR2006002895 W KR 2006002895W WO 2008001970 A1 WO2008001970 A1 WO 2008001970A1
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WO
WIPO (PCT)
Prior art keywords
polishing pad
diamond disk
arm
conditioning
polishing
Prior art date
Application number
PCT/KR2006/002895
Other languages
French (fr)
Inventor
Jung Hoon Lee
Seung Wook Yoon
Original Assignee
Doosan Mecatec Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co., Ltd. filed Critical Doosan Mecatec Co., Ltd.
Publication of WO2008001970A1 publication Critical patent/WO2008001970A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to an apparatus and method for conditioning a polishing pad for a chemical mechanical polishing apparatus, and more particularly, to an apparatus and method for conditioning a polishing pad for a chemical mechanical polishing apparatus capable of reducing the size of a diamond disk for conditioning the polishing pad.
  • a chemical mechanical polishing apparatus mechanically creates friction between a polishing pad and a semiconductor wafer and chemically and mechanically polishes a surface of the semiconductor wafer using an abrasive agent.
  • the surface of the polishing pad is also polished, thereby degrading its abrasion performance.
  • an industrial diamond disk is attached to a conditioning carrier to condition the surface of the polishing pad.
  • a conventional apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus will be described below with reference to the accompanying drawings.
  • FlG. 1 is a schematic view of a conventional polishing apparatus of a chemical mechanical polishing apparatus
  • FlG. 2 is a schematic view of a conventional apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus.
  • the conventional polishing apparatus of the chemical mechanical polishing apparatus includes a polishing carrier 1 for fixing a semiconductor wafer and creating friction between the semiconductor wafer and a polishing pad 5 to polish the semiconductor wafer, a conditioning carrier 2 for fixing a ring- shaped diamond disk for conditioning the polishing pad 5, and a spindle 4 for rotating the polishing carrier 1 and the conditioning carrier 2.
  • the diamond disk 3 attached to the conditioning carrier 2 has a diameter corresponding to the radius of the polishing pad 5, and is revolved and rotated by the spindle 4 to condition the entire surface of the polishing pad 5.
  • the conventional chemical mechanical polishing apparatus employs the diamond disk 3 having a diameter corresponding to the radius of the polishing pad 5 to condition the polishing pad 5.
  • use of such a large and expensive diamond disk drives up maintenance and management costs of the chemical mechanical polishing apparatus.
  • One aspect of the present invention provides an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus including: an arm drive motor disposed in a rotating spindle and periodically changing a rotational direction of a rotary shaft thereof; an arm having a rotary shaft disposed at an eccentric position of the lower surface of the spindle, and one end reciprocating along a semi-circular trajectory spanning the radius of the polishing pad by a drive force of the arm drive motor; and a holder rotatably engaged with the lower surface of the one end of the arm, and at which a small sized diamond disk is attached to the lower surface.
  • the apparatus may further include a holder fixing part rotatably engaged with the arm, and accommodating the holder; a disk drive motor for rotating the holder fixing part; and a pressure regulator for raising/lowering the holder accommodated in the holder fixing part.
  • the disk drive motor may control a rotational speed of the holder fixing part.
  • the pressure regulator may vary a contact pressure between the diamond disk and the polishing pad in a state in which the holder is lowered to put the diamond disk in contact with the polishing pad.
  • the arm drive motor may vary a rotational speed of the arm in different sections when the arm is rotated in one direction.
  • the arm drive motor may transmit a drive force to the arm using a belt, and further include a belt detection part for detecting whether the belt is operating normally.
  • the diamond disk may have a diameter corresponding to 10 - 40% of the radius of the polishing pad.
  • Another aspect of the present invention provides a method of conditioning a polishing pad of a chemical mechanical polishing apparatus by creating friction between the polishing pad and a diamond disk during a semiconductor wafer polishing process, the method including reciprocating the diamond disk having a diameter corresponding to 10 - 40% of the radius of the polishing pad along a semi-circular trajectory spanning the radius of the polishing pad to condition the polishing pad.
  • the semi-circular movement trajectory of the diamond disk may be divided into at least two sections, and its movement speed may be varied at each section.
  • the diamond disk may move through the edge part of the polishing pad at a highest speed, an intermediate part at a lowest speed, and the center part at a medium speed.
  • the semi-circular movement trajectory of the diamond disk may be divided into at least two sections, and a contact pressure between the diamond disk and the polishing pad may be varied at each section.
  • the diamond disk may have a highest contact pressure at the edge part of the polishing pad, a lowest contact pressure at an intermediate part, and a medium contact pressure at the center part.
  • the semi-circular movement trajectory of the diamond disk may be divided into at least two sections, and a rotational speed of the diamond disk may be varied at each section.
  • the diamond disk may have a highest speed at an edge part of the polishing pad, a lowest rotational speed at an intermediate part, and a medium rotational speed at a center part.
  • An apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention include an arm driven along a semi-circular trajectory, and a small sized diamond disk attached to the arm for conditioning the polishing pad.
  • the apparatus and method can uniformly condition the polishing pad and reduce costs associated with managing, maintaining, and replacing the diamond disk.
  • FlG. 1 is a schematic view of a conventional polishing apparatus of a chemical mechanical polishing apparatus
  • FlG. 2 is a schematic view of a conventional apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus
  • FlG. 3 is a perspective view of an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with an exemplary embodiment of the present invention
  • FlG. 4 is a cross-sectional view of FlG. 3;
  • FlG. 5 is a perspective view of a chemical mechanical polishing apparatus in accordance with the present invention.
  • FlG. 6 is a plan view comparing an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention with the conventional apparatus for conditioning a polishing pad;
  • FlG. 7 is a plan view of the trajectory of a diamond disk in accordance with the present invention. Best Mode for Carrying Out the Invention
  • FIG. 3 is a perspective view of an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with an exemplary embodiment of the present invention
  • FIG. 4 is a cross-sectional view of FIG. 3.
  • an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention includes an arm drive motor 10 periodically changing a rotational direction of a rotor, an arm 20 receiving a rotational force of the arm drive motor 10 through a belt 11 to reciprocate along a semi-circular trajectory about a rotary shaft thereof, a holder 30 disposed at a lower part of the arm 20 and fixing a diamond disk 31 for conditioning a polishing pad 70, and a disk drive motor 40 disposed in a rotary shaft of the arm 20 and transmitting a rotational force to the holder 30 through a belt 41.
  • the holder 30 is fixed by a holder fixing part 60 rotatably engaged with a lower part of one end of the arm 20, and vertically moves along the holder fixing part 60 by pressure regulation of a pressure regulator 50.
  • Reference numeral 12 designates a belt detection part for detecting whether the belt
  • reference numeral 21 designates a polishing pad detection part for detecting whether the holder fixing part 60 is lowered to put the diamond disk 31 in contact with the polishing pad 70.
  • the arm drive motor 10 may control its rotational direction and speed and shift the direction of its rotor by 180 , thereby transmitting a drive force to the arm 20 through a belt 11. [41] Therefore, the arm 20, to which the drive force of the driving motor 10 is transmitted through the belt 11, rotates along a semi-circular trajectory about a rotary shaft thereof.
  • the arm 20 includes a rotary shaft directly connected to the belt 11 to be rotated by the belt 11 at a fixed position, and a projection part projecting from a lower end of the rotary shaft and engaging with the holder at the lower surface of a projected end thereof.
  • the rotary shaft of the arm 20 is rotated in the same direction as the drive motor 10, and the end of the projection part projecting from the lower end of the rotary shaft reciprocates along a semi-circular trajectory.
  • the rotary shaft of the arm 20 is disposed in the middle of the radius of the polishing pad 70, and the holder 30 moves along a semi-circular trajectory between the edge and the center of the polishing pad 70 driven by the arm 20.
  • the disk drive motor 40 is installed in the rotary shaft of the arm 20 which reciprocates along the semi-circular trajectory.
  • a fluid supply pipe passes through a side surface of the disk drive motor 40 to supply fluid to the pressure regulator 50 for raising or lowering the holder fixing part 60.
  • the disk drive motor 40 transmits a rotational force with a uniform speed in one direction, unlike the arm drive motor 10.
  • the rotational force is transmitted to the holder fixing part 60 disposed at the lower surface of one side of the projection part of the arm 20 through the belt 41.
  • the holder fixing part 60 can be rotated at a predetermined position with respect to the arm 20, and the pressure regulator 50 for supplying fluid to the holder fixing part 60 is connected by a rotary joint to prevent twisting of the fluid supply pipe.
  • the diamond disk 31 may have a diameter corresponding to 10 - 40% of the radius of the polishing pad 70.
  • the holder 30 fixed to the holder fixing part 60 can be raised or lowered by operation of the pressure regulator 50. That is, while the polishing pad 70 is conditioned, the holder 30 is lowered to allow the diamond disk 31 attached to the lower surface thereof to contact a polishing surface of the polishing pad 70.
  • the polishing pad 70 is conditioned simultaneously while the semiconductor wafer is chemically mechanically polished, and when the chemical mechanical polishing is completed, the holder 30 is raised to allow the diamond disk 31 to be spaced apart from the polishing pad 70.
  • the diamond disk 31 in contact with the polishing pad 70 is rotated to draw a circular arc spanning the radius of the polishing pad.
  • the entire polishing pad 70 can be conditioned by moving the diamond disk 31 this way.
  • FlG. 5 is a perspective view of a chemical mechanical polishing apparatus in accordance with the present invention.
  • a portion of the rotary shaft of the arm 20 including the arm drive motor 10 and the disk drive motor 40 is installed in the spindle 100, and the other part of the arm 20 and the diamond disk 31 are exposed to the exterior.
  • the diamond disk 31 has a smaller size than a polishing carrier 80 for fixing a semiconductor wafer.
  • the diamond disk 31 can sequentially condition the entire polishing pad 70 through rotation of the spindle 100 itself, drive of the arm 20, and rotation of the diamond disk.
  • FlG. 6 is a plan view comparing an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention with the conventional apparatus for conditioning a polishing pad.
  • the polishing carrier 80 for creating friction between the semiconductor wafer and the polishing pad 70 to polish a surface of the wafer has a size substantially equal to a conditioning carrier 90 for fixing the diamond disk for conditioning a surface of the polishing pad 70, and the diamond disk engaged with the lower surface of the conditioning carrier 90 also has a size substantially equal to the conditioning carrier 90.
  • the polishing carrier 80 and the conditioning carrier 90 are rotatably engaged with the spindle to be revolved on an upper surface of the polishing pad 70 depending on rotation of the spindle.
  • the polishing carrier 80 is rotated to polish the semiconductor wafer, and the conditioning carrier 90 is also rotated to condition a surface of the polishing pad 70.
  • the rotary shaft is disposed at the middle of the radius of the polishing pad 70 at its one end, and includes the arm 20, which reciprocates along a semi-circular trajectory between the center and the edge of the polishing pad 70, at the other end.
  • a small sized diamond disk 31 is fixed to the lower surface of the other end of the arm 20 through the medium of the holder 30. Therefore, it is possible to condition the polishing pad 70 and reduce maintenance and management costs of the diamond disk 31.
  • FlG. 7 is a plan view of the trajectory of a diamond disk in accordance with the present invention.
  • the trajectory of the diamond disk employed in the apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with an exemplary embodiment of the present invention has a semi-circular pattern such that the entire polishing pad 70 can be conditioned as the spindle rotates.
  • a conditioning level during a process of driving the small sized diamond disk 31 and conditioning the polishing pad 70 is proportional a contact pressure between the diamond disk 31 and the polishing pad 70, a linear velocity and a contact time of the diamond disk 31.
  • the diamond disk 31 is rotated, rather than linearly moved, thus causing the polishing pad 70 to be irregularly conditioned.
  • another parameter e.g., the velocity of the diamond disk 31, may be differently set in different sections 70.
  • the polishing pad 70 may be divided into an edge part A, an intermediate part B, and a center part C such that the velocity of the arm drive motor 10 can be controlled to vary the velocity of the diamond disk 31 in each section.
  • the number of speed differential sections is preferably about 10.
  • the intermediate part B is polished more than the edge part A and the center part C.
  • the diamond disk 31 slowly passes through the intermediate part B in comparison with the other parts.
  • the drive speed of the arm drive motor 10 is controlled, and each section speed of the arm 20 is also controlled.
  • the contact pressure between the diamond disk 31 and the polishing pad 70 may be differently set for each section.
  • edge part A is set to have the highest pressure
  • center part C and the intermediate part B are set to have sequentially lower pressures.
  • the contact pressure can be adjusted in a state in which the diamond disk 31 is in contact with an upper surface of the polishing pad 70 by lowering the holder 30 by the pressure regulator 50.
  • the rotational speed of the disk drive motor 40 may be varied within each section such that the rotational speed of the diamond disk 31 is differently controlled to uniformly condition the polishing pad 70.
  • an apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention include an arm driven along a semi-circular trajectory, and a small sized diamond disk attached to the arm for conditioning the polishing pad.
  • the apparatus and method can uniformly condition the polishing pad and reduce costs associated with managing, maintaining, and replacing the diamond disk.

Abstract

An apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus are provided. The apparatus includes: an arm drive motor disposed in a rotating spindle and periodically changing a rotational direction of a rotary shaft thereof; an arm having a rotary shaft disposed at an eccentric position of the lower surface of the spindle, and one end re-ciprocating along a semi-circular trajectory spanning the radius of the polishing pad by a drive force of the arm drive motor; and a holder rotatably engaged with the lower surface of the one end of the arm, and at which a small sized diamond disk is attached to the lower surface. In addition, the method of conditioning a polishing pad of a chemical mechanical polishing apparatus by creating friction between the polishing pad and the diamond disk during a semi-conductor wafer polishing process includes: reciprocating the diamond disk having a diameter corresponding to 10 - 40% of the radius of the polishing pad along a semi-circular trajectory spanning the radius of the polishing pad to condition the polishing pad. Therefore, it is possible to uniformly condition the polishing pad and reduce maintenance, management and exchange cost of the diamond disk for conditioning the polishing pad by using the small sized diamond disk attached to the arm driven along the semi-circular trajectory.

Description

Description
APPARATUS AND METHOD FOR CONDITIONING POLISHING PAD FOR CHEMICAL MECHANICAL
POLISHING APPARATUS
Technical Field
[1] The present invention relates to an apparatus and method for conditioning a polishing pad for a chemical mechanical polishing apparatus, and more particularly, to an apparatus and method for conditioning a polishing pad for a chemical mechanical polishing apparatus capable of reducing the size of a diamond disk for conditioning the polishing pad.
Background Art
[2] Generally, a chemical mechanical polishing apparatus mechanically creates friction between a polishing pad and a semiconductor wafer and chemically and mechanically polishes a surface of the semiconductor wafer using an abrasive agent.
[3] In polishing the surface of the semiconductor wafer by creating friction between the polishing pad and the semiconductor wafer, the surface of the polishing pad is also polished, thereby degrading its abrasion performance.
[4] In order to prevent degradation of the abrasion performance of the polishing pad, an industrial diamond disk is attached to a conditioning carrier to condition the surface of the polishing pad. A conventional apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus will be described below with reference to the accompanying drawings.
[5] FlG. 1 is a schematic view of a conventional polishing apparatus of a chemical mechanical polishing apparatus, and FlG. 2 is a schematic view of a conventional apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus.
[6] Referring to FIGS. 1 and 2, the conventional polishing apparatus of the chemical mechanical polishing apparatus includes a polishing carrier 1 for fixing a semiconductor wafer and creating friction between the semiconductor wafer and a polishing pad 5 to polish the semiconductor wafer, a conditioning carrier 2 for fixing a ring- shaped diamond disk for conditioning the polishing pad 5, and a spindle 4 for rotating the polishing carrier 1 and the conditioning carrier 2.
[7] Here, the diamond disk 3 attached to the conditioning carrier 2 has a diameter corresponding to the radius of the polishing pad 5, and is revolved and rotated by the spindle 4 to condition the entire surface of the polishing pad 5.
[8] Since the diamond disk 3 is abraded together with conditioning the polishing pad 5, the diamond disk 3 should be replaced every so often.
[9] However, the conventional chemical mechanical polishing apparatus employs the diamond disk 3 having a diameter corresponding to the radius of the polishing pad 5 to condition the polishing pad 5. Thus, use of such a large and expensive diamond disk drives up maintenance and management costs of the chemical mechanical polishing apparatus.
Disclosure of Invention Technical Problem
[10] In order to solve the foregoing and/or other problems, it is an aspect of the present invention to provide an apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus using a smaller size of diamond disk. Technical Solution
[11] One aspect of the present invention provides an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus including: an arm drive motor disposed in a rotating spindle and periodically changing a rotational direction of a rotary shaft thereof; an arm having a rotary shaft disposed at an eccentric position of the lower surface of the spindle, and one end reciprocating along a semi-circular trajectory spanning the radius of the polishing pad by a drive force of the arm drive motor; and a holder rotatably engaged with the lower surface of the one end of the arm, and at which a small sized diamond disk is attached to the lower surface.
[12] The apparatus may further include a holder fixing part rotatably engaged with the arm, and accommodating the holder; a disk drive motor for rotating the holder fixing part; and a pressure regulator for raising/lowering the holder accommodated in the holder fixing part.
[13] The disk drive motor may control a rotational speed of the holder fixing part.
[14] The pressure regulator may vary a contact pressure between the diamond disk and the polishing pad in a state in which the holder is lowered to put the diamond disk in contact with the polishing pad.
[15] The arm drive motor may vary a rotational speed of the arm in different sections when the arm is rotated in one direction.
[16] The arm drive motor may transmit a drive force to the arm using a belt, and further include a belt detection part for detecting whether the belt is operating normally.
[17] The diamond disk may have a diameter corresponding to 10 - 40% of the radius of the polishing pad.
[18] Another aspect of the present invention provides a method of conditioning a polishing pad of a chemical mechanical polishing apparatus by creating friction between the polishing pad and a diamond disk during a semiconductor wafer polishing process, the method including reciprocating the diamond disk having a diameter corresponding to 10 - 40% of the radius of the polishing pad along a semi-circular trajectory spanning the radius of the polishing pad to condition the polishing pad. [19] The semi-circular movement trajectory of the diamond disk may be divided into at least two sections, and its movement speed may be varied at each section. [20] The diamond disk may move through the edge part of the polishing pad at a highest speed, an intermediate part at a lowest speed, and the center part at a medium speed. [21] The semi-circular movement trajectory of the diamond disk may be divided into at least two sections, and a contact pressure between the diamond disk and the polishing pad may be varied at each section. [22] The diamond disk may have a highest contact pressure at the edge part of the polishing pad, a lowest contact pressure at an intermediate part, and a medium contact pressure at the center part. [23] The semi-circular movement trajectory of the diamond disk may be divided into at least two sections, and a rotational speed of the diamond disk may be varied at each section. [24] The diamond disk may have a highest speed at an edge part of the polishing pad, a lowest rotational speed at an intermediate part, and a medium rotational speed at a center part.
Advantageous Effects [25] An apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention include an arm driven along a semi-circular trajectory, and a small sized diamond disk attached to the arm for conditioning the polishing pad. The apparatus and method can uniformly condition the polishing pad and reduce costs associated with managing, maintaining, and replacing the diamond disk.
Brief Description of the Drawings [26] These and/or other aspects and advantages of the present invention will become apparent and more readily appreciated from the following description of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings of which: [27] FlG. 1 is a schematic view of a conventional polishing apparatus of a chemical mechanical polishing apparatus; [28] FlG. 2 is a schematic view of a conventional apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus; [29] FlG. 3 is a perspective view of an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with an exemplary embodiment of the present invention;
[30] FlG. 4 is a cross-sectional view of FlG. 3;
[31] FlG. 5 is a perspective view of a chemical mechanical polishing apparatus in accordance with the present invention;
[32] FlG. 6 is a plan view comparing an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention with the conventional apparatus for conditioning a polishing pad; and
[33] FlG. 7 is a plan view of the trajectory of a diamond disk in accordance with the present invention. Best Mode for Carrying Out the Invention
[34] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings, throughout which like reference numerals refer to like elements.
[35] FIG. 3 is a perspective view of an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with an exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view of FIG. 3.
[36] Referring to FIGS. 3 and 4, an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention includes an arm drive motor 10 periodically changing a rotational direction of a rotor, an arm 20 receiving a rotational force of the arm drive motor 10 through a belt 11 to reciprocate along a semi-circular trajectory about a rotary shaft thereof, a holder 30 disposed at a lower part of the arm 20 and fixing a diamond disk 31 for conditioning a polishing pad 70, and a disk drive motor 40 disposed in a rotary shaft of the arm 20 and transmitting a rotational force to the holder 30 through a belt 41.
[37] The holder 30 is fixed by a holder fixing part 60 rotatably engaged with a lower part of one end of the arm 20, and vertically moves along the holder fixing part 60 by pressure regulation of a pressure regulator 50.
[38] Reference numeral 12 designates a belt detection part for detecting whether the belt
11 is operating normally, and reference numeral 21 designates a polishing pad detection part for detecting whether the holder fixing part 60 is lowered to put the diamond disk 31 in contact with the polishing pad 70.
[39] Hereinafter, the constitution and operation of the apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention will be described in detail.
[40] First, the arm drive motor 10 may control its rotational direction and speed and shift the direction of its rotor by 180 , thereby transmitting a drive force to the arm 20 through a belt 11. [41] Therefore, the arm 20, to which the drive force of the driving motor 10 is transmitted through the belt 11, rotates along a semi-circular trajectory about a rotary shaft thereof.
[42] The arm 20 includes a rotary shaft directly connected to the belt 11 to be rotated by the belt 11 at a fixed position, and a projection part projecting from a lower end of the rotary shaft and engaging with the holder at the lower surface of a projected end thereof.
[43] The rotary shaft of the arm 20 is rotated in the same direction as the drive motor 10, and the end of the projection part projecting from the lower end of the rotary shaft reciprocates along a semi-circular trajectory.
[44] At this time, the rotary shaft of the arm 20 is disposed in the middle of the radius of the polishing pad 70, and the holder 30 moves along a semi-circular trajectory between the edge and the center of the polishing pad 70 driven by the arm 20.
[45] The disk drive motor 40 is installed in the rotary shaft of the arm 20 which reciprocates along the semi-circular trajectory. In addition, a fluid supply pipe passes through a side surface of the disk drive motor 40 to supply fluid to the pressure regulator 50 for raising or lowering the holder fixing part 60.
[46] The disk drive motor 40 transmits a rotational force with a uniform speed in one direction, unlike the arm drive motor 10. The rotational force is transmitted to the holder fixing part 60 disposed at the lower surface of one side of the projection part of the arm 20 through the belt 41.
[47] The holder fixing part 60 can be rotated at a predetermined position with respect to the arm 20, and the pressure regulator 50 for supplying fluid to the holder fixing part 60 is connected by a rotary joint to prevent twisting of the fluid supply pipe.
[48] By the rotational force of the disk drive motor 40 transmitted to the holder fixing part 60, the holder 30 engaged with the holder fixing part 60 is rotated with the small sized diamond disk 31 fixed to the lower surface thereof.
[49] The diamond disk 31 may have a diameter corresponding to 10 - 40% of the radius of the polishing pad 70.
[50] Here, the holder 30 fixed to the holder fixing part 60 can be raised or lowered by operation of the pressure regulator 50. That is, while the polishing pad 70 is conditioned, the holder 30 is lowered to allow the diamond disk 31 attached to the lower surface thereof to contact a polishing surface of the polishing pad 70.
[51] The polishing pad 70 is conditioned simultaneously while the semiconductor wafer is chemically mechanically polished, and when the chemical mechanical polishing is completed, the holder 30 is raised to allow the diamond disk 31 to be spaced apart from the polishing pad 70.
[52] The diamond disk 31 in contact with the polishing pad 70 is rotated to draw a circular arc spanning the radius of the polishing pad.
[53] Here, since the spindle (not shown) is rotated at a uniform speed, the entire polishing pad 70 can be conditioned by moving the diamond disk 31 this way.
[54] FlG. 5 is a perspective view of a chemical mechanical polishing apparatus in accordance with the present invention.
[55] Referring to FlG. 5, in the apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention, a portion of the rotary shaft of the arm 20 including the arm drive motor 10 and the disk drive motor 40 is installed in the spindle 100, and the other part of the arm 20 and the diamond disk 31 are exposed to the exterior.
[56] The diamond disk 31 has a smaller size than a polishing carrier 80 for fixing a semiconductor wafer. The diamond disk 31 can sequentially condition the entire polishing pad 70 through rotation of the spindle 100 itself, drive of the arm 20, and rotation of the diamond disk.
[57] Movement of the diamond disk 31 will now be described in detail.
[58] FlG. 6 is a plan view comparing an apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention with the conventional apparatus for conditioning a polishing pad.
[59] Referring to FlG. 6, in the conventional art, the polishing carrier 80 for creating friction between the semiconductor wafer and the polishing pad 70 to polish a surface of the wafer has a size substantially equal to a conditioning carrier 90 for fixing the diamond disk for conditioning a surface of the polishing pad 70, and the diamond disk engaged with the lower surface of the conditioning carrier 90 also has a size substantially equal to the conditioning carrier 90.
[60] The polishing carrier 80 and the conditioning carrier 90 are rotatably engaged with the spindle to be revolved on an upper surface of the polishing pad 70 depending on rotation of the spindle. Here, the polishing carrier 80 is rotated to polish the semiconductor wafer, and the conditioning carrier 90 is also rotated to condition a surface of the polishing pad 70.
[61] On the other hand, the rotary shaft is disposed at the middle of the radius of the polishing pad 70 at its one end, and includes the arm 20, which reciprocates along a semi-circular trajectory between the center and the edge of the polishing pad 70, at the other end. In addition, a small sized diamond disk 31 is fixed to the lower surface of the other end of the arm 20 through the medium of the holder 30. Therefore, it is possible to condition the polishing pad 70 and reduce maintenance and management costs of the diamond disk 31.
[62] FlG. 7 is a plan view of the trajectory of a diamond disk in accordance with the present invention. [63] Referring to FlG. 7, the trajectory of the diamond disk employed in the apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with an exemplary embodiment of the present invention has a semi-circular pattern such that the entire polishing pad 70 can be conditioned as the spindle rotates.
[64] A conditioning level during a process of driving the small sized diamond disk 31 and conditioning the polishing pad 70 is proportional a contact pressure between the diamond disk 31 and the polishing pad 70, a linear velocity and a contact time of the diamond disk 31.
[65] That is, when the contact pressure between the diamond disk 31 and the polishing pad 70 is uniformly maintained, and the diamond disk 31 is linearly moved from the center to the edge of the polishing pad 70 at a uniform speed, the entire surface of the polishing pad 70 can be uniformly conditioned.
[66] However, the diamond disk 31 is rotated, rather than linearly moved, thus causing the polishing pad 70 to be irregularly conditioned.
[67] In order to compensate for the irregular conditioning of the polishing pad 70, another parameter, e.g., the velocity of the diamond disk 31, may be differently set in different sections 70.
[68] In FlG. 7, the polishing pad 70 may be divided into an edge part A, an intermediate part B, and a center part C such that the velocity of the arm drive motor 10 can be controlled to vary the velocity of the diamond disk 31 in each section.
[69] Division into three parts, i.e., the edge part A, the intermediate part B, and the center part C, is only an example. Conditioning uniformity can be improved as the number of speed differential sections of the polishing pad 70 is increased.
[70] For convenient control and efficient conditioning, the number of speed differential sections is preferably about 10.
[71] The intermediate part B is polished more than the edge part A and the center part C.
Therefore, in order to reduce polishing of the intermediate part B, the diamond disk 31 slowly passes through the intermediate part B in comparison with the other parts.
[72] As a result of experiment, in conditioning the polishing pad 70 using the small sized diamond disk 31 according to uniform speed drive of the arm 20, the edge part A is polished least, the center part C is polished an medium amount, and the intermediate part B is polished the most.
[73] Therefore, the diamond disk 31 should be most rapidly moved through the edge part
A by the arm 20, and slower in sequence of the center part C and the intermediate part B.
[74] The most preferable moving speed ratio of the diamond disk 31 in each section is given by the following Formula 1.
[75] Formula 1 [76] A : B : C = 5v : 1.3v : 1.6 v (v is velocity)
[77] In the above example, the drive speed of the arm drive motor 10 is controlled, and each section speed of the arm 20 is also controlled. On the other hand, the contact pressure between the diamond disk 31 and the polishing pad 70 may be differently set for each section.
[78] Here, the edge part A is set to have the highest pressure, and the center part C and the intermediate part B are set to have sequentially lower pressures.
[79] The contact pressure can be adjusted in a state in which the diamond disk 31 is in contact with an upper surface of the polishing pad 70 by lowering the holder 30 by the pressure regulator 50.
[80] In addition, the rotational speed of the disk drive motor 40 may be varied within each section such that the rotational speed of the diamond disk 31 is differently controlled to uniformly condition the polishing pad 70.
[81]
Industrial Applicability
[82] As can be seen from the foregoing, an apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus in accordance with the present invention include an arm driven along a semi-circular trajectory, and a small sized diamond disk attached to the arm for conditioning the polishing pad. The apparatus and method can uniformly condition the polishing pad and reduce costs associated with managing, maintaining, and replacing the diamond disk.

Claims

Claims
[1] An apparatus for conditioning a polishing pad of a chemical mechanical polishing apparatus comprising: an arm drive motor disposed in a rotating spindle and periodically changing a rotational direction of a rotary shaft thereof; an arm having a rotary shaft disposed at an eccentric position of the lower surface of the spindle, and one end reciprocating along a semi-circular trajectory spanning the radius of the polishing pad by a drive force of the arm drive motor; and a holder rotatably engaged with the lower surface of the one end of the arm, and at which a small sized diamond disk is attached to the lower surface. [2] The apparatus according to claim 1, further comprising: a holder fixing part rotatably engaged with the arm and accommodating the holder; a disk drive motor for rotating the holder fixing part; and a pressure regulator for raising/lowering the holder accommodated in the holder fixing part. [3] The apparatus according to claim 2, wherein the disk drive motor is able to control a rotational speed of the holder fixing part. [4] The apparatus according to claim 2, wherein the pressure regulator is able to vary a contact pressure between the diamond disk and the polishing pad in a state in which the holder is lowered to put the diamond disk in contact with the polishing pad. [5] The apparatus according to claim 1, wherein the arm drive motor is able to vary a rotational speed of the arm in different sections when the arm is rotated in one direction. [6] The apparatus according to claim 5, wherein the arm drive motor transmits a drive force to the arm using a belt, and further comprises a belt detection part for detecting whether the belt is operating normally. [7] The apparatus according to claim 6, wherein the diamond disk has a diameter corresponding to 10 - 40% of the radius of the polishing pad. [8] A method of conditioning a polishing pad of a chemical mechanical polishing apparatus by creating friction between the polishing pad and a diamond disk during a semiconductor wafer polishing process, the method comprising: reciprocating the diamond disk having a diameter corresponding to 10 - 40% of the radius of the polishing pad along a semi-circular trajectory spanning the radius of the polishing pad to condition the polishing pad. [9] The method according to claim 8, wherein the semi-circular movement trajectory of the diamond disk is divided into at least two sections, and its movement speed is differently controlled in each section. [10] The method according to claim 9, wherein the diamond disk moves through the edge part of the polishing pad at a highest speed, an intermediate part at a lowest speed, and the center part at a medium speed. [11] The method according to claim 8, wherein the semi-circular movement trajectory of the diamond disk is divided into at least two sections, and a contact pressure between the diamond disk and the polishing pad is differently controlled in each section. [12] The method according to claim 11, wherein the diamond disk has a highest contact pressure at an edge part of the polishing pad, a lowest contact pressure at an intermediate part, and a medium contact pressure at a center part. [13] The method according to claim 8, wherein the semi-circular movement trajectory of the diamond disk is divided into at least two sections, and a rotational speed of the diamond disk is differently controlled in each section. [14] The method according to claim 13, wherein the diamond disk has a highest speed at an edge part of the polishing pad, a lowest rotational speed at an intermediate part, and a medium rotational speed at a center part.
PCT/KR2006/002895 2006-06-29 2006-07-21 Apparatus and method for conditioning polishing pad for chemical mechanical polishing apparatus WO2008001970A1 (en)

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KR1020060059042A KR100776570B1 (en) 2006-06-29 2006-06-29 Polishing-pad conditioning device for chemical mechanical polishing apparatus and method thereof
KR10-2006-0059042 2006-06-29

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