WO2008027709A3 - Microelectronic device having interconnects and conductive backplanes - Google Patents

Microelectronic device having interconnects and conductive backplanes Download PDF

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Publication number
WO2008027709A3
WO2008027709A3 PCT/US2007/075638 US2007075638W WO2008027709A3 WO 2008027709 A3 WO2008027709 A3 WO 2008027709A3 US 2007075638 W US2007075638 W US 2007075638W WO 2008027709 A3 WO2008027709 A3 WO 2008027709A3
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WO
WIPO (PCT)
Prior art keywords
interconnects
conductive
semiconductor substrate
electrically coupled
microelectronic device
Prior art date
Application number
PCT/US2007/075638
Other languages
French (fr)
Other versions
WO2008027709A2 (en
Inventor
Mark E Tuttle
Original Assignee
Micron Technology Inc
Mark E Tuttle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc, Mark E Tuttle filed Critical Micron Technology Inc
Priority to KR1020097006627A priority Critical patent/KR101186712B1/en
Publication of WO2008027709A2 publication Critical patent/WO2008027709A2/en
Publication of WO2008027709A3 publication Critical patent/WO2008027709A3/en

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    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01—Chemical elements
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/30—Technical effects
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    • H01L2924/3025—Electromagnetic shielding

Abstract

Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.
PCT/US2007/075638 2006-08-31 2007-08-09 Microelectronic device having interconnects and conductive backplanes WO2008027709A2 (en)

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TWI368972B (en) 2012-07-21
US20110151621A1 (en) 2011-06-23
US7902643B2 (en) 2011-03-08
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US20080054444A1 (en) 2008-03-06
KR20090051245A (en) 2009-05-21

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