WO2008008232A3 - Probes with self-cleaning blunt skates for contacting conductive pads - Google Patents

Probes with self-cleaning blunt skates for contacting conductive pads Download PDF

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Publication number
WO2008008232A3
WO2008008232A3 PCT/US2007/015307 US2007015307W WO2008008232A3 WO 2008008232 A3 WO2008008232 A3 WO 2008008232A3 US 2007015307 W US2007015307 W US 2007015307W WO 2008008232 A3 WO2008008232 A3 WO 2008008232A3
Authority
WO
WIPO (PCT)
Prior art keywords
skate
blunt
skates
self
probes
Prior art date
Application number
PCT/US2007/015307
Other languages
French (fr)
Other versions
WO2008008232A2 (en
Inventor
January Kister
Original Assignee
Microprobe Inc
January Kister
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microprobe Inc, January Kister filed Critical Microprobe Inc
Publication of WO2008008232A2 publication Critical patent/WO2008008232A2/en
Publication of WO2008008232A3 publication Critical patent/WO2008008232A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Abstract

A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical' testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.
PCT/US2007/015307 2006-06-29 2007-06-27 Probes with self-cleaning blunt skates for contacting conductive pads WO2008008232A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/480,302 2006-06-29
US11/480,302 US7759949B2 (en) 2004-05-21 2006-06-29 Probes with self-cleaning blunt skates for contacting conductive pads

Publications (2)

Publication Number Publication Date
WO2008008232A2 WO2008008232A2 (en) 2008-01-17
WO2008008232A3 true WO2008008232A3 (en) 2008-03-06

Family

ID=38812210

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/015307 WO2008008232A2 (en) 2006-06-29 2007-06-27 Probes with self-cleaning blunt skates for contacting conductive pads

Country Status (2)

Country Link
US (3) US7759949B2 (en)
WO (1) WO2008008232A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9316670B2 (en) 2004-05-21 2016-04-19 Formfactor, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9533376B2 (en) 2013-01-15 2017-01-03 Microfabrica Inc. Methods of forming parts using laser machining
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
CN101140295A (en) * 2006-09-05 2008-03-12 杰冯科技有限公司 Improvement contactor used for interconnection system
WO2008033428A2 (en) * 2006-09-12 2008-03-20 Innoconnex, Inc. Compliance partitioning in testing of integrated circuits
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
ATE519123T1 (en) 2008-02-08 2011-08-15 Technoprobe Spa CONTACT PIN FOR A TEST HEAD WITH VERTICAL TEST NEEDLES WITH IMPROVED SCRUBBING MOTION
DE102008023761B9 (en) 2008-05-09 2012-11-08 Feinmetall Gmbh Electrical contact element for contact contacting of electrical specimens and corresponding contacting arrangement
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
JP5222874B2 (en) * 2010-03-19 2013-06-26 ルネサスエレクトロニクス株式会社 Electronic component contactor, electronic component inspection apparatus, and electronic component inspection method
IT1399906B1 (en) * 2010-04-28 2013-05-09 Technoprobe Spa METHOD FOR THE CLEANING OF A CONTACT PITCH OF A MICROSTRUCTURE AND RELATED SHUTTER CONTACT PROBE AND HEAD OF MEASURING PROBES [CANTILEVER].
TWI534432B (en) * 2010-09-07 2016-05-21 瓊斯科技國際公司 Electrically conductive pins for microcircuit tester
CN104204818B (en) * 2012-03-23 2017-05-24 爱德万测试公司 Laterally driven probes for semiconductor testing
US20140044985A1 (en) * 2012-08-09 2014-02-13 Formfactor, Inc. Probe fabrication using combined laser and micro-fabrication technologies
CN108333394B (en) * 2012-12-04 2020-06-09 日本电子材料株式会社 Contact probe
KR102081478B1 (en) 2013-07-09 2020-02-25 폼팩터, 인크. Multipath electrical probe and probe assemblies with signal paths through and secondary paths between electrically conductive guide plates
EP2894483B1 (en) 2014-01-09 2018-06-27 Multitest elektronische Systeme GmbH Contact tip and contact element and method of producing the same
US9702906B2 (en) 2015-06-26 2017-07-11 International Business Machines Corporation Non-permanent termination structure for microprobe measurements
US10114042B2 (en) * 2016-02-05 2018-10-30 Texas Instruments Incorporated Vertical probe card
KR20190021101A (en) 2017-08-22 2019-03-05 삼성전자주식회사 Probe card, test apparatus comprising the probe card, testing method for testing and manufacturing semiconductor using the probe card
JP7407724B2 (en) * 2018-03-22 2024-01-04 フォームファクター， インコーポレイテッド Probe tip with embedded skate
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
CN111693739B (en) * 2020-05-20 2022-07-22 成都恒晶科技有限公司 Solder joint structure of crystal oscillator test tool seat
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
TWI755945B (en) * 2020-11-24 2022-02-21 中華精測科技股份有限公司 Probe card device and self-aligned probe
CN112462105B (en) * 2020-11-29 2021-07-30 法特迪精密科技（苏州）有限公司 Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0893695A2 (en) * 1997-07-24 1999-01-27 Mitsubishi Denki Kabushiki Kaisha Test probe for semiconductor devices and method of manufacturing of the same
US20020190737A1 (en) * 2001-06-13 2002-12-19 Mitsubishi Denki Kabushiki Kaisha Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
US20040104737A1 (en) * 2001-12-25 2004-06-03 Tsuyoshi Haga Contact probe
US20050258844A1 (en) * 2004-05-21 2005-11-24 January Kister Freely deflecting knee probe with controlled scrub motion

Family Cites Families (232)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2754203A (en) 1953-05-22 1956-07-10 Rem Cru Titanium Inc Thermally stable beta alloys of titanium
GB1147037A (en) 1966-08-06 1969-04-02 Ibm Connector assembly
US3599093A (en) 1969-04-28 1971-08-10 Rca Corp Apparatus including a wire tipped probe for testing semiconductor wafers
US3710251A (en) 1971-04-07 1973-01-09 Collins Radio Co Microelectric heat exchanger pedestal
US3812311A (en) * 1972-12-11 1974-05-21 Electronic Memories & Magnetic Miniature type switch probe for testing integrated circuit assemblies or the like
US4116523A (en) 1976-01-23 1978-09-26 James M. Foster High frequency probe
US4027935A (en) 1976-06-21 1977-06-07 International Business Machines Corporation Contact for an electrical contactor assembly
US4115736A (en) 1977-03-09 1978-09-19 The United States Of America As Represented By The Secretary Of The Air Force Probe station
US4314855A (en) 1979-12-17 1982-02-09 Bell Telephone Laboratories, Incorporated Method of cleaning test probes
US4523144A (en) 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer
US4423376A (en) 1981-03-20 1983-12-27 International Business Machines Corporation Contact probe assembly having rotatable contacting probe elements
JPS58210631A (en) 1982-05-31 1983-12-07 Toshiba Corp Ic tester utilizing electron beam
US4525697A (en) 1982-12-13 1985-06-25 Eaton Corporation Thermally responsive controller and switch assembly therefor
US4618821A (en) 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
ATE45427T1 (en) 1983-11-07 1989-08-15 Martin Maelzer ADAPTER FOR A PCB TESTER.
US4593961A (en) 1984-12-20 1986-06-10 Amp Incorporated Electrical compression connector
US4618767A (en) 1985-03-22 1986-10-21 International Business Machines Corporation Low-energy scanning transmission electron microscope
JPH0646550B2 (en) 1985-08-19 1994-06-15 株式会社東芝 Electronic beam fixed position irradiation control method and electronic beam fixed position irradiation control device
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4706019A (en) 1985-11-15 1987-11-10 Fairchild Camera And Instrument Corporation Electron beam test probe system for analyzing integrated circuits
US4757255A (en) 1986-03-03 1988-07-12 National Semiconductor Corporation Environmental box for automated wafer probing
US4747698A (en) 1986-04-30 1988-05-31 International Business Machines Corp. Scanning thermal profiler
US4730158A (en) 1986-06-06 1988-03-08 Santa Barbara Research Center Electron-beam probing of photodiodes
EP0256541A3 (en) 1986-08-19 1990-03-14 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Contacting device
US4973903A (en) 1986-12-23 1990-11-27 Texas Instruments Incorporated Adjustable probe for probe assembly
US4772846A (en) 1986-12-29 1988-09-20 Hughes Aircraft Company Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy
EP0285799B1 (en) 1987-03-31 1993-07-28 Siemens Aktiengesellschaft Device for the functional electric testing of wiring arrays, in particular of circuit boards
US4871964A (en) 1988-04-12 1989-10-03 G. G. B. Industries, Inc. Integrated circuit probing apparatus
US5225771A (en) 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
JPH01313969A (en) 1988-06-13 1989-12-19 Hitachi Ltd Semiconductor device
US4901013A (en) 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
US5030318A (en) 1989-09-28 1991-07-09 Polycon Corporation Method of making electrical probe diaphragms
US5399982A (en) 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
DE4237591A1 (en) 1992-11-06 1994-05-11 Mania Gmbh PCB test facility with foil adapter
US5205739A (en) 1989-11-13 1993-04-27 Augat Inc. High density parallel interconnect
US5471151A (en) 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US5015947A (en) 1990-03-19 1991-05-14 Tektronix, Inc. Low capacitance probe tip
US5026291A (en) 1990-08-10 1991-06-25 E. I. Du Pont De Nemours And Company Board mounted connector system
JP3208734B2 (en) 1990-08-20 2001-09-17 東京エレクトロン株式会社 Probe device
JPH0638382Y2 (en) 1990-09-10 1994-10-05 モレックス インコーポレーテッド Surface mount connector for connecting boards
US5207585A (en) 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
US5061192A (en) 1990-12-17 1991-10-29 International Business Machines Corporation High density connector
JPH07105420B2 (en) 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー Electrical connection with molded contacts
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
JP3723232B2 (en) 1992-03-10 2005-12-07 シリコン システムズ インコーポレーテッド Probe needle adjustment tool and probe needle adjustment method
US5576631A (en) 1992-03-10 1996-11-19 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly
US5237743A (en) 1992-06-19 1993-08-24 International Business Machines Corporation Method of forming a conductive end portion on a flexible circuit member
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5468994A (en) 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
US5422574A (en) 1993-01-14 1995-06-06 Probe Technology Corporation Large scale protrusion membrane for semiconductor devices under test with very high pin counts
US7368924B2 (en) 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US5676599A (en) 1993-05-03 1997-10-14 Lohr & Bromkamp Gmbh Outer joint part for a tripod joint
US7064566B2 (en) 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US5806181A (en) 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6482013B2 (en) 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US6029344A (en) 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5832601A (en) 1993-11-16 1998-11-10 Form Factor, Inc. Method of making temporary connections between electronic components
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5642056A (en) 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5500607A (en) * 1993-12-22 1996-03-19 International Business Machines Corporation Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5802699A (en) 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5936421A (en) 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
GB9503953D0 (en) * 1995-02-28 1995-04-19 Plessey Semiconductors Ltd An mcm-d probe tip
US5720098A (en) 1995-05-12 1998-02-24 Probe Technology Method for making a probe preserving a uniform stress distribution under deflection
KR100252457B1 (en) 1995-05-26 2000-04-15 이고르 와이. 칸드로스 Cantilever beams and manufacturing method of interconnects factor using sacrificial substrates
US5701085A (en) 1995-07-05 1997-12-23 Sun Microsystems, Inc. Apparatus for testing flip chip or wire bond integrated circuits
US5834946A (en) 1995-10-19 1998-11-10 Mosaid Technologies Incorporated Integrated circuit test head
US5742174A (en) 1995-11-03 1998-04-21 Probe Technology Membrane for holding a probe tip in proper location
US5970167A (en) 1995-11-08 1999-10-19 Alpha Innotech Corporation Integrated circuit failure analysis using color voltage contrast
US5892539A (en) 1995-11-08 1999-04-06 Alpha Innotech Corporation Portable emission microscope workstation for failure analysis
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5773987A (en) 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US6071630A (en) 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US5764409A (en) 1996-04-26 1998-06-09 Alpha Innotech Corp Elimination of vibration by vibration coupling in microscopy applications
WO1997044859A1 (en) 1996-05-24 1997-11-27 Tessera, Inc. Connectors for microelectronic elements
US5644249A (en) 1996-06-07 1997-07-01 Probe Technology Method and circuit testing apparatus for equalizing a contact force between probes and pads
JP3420435B2 (en) 1996-07-09 2003-06-23 松下電器産業株式会社 Substrate manufacturing method, semiconductor device, and semiconductor device manufacturing method
US5751157A (en) 1996-07-22 1998-05-12 Probe Technology Method and apparatus for aligning probes
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6247228B1 (en) 1996-08-12 2001-06-19 Tessera, Inc. Electrical connection with inwardly deformable contacts
US5945836A (en) 1996-10-29 1999-08-31 Hewlett-Packard Company Loaded-board, guided-probe test fixture
US6133072A (en) 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
US5764072A (en) 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
KR100397227B1 (en) 1997-04-04 2003-09-13 유니버시티 오브 써던 캘리포니아 Electroplating article, method and apparatus for electrochemical fabrication
US5884395A (en) 1997-04-04 1999-03-23 Probe Technology Assembly structure for making integrated circuit chip probe cards
US5923178A (en) 1997-04-17 1999-07-13 Cerprobe Corporation Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
JPH10319044A (en) 1997-05-15 1998-12-04 Mitsubishi Electric Corp Probe card
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US5847936A (en) 1997-06-20 1998-12-08 Sun Microsystems, Inc. Optimized routing scheme for an integrated circuit/printed circuit board
US6066957A (en) 1997-09-11 2000-05-23 Delaware Capital Formation, Inc. Floating spring probe wireless test fixture
US6278584B1 (en) * 1997-10-27 2001-08-21 Seagate Technology, Inc. Friction control on HGA ramp load/unload surface
US6204674B1 (en) 1997-10-31 2001-03-20 Probe Technology, Inc. Assembly structure for making integrated circuit chip probe cards
JPH11233216A (en) 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk Ic socket for test
US6411112B1 (en) 1998-02-19 2002-06-25 International Business Machines Corporation Off-axis contact tip and dense packing design for a fine pitch probe
US6246245B1 (en) 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
US5952843A (en) 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6064215A (en) 1998-04-08 2000-05-16 Probe Technology, Inc. High temperature probe card for testing integrated circuits
US6292003B1 (en) 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6433571B1 (en) 1998-07-06 2002-08-13 Motorola, Inc. Process for testing a semiconductor device
US6359452B1 (en) 1998-07-22 2002-03-19 Nortel Networks Limited Method and apparatus for testing an electronic assembly
US6031282A (en) 1998-08-27 2000-02-29 Advantest Corp. High performance integrated circuit chip package
JP3279294B2 (en) 1998-08-31 2002-04-30 三菱電機株式会社 Semiconductor device test method, semiconductor device test probe needle, method of manufacturing the same, and probe card provided with the probe needle
US6184576B1 (en) 1998-09-21 2001-02-06 Advantest Corp. Packaging and interconnection of contact structure
US6215320B1 (en) 1998-10-23 2001-04-10 Teradyne, Inc. High density printed circuit board
US6441315B1 (en) 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6332270B2 (en) 1998-11-23 2001-12-25 International Business Machines Corporation Method of making high density integral test probe
US6579804B1 (en) 1998-11-30 2003-06-17 Advantest, Corp. Contact structure and production method thereof and probe contact assembly using same
US6504223B1 (en) 1998-11-30 2003-01-07 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6255126B1 (en) 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6419500B1 (en) 1999-03-08 2002-07-16 Kulicke & Soffa Investment, Inc. Probe assembly having floatable buckling beam probes and apparatus for abrading the same
JP3745184B2 (en) 1999-03-25 2006-02-15 株式会社東京カソード研究所 Probe for probe card and manufacturing method thereof
US6583328B1 (en) * 1999-04-05 2003-06-24 Pcbu Services, Inc. Method for the preparation of 1,1,1,3,3-pentafluoropropene and 1,1,1,3,3-pentafluoropropane
US6259261B1 (en) 1999-04-16 2001-07-10 Sony Corporation Method and apparatus for electrically testing semiconductor devices fabricated on a wafer
US6486689B1 (en) 1999-05-26 2002-11-26 Nidec-Read Corporation Printed circuit board testing apparatus and probe device for use in the same
US6917525B2 (en) 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
DE19924527A1 (en) 1999-05-28 2000-11-30 Stahlecker Fritz Appts to condense a drawn sliver for spinning has a friction roller rotated by the final drawing roller to power the clamping roller which drives the transport belt to carry the sliver through the condensing zone
JP2001004698A (en) * 1999-06-18 2001-01-12 Mitsubishi Electric Corp Socket for test, manufacture of its contact terminal, and electronic apparatus or semiconductor package
US6218203B1 (en) 1999-06-28 2001-04-17 Advantest Corp. Method of producing a contact structure
JP4579361B2 (en) 1999-09-24 2010-11-10 軍生 木本 Contact assembly
US6676438B2 (en) 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6641430B2 (en) 2000-02-14 2003-11-04 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6496026B1 (en) 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
US6566898B2 (en) 2000-03-06 2003-05-20 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6586955B2 (en) 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
JP2001356134A (en) 2000-04-13 2001-12-26 Innotech Corp Probe card device and probe used therefor
US6529021B1 (en) 2000-04-25 2003-03-04 International Business Machines Corporation Self-scrub buckling beam probe
JP2001326046A (en) 2000-05-17 2001-11-22 Enplas Corp Contact pin assembly
JP2001338955A (en) 2000-05-29 2001-12-07 Texas Instr Japan Ltd Semiconductor device and its manufacturing method
US6424164B1 (en) 2000-06-13 2002-07-23 Kulicke & Soffa Investment, Inc. Probe apparatus having removable beam probes
US6420887B1 (en) 2000-06-13 2002-07-16 Kulicke & Soffa Investment, Inc. Modulated space transformer for high density buckling beam probe and method for making the same
IT1318734B1 (en) 2000-08-04 2003-09-10 Technoprobe S R L VERTICAL PROBE MEASUREMENT HEAD.
JP3486841B2 (en) 2000-08-09 2004-01-13 日本電子材料株式会社 Vertical probe card
US6970005B2 (en) 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US7273457B2 (en) 2000-10-16 2007-09-25 Remon Medical Technologies, Ltd. Barometric pressure correction based on remote sources of information
US6538336B1 (en) 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits
US6570396B1 (en) 2000-11-24 2003-05-27 Kulicke & Soffa Investment, Inc. Interface structure for contacting probe beams
JP2002162415A (en) 2000-11-28 2002-06-07 Japan Electronic Materials Corp Probe for probe card
US7064564B2 (en) 2001-02-01 2006-06-20 Antares Contech, Inc. Bundled probe apparatus for multiple terminal contacting
JP2002296297A (en) 2001-03-29 2002-10-09 Isao Kimoto Contact assembly
US6525552B2 (en) 2001-05-11 2003-02-25 Kulicke And Soffa Investments, Inc. Modular probe apparatus
US7108546B2 (en) 2001-06-20 2006-09-19 Formfactor, Inc. High density planar electrical interface
US6523255B2 (en) 2001-06-21 2003-02-25 International Business Machines Corporation Process and structure to repair damaged probes mounted on a space transformer
US7143500B2 (en) 2001-06-25 2006-12-05 Micron Technology, Inc. Method to prevent damage to probe card
JP4496456B2 (en) 2001-09-03 2010-07-07 軍生 木本 Prober equipment
US20030116346A1 (en) 2001-12-21 2003-06-26 Forster James Allam Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US6727719B2 (en) 2002-01-11 2004-04-27 Taiwan Semiconductor Manufacturing Co., Ltd. Piercer combined prober for CU interconnect water-level preliminary electrical test
TWI288958B (en) 2002-03-18 2007-10-21 Nanonexus Inc A miniaturized contact spring
US7015707B2 (en) 2002-03-20 2006-03-21 Gabe Cherian Micro probe
US6768331B2 (en) 2002-04-16 2004-07-27 Teradyne, Inc. Wafer-level contactor
US7265565B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US6911835B2 (en) 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US20030218865A1 (en) 2002-05-24 2003-11-27 Macias Jose Javier Semiconductor thermal management system
US6707311B2 (en) 2002-07-09 2004-03-16 Advantest Corp. Contact structure with flexible cable and probe contact assembly using same
US6701630B2 (en) 2002-07-22 2004-03-09 Larry D. Humphrey Power shovel
US6773938B2 (en) 2002-08-29 2004-08-10 Micron Technology, Inc. Probe card, e.g., for testing microelectronic components, and methods for making same
WO2004034068A2 (en) 2002-10-10 2004-04-22 Advantest Corporation Contact structure and production method thereof and probe contact assembly using same
US6765228B2 (en) 2002-10-11 2004-07-20 Taiwan Semiconductor Maunfacturing Co., Ltd. Bonding pad with separate bonding and probing areas
US7202682B2 (en) 2002-12-20 2007-04-10 Formfactor, Inc. Composite motion probing
US20040119485A1 (en) 2002-12-20 2004-06-24 Koch Daniel J. Probe finger structure and method for making a probe finger structure
US6945827B2 (en) 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US6897666B2 (en) 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
KR100573089B1 (en) 2003-03-17 2006-04-24 주식회사 파이컴 Probe and manufacturing method thereof
JP4741949B2 (en) 2003-04-15 2011-08-10 日本電気株式会社 Inspection probe
US6965245B2 (en) 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
JP2004347565A (en) 2003-05-26 2004-12-09 Nec Electronics Corp Inspection method for probe card and semiconductor device
USD510043S1 (en) 2003-06-11 2005-09-27 K&S Interconnect, Inc. Continuously profiled probe beam
US6853205B1 (en) 2003-07-17 2005-02-08 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
US6890185B1 (en) 2003-11-03 2005-05-10 Kulicke & Soffa Interconnect, Inc. Multipath interconnect with meandering contact cantilevers
USD525207S1 (en) 2003-12-02 2006-07-18 Antares Contech, Inc. Sheet metal interconnect array
US7059865B2 (en) 2004-01-16 2006-06-13 K & S Interconnect, Inc. See-saw interconnect assembly with dielectric carrier grid providing spring suspension
US7071715B2 (en) 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
US7218127B2 (en) 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
JP2005241275A (en) 2004-02-24 2005-09-08 Japan Electronic Materials Corp Probe card
JP2005265720A (en) 2004-03-19 2005-09-29 Nec Corp Electric contact structure, and forming method therefor, and element inspection method
US20050253602A1 (en) 2004-04-28 2005-11-17 Cram Daniel P Resilient contact probe apparatus, methods of using and making, and resilient contact probes
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7091729B2 (en) 2004-07-09 2006-08-15 Micro Probe Cantilever probe with dual plane fixture and probe apparatus therewith
US7436192B2 (en) 2006-06-29 2008-10-14 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US7046021B2 (en) 2004-06-30 2006-05-16 Microprobe Double acting spring probe
US6956389B1 (en) 2004-08-16 2005-10-18 Jem America Corporation Highly resilient cantilever spring probe for testing ICs
US7459795B2 (en) 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US7279916B2 (en) 2004-10-05 2007-10-09 Nanoconduction, Inc. Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires
CN100520414C (en) 2004-12-14 2009-07-29 株式会社爱德万测试 Contact pin and probe card
US7088118B2 (en) 2004-12-15 2006-08-08 Chipmos Technologies (Bermuda) Ltd. Modularized probe card for high frequency probing
TWI271524B (en) 2005-02-02 2007-01-21 Mjc Probe Inc Vertical probe card
US20060189867A1 (en) 2005-02-22 2006-08-24 Ian Revie Probe
JP4769538B2 (en) 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 Contactor for electronic parts and contact method
WO2006091454A1 (en) 2005-02-24 2006-08-31 Sv Probe Pte Ltd. Probes for a wafer test apparatus
US7126361B1 (en) 2005-08-03 2006-10-24 Qualitau, Inc. Vertical probe card and air cooled probe head system
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7345492B2 (en) 2005-12-14 2008-03-18 Microprobe, Inc. Probe cards employing probes having retaining portions for potting in a retention arrangement
US20070145989A1 (en) 2005-12-27 2007-06-28 Hua Zhu Probe card with improved transient power delivery
TWI284209B (en) 2005-12-30 2007-07-21 Ind Tech Res Inst A method of fabricating vertical probe head
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
JP2007273233A (en) 2006-03-31 2007-10-18 Fujitsu Ltd Socket, circuit component with socket, and information processing device provided with circuit component
US7281305B1 (en) 2006-03-31 2007-10-16 Medtronic, Inc. Method of attaching a capacitor to a feedthrough assembly of a medical device
US7150658B1 (en) 2006-06-19 2006-12-19 Excel Cell Electronic Co., Ltd. Terminal for an electrical connector
JP2008070146A (en) 2006-09-12 2008-03-27 Yokowo Co Ltd Socket for inspection
US7782072B2 (en) 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
KR20080030124A (en) 2006-09-29 2008-04-04 (주) 미코티엔 Probe card
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8299394B2 (en) 2007-06-15 2012-10-30 Sv Probe Pte Ltd. Approach for assembling and repairing probe assemblies using laser welding
US20090079455A1 (en) 2007-09-26 2009-03-26 Formfactor, Inc. Reduced scrub contact element
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8310253B1 (en) 2009-07-14 2012-11-13 Xilinx, Inc. Hybrid probe card
TW201109669A (en) 2009-09-07 2011-03-16 Pleader Yamaichi Co Ltd Cantilever probe structure capable of providing large current and the measurement of electrical voltage
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0893695A2 (en) * 1997-07-24 1999-01-27 Mitsubishi Denki Kabushiki Kaisha Test probe for semiconductor devices and method of manufacturing of the same
US20020190737A1 (en) * 2001-06-13 2002-12-19 Mitsubishi Denki Kabushiki Kaisha Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
US20040104737A1 (en) * 2001-12-25 2004-06-03 Tsuyoshi Haga Contact probe
US20050258844A1 (en) * 2004-05-21 2005-11-24 January Kister Freely deflecting knee probe with controlled scrub motion

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9316670B2 (en) 2004-05-21 2016-04-19 Formfactor, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods

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US7759949B2 (en) 2010-07-20
US8203353B2 (en) 2012-06-19
US20100289512A1 (en) 2010-11-18
WO2008008232A2 (en) 2008-01-17
US20080001612A1 (en) 2008-01-03
US9121868B2 (en) 2015-09-01
US20120313660A1 (en) 2012-12-13

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