WO2008042520A3 - Probe array wafer - Google Patents
Probe array wafer Download PDFInfo
- Publication number
- WO2008042520A3 WO2008042520A3 PCT/US2007/076841 US2007076841W WO2008042520A3 WO 2008042520 A3 WO2008042520 A3 WO 2008042520A3 US 2007076841 W US2007076841 W US 2007076841W WO 2008042520 A3 WO2008042520 A3 WO 2008042520A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe array
- array wafer
- probes
- pairs
- electrically connected
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
Abstract
A probe array wafer (20) includes a substrate (24) upon which a plurality of compliant probes (22, 28, 30) are mounted. Pairs of axially aligned probes (28) may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes (28) may be electrically connected together to probe a ground connection from the test equipment to the device under test.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/511,061 | 2006-08-25 | ||
US11/511,061 US7498826B2 (en) | 2006-08-25 | 2006-08-25 | Probe array wafer |
Publications (4)
Publication Number | Publication Date |
---|---|
WO2008042520A2 WO2008042520A2 (en) | 2008-04-10 |
WO2008042520A3 true WO2008042520A3 (en) | 2008-08-07 |
WO2008042520A9 WO2008042520A9 (en) | 2008-09-18 |
WO2008042520B1 WO2008042520B1 (en) | 2008-10-30 |
Family
ID=39187916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/076841 WO2008042520A2 (en) | 2006-08-25 | 2007-08-27 | Probe array wafer |
Country Status (2)
Country | Link |
---|---|
US (1) | US7498826B2 (en) |
WO (1) | WO2008042520A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008006130A1 (en) * | 2008-01-25 | 2009-07-30 | Atg Luther & Maelzer Gmbh | Module for a parallel tester for testing printed circuit boards |
US9366697B2 (en) * | 2010-05-21 | 2016-06-14 | University Of Virginia Patent Foundation | Micromachined on-wafer probes and related method |
KR101136534B1 (en) * | 2010-09-07 | 2012-04-17 | 한국기계연구원 | Probe card and manufacturing method thereof |
US8506307B2 (en) | 2010-12-02 | 2013-08-13 | Interconnect Devices, Inc. | Electrical connector with embedded shell layer |
CN109085435A (en) * | 2016-07-08 | 2018-12-25 | 蓝龙飞 | A kind of electric system detection communication system |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4352061A (en) * | 1979-05-24 | 1982-09-28 | Fairchild Camera & Instrument Corp. | Universal test fixture employing interchangeable wired personalizers |
US4506215A (en) * | 1981-06-30 | 1985-03-19 | International Business Machines Corporation | Modular test probe |
US4780670A (en) * | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
US4833402A (en) * | 1984-06-13 | 1989-05-23 | Boegh Petersen Allan | Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circuit board by means of a circuit board testing machine |
US4862075A (en) * | 1988-09-01 | 1989-08-29 | Photon Dynamics, Inc. | High frequency test head using electro-optics |
US4931726A (en) * | 1987-06-22 | 1990-06-05 | Hitachi, Ltd. | Apparatus for testing semiconductor device |
US5134363A (en) * | 1986-11-11 | 1992-07-28 | Lang Dahlke Helmut | Arrangement for testing electrical printed-circuit boards |
US5276395A (en) * | 1979-08-13 | 1994-01-04 | Malloy James T | Bed-of-pins test fixture |
US5639385A (en) * | 1992-06-04 | 1997-06-17 | Lsi Logic Corporation | Method of fabricating a wafer probe card for testing an integrated circuit die |
US6359452B1 (en) * | 1998-07-22 | 2002-03-19 | Nortel Networks Limited | Method and apparatus for testing an electronic assembly |
US6570339B1 (en) * | 2001-12-19 | 2003-05-27 | Chad Byron Moore | Color fiber-based plasma display |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4993968A (en) | 1989-03-02 | 1991-02-19 | Precision Interconnect Corporation | Economical connector system for an array of conductors |
US4993969A (en) | 1989-07-11 | 1991-02-19 | Precision Interconnect Corporation | Electrical connector assembly |
US5160269A (en) | 1991-12-19 | 1992-11-03 | Precision Interconnect Corporation | Hydrostatic connector for flex circuits |
US5818248A (en) | 1996-07-29 | 1998-10-06 | Delaware Capital Formation, Inc | Loaded board test fixture with integral translator fixture for testing closely spaced test sites |
US6799976B1 (en) | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US6265886B1 (en) | 1999-07-12 | 2001-07-24 | Micron Technology, Inc. | Conductive bump array contactors having an ejector and methods of testing using same |
US6570399B2 (en) * | 2000-05-18 | 2003-05-27 | Qa Technology Company, Inc. | Test probe and separable mating connector assembly |
US6902416B2 (en) | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
US6878016B2 (en) | 2002-12-12 | 2005-04-12 | Symbol Technologies, Inc. | High cycle connector contact system |
-
2006
- 2006-08-25 US US11/511,061 patent/US7498826B2/en active Active
-
2007
- 2007-08-27 WO PCT/US2007/076841 patent/WO2008042520A2/en active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4352061A (en) * | 1979-05-24 | 1982-09-28 | Fairchild Camera & Instrument Corp. | Universal test fixture employing interchangeable wired personalizers |
US5276395A (en) * | 1979-08-13 | 1994-01-04 | Malloy James T | Bed-of-pins test fixture |
US4506215A (en) * | 1981-06-30 | 1985-03-19 | International Business Machines Corporation | Modular test probe |
US4833402A (en) * | 1984-06-13 | 1989-05-23 | Boegh Petersen Allan | Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circuit board by means of a circuit board testing machine |
US4780670A (en) * | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
US5134363A (en) * | 1986-11-11 | 1992-07-28 | Lang Dahlke Helmut | Arrangement for testing electrical printed-circuit boards |
US4931726A (en) * | 1987-06-22 | 1990-06-05 | Hitachi, Ltd. | Apparatus for testing semiconductor device |
US4862075A (en) * | 1988-09-01 | 1989-08-29 | Photon Dynamics, Inc. | High frequency test head using electro-optics |
US5639385A (en) * | 1992-06-04 | 1997-06-17 | Lsi Logic Corporation | Method of fabricating a wafer probe card for testing an integrated circuit die |
US6359452B1 (en) * | 1998-07-22 | 2002-03-19 | Nortel Networks Limited | Method and apparatus for testing an electronic assembly |
US6570339B1 (en) * | 2001-12-19 | 2003-05-27 | Chad Byron Moore | Color fiber-based plasma display |
Also Published As
Publication number | Publication date |
---|---|
US7498826B2 (en) | 2009-03-03 |
US20080068034A1 (en) | 2008-03-20 |
WO2008042520B1 (en) | 2008-10-30 |
WO2008042520A9 (en) | 2008-09-18 |
WO2008042520A2 (en) | 2008-04-10 |
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